STTH802-Y
Features
■
■
■
■
■
Very low conduction losses
Negligible switching losses
Low forward and reverse recovery time
High junction temperature
AEC-Q101 qualified
Description
The STTH802-Y uses ST's new 200 V planar Pt doping technology, and is specially suited for switching mode base drive and transistor circuits.
Packaged in DPAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for automotive application.
Automotive ultrafast recovery diode
Datasheet
production data
A
K
K
A
NC
DPAK
STTH802BY-TR
Table 1.
Device summary
I
F(AV)
V
RRM
T j (max)
V
F
(typ) t rr
(typ)
8 A
200 V
175 °C
0.8 V
17 ns
October 2012
This is information on a product in full production.
Doc ID 018563 Rev 2 1/7 www.st.com
7
Characteristics
1 Characteristics
STTH802-Y
Table 2.
Symbol
Absolute ratings (limiting values at T j
= 25 °C, unless otherwise specified)
Parameter Value
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
T stg
T j
Repetitive peak reverse voltage
Forward rms current
Average forward current,
= 0.5
Surge non repetitive forward current
Storage temperature range
Operating junction temperature range
T c
= 145 °C t p
= 10 ms sinusoidal
200
16
8
100
-65 to + 175
-40 to + 175
Table 3.
Symbol
Thermal parameters
R th(j-c)
Junction to case
Parameter Value
3.2
Table 4.
Symbol
Table 5.
Symbol
Static electrical characteristics
Parameter
Dynamic characteristics
Parameter
Test conditions
I
R
(1)
V
F
(2)
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 150 °C
V
R
= V
RRM
I
F
= 8 A
1.
Pulse test: t p
= 5 ms,
< 2%
2.
Pulse test: t p
= 380 µs,
< 2%
To evaluate the conduction losses use the following equation:
P = 0.73 x I
F(AV)
+ 0.021 I
F
2
(RMS)
Test conditions
Min.
Min.
t rr
I
RM t fr
V
FP
Reverse recovery time
Reverse recovery current
Forward recovery time
Forward recovery voltage
I
F
= 1 A, dI
F
/dt = -50 A/µs,
V
R
= 30 V, T j
= 25 °C
I
F
= 1 A, dI
F
/dt = -100 A/µs,
V
R
= 30 V, T j
= 25 °C
I
F
= 8 A, dI
V
R
F
/dt = -200 A/µs,
= 160 V, T j
= 125 °C
I
F
= 8 A, dI
V
FR
F
/dt = 50 A/µs
= 1.1 x V
Fmax
, T j
= 25 °C
I
F
= 8 A, dI
F
/dt = 50 A/µs,
T j
= 25 °C
Typ.
6
0.95
0.8
Typ.
25
17
5.5
150
1.5
Max.
6
60
1.05
0.90
Max.
30
22
7
Unit
V
A
A
A
°C
°C
Unit
°C/W
Unit
µA
V
Unit ns
A ns
V
2/7 Doc ID 018563 Rev 2
STTH802-Y Characteristics
Figure 1.
100
I
M
(A)
80
60
40
Peak current versus duty cycle
I I
Figure 2.
Forward voltage drop versus forward current (typical values)
80
60
40
20
0
0.0
200
180
I
FM
(A)
160
140
120
100
0.5
T j
=150°C
1.0
1.5
T j
=25°C
2.0
2.5
V
FM
(V)
3.0
20
δ
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 3.
Forward voltage drop versus forward current (maximum values)
Figure 4.
Relative variation of thermal impedance, junction to case, versus pulse duration
1.0
Z th(j-c)
/R th(j-c)
Single pulse
100
80
60
40
20
0
0.0
200
I
FM
(A)
180
160
140
120
0.5
1.0
T j
=150°C
T j
=25°C
1.5
2.0
2.5
V
FM
(V)
3.0
0.1
1.E-03 1.E-02 1.E-01 tp(s)
1.E+00
Figure 5.
Junction capacitanceversus reverse applied voltage
(typical values)
100
C(pF)
F=1MHz
V osc
=30mV
RMS
T j
=25°C
10
1 10 100
V
R
(V)
1000
Figure 6.
Reverse recovery charges versus dI
80
60
40
20
0
10
160
Q
RR
(nC)
140 V
R
I
F
=8A
=160V
120
100
F
/dt (typical values)
T j
=125°C
100
T j
=25°C dI
F
/dt(A/µs)
1000
Doc ID 018563 Rev 2 3/7
Characteristics STTH802-Y
Figure 7.
Reverse recovery time versus dI
F
(typical values)
/dt Figure 8.
Peak reverse recovery current versus dI
F
/dt (typical values) t
RR
(ns)
80
70 V
R
I
F
=8A
=160V
12
I
RM
(A)
V
I
F
=8A
R
=160V
10
60
8
50
T j
=125°C
40 6
T j
=125°C
30
T j
=25°C 4
20
10
2
T j
=25°C dI
F
/dt(A/µs) dI
F
/dt(A/µs)
0
10 100 1000
0
10 100 1000
Figure 9.
Dynamic parameters versus junction temperature
1.4
Q
RR
; I
RM
[T j
] / Q
RR
; I
RM
[T j
=125°C]
1.2
I
F
=8A
V
R
=160V
1.0
0.8
0.6
0.4
0.2
0.0
25 50
I
RM
Q
RR
75 100 125
T j
(°C)
150
Figure 10.
Thermal resistance, junction to ambient, versus copper surface under tab
100
Rth
(j-a)
(°CW)
90 epoxy printed board copper thickness = 35 µm
80
70
60
50
40
30
20
10
0
0 2 4 6 8
S(cm²)
10 12 14 16 18 20
4/7 Doc ID 018563 Rev 2
STTH802-Y Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 6.
DPAK dimensions
H
L4
E
B2
G
0.60 MIN.
B
L2
A2
V2
A1
R
C2
A
C
R
D
Ref.
D
E
G
H
L2
L4
V2
A
A1
A2
B
B2
C
C2
Dimensions
Millimeters
Min.
Max.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
6.20
6.60
4.60
9.35
10.10
0.80 typ.
0.60
0°
1.00
8°
2.40
1.10
0.23
0.90
5.40
0.60
0.60
Inches
Min.
Max.
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.244
0.259
0.181
0.368
0.397
0.031 typ.
0.023
0°
0.039
8°
0.094
0.043
0.009
0.035
0.212
0.023
0.023
Figure 11.
Footprint (dimensions in mm)
6.7
3 3
1.6
6.7
2.3
2.3
1.6
Doc ID 018563 Rev 2 5/7
Ordering information STTH802-Y
Table 7.
Ordering information
Order code Marking
STTH802BY-TR STTH802Y
Package
DPAK
Weight Base qty Delivery mode
0.3 g 2500 Tape and reel
Table 8.
Date
Document revision history
Revision
10-Mar-2011
24-Oct-2012
1
2
Changes
First issue.
Updated operating temperature range in
Table 2
.
6/7 Doc ID 018563 Rev 2
STTH802-Y
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Doc ID 018563 Rev 2 7/7
