STMicroelectronics STF28N60DM2 Datasheet
Annonce
Annonce
STF28N60DM2
N-channel 600 V, 0.13
Ω typ., 21 A MDmesh™ DM2
Power MOSFET in a TO-220FP package
Datasheet - production data
TO-220FP
1
2
3
Features
Order code
V
DS
@
T
Jmax.
R
DS(on) max.
I
D
P
TOT
STF28N60DM2 650 V 0.16 Ω 21 A 30 W
Fast-recovery body diode
Extremely low gate charge and input capacitance
Low on-resistance
100% avalanche tested
Extremely high dv/dt ruggedness
Zener-protected
Figure 1: Internal schematic diagram
Order code
STF28N60DM2
Applications
Switching applications
Description
This high voltage N-channel Power MOSFET is part of the MDmesh™ DM2 fast recovery diode series. It offers very low recovery charge (Q rr
) and time (t rr
) combined with low R
DS(on)
, rendering it suitable for the most demanding high efficiency converters and ideal for bridge topologies and
ZVS phase-shift converters.
Table 1: Device summary
Marking Package Packing
28N60DM2 TO-220FP Tube
October 2015 DocID026863 Rev 2
This is information on a product in full production.
1/12 www.st.com
Contents
Contents
STF28N60DM2
1 Electrical ratings ............................................................................. 3
2 Electrical characteristics ................................................................ 4
Electrical characteristics (curves) ...................................................... 6
4 Package information ....................................................................... 9
TO-220FP package information ........................................................ 9
5 Revision history ............................................................................ 11
2/12 DocID026863 Rev 2
STF28N60DM2
1 Electrical ratings
Symbol
V
GS
I
D
I
P
TOT
V
T stg
T j
Table 2: Absolute maximum ratings
Parameter
Gate-source voltage
Drain current (continuous) at T case
= 25 °C
Drain current (continuous) at T case
= 100 °C
Drain current (pulsed)
Total dissipation at T case
= 25 °C
Peak diode recovery voltage slope
MOSFET dv/dt ruggedness
Insulation withstand voltage (RMS) from all three leads to external heat sink
Storage temperature
Operating junction temperature
Notes:
(1)
Pulse width is limited by safe operating area.
(2)
I
SD
≤ 21 A, di/dt=900 A/μs; V
DS
peak < V
(BR)DSS
,V
DD
= 400 V
(3)
V
DS
≤ 480 V.
(4) t = 1 s; T
C
= 25 °C
Symbol
Table 3: Thermal data
Parameter
R thj-case
R thj-amb
Thermal resistance junction-case
Thermal resistance junction-ambient
Symbol
I
E
Table 4: Avalanche characteristics
Parameter
Avalanche current, repetitive or not repetitive
Single pulse avalanche energy
Notes:
(1)
pulse width limited by T jmax
(2)
starting T j
= 25 °C, I
D
= I
AR
, V
DD
= 50 V.
Electrical ratings
Value
±25
21
14
84
30
50
50
2.5
-55 to 150
Value
4.2
62.5
Value
4
350
Unit
V
A
A
W
V/ns kV
°C
Unit
°C/W
Unit
A mJ
DocID026863 Rev 2 3/12
Electrical characteristics
2 Electrical characteristics
(T case
= 25 °C unless otherwise specified)
Symbol Parameter
Table 5: Static
Test conditions
V
(BR)DSS
Drain-source breakdown voltage
V
GS
= 0 V, I
D
= 1 mA
I
DSS
Zero gate voltage drain current
V
GS
= 0 V, V
DS
= 600 V
V
GS
= 0 V, V
DS
= 600 V,
T case
= 125 °C
I
GSS
V
GS(th)
R
DS(on)
Gate-body leakage current
Gate threshold voltage
Static drain-source on-resistance
V
DS
= 0 V, V
GS
= ±25 V
V
DS
= V
GS
, I
D
= 250 µA
V
GS
= 10 V, I
D
= 10.5 A
Symbol Parameter
Table 6: Dynamic
Test conditions
C iss
C oss
C rss
C
R
G
Q g
Q gs
Q gd
Input capacitance
Output capacitance
Reverse transfer capacitance
Equivalent output capacitance
Intrinsic gate resistance
Total gate charge
Gate-source charge
Gate-drain charge
V
DS
= 100 V, f = 1 MHz,
V
GS
= 0 V
V
DS
= 0 to 480 V, V
GS
= 0 V f = 1 MHz, I
D
= 0 A
V
DD
= 480 V, I
D
= 21 A,
V
GS
"Test circuit for gate charge behavior" )
STF28N60DM2
Min. Typ. Max. Unit
600 V
1
100
µA
±10 µA
3 4 5 V
Min. Typ. Max. Unit
-
-
1500
70
-
- pF
- 1.6 -
-
-
-
-
-
0.13 0.16 Ω
134
4.6
34
8
18.5
-
-
-
-
- pF
Ω nC
Notes:
(1)
C oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C oss
when V
DS increases from 0 to 80% V
DSS
.
