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SMA6FxxAY
Datasheet
Automotive 600 W TVS in SMA Flat
Features
SMA6FY
Product status link
SMA6F5.0AY
, SMA6F6.0AY
,
SMA6F6.5AY
, SMA6F8.5AY
,
SMA6F10AY , SMA6F11AY ,
SMA6F12AY , SMA6F13AY ,
SMA6F14AY , SMA6F15AY ,
SMA6F16AY , SMA6F18AY ,
SMA6F20AY , SMA6F22AY ,
SMA6F23AY , SMA6F24AY ,
SMA6F26AY , SMA6F28AY ,
SMA6F30AY , SMA6F31AY ,
SMA6F33AY , SMA6F36AY ,
SMA6F40AY , SMA6F48AY ,
SMA6F58AY , SMA6F64AY ,
SMA6F70AY , SMA6F85AY ,
SMA6F100AY , SMA6F130AY ,
SMA6F154AY , SMA6F170AY ,
SMA6F188AY
• AEC-Q101 qualified
• Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
• Flat and thin package: 1 mm
• Stand-off voltage range from 5 V to 188 V
• Unidirectional type
• Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
• Operating T j
max: 175 °C
• High power capability at T j max.: up to 400 W (10/1000 µs)
• Lead finishing: matte tin plating
Complies with the following standards
• UL94, V0
• J-STD-020 MSL level 1
• J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
• JESD-201 class 2 whisker test
• IPC7531 footprint and JEDEC registered package outline
• IEC 61000-4-4 level 4:
– 4 kV
• ISO10605, IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4:
– 30 kV (contact discharge)
– 30 kV (air discharge)
• ISO10605, C = 330 pF, R = 330 Ω exceeds level 4:
– 30 kV (contact discharge)
– 30 kV (air discharge)
• ISO7637-2 (Not applicable to parts with V
RM
lower than battery voltage)
– Pulse 1: V
S
= -150 V
– Pulse 2a: V
S
= +112 V
– Pulse 3a: V
S
= -220 V
– Pulse 3b: V
S
= +150 V
Description
The SMA6FY Transil series are designed to protect sensitive automotive circuits against surges defined in ISO 7637 series and against electrostatic discharges according to ISO 10605.
The Planar technology makes it compatible with high-end circuits where low leakage current and high junction temperature are required to provide long term reliability and stability.
DS12477 - Rev 3 - January 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1
SMA6FxxAY
Characteristics
Characteristics
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Symbol
V
P
T
T
PP
PP stg
T j
L
Peak pulse voltage
Parameter
ISO10605 (C = 330 pF, R = 330 Ω):
Contact discharge
Air discharge
ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
Contact discharge
Air discharge
10/1000 µs, T j
initial = T amb
Peak pulse power dissipation
Storage temperature range
Operating junction temperature range
Maximum lead temperature for soldering during 10 s
Value Unit
30
30 kV
30
30
600 W
-65 to +175 °C
-55 to +175 °C
260 °C
Figure 1. Electrical characteristics - parameter definitions
Figure 2. Pulse definition for electrical characteristics
DS12477 - Rev 3 page 2/15
SMA6FxxAY
Characteristics
Table 2. Electrical characteristics - parameter values (T amb
= 25 °C, unless otherwise specified)
Type
I
RM
max at V
25 °C 85 °C
µA
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
20
20
20
20
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
50
50
50
50
1
1
1
1
1
1
1
1
1
1
1
1
RM
V
BR
at I
R
SMA6F5.0AY
SMA6F6.0AY
SMA6F6.5AY
SMA6F8.5AY
SMA6F10AY
SMA6F11AY
SMA6F12AY
SMA6F13AY
SMA6F14AY
SMA6F15AY
SMA6F16AY
SMA6F18AY
SMA6F20AY
SMA6F22AY
SMA6F23AY
SMA6F24AY
SMA6F26AY
SMA6F28AY
SMA6F30AY
SMA6F31AY
SMA6F33AY
SMA6F36AY
SMA6F40AY
SMA6F48AY
SMA6F58AY
SMA6F64AY
SMA6F70AY
SMA6F85AY
SMA6F100AY
SMA6F130AY
SMA6F154AY
SMA6F170AY
SMA6F188AY
1. To calculate V
BR
versus T j
: V
BR
at T
J
= V
BR
at 25 °C x (1 + αT x (T j
- 25))
2. To calculate V
CLmax
versus I
PPappli
: V
CLmax
= V
BR max
+ R
D
x I
PPappli
3. To calculate V
CL
versus T j
: V
CL
at T
J
= V
CL
at 25 °C x (1 + αT x (T j
- 25))
V
Min.
