JTS393
Micropower dual CMOS voltage comparator: unsawn wafer
Datasheet
-
production data
Description
The JTS393 is a micro power CMOS dual voltage comparator with extremely low consumption of
9 µA typical per comparator (20 times less than the dual bipolar LM393 device). Similar performance is offered by the dual micropower
TS3702 (or JTS3702 in wafer version) with a push-pull CMOS output. Thus, response times remain similar to the LM393.
Unsawn wafer
Features
• Extremely low supply current: typically 9 µA per comparator
• Wide single supply range: 2.7 V to 16 V or dual supplies (±1.35 V to ±8 V)
• Extremely low input bias current: 1 pA typical
• Extremely low input offset currents: 1 pA typical
• Input common-mode voltage range includes ground
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• Fast response time: 2.5
µs typical for 5 mV overdrive
• Functionally compatible with bipolar LM393
Related products
• See TS393 for plastic packaged version
December 2013
This is information on a product in full production.
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4
1
2
5
6
Contents
Contents
JTS393
Schematic diagram and pad configuration . . . . . . . . . . . . . . . . . . . . . . . 3
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Schematic diagram and pad configuration
Schematic diagram and pad configuration
Figure 1. Schematic diagram (for one channel of JTS393)
V
CC
+
T
1
T
3
T
2
R
1
T
4
T
9
Input -
T
11
T
10
T
8
T
13
T
12
Input +
T
17
T
18
T
20
Output
T
19
T
5
T
6
T
7
T
14
T
15
T
16
V
CC
-
Figure 2. Pad configuration (top view)
Y axis Die ID
8
1 7
2 6
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3 4 5
X axis
0
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Schematic diagram and pad configuration JTS393
Table 1. Pad coordinates (pad placement origin is the lower left corner of the die)
Center pad coordinates
Pad number Pad description
X (µm) Y (µm)
6
7
4
5
8
1
2
3
Output 1
Inverting input 1
Non-inverting input 1
Vcc-
Non-inverting input 2
Inverting input 2
Output 2
Vcc+
165
165
165
695
1225
1225
1225
835
870.3
575.3
140.3
140.3
140.3
575.3
870.3
870.3
Wafer dimension: 6 inches.
Die size without scribe line:
• X = 1326.0 µm
• Y = 926.0 µm
Scribe line: 60 µm
Bond pad opening 109 x 109 µm
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Absolute maximum ratings and operating conditions
Absolute maximum ratings and operating conditions
Symbol
V
CC
+
V id
V i
V o
I o
I
F
T
J
T stg
ESD
Table 2. Absolute maximum ratings (AMR)
Parameter
Supply voltage
(1)
Differential input voltage
(2)
Input voltage
(3)
Output voltage
Output current
Forward current in ESD protection diodes on input
(4)
Maximum junction temperature
Storage temperature range
HBM: human body model
(5)
MM: machine model
(6)
Value
18
±18
18
18
20
50
150
-65 to +150
500
200
Unit
V mA
°C
V
1. All voltage values, except differential voltage, are with respect to network ground terminal.
2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.
3. Excursions of input voltages may exceed the power supply level. As long as the common-mode voltage
[Vicm = (Vin+ + Vin-)/2] remains within the specified range, the comparator provides a stable output state.
However, the maximum current through the ESD diodes (IF) of the input stage must strictly be observed.
4. Guaranteed by design.
5. Human body model: 100 pF discharged through a 1.5 k all couples of pin combinations with other pins floating.
Ω resistor between two pins of the device, done for
6. Machine model: a 200 pF cap is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 combinations with other pins floating.
Ω ), done for all couples of pin
Symbol
V
CC
+
Table 3. Operating conditions
Parameter
Supply voltage
Common mode input voltage range
T min
. ≤ T amb
≤ T max
Operating free-air temperature range - JTS393C
Unit
V icm
T oper
Value
2.7 to 16
0 to V
0 to V
CC
+
CC
+
-1.2
-1.5
0 to +70
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V
°C
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Electrical characteristics JTS393
Table 4. Electrical characteristics at V
CC+
= 3 V, V
CC-
= 0 V, T = 25 °C (unless otherwise specified)
Symbol Parameter Conditions Min.
Typ.
Max.
Unit
V
I io io
Input offset voltage
Input offset current
(1)
(2)
V ic
T
= 1.5 V min
. ≤ T amb
≤ max
V ic
T
= 1.5 V min
. ≤ T amb
≤ max.