Symbol Parameter
Table 7: Switching times
Test conditions Min. Typ. Max. Unit t d(on) t r t d(off) t f
Turn-on delay time
Rise time
Turn-off delay time
Fall time
V
DD
= 300 V, I
D
= 10.5 A
R
G
= 4.7 Ω, V
GS
= 10 V (see
-
-
-
-
16
7.3
53
9.3
-
-
-
- ns
4/12 DocID026863 Rev 2
STF28N60DM2
Symbol
I
I
V
t rr
Q rr
I
RRM t rr
Q rr
I
RRM
Parameter
Source-drain current
Source-drain current
(pulsed)
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Table 8: Source-drain diode
Test conditions
I
I
V
V
GS
SD
DD
= 0 V, I
SD
= 21 A
"Test circuit for inductive load switching and diode recovery times"
SD
V
= 21 A, di/dt = 100 A/µs,
= 21 A, di/dt = 100 A/µs,
DD
= 60 V, T j
= 150 °C (see
Figure 16: "Test circuit for inductive load switching and diode recovery times" )
Electrical characteristics
Min. Typ. Max. Unit
- 21 A
- 84 A
-
- 140
1.6 V ns
- 0.5 µC
-
-
-
-
7.4
309
2.6
16.8
A ns
µC
A
Notes:
(1)
Limited by maximum junction temperature.
(2)
Pulse width is limited by safe operating area.
(3)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%.
Symbol
Table 9: Gate-source Zener diode
Parameter Test conditions Min. Typ. Max. Unit
V
(BR)GSO
Gate-source breakdown voltage I
GS
= ±250 µA, I
D
= 0 A ±30 - - V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for additional external componentry.
DocID026863 Rev 2 5/12
Electrical characteristics
2.1 Electrical characteristics (curves)
Figure 2: Safe operating area
STF28N60DM2
Figure 3: Thermal impedance
Figure 4: Output characteristics Figure 5: Transfer characteristics
Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance
6/12 DocID026863 Rev 2
STF28N60DM2
Figure 8: Capacitance variations
Electrical characteristics
Figure 9: Normalized gate threshold voltage vs temperature
Figure 10: Normalized on-resistance vs temperature
Figure 11: Normalized V(BR)DSS vs temperature
Figure 12: Output capacitance stored energy
Figure 13: Source-drain diode forward characteristics
DocID026863 Rev 2 7/12
Test circuits
3 Test circuits
Figure 14: Test circuit for resistive load switching times
STF28N60DM2
Figure 15: Test circuit for gate charge behavior
Figure 16: Test circuit for inductive load switching and diode recovery times
Figure 17: Unclamped inductive load test circuit
Figure 18: Unclamped inductive waveform Figure 19: Switching time waveform
8/12 DocID026863 Rev 2
STF28N60DM2
4
4.1
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK ® is an ST trademark.
TO-220FP package information
Figure 20: TO-220FP package outline
DocID026863 Rev 2
7012510_Rev_K_B
9/12
Package information
Dim.
G1
H
L2
L3
L4
L5
L6
L7
Dia
F
F1
F2
G
A
B
D
E
Table 10: TO-220FP package mechanical data mm
Min. Typ.
4.4
2.5
2.5
0.45
0.75
1.15
1.15
4.95
2.4
10
16
28.6
9.8
2.9
15.9
9
3
STF28N60DM2
Max.
4.6
2.7
2.75
0.7
1
1.70
1.70
5.2
2.7
10.4
30.6
10.6
3.6
16.4
9.3
3.2
10/12 DocID026863 Rev 2
STF28N60DM2
5
Revision history
Revision history
Date Revision
Table 11: Document revision history
Changes
04-Sep-2014
09-Oct-2015
1
2
First release.
Text and formatting changes throughout document
On cover page:
- upated title and Features table
In section Electrical ratings:
- updated all table data
In section Electrical characteristics:
- updated all table data
- renamed table Static (was On /off states)
- added table Gate-source Zener diode
Added section Electrical characteristics (curves)
Updated and renamed section Package mechanical data (was
Package information)
Datasheet promoted from preliminary to production data
DocID026863 Rev 2 11/12
STF28N60DM2
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics
– All rights reserved
12/12 DocID026863 Rev 2
Download
Annonce