STMicroelectronics ESDALC12-1T2 Data Sheet

ESDALC12-1T2

Single line transient surge voltage suppressor (TVS) for data and power line

Datasheet

−

production data

Features

■

■

■

■

■

■

■

■

Stand-off voltage 10 V

Unidirectional device

Low clamping factor V

CL

/V

BR

Breakdown voltage V

BR

= 12 V min.

Fast response time

Very thin package: 0.4 mm

Low leakage current

RoHS compliant

Benefits

■

■

High ESD robustness of the application

Suitable for high density boards

Complies with the following standards:

■

■

IEC 61000-4-2 level 4:

– 15 kV (air discharge)

– 8 kV (contact discharge)

MIL STD 883G - Method 3015-7: class 3B

SOD882T

Figure 1.

Functional diagram

I/O1

GND

Applications

Where transient overvoltage protection and electrical overstress protection in sensitive equipment are required, such as:

■

■

Computers

Printers

■

■

■

Communication systems

Cellular phone handsets and accessories

Video equipment

Description

The ESDALC12-1T2 is a unidirectional single line

Transil™ diode designed specially for protection of integrated circuits in portable equipment and miniaturized electronic devices subjected to ESD and EOS transient over voltages. Packed in

SOD882T, it minimizes PCB occupation.

June 2012

This is information on a product in full production.

TM: Transil is a trademark of STMicroelectronics

Doc ID 15025 Rev 3 1/11 www.st.com

11

Characteristics

1 Characteristics

ESDALC12-1T2

Table 1.

Symbol

Absolute maximum ratings (T amb

= 25 °C)

Parameter

V

PP

P

PP

I

PP

T j

T stg

Peak pulse voltage - IEC 61000-4-2

Air discharge

Contact discharge

Peak pulse power dissipation (8/20 µs)

Peak pulse current (8/20 µs)

Storage temperature range

(1)

Operating junction temperature range

(1)

T j initial

= T

1.

For a surge greater than the maximum values, the diode will fail in short-circuit amb

Figure 2.

Electrical characteristics (definitions)

Symbol

I

PP

I

R

α

T

V

F

V

BR

I

RM

V

RM

V

CL

R d

=

=

=

=

=

=

=

=

=

Parameter

Breakdown voltage

Leakage current @ V

RM

Stand-off voltage

Clamping voltage

Dynamic impedance

Peak pulse current

Breakdown current

Voltage temperature coefficient

Forward voltage drop

V

CL

V

BR

V

RM

I

F

I

I

RM

Slope = 1/Rd

I

PP

V

F

Value

25

20

50

2

- 40 to + 125

- 55 to +150

V

Table 2.

Symbol

V

BR

I

RM

R d

V

CL

C

Electrical characteristics (T amb

= 25 °C)

Test conditions

I

R

= 1 mA

V

RM

= 10 V

1 A to 3 A, 8/20 µs

I

PP

= 1 A, 8/20µs

V

R

= 0 V DC, F = 1 MHz, V

OSC

= 30 mV

RMS

Unit kV

W

A

°C

°C

Min.

12

Typ.

1.9

15

Max.

14

200

20

18

Unit

V nA

Ω

V pF

2/11 Doc ID 15025 Rev 3

ESDALC12-1T2 Characteristics

Figure 3.

Peak pulse power dissipation versus initial junction temperature

Figure 4.

Peak pulse power versus exponential pulse duration

100

90

80

70

60

50

40

30

20

10

0

0 25 50 75 100 125

8/20 µs

150 175

1000

100

10

1

1 10 100

Figure 5.

Clamping voltage versus peak pulse current (maximum values)

10.0

8/20 µs

1000

Figure 6.

Forward voltage drop versus peak

10.00

I

FM

(A) forward current (typical values)

1.00

1.0

0.10

0.01

0.1

12 14 16 18 20 22 24 26 28

0.00

0.0

0.5

1.0

1.5

2.0

2.5

V

FM

(V)

3.0

10

8

6

4

2

0

0

Figure 7.

Junction capacitance versus reverse applied voltage

(typical values)

16

C(pF)

14

F = 1 Mhz

V

OSC

= 30 mV

RMS

12

1 2 3 4 5

Figure 8.

Leakage current versus junction temperature (typical values)

10.00

1.00

0.10

0.01

25 50

V = V

RM

= 10 V

75 100 125

Doc ID 15025 Rev 3 3/11

Characteristics

Figure 9.

ESD response to IEC 61000-4-2

(+15 kV air discharge) on each channel

10 V/div

ESDALC12-1T2

Figure 10.

