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Dell EMC Unity™ All Flash and Unity Hybrid
Unity 480/F, Unity 680/F, Unity 880/F
Hardware Information Guide
Part Number: 302-005-520
June 2021
Rev. 02
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2019 - 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Other trademarks may be trademarks of their respective owners.
Contents
Contents 3
Additional resources
As part of an improvement effort, revisions of the software and hardware are periodically released. Therefore, some functions described in this document might not be supported by all versions of the software or hardware currently in use. The product release notes provide the most up-to-date information on product features. Contact your technical support professional if a product does not function properly or does not function as described in this document.
Where to get help
Support, product, and licensing information can be obtained as described below.
Product information
For product and feature documentation or release notes, go to Unity Technical Documentation at: https://www.dell.com/ unitydocs .
Troubleshooting
For information about products, software updates, licensing, and service, go to Support (registration required) at: https:// www.dell.com/support . After logging in, locate the appropriate product page.
4 Additional resources
1
DPE component descriptions
Topics:
•
2U, 25-drive DPE component overview
•
•
•
Storage processor assembly internal components
2U, 25-drive DPE component overview
The 25-drive DPE is two rack units (U), 8.9 cm (3.5 in.) high, 79.2 cm (31.2 in.) deep, and includes slots for twenty-five 2.5-in.
drives.
The DPE consists of the following components:
● Drives
● Midplane
● Storage processor assembly
● Power supply module
● EMI shielding
Drives
Each drive consists of one drive in a carrier. The drive carriers are metal and plastic assemblies that provide smooth, reliable contact with the enclosure slot guides and midplane connectors. Each carrier has a handle with a latch and spring clips. The latch holds the drive in place to ensure proper connection with the midplane. Drive activity and fault LEDs are located on the front of the enclosure.
SAS and SAS flash drives are supported. The drives are populated in the system from left to right.
NOTE: The first four drive slots are reserved for system drives, and should not be removed.
You can visually distinguish between drive types by their different latch and handle mechanisms and by type, capacity, and speed labels on each drive. You can add or remove a drive while the DPE is powered on, but you should exercise special care when removing modules while they are in use. Drives are sensitive electronic components.
Midplane
The midplane separates the front-facing drives from the rear-facing SP assemblies. It distributes power and signals to all components in the enclosure. The SP assemblies and drives plug directly into the midplane.
Storage processor assembly
Each DPE contains two SP assemblies. The SP assembly is the intelligent component providing the compute capability of the
DPE. Acting as the control center, each SP assembly includes status LEDs.
DPE component descriptions 5
Storage processor assembly power supply module
Each SP assembly contains a power supply module that connects the system to an exterior power source. Redundant power supplies can keep the entire DPE running if one power supply fails. The power supplies include LEDs to indicate component status. A latch on the module locks it into place to ensure proper connection.
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in front of the DPE drives. When installed in cabinets that include a front door, the DPE includes a simple EMI shield. Other installations require a front bezel that has a locking latch and integrated EMI shield. Remove the bezel or shield to remove and install the drives.
DPE front view
On the front, the DPE contains the following elements:
● Drives in 2.5 in. carriers
● Status LEDs
Figure 1. DPE front view
Table 1. DPE component locations
Location Description
SAS or SAS Flash drives
Drive fault LED
Drive ready/activity LED
DPE power on LED
Figure 2. DPE and drive LEDs
6 DPE component descriptions
Table 2. DPE and drive LEDs
LED
Drive fault
Location
Drive active
DPE fault/power
State
Amber
Off
Blue
Off
Blue
Amber
Off
Description
Fault has occurred.
No fault has occurred, normal operation.
Drive activity.
Drive is powered off.
Power is on. No fault has occurred, normal operation.
Power is on. Fault has occurred within the enclosure.
Power is off.
System identification tags
The Product Serial Number Tag (PSNT) and World Wide Name Seed are serialized labels that allow customer support to track nested hardware material in the field.