I ib
Input bias current
(2)
V ic
T
= 1.5 V min
. ≤ T amb
≤ max.
CMR Common-mode rejection ratio V ic
= V icm min.
SVR Supply voltage rejection ratio V
CC
+
= 3 V to 5 V t
I
V
I
OH
OL
CC
PLH
High level output current
Low level output voltage
Supply current
(each comparator)
Response time low to high
V id
= 1 V, V
OH
= 3 V
T min
. ≤ amb
≤ max.
V id
T
= -1 V, I min
. ≤ T amb
OL
= 6 mA
≤ max.
No load - outputs low
T min
. ≤ amb
≤ max.
V ic
R
L
= 0 V, f = 10 kHz,
= 5.1 k Ω , C
L
= 50 pF,
Overdrive = 5 mV
TTL input t
PHL
Response time high to low
V ic
R
L
= 0 V, f = 10 kHz,
= 5.1 k Ω , C
L
= 50 pF,
Overdrive = 5 mV
TTL input
1
1
70
70
2
400
9
1.5
0.7
2.5
0.08
5
6.5
300
600
1. The specified offset voltage is the maximum value required to drive the output up to 2.5 V or down to 0.3 V.
2. Maximum values including unavoidable inaccuracies of the industrial test.
40
1000
550
800
20
25 mV pA dB nA mV
μ A
μ s
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JTS393 Electrical characteristics
Table 5. Electrical characteristics at V
CC+
= 5 V, V
CC-
= 0 V, T = 25 °C (unless otherwise specified)
Symbol Parameter Conditions Min.
Typ.
Max.
Unit
V io
I io
I ib
CMR
SVR
I
OH
V
OL
I
CC t
PLH t
PHL
Input offset voltage
Input offset current
Input bias current
(1)
(2)
(2)
V ic
= 2.5 V, V
T min
. ≤ T amb cc
+
≤ T max.
= 5 V to 10 V
V ic
T
= 2.5 V min
. ≤ T amb
≤ T max.
V ic
T
= 2.5 V min
. ≤ T amb
≤ T max.
Common-mode rejection ratio V ic
= 0 V
Supply voltage rejection ratio V
CC
+
= +5 V to +10 V
High level output current
Low level output voltage
Supply current
(each comparator)
Response time low to high
Response time high to low
V id
= 1 V, V
OH
= 5 V
T min
. ≤ T amb
≤ T max.
V id
= -1 V, I
OL
T min
. ≤ T amb
≤ T
= 6 mA max.
No load - outputs low
T min
. ≤ T amb
≤ T max.
V ic
R
L
= 0 V, f = 1 0kHz,
= 5.1 k Ω , C
L
= 50 pF,
Overdrive = 5 mV
Overdrive = 10 mV
Overdrive = 20 mV
Overdrive = 40 mV
TTL input
V ic
R
L
= 0 V, f = 10 kHz,
= 5.1 k Ω , C
L
= 50 pF,
Overdrive = 5 mV
Overdrive = 10 mV
Overdrive = 20 mV
Overdrive = 40 mV
TTL input
1.4
1
1
71
80
2
260
10
1.5
1.2
1.0
0.8
0.7
2.5
1.9
1.2
0.8
0.08
5
6.5
300
600
40
1000
400
650
20
25 t f
Fall time f = 10 kHz, C
L
R
L
= 5.1 k Ω
,
= 50 pF, overdrive 50 mV
25
1. The specified offset voltage is the maximum value required to drive the output up to 4.5 V or down to 0.3 V.
2. Maximum values including unavoidable inaccuracies of the industrial test.
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μ A
μ s
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Packing description JTS393
Collective packing is used as STMicroelectronics qualified system for shipment of finished wafers.
The following parts of the collective packing are used in the clean room (see
Figure 3 for
detailed view):
• Canister (composed of a base and a cover, maximum content is 25 wafers)
• Pink foam discs (lodged below and over the stack, minimum content is 2 discs)
• White interleaves (separators between wafers, maximum content is 26 or more for best fit).
• CMB bag (to protect canister under moderate vacuum)
Figure 3. Canister composition overview
Figure 4. Packed canister picture
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JTS393 Ordering information
Order code
JTS393C-1AA5
Table 6. Order codes
Temperature range Package
0 to +70 °C Unsawn wafer
Packaging
Collective packing
Date
18-Dec-2013
Revision
Table 7. Document revision history
Changes
1 Initial release
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JTS393
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