STGIPS10C60T-H
SLLIMM™ small low-loss intelligent molded module
IPM, 3-phase inverter - 10 A, 600 V short-circuit rugged IGBT
Datasheet
-
production data
Applications
• 3-phase inverters for motor drives
• Air conditioners
SDIP-25L
Description
This intelligent power module provides a compact, high performance AC motor drive in a simple, rugged design. Combining ST proprietary control ICs with the most advanced short-circuitrugged IGBT system technology, this device is ideal for 3-phase inverters in applications such as motor drives and air conditioners. SLLIMM™ is a trademark of STMicroelectronics.
Features
•
IPM 10 A, 600 V 3-phase IGBT inverter bridge including control ICs for gate driving and freewheeling diodes
•
Short-circuit rugged IGBTs
•
3.3 V, 5 V, 15 V CMOS/TTL inputs comparators with hysteresis and pull-down / pull-up resistors
•
Undervoltage lockout
•
Internal bootstrap diode
•
Interlocking function
•
Shutdown function
•
DBC leading to low thermal resistance
•
Isolation rating of 2500 V rms
/min
•
4.7 k Ω NTC for temperature control
•
UL recognized: UL1557 file E81734
Order code
STGIPS10C60T-H
Table 1. Device summary
Marking Package
GIPS10C60T-H SDIP-25L
Packing
Tube
April 2015
This is information on a product in full production.
DocID025628 Rev 2 1/19 www.st.com
1
2
Contents
Contents
3
4
5
6
STGIPS10C60T-H
Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1.1
NTC thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2
Waveforms definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1
Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1
SDIP-25L Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19 DocID025628 Rev 2
STGIPS10C60T-H
1
Internal block diagram and pin configuration
Internal block diagram and pin configuration
Figure 1. Internal block diagram
AM09320v6
DocID025628 Rev 2 3/19
19
Pin n°
14
15
16
17
18
19
8
9
10
11
12
13
20
21
22
23
24
25
5
6
7
3
4
1
2
Internal block diagram and pin configuration
Symbol
LIN
V
HIN
V
OUT
W
V boot W
LIN
W
HIN
W
SD
T1
OUT
U
V bootU
LIN
U
HIN
U
V
CC
OUT
V
V boot V
GND
N
W
W
P
N
V
V
P
N
U
U
P
Table 2. Pin description
Description
High-side reference output for U phase
Bootstrap voltage for U phase
Low-side logic input for U phase
High-side logic input for U phase
Low voltage power supply
High-side reference output for V phase
Bootstrap voltage for V phase
Ground
Low-side logic input for V phase
High-side logic input for V phase
High-side reference output for W phase
Bootstrap voltage for W phase
Low-side logic input for W phase
High-side logic input for W phase
Shutdown logic input (active low)
NTC thermistor terminal
Negative DC input for W phase
W phase output
Positive DC input
Negative DC input for V phase
V phase output
Positive DC input
Negative DC input for U phase
U phase output
Positive DC input
Figure 2. Pin layout (bottom view)
STGIPS10C60T-H
0$5.,1*$5($
4/19 DocID025628 Rev 2
STGIPS10C60T-H Electrical ratings
Symbol
Table 3. Inverter part
Parameter
V
PN
Supply voltage applied between P - N
U
, N
V
, N
W
V
PN(surge)
V
CES
± I
C
Supply voltage (surge) applied between P - N
U
,
N
V
, N
W
Each IGBT collector emitter voltage (V
IN
(1)
= 0)
Each IGBT continuous collector current at T
C
= 25°C
Each IGBT pulsed collector current ± I
CP
(2)
P t
TOT scw
Each IGBT total dissipation at T
C
= 25°C
Short circuit withstand time, V
CE
= 0.5 V
(BR)CES
T
J
= 125 °C, V
CC
= V boot
= 15 V, V
IN (1)
= 0 - 5 V
1.