ESD response to IEC 61000-4-2

(-15 kV air discharge) on each channel

5 V/div

100 ns/div 100 ns/div

Figure 11.

S21 attenuation measurement

0.00

dB

-5.00

-10.00

-15.00

-20.00

-25.00

F (Hz)

-30.00

300.0k

1.0M

3.0M

10.0M 30.0M 100.0M 300.0M 1.0G

3.0G

4/11 Doc ID 15025 Rev 3

ESDALC12-1T2

2 Ordering information scheme

Figure 12.

Ordering information scheme

Ordering information scheme

ESDA LC 12 - 1 T2

ESD array

Low capacitance

Breakdown voltage

12 = 12 Volt min.

Number of lines

Package

T2 = SOD882T

Doc ID 15025 Rev 3 5/11

Package information ESDALC12-1T2

6/11

●

●

Epoxy meets UL94, V0

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

® specifications, grade definitions and product status are available at: www.st.com

.

ECOPACK

®

is an ST trademark.

Figure 13.

SOD882 dimension definitions

L1 L2 b1

PIN # 1 ID b2 e

A

A1

E

D

Table 3.

SOD882 dimension values

Ref.

b2

D

E e

A

A1 b1

L1

L2

Min.

0.40

0.00

0.45

0.45

0.55

0.95

0.60

0.20

0.20

Dimensions

Millimeters

Typ.

0.47

0.50

0.50

0.60

1.00

0.65

0.25

0.25

Max.

0.50

0.05

0.55

0.55

0.65

1.05

0.70

0.30

0.30

Min.

0.016

0.000

0.018

0.018

0.022

0.037

0.024

0.008

0.008

Inches

Typ.

0.019

0.020

0.020

0.024

0.039

0.026

0.010

0.010

Max.

0.020

0.002

0.022

0.022

0.026

0.041

0.028

0.012

0.012

Doc ID 15025 Rev 3

ESDALC12-1T2 Package information

Figure 14.

Footprint (dimensions in mm) Figure 15.

Marking

0.55

(0.022)

0.55

(0.022)

Pin1

I N

Pin 2

0.40

(0.016)

0.50

0.020

Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a

PCB. Only pin 1 mark is to be used for this purpose.

Figure 16.

Tape and reel specifications

Cathode bar

Ø 1.55

2.0

4.0

0.20

0.6

All dimensions in mm

0.68

2.0

User direction of unreeling

Doc ID 15025 Rev 3 7/11

Recommendation on PCB assembly

4 Recommendation on PCB assembly

4.1 Stencil opening design

1.

General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 17.

Stencil opening dimensions

L

T

W

ESDALC12-1T2 b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio =

Aspect Area =

W

1.5

T

≥

L

×

2T L

W

+ W

)

≥

0.66

a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.

Figure 18.

Recommended stencil windows position

Package footprint

Lead footprint on PCB 0.055 mm

Lead footprint on PCB

Stencil window position 0.39 mm

Stencil window position

0.45 mm

0.05 mm 0.05 mm

8/11

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed

4. Solder paste with fine particles: powder particle size is 20-45 µm.

Doc ID 15025 Rev 3

ESDALC12-1T2 Recommendation on PCB assembly

4.3 Placement

1.

Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering

3. Standard tolerance of ± 0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.

1.

To control the solder paste amount, the closed via is recommended instead of open vias.

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.

Figure 19.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

150

100

50

250

Temperature (°C)

200

0 30

2 - 3 °C/s

240-245 °C

60 sec

(90 max)

-2 °C/s to

-3 °C/s

-6 °C/s max

0.9 °C/s

60 90 120 150 180 210

Time (s)

240 270 300

Note: Minimize air convection currents in the reflow oven to avoid component movement.

Doc ID 15025 Rev 3 9/11

Ordering information ESDALC12-1T2

Table 4.

Ordering information

Order code Package

ESDALC12-1T2

Marking

V

(1)

SOD882T

Weight

0.76 mg

Base qty

12000

1.

The marking can be rotated by multiples of 90° to differentiate assembly location

Delivery mode

Tape and reel

Table 5.

Date

Document revision history

Revision

16-Sep-2008

02-Nov-2010

13-Jun-2012

1

2

3

Changes

Initial release

Updated Table 1

, base quantity change on

Table 4 and updated

graphics.

Added Figure 13 , updated Table 3

and added note after

Figure 15 .

10/11 Doc ID 15025 Rev 3

ESDALC12-1T2

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS

OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT

RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,

DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE

GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2012 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com

Doc ID 15025 Rev 3 11/11