Product Serial Number Tag
The PSNT for the 25-slot DPE is a black pull-out tag that is located between the drives in slots 16 and 17.
Figure 3. PSNT location
World Wide Name (WWN) Seed Tag
The World Wide Name (WWN) Seed tag is a blue pull-out tag that is located between the drives in slot 7 and 8.
Figure 4. WWN Seed tag location
DPE component descriptions 7
DPE rear view
On the rear of the DPE are two SP assemblies: SP assembly A and SP assembly B.
Each SP assembly contains the following hardware components:
● One embedded module
● Two optional I/O modules
● One power supply module
Figure 5. DPE rear view with hardware component locations
Table 3. DPE hardware component locations
Location Description
Storage processor assembly B
5
Storage processor assembly A
Power supply module
I/O module, slots 0 and 1
Embedded module
DPE embedded modules and 4-port cards
About embedded modules
Each SP assembly contains one embedded module that can hold one 4-port card for connectivity.
NOTE: Both SP assemblies must have the same type of embedded modules in the same slots.
The embedded module contains the following components:
● One 4-port card
● One non-maskable interrupt (NMI) button
● Two mini-SAS HD back-end ports
● Two RJ-45 LAN connectors
○ System management port ( )
○ Service port ( )
● One USB 3.0 port
● One mini-USB port (unused)
● One DB9 serial port (service access)
NOTE: The following figure shows the location of these components on the embedded module in SP assembly A. The location of the components in SP assembly B is mirrored.
8 DPE component descriptions
Figure 6. Embedded module rear view with component locations
Table 4. Embedded module component locations
Location Description
4-port card
5
6
7
8
Mini serial port (unused)
Mini-SAS HD back-end ports
DB9 serial port (unused)
RJ-45 LAN connector - service port
RJ 45 LAN connector - system management port
Non-maskable interrupt (NMI) button
USB 3.0 port
About 4-port cards
The 4-port card is an optional component located within the embedded module that serves Ethernet traffic and iSCSI block protocol. There are two supported 4-port cards: the 25GbE 4-port card and the 10GbE BaseT 4-port card.
The 25GbE 4-port card supports 1GbE SFP to RJ45, 10GbE or 25GbE SFP28, 25GbE passive TwinAx, and 10GbE active or passive TwinAx. Depending on the installed SFP or TwinAx cable, the following speeds are supported: 1GbE, 10GbE, and 25GbE.
The ports may be configured individually with TwinAx or any of the supported SFPs.
The 10GbE BaseT 4-port card supports speeds of 1GbE and 10 GbE.
Embedded module and 4-port card LED status
Figure 7. Embedded module LEDs
DPE component descriptions 9
Table 5. Embedded module LEDs
LED
Embedded module power
Location
Ethernet port link
Ethernet port activity
SAS port/activity Link
Port link
Storage processor assembly fault
Storage processor assembly power
Unsafe to remove
Off
Blue
Off
Green
Amber
Off
Amber
Blue
State
Amber
Off
Green
Off
Amber blinking
Green blinking
Off
White
Off
Description
Embedded module has faulted.
No fault has occurred, normal operation.
Link established.
No link established.
Port activity.
No port activity.
SAS port link is up.
No link established.
Link up with high speed.
Link up with degraded speed.
Link down.
Fault has occurred.
Storage processor assembly in Degraded
Mode.
System is booting.
Amber or blue blinking
Blue and amber alternating (green for 3 seconds)
Blue and amber alternating at one second intervals
Off
Green
System not initialized. A management IP address has not been assigned.
Storage processor assembly in Service
Mode.
No fault has occurred, normal operation.
Storage processor assembly is on (main power).
Storage processor assembly is initializing a serial over LAN session.
Storage processor assembly is off.
Do not remove the SP assembly.
Improper removal could cause data loss.
Safe to remove the SP assembly or embedded module when the SP assembly or embedded module has been properly prepared.
