STPS1045B-Y
Automotive power Schottky rectifier
Features
■
■
■
■
■
■
Negligible switching losses
Low forward voltage drop
Low capacitance
High reverse avalanche surge capability
Avalanche specification
AEC-Q101 qualified
Description
High voltage Schottky rectifier suited for switch mode power supplies and other power converters.
Packaged in DPAK, this device is intended for use in high frequency circuits where low switching losses are required.
K
A
K A
DPAK
STPS1045BY
j
Table 1.
Device summary
I
F(AV)
V
RRM
T j
V
F
(max)
10 A
45 V
175 °C
0.57 V
May 2011 Doc ID 17265 Rev 1 1/7 www.st.com
7
Characteristics
1 Characteristics
STPS1045B-Y
Table 2.
Symbol
Absolute maximum ratings
Parameter Value
V
RRM
Repetitive peak reverse voltage
I
F(RMS)
/pin Forward rms current
Average forward current I
F(AV)
I
FSM
Surge non repetitive forward current t
T p c
= 150 °C
δ
= 0.5
= 10 ms sinusoidal
I
RRM
Repetitive peak reverse current t p
= 2 µs, F= 1 kHz
P
ARM
T stg
T j
Repetitive peak avalanche power
Storage temperature range
Operating junction temperature range
(1) t p
= 1 µs, T j =
25 °C
1.
dV/dt dTj
Critical rate of rise of reverse voltage
<
(
1
Rth j a )
condition to avoid thermal runaway for a diode on its own heatsink
Table 3.
Thermal parameters
Symbol Parameter
45
7
10
75
1
4000
-65 to +175
-40 to +175
10000
Value
3 R th(j-c)
Junction to case
Table 4.
Symbol
Static electrical characteristics
Parameter Test conditions Min.
I
R
(1)
Reverse leakage current
T j
= 25 °C
T j
= 125 °C
V
R
= V
RRM
T j
= 25 °C
T j
= 125 °C
I
F
= 10 A
V
F
(2)
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
I
F
= 20 A
1.
Pulse test: t p
= 5 ms,
δ
< 2%
2.
Pulse test: t p
= 380 µs,
δ
< 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x I
F(AV)
+ 0.015 I
F
2
(RMS)
-
-
-
-
-
-
Typ.
-
7
-
0.50
-
0.65
Max.
100
15
0.63
0.57
0.84
0.72
Unit
°C/W
Unit
μ
A mA
V
Unit
W
°C
°C
V/µs
A
A
V
A
A
2/7 Doc ID 17265 Rev 1
STPS1045B-Y Characteristics
Figure 1.
Average forward power dissipation versus average forward current
Figure 2.
Average forward current versus ambient temperature ( δ = 0.5)
8
P
F(AV)
(W)
5
4
3
7
6
2
1
0
0 1 2
δ
= 0.05
δ
= 0.1
δ
= 0.2
3 4 5
I
F(AV)
(A)
6 7 8
δ
= 0.5
δ
= 1
T
9
δ
=tp/T
10 11 tp
12
12
I
F(AV)
(A)
10
8
6
4
2
0
0 25
R th(j-a)
=70°C/W
50 75
R th(j-a)
=R th(j-c)
R th(j-a)
=15°C/W
T amb
(°C)
100 125 150 175
Figure 3.
1
P
P
ARM
(1µs)
Normalized avalanche power derating versus pulse duration
Figure 4.
Normalized avalanche power derating versus junction temperature
1.2
P ARM (T )
P ARM (25 °C)
0.1
0.01
0.001
0.01
0.1
1 10 100 1000
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
Figure 5.
Non repetitive surge peak forward current versus overload duration
(maximum values)
Figure 6.
Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th(j-c)
/R th(j-c)
120
100
80
60
0.8
0.6
δ
= 0.5
0.4
40
20
0
1E-3
I M t
δ
=0.5
1E-2 t(s)
1E-1
0.2
1E+0
0.0
1E-4
δ
= 0.2
δ
= 0.1
Single pulse
1E-3 1E-2 1E-1
δ =tp/T
T tp
1E+0
Doc ID 17265 Rev 1 3/7
Characteristics STPS1045B-Y
Figure 7.
Reverse leakage current versus reverse voltage applied
(typical values)
1E+5
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
0 5 10 15 20 25 30 35 40
Figure 9.
Forward voltage drop versus forward current
45
100.0
I
FM
(A)
(maximum values)
Figure 8.
Junction capacitance versus reverse voltage applied
(typical values)
1000
C(pF)
V
F=1MHz
OSC
=30mV
RMS
500
200
100
1 2 5 10 20
Figure 10.
Thermal resistance junction to ambient versus copper surface under tab
100
Rth(j-a)(°C/W)
Epoxy printed circuit board, copper thickness: 35 µm
80
10.0
(typical values)
60
50
(maximum values)
40
1.0
20
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
FM
(V)
1.4
1.6
0
0 2 4 6 8
2
S(Cu)(cm )
10 12 14 16 18 20
4/7 Doc ID 17265 Rev 1
STPS1045B-Y Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 5.
DPAK dimensions
Dimensions
Ref.
H
L4
E
B2
G
0.60 MIN.
B
L2
A2
V2
A1
R
C2
A
C
R
D
G
H
L2
L4
V2
C2
D
E
A
A1
A2
B
B2
C
Millimeters Inches
Min.
Max Min.
Max.
2.20
0.90
0.03
0.64
5.20
0.45
2.40
1.10
0.23
0.90
5.40
0.60
0.086
0.094
0.035
0.043
0.001
0.009
0.025
0.035
0.204
0.212
0.017
0.023
0.48
6.00
6.40
0.60
6.20
6.60
0.018
0.023
0.236
0.244
0.251
0.259
4.40
9.35
4.60
0.80 typ.
0.173
0.181
10.10
0.368
0.397
0.031 typ.
0.60
0°
1.00
8°
0.023
0.039
0° 8°
Figure 11.
DPAK footprint (dimensions in mm)
6.7
3 3
1.6
6.7
2.3
2.3
1.6
Doc ID 17265 Rev 1 5/7
Ordering information STPS1045B-Y
Table 6.
Ordering information
Order code Marking
STPS1045BY-TR S1045Y
Package
DPAK
Weight Base qty Delivery mode
0.30 g 2500 Tape and reel
Table 7.
Date
Document revision history
Revision
23-May-2011 1 Initial release.
Changes
6/7 Doc ID 17265 Rev 1
STPS1045B-Y
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