Applied between HIN i
, LIN i and
GND for i = U, V, W
2.
Pulse width limited by max junction temperature
Value
450
500
600
10
20
33
5
Symbol
Table 4. Control part
Parameter
V
V
V
OUT boot
V
CC
IN
Output voltage applied between
OUT
U,
OUT
V,
OUT
W
- GND
Low voltage power supply
Bootstrap voltage applied between
V boot i
- OUT i
for i = U, V, W
Logic input voltage applied between HIN, LIN and
GND
V
SD
Open drain voltage dV
OUT
/dt Allowed output slew rate
Value
V boot
- 21 to V boot
+ 0.3
-0.3 to +21
-0.3 to 620
-0.3 to 15
-0.3 to 15
50
Symbol
V
ISO
T j
T
C
Table 5. Total system
Parameter
Isolation withstand voltage applied between each pin and heatsink plate (AC voltage, t = 60 sec.)
Power chips operating junction temperature
Module case operation temperature
Value
2500
-40 to 150
-40 to 125
Unit
V
V
V
V
V
V/ns
Unit
V
°C
°C
Unit
V
V
V
A
A
W
µs
DocID025628 Rev 2 5/19
19
Electrical ratings
Symbol
R thJC
Table 6. Thermal data
Parameter
Thermal resistance junction-case single IGBT
Thermal resistance junction-case single diode
STGIPS10C60T-H
Value
3.8
5.5
Unit
°C/W
°C/W
6/19 DocID025628 Rev 2
STGIPS10C60T-H Electrical characteristics
T
J
= 25 °C unless otherwise specified.
Table 7. Inverter part
Symbol Parameter Test conditions
V
CE(sat)
Collector-emitter saturation voltage
V
CC
= V boot
= 15 V, V
IN
(1)
= 0 - 5 V,
I
C
= 10 A
V
CC
= V boot
= 15 V, V
IN
(1)
= 0 - 5 V,
I
C
= 10 A, T
J
= 125 °C
I
CES
V
F
Collector-cut off current
(V
IN
(1)
= 0 “logic state”)
Diode forward voltage
V
V
CE
= 550 V, V
IN
(1)
Inductive load switching time and energy
CC
= V
Boot
= 0 “logic state”, I
C
= 15 V
= 10 A t on t c(on) t off t c(off) t rr
E on
E off
Turn-on time
Crossover time (on)
Turn-off time
Crossover time (off)
Reverse recovery time
Turn-on switching losses
Turn-off switching losses
V
PN
= 300 V,
V
CC
= V boot
= 15 V,
V
IN
(1)
= 0 ÷ 5 V,
I
C
= 10 A
(see
Figure 3
)
1. Applied between HIN i
, LIN i and
GND for i = U, V, W.
Min.
-
-
-
-
-
-
-
-
-
-
-
Note:
Value
Typ.
1.6
1.7
1700
127
828
145
246
242
184
Max.
1.95
100
2.2
-
-
-
-
-
-
-
Unit
V
µA
V ns
µJ t
ON
and t
OFF
include the propagation delay time of the internal drive. t
C(ON)
and t
C(OFF)
are the switching time of IGBT itself under the internally given gate driving condition.
DocID025628 Rev 2 7/19
19
Electrical characteristics
Figure 3. Switching time test circuit
STGIPS10C60T-H
V
Figure 4. Switching time definition
100% I
C
100% I
C t rr
CE
I
C
I
C
V
CE
AM06019v2
Note:
V
IN
V
IN(ON) t
ON t
C(ON)
10% I
C
90% I
C
10% V
CE
V
IN t
OFF
V
IN(OFF)
10% V
CE t
C(OFF)
10% I
C
(a) turn-on (b) turn-off
Figure 4 "Switching time definition" refers to HIN, LIN inputs (active high).
AM09223V1
8/19 DocID025628 Rev 2
STGIPS10C60T-H Electrical characteristics
Symbol
Table 8. Low voltage power supply (V
CC
= 15 V unless otherwise specified)
Parameter Test conditions Min.