Nonmaskable interrupt (NMI) button
The nonmaskable interrupt (NMI) button is a recessed button located on the embedded module, which is used to reset the system password or force a system reboot.
Use a non-metallic object such as a toothpick or pen to press the recessed button. Press the button for approximately 2 seconds to reset the password. The SP assembly fault LED blinks blue when the password has been successfully reset.
Press the button for 10 or more seconds to force a system reboot.
10 DPE component descriptions
Figure 8. Location of the NMI button on the embedded module
DPE I/O module types
I/O module installation priority
There are two I/O module slots per SP assembly: slot 0 and slot 1. Slot 0 has a 16 lane PCIe channel, and slot 1 has an eight lane
PCIe channel.
Populate new I/O modules in the following order to take advantage of the increased speed on slot 0. If two I/O modules are ordered, use the same installation priority for both I/O modules.
1. 4-port 32Gb Fibre Channel I/O module
2. 4-port 25GbE Optical I/O module
3. 4-port 16Gb Fibre Channel I/O module
4. 4-port 10GbE BaseT I/O module
5. 4-port 12Gb SAS backend I/O module
When adding new I/O modules, always install I/O modules in pairs: one module in SP assembly A and one module in SP assembly
B. Both SP assemblies must have the same type of I/O modules in the same slots.
I/O module LED status
Figure 9. DPE I/O module LEDs
Table 6. DPE I/O module LEDs
LED
Port link
Power fault
Location State
Green or blue
Off
Green
Amber
Description
Link up
Link down
Power on
Power fault
DPE component descriptions 11
4-port 32Gb Fibre Channel I/O module
The 4-port 32Gb Fibre Channel I/O module is used to serve Fibre Channel block protocol over SAN to hosts for the platform.
Each port employs an optical SFP+ connection that supports 16 Gb and 32 Gb SFPs. 16 Gb SFPs support speeds of 4 Gb/s, 8
Gb/s, and 16 Gb/s. 32 Gb SFPs support speeds of 8 Gb/s, 16 Gb/s, and 32 Gb/s.
4-port 25GbE Optical I/O module
The 4-port 25GbE Optical I/O module is an Ethernet I/O module that is used to serve Ethernet network traffic and iSCSI block protocol to hosts for the platform. The I/O module uses an optical 10 Gb or 25 Gb capable SFP+ connection to a host or switch port, and it supports speeds of 1 Gb/s, 10 Gb/s, and 25 Gb/s.
4-port 16Gb Fibre Channel I/O module
The 4-port 16Gb Fibre Channel I/O module comes with four optical ports, one power and fault LED, and a combination link and activity LED for each optical port. This I/O module can interface at speeds of 4 Gb/s, 8 Gb/s, and 16 Gb/s FC for host or initiator layered connections.
NOTE: You cannot upgrade from a 4-port 16Gb Fibre Channel I/O module to a 4-port 32Gb Fibre Channel I/O module.
4-port 10GbE BaseT I/O module
The 4-port 10GbE BaseT I/O module can interface at speeds of 1 Gb/s and 10 Gb/s and supports both IP(file) and iSCSI (Block) on the same SP assembly. Ports can be configured as both IP and iSCSI simultaneously. The I/O module comes with four
10-Gb/s RJ-45 ports, one power/fault LED, activity LED, and link LED for each port.
4-port 12Gb SAS backend I/O module
Where supported, the 4-port 12Gb SAS backend I/O module comes with four x4 lane mini-SAS high density (HD) ports, one power and fault LED, and a combination link and activity LED for each port. Install this I/O module into the SP assembly to provide additional SAS buses. Labeled 12 Gb SAS v1.
NOTE: The optional back-end 12-Gb/s SAS module is only supported on Unity 480F, Unity 680F, and Unity 880F systems.