Typ.
Max.
V
5.0
6.4
6.74
6.0
6.7
7.05
7.1
7.4
6.5
7.2
7.58
8.5
9.4
9.9
8
10.4
10 11.1
11.7
12.3
11 12.3
13 13.7
12 13.3
14
13 14.4
15.2
14.7
16
14 15.7
16.5
17.3
15 16.7
17.6
18.5
16 17.9
18.8
19.8
18 20 21.1
22.2
20 22.2
23.4
24.6
22 24.4
25.7
27
23 25.7
27 28.4
24 26.7
28.1
29.5
26 28.9
30.4
31.9
28 31.1
32.7
34.3
30 33.2
35 36.8
31 34.2
36 37.8
33 36.7
38.6
40.5
36 40 42.1
44.2
40 44.4
46.7
49
48 53.2
56 58.8
58 64.6
68 71.4
64 71.1
74.8
78.6
70 77.9
85 95
82 86.1
100 105
100 111 117 123
130 144 152 160
154 171 180 189
170 190 200 210
188 209 220 231 mA
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
10
1
1
1
10
10
1
1
1
1
1
1
1
1
1
1
V
CL
Max.
10 / 1000 µs
I
PP
R
D
Max.
V
48.4
50.2
53.3
58.1
64.5
35.5
37.8
38.9
42.1
45.4
19.9
21.5
23.1
24.4
26
29.2
32.4
9.2
10.3
11.2
14.4
17
18
162
209
246
275
328
77.4
93.6
103
113
137
A Ω
3.8
3
2.4
2.2
2
8.1
6.7
5.8
5.5
4.6
68
61
0.031
0.048
56 0.057
41.7
0.096
37 0.127
33.8
0.127
31
29
0.168
0.190
26 0.223
25.1
0.235
23.1
0.268
21.5
0.326
19.4
0.402
13
12.3
11.8
10.3
9.7
17.7
0.480
16.4
0.573
16 0.588
14.9
0.685
13.8
0.804
0.885
1.01
1.08
1.35
1.60
10.3
16.3
23.8
30
48.5
2.28
3.34
4.17
4.91
7.17
V
CL
Max.
8 / 20 µs
I
PP
R
D
Max.
Ω A
19
15
12.6
11.3
10.3
40
33
30
27
22.5
62
61
57
52
48
83
81
80
75
68
298 0.021
290 0.022
276 0.024
205 0.044
184 0.051
165 0.064
157 0.068
147 0.076
136 0.086
123 0.114
115 0.130
102 0.168
93 0.196
0.442
0.45
0.512
0.612
0.729
0.257
0.257
0.256
0.288
0.363
4.68
7
10.2
12.7
15.2
1.03
1.51
1.84
2.22
3.29
V
64.3
65
69.7
76
84
48.3
49.2
50
53.5
59
25.3
27.2
29
32.5
34.7
39.3
42.8
13.4
13.7
14.5
19.5
21.7
24.2
212
265
317
353
388
100
121
134
146
178
αT
10.3
10.4
10.5
10.5
10.6
9.9
9.9
10
10
10.1
10.7
10.8
10.8
10.8
10.8
9.6
9.6
9.6
9.7
9.8
8.3
8.4
8.6
8.8
9.0
9.2
9.4
Max.