Typ.
Max.
Unit
V
CC_hys
V
CC_thON
V
CC_thOFF
I qccu
V
CC
UV hysteresis
V
CC
UV turn ON threshold
V
CC
UV turn OFF threshold
Undervoltage quiescent supply current
I qcc
Quiescent current
V
CC
= 10 V
SD = 5 V; LIN = 0; HIN = 0
V
CC
= 15 V
SD = 5 V; LIN = 0; HIN = 0
1.2
11.5
10
1.5
12
10.5
1.8
12.5
11
450
3.5
V
V
V
µA mA
Symbol
Table 9. Bootstrapped voltage (V
CC
= 15 V unless otherwise specified)
Parameter Test conditions
V
BS_hys
V
BS
UV hysteresis
V
BS_thON
V
BS
UV turn ON threshold
V
BS_thOFF
V
BS
UV turn OFF threshold
I
QBSU
Undervoltage V
BS
quiescent current
R
I
QBS
DS(on)
V
BS
quiescent current
V
BS
< 9 V
SD = 5 V; LIN = 0, HIN = 5 V
V
BS
= 15 V
SD = 5 V; LIN = 0, HIN = 5 V
Bootstrap driver on resistance LIN= 5 V; HIN= 0 V
Min.
1.2
11.1
9.8
Typ.
1.5
11.5
10
70
200
120
Max.
1.8
12.1
10.6
110
300
Unit
V
V
V
µA
µA
Ω
Symbol
V il
V ih
I
HINh
I
HINi
I
LINh
I
LINi
I
SDh
I
SDl
Dt
Table 10. Logic inputs (V
CC
= 15 V unless otherwise specified)
Parameter Test conditions Min.
Typ.
Low logic level voltage
High logic level voltage
HIN logic “1” input bias current HIN = 15 V
HIN logic “0” input bias current HIN = 0 V
LIN logic “1” input bias current LIN = 15 V
LIN logic “0” input bias current LIN = 0 V
SD logic “0” input bias current SD = 15 V
SD logic “1” input bias current SD = 0 V
Dead time
see Figure 7 and
Table 14
0.8
1.9
20
20
30
40
40
120
1.2
Max.
1.1
2.25
100
1
100
1
300
3
Unit
V
V
µA
µA
µA
µA
µA
µA
µs
DocID025628 Rev 2 9/19
19
Electrical characteristics STGIPS10C60T-H
Symbol
Table 11. Shut down characteristics (V
CC
= 15 V unless otherwise specified)
Parameter Test conditions Min.
Typ.
Max.
t sd
Shut down to high / low side driver propagation delay
V
OUT
= 0, V boot
= V
CC,
V
IN
= 0 to 3.3 V
50 125 200
Unit ns
Condition
Shutdown enable half-bridge tri-state
Interlocking half-bridge tri-state
0 ‘’logic state” half-bridge tri-state
1 “logic state” low side direct driving
1 “logic state” high side direct driving
Note: X: don’t care
H
H
SD
L
H
H
Table 12. Truth table
Logic input (V
I
)
LIN HIN
X X
H
L
H
L
L
H
H
L
LVG
L
L
L
H
L
Output
HVG
L
L
L
L
H
Symbol
R
25
R
125
B
T
Table 13. NTC thermistor
Parameter Test conditions
Resistance
Resistance
B-constant
Operating temperature
T = 25°C
T = 125°C
T = 25°C to 85°C
Min.
Typ. Max. Unit.
-40
4.7
160
3950 k
Ω
Ω
K
150 °C
Equation 1: resistance variation vs. temperature
R T = R
25
⋅ e
B
1
---
T
–
1
----------
298
Where T = temperature in Kelvins
10/19 DocID025628 Rev 2
STGIPS10C60T-H Electrical characteristics
Figure 5. NTC resistance vs. temperature
NTC [kΩ]
AM16299v1
180
160
140
120
100
80 MAX.
60
CENTER
40
20 MIN.
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 (°C)
Figure 6. NTC resistance vs. temperature (zoom)
NTC [kΩ]
AM17098v1
1.800
1.600
1.400
1.200
MAX.