The 4-port 12Gb SAS backend I/O module can also be configured to support x8 lane cabling for the 80-drive DAE by combining ports 0 and 1 as back-end 2, or ports 2 and 3 to create back-end 4. The I/O module can also be configured to support both x4 lane and x8 lane back-ends simultaneously.
NOTE: If the 4-port 12Gb SAS backend I/O module is to be configured for x8 lane cabling, the x8 lane cable must be inserted into the I/O module before persisting it. If the x8 lane cables are not inserted into the I/O module first, all four ports default to x4 lane ports.
DPE power supply
NOTE: The power supply used in your system must meet the system power requirements and must be the same type of power supply to be used in both nodes. Do not mix power supply types.
Figure 10. DPE power supply LEDs
12 DPE component descriptions
Table 7. DPE power supply LEDs
LED
AC power (input)
Location
DC power (output)
Fault
State
Green
Off
Green
Off
Solid amber
Off
Description
AC power is on.
AC power is off. Verify source power
DC power is on.
DC power is off. Verify source power.
Power supply or backup fault. Check cable connection.
No fault.
Storage processor assembly internal components
Included within the SP assembly are the following components:
● Dual inline memory modules (DIMM)
● M.2 SSDs
● Internal battery backup module
● Fan module
Dual inline memory modules
Twenty-four, 288-pin DIMM sockets support up to 12 DDR4 DIMMs, capable of up to 96 GB, 192 GB, or 384 GB of memory, depending on the model.
Internal battery backup module
The SP assembly includes a Lithium-ion (Li-ion) internal battery that powers the associated SP assembly during a power event.
M.2 SSD
Each SP assembly has two slots for M.2 SSD on a M.2 SSD adaptor located between DIMM slots 5/17 and 6/18. One M.2 SSD is used for general system operations, while the other M.2 SSD is used for vaulting.
Fan module
Six redundant fan modules connect to the motherboard within the SP assembly to provide continuous airflow through the front drives and through the rear of the SP assembly to keep the components at optimal operating temperatures.
NOTE: The SP assembly performs a protective thermal shutdown if two cooling modules fault within the same SP assembly.
DPE component descriptions 13
2
Technical specifications
Topics:
•
•
•
•
Operating environment requirements
Technical specifications
Storage processor assembly specifications
Unity 480/480F Unity 680/680F Parameter (per SP assembly)
CPU
Memory
Embedded SAS ports
Optional SAS ports
Unity 880/880F
Two, 8-core 1.8 GHz Intel
Skylake processors
96 GB (12 x 8 GB)
Two, 4-lane 12 GB SAS
Four, 4-lane or two, 8-lane 12
Gb/s SAS I/O module
Two, 12-core 2.1 GHz Intel
Skylake processors
192 GB (12 x 16 GB)
Two, 4-lane 12 GB SAS
Four, 4-lane or two, 8-lane 12
Gb/s SAS I/O module
Two, 16-core 2.1 GHz Intel
Skylake processors
384 GB (12 x 32 GB)
Two, 4-lane 12 GB SAS
Four, 4-lane or two, 8-lane 12
Gb/s SAS I/O module
DAE and drive specifications
Supported DAEs:
● 2U, 25-drive disk-array enclosure
● 3U, 15-drive disk-array enclosure
● 3U, 80-drive disk-array enclosure
Table 8. Drive and DAE support
Parameter
Maximum drives
Minimum drives
Maximum DAEs
Maximum 25-drive DAE
Maximum 15-drive DAE
Maximum 80-drive DAE
Unity 480/480F
750
4
48
29 (750)
48 (745)
9 (745)
Unity 680/680F
1000
4
60
39 (1000)
60 (925)
12 (985)
Unity 880/880F
1500
4
60
59 (1500)
60 (925)
18 (1465)
Drive counts listed in parentheses next to the maximum amount of DAEs represent the maximum achievable drive count when using the maximum of each DAE, plus the 25 drives on the DPE.