10 -4 /°C
5.7
5.9
6.1
7.3
7.8
8.1
DS12477 - Rev 3 page 3/15
SMA6FxxAY
Characteristics (curves)
4. Surge capability given for both directions
1.1
Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial junction temperature
800
P pp
(W)
Figure 4. Maximum peak pulse power versus exponential pulse duration
10000
P
PP
(W)
Tj initial = 25 °C
600
V
RM
< 100 V
1000
400
V
RM
≥ 100 V
100
200
0
0 25 50 75 100 125 150
T j
(°C)
175 200
10
0.01
0.1
1 t p
(ms)
10
Figure 5. Maximum clamping voltage versus peak pulse current
1000
I pp
(A)
8/20 µs
10/1000 µs
100
10
1
0.1
1 10 100
VCL (V)
1000
Figure 6. Dynamic resistance versus pulse duration
1000
R
D
( Ω )
100
SMA6F188AY
10
SMA6F70AY
1
0.1
0.01
SMA6F33AY
SMA6F5.0AY
0.001
0.01
0.1
1 t p
(ms)
10
DS12477 - Rev 3 page 4/15
SMA6FxxAY
Characteristics (curves)
Figure 7. Junction capacitance versus reverse applied voltage (unidirectional types)
10
C (nF) f = 1 MHz
V osc
= 30 mV
RMS
T j
= 25 °C
SMA6F5.0AY
1
Figure 8. Leakage current versus junction temperature
10000
I
R
(nA)
V
R
=V
RM
V
RM
< 10V
1000
100
V
RM
≥ 10V
0.1
0.01
1 10
SMA6F33AY
SMA6F70AY
100
SMA6F188AY
VR (V)
1000
10
1
25 50 75 100 125 150
Tj (°C)
175
Figure 9. Peak forward voltage drop versus peak forward current
100
I
F
(A) single pulse
Figure 10. Thermal impedance junction to ambient versus pulse duration
1000
Z th(j-a)
(°C/W)
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
10
100
T j
= 175 °C
T j
= 25 °C
1 10
0
0 0.5
1 1.5
2 2.5
V
F
(V)
3
1
0.01
0.1
1 10 100 t p
(s)
1000
Figure 11. Thermal resistance junction to ambient versus copper area under each lead
160
R th(j-a)
(°C/W)
140
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
120
100
80
60
40
20
0
0 0.5
1 1.5
2 2.5
3 3.5
4
S
Cu
(cm²)
4.5
5
Figure 12. ISO7637-2 pulse 1: Vs = -150 V with 12 V battery
DS12477 - Rev 3 page 5/15
SMA6FxxAY
Characteristics (curves)