1.000
0.800
0.600
CENTER
0.400
0.200
MIN.
0.000
50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130 135 140 145 (°C)
DocID025628 Rev 2 11/19
19
Electrical characteristics STGIPS10C60T-H
Figure 7. Dead time and interlocking waveforms definitions
G
12/19 DocID025628 Rev 2
STGIPS10C60T-H
Figure 8. Typical application circuit
Applications information
DocID025628 Rev 2
AM09321v2
13/19
19
Applications information STGIPS10C60T-H
4.1 Recommendations
•
Input signals HIN, LIN are active high logic. A 375 k
Ω
(typ.) pull down resistor is built-in for each input. If an external RC filter is used, for noise immunity, pay attention to the variation of the input signal level.
• To prevent the input signals oscillation, the wiring of each input should be as short as possible.
•
By integrating an application specific type HVIC inside the module, direct coupling to
MCU terminals without any opto-coupler is possible.
• Each capacitor should be located as nearby the pins of IPM as possible.
•
Low inductance shunt resistors should be used for phase leg current sensing.
• Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible. Additional high frequency ceramic capacitor mounted close to the module pins will further improve performance.
•
The SD signal should be pulled up to 5 V / 3.3 V with an external resistor.
Table 14. Recommended operating conditions
Symbol f t
V
V
V
PN
CC dead
PWM
T
BS
C
Value
Parameter Conditions
Supply voltage Applied between P-Nu,Nv,Nw
Control supply voltage Applied between V
CC
-GND
High side bias voltage
Applied between V
BOOTi
-OUT i
for i=U,V,W
Blanking time to prevent Arm-short
For each input signal
PWM input signal
-40°C < T c
< 100°C
-40°C < T j
< 125°C
Case operation temperature
Min.
Typ.
Max.
300 400
13.5
15 18
13
1.5
18
20
100
Unit
V
V
V
µs kHz
°C
Note: For further details refer to AN3338.
14/19 DocID025628 Rev 2
STGIPS10C60T-H Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Please refer to dedicated technical note TN0107 for mounting instructions.
Figure 9. SDIP-25L package outline
DocID025628 Rev 2
B
15/19
19
Package information
Dim.
F
F1
R
T
V
D1
E
E1
C3 e e1 e2 e3
D
B
B1
B2
C
C1
C2
A
A1
A2
A3
STGIPS10C60T-H
0.85
0.35
1.55
0.45
0°
Table 15. SDIP-25L mechanical data mm
Min.
43.90
1.15
1.40
38.90
21.50
11.25
24.83
5.00
6.50
11.20
2.90
2.15
3.40
4.50
6.30
Typ.
5.55
11.20
1.40
1.00
0.50
1.75
0.55
3.00
2.35
3.60
4.70
6.50
33.30
44.40
1.35
1.60
39.40
22.00
11.85
25.23
5.40
7.00
11.70
Max.
44.90
1.55
1.80
39.90
22.50
12.45
25.63
6.00
7.50
12.20
3.10
2.55
3.80
4.90
6.70
1.15
0.65
1.95
0.65
6°
16/19 DocID025628 Rev 2
STGIPS10C60T-H
Figure 10. SDIP-25L packing information
Package information
DocID025628 Rev 2 17/19
19
Revision history STGIPS10C60T-H
Date
08-May-2014
08-Apr-2015
Table 16. Document revision history
Revision Changes
1
2
Initial release.
Text edits and formatting changes throughout document
Updated Figure 2: Pin layout (bottom view)
Updated Section 5: Package information
18/19 DocID025628 Rev 2
STGIPS10C60T-H
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