14 Technical specifications
Embedded module specifications
Supported optional 4-port cards:
● 10GbE BaseT 4-port card
● 25GbE 4-port card
The 4-port card can also be left unpopulated.
I/O module specifications
Supported I/O modules:
● 4-port 16Gb Fibre Channel I/O module
● 4-port 25GbE Optical I/O module
● 4-port 10GbE BaseT I/O module
● 4-port 12Gb SAS backend I/O module
Power supply unit specifications
You can use high line power, such as in a rack, or low line power, such as from a wall power outlet, to supply power to the DPE.
A step-up transformer, not included, is required for low line power with Unity 880/880F systems.
Table 9. Power specifications per Unity model
Model
Unity 480/480F
Unity 680/680F
Unity 880/880F
High line
1800 W
1800 W
1800 W
Low line
1450 W
1450 W
1800 W (Step-up transformer required)
Dimensions and weight
Table 10. 2U, 25-drive DPE, dimensions and weight
Dimension Value
Weight (unpopulated) 25.9 kg (54.11 lbs)
Vertical size
Height
Width
Depth
2 NEMA units
8.72 cm (3.43 in.)
44.72 cm (17.61 in.)
79.55 cm (31.32 in.)
NOTE: The weight does not include mounting rails. Allow approximately 2.3-4.5 kg (5-10 lb) for a rail set.
Power requirements
Power consumption values are based on enclosures with all power supplies, drives, embedded modules and I/O modules populated.
To estimate power consumption values for your specific environment, go to https://powercalculator.emc.com/ .
Technical specifications 15
Table 11. DPE power requirements, per model
Specification
AC line voltage
AC line current (operating maximum)
Power consumption
(operating maximum)
Power factor
Heat dissipation (operating maximum)
In-rush current
Startup surge current
AC protection
Unity 480/480F
100 to 240 VAC ± 10%, single phase, 47 to 63 Hz
10.6 A max at 100 VAC; 5.3 A max at 200VAC
1060 VA (1050W) max at 100
VAC; 1060 VA (1050 W) max at 200 VAC
0.95 minimum at full load, @
100/ 200 VAC
3.78 x 10 6 J/hr, (3,581
Btu/hr) max at 100 VAC; 3.78
x 10 6 J/hr, (3,581 Btu/hr) max 200VAC
45 Apk cold per line cord, at any line voltage
120 Apk hot per line cord, at any line voltage
20 A fuse on each power supply, single line
Unity 680/680F
100 to 240 VAC ± 10%, single phase, 47 to 63 Hz
11.72 A max at 100 VAC; 5.86
A max at 200VAC
1172 VA (1161 W) max at 100
VAC; 1172 VA (1161 W) max at
200 VAC
0.95 minimum at full load, @
100/ 200 VAC
4.18 x 10 6 J/hr, (3,960
Btu/hr) max at 100 VAC; 4.18
x 10 6 J/hr, (3,960 Btu/hr) max 200VAC
45 Apk cold per line cord, at any line voltage
120 Apk hot per line cord, at any line voltage
20 A fuse on each power supply, single line
Unity 880/880F
100 to 240 VAC ± 10%, single phase, 47 to 63 Hz
14.41 A max at 100 VAC; 7.2 A max at 200VAC
1440.77 VA (1411.96) max at
100 VAC; 1440.77 VA (1411.96
W) max at 200 VAC
0.95 minimum at full load, @
100/ 200 VAC
5.08 x 10 6 J/hr, (4,818
Btu/hr) max at 100 VAC; 5.08
x 10 6 J/hr, (4,818 Btu/hr) max 200VAC
45 Apk cold per line cord, at any line voltage
120 Apk hot per line cord, at any line voltage
20 A fuse on each power supply, single line
AC inlet type (high line power)
IEC320-C14 appliance coupler, per power zone
AC inlet type (low line power) IEC320-C20 appliance coupler, per power zone
IEC320-C14 appliance coupler, per power zone
IEC320-C14 appliance coupler, per power zone
IEC320-C20 appliance coupler, per power zone
IEC320-C14 appliance coupler, per power zone
Ride-through sharing
Current sharing
10 ms min
± 5 percent of full load, between power supplies
10 ms min
± 5 percent of full load, between power supplies
10 ms min
± 5 percent of full load, between power supplies
Operating environment requirements
Temperature gradient and altitude requirements
Systems and components must not experience changes in temperature and humidity that are likely to cause condensation to form on or in that system or component. Do not exceed the temperature gradient of 20°C/hr (36°F/hr), or the altitude requirement of 3050 m (10,0000 ft).