Figure 13. ISO7637-2 pulse 2a: Vs = +112 V with 12 V battery
Figure 14. ISO7637-2 pulse 3a: Vs = -220 V with 12 V battery
Figure 15. ISO7637-2 pulse 3b: Vs = +150 V with 12 V battery
DS12477 - Rev 3 page 6/15
2
2.1
SMA6FxxAY
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
SMA Flat package information
Figure 16. SMA Flat package outline
DS12477 - Rev 3
Table 3. SMA Flat mechanical data
Symbol
D
E
E1
G
G1
A
A1 b c
L
L1
L2
L3
V
V1
Min
0.90
1.25
0.15
2.25
5.00
3.95
0.75
Millimeters
Typ
0.05
2.00
0.85
0.45
0.45
0.05
Max
1.10
1.65
0.40
2.90
5.35
4.60
1.20
8°
8°
1. Values in inches are converted from mm and rounded to 3 decimal digits.
Min
0.035
0.049
0.005
0.088
0.196
0.155
0.029
Inches
Typ
0.002
0.079
0.033
0.018
0.018
0.002
Max
0.044
0.065
0.016
0.115
0.211
0.182
0.048
8°
8° page 7/15
Figure 17. SMA Flat recommended footprint in mm
(inches)
SMA6FxxAY
SMA Flat package information
Figure 18. SMA Flat marking
Figure 19. Package orientation in reel
Figure 20. Tape and reel orientation
Figure 21. 13'' reel dimension values Figure 22. Inner box dimension values
DS12477 - Rev 3 page 8/15
DS12477 - Rev 3
Figure 23. Tape outline
SMA6FxxAY
SMA Flat package information
Ref.
P0
P1
P2
W
D0
D1
F
K0
Min.
1.5
1.5
5.4
1.1
3.9
3.9
1.9
11.7
Table 4. Tape dimension values
Dimensions
Millimeters
Typ.
1.55
5.5
1.2
4.0
4.0
2.0
12
Max.
1.6
5.6
1.3
4.1
4.1
2.1
12.3
page 9/15
2.2
SMA6FxxAY
Reflow profile
Reflow profile
Figure 24. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
Temperature (°C)
200
150
100
50
0 30
0.9 °C/s
60
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
90 120 150
Time (s)
180 210 240 270 300
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
DS12477 - Rev 3 page 10/15
3
SMA6FxxAY
Application and design guidelines
Application and design guidelines
More information is available in the application note AN2689 “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”.
DS12477 - Rev 3 page 11/15
4
Ordering information
Figure 25. Ordering information scheme
SMA 6 F vv A Y
Package:
SMA
Power capability (10 / 1000 µs):
600 W
Flat package
Stand-off voltage:
VRM
Type:
A : unidirectional
Automotive grade
SMA6FxxAY
Ordering information
Order code
SMA6FxxxAY
Table 5. Ordering information
Marking
.
Package
SMA Flat
Weight
39 mg
Base qty.
10000
Delivery mode
Tape and reel
DS12477 - Rev 3 page 12/15
4.1
Marking
Order code
SMA6F5.0AY
SMA6F6.0AY
SMA6F6.5AY
SMA6F8.5AY
SMA6F10AY
SMA6F11AY
SMA6F12AY
SMA6F13AY
SMA6F14AY
SMA6F15AY
SMA6F16AY
SMA6F18AY
SMA6F20AY
SMA6F22AY
SMA6F23AY
SMA6F24AY
SMA6F26AY
SMA6F28AY
SMA6F30AY
SMA6F31AY
SMA6F33AY
SMA6F36AY
SMA6F40AY
SMA6F48AY
SMA6F58AY
SMA6F64AY
SMA6F70AY
SMA6F85AY
SMA6F100AY
SMA6F130AY
SMA6F154AY
SMA6F170AY
SMA6F188AY
Table 6. Marking
6BAY
6BCY
6BEY
6BIY
6BMY
6BOY
6BPY
6BQY
6BSY
6BUY
6BWY
6BXY
6BZY
6CCY
Marking
6AIY
6AKY
6ALY
6APY
6ASY
6AUY
6AWY
6AYY
6CGY
6COY
6CYY
6DEY
6DKY
6DZY
6EOY
6FSY
6GQY
6HGY
6HYY
SMA6FxxAY
Marking
DS12477 - Rev 3 page 13/15
SMA6FxxAY
Revision history
Date
24-Sep-2018
26-Aug-2019
07-Jan-2020
2
3
Table 7. Document revision history
Version
1
Changes
Initial release.
Updated Table 1. Absolute maximum ratings (T amb
,
Figure 10. Thermal impedance junction to ambient versus pulse duration ,
Figure 11. Thermal resistance junction to ambient versus copper area under each lead .
Updated links syntax.
DS12477 - Rev 3 page 14/15
SMA6FxxAY
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
DS12477 - Rev 3 page 15/15
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