Recommended range of operation
The recommended range of operation is the limit under which equipment operates the most reliably while still achieving reasonably energy-efficient data center operation.
The recommended range of operation is 18°C–27°C (64.4°F to 80.6°F) at 5.5°C (41.9°F) dew point to 60% relative humidity and 15°C (59°F) dew point.
Continuous allowable range of operation
Data center economization techniques such as free cooling can be employed to improve overall data center efficiency. These techniques can cause equipment inlet conditions to fall outside the recommended range, but still within the continuously allowable range. Equipment can be operated without any hourly limitations in this range.
16 Technical specifications
The continuous allowable range of operation is 10°C–35°C (50°F–95°F) at 20% to 80% relative humidity with 21°C (69.8°F) maximum dew point (maximum wet bulb temperature). De-rate the maximum allowable dry bulb temperature by 1°C per 300 m above 950 m (1°F per 547 ft above 3117 ft).
Expanded allowable range of operation
During certain times of the day or year, equipment inlet conditions can fall outside the continuously allowable range but still within the expanded improbable range. Equipment operation is limited to ≤ 10% of annual operating hours in this range.
The expanded allowable range of operation is 5°C–10°C and 35°C–40°C (with no direct sunlight on the equipment) at -12°C dew point and 8% to 85% relative humidity with 24°C dew point (maximum wet bulb temperature). Outside the continuously allowable range (10°C–35°C), the system can operate down to 5°C or up to 40°C for a maximum of 10% of its annual operating hours. For temperatures 35 °C–40°C (95°F–104°F), de-rate the maximum allowable dry bulb temperature by 1°C per 175 m above 950 m (1°F per 319 ft above 3117 ft).
Exceptions to the expanded allowable range of operation
During certain times of the day or year, equipment inlet conditions can fall outside the continuously allowable range but still within the expanded exceptional range. Equipment operation is limited to ≤ 1% of annual operating hours in this range.
Exceptions to the expanded allowable range of operation are 5°C–10°C and 35°C–40°C (with no direct sunlight on the equipment) at -12°C dew point and 8% to 85% relative humidity with 24°C dew point (maximum wet bulb temperature).
Outside the continuously allowable range (10°C–35°C), the system can operate down to 5°C or up to 45°C for a maximum of
1% of its annual operating hours. For temperatures between 35°C and 45°C (95°F–104°F), de-rate the maximum allowable dry bulb temperature by 1°C per 125 m above 950 m (1°F per 228 ft above 3117 ft).
DPE airflow
The DPE uses an adaptive cooling algorithm that increases or decreases fan speed as the unit senses changes to the external ambient temperature. Exhaust increases with ambient temperature and fan speed, and is roughly linear within recommended operating parameters. Note that the information in the table below is typical, and was measured without cabinet front/rear doors that would potentially reduce front-to-back air flow.
Table 12. DPE airflow
Max Airflow CFM Min Airflow CFM
106 CFM 40 CFM
Max Power
Usage (Watts)
850 W
Environmental recovery
If the system exceeds the maximum ambient temperature by approximately 10°C (18°F), the SP assemblies in the system begin an orderly shutdown that saves cached data, and then shut themselves down. Link control cards (LCCs) in each DAE in the system power down drives but remain powered on.
If the system detects that the temperature has dropped to an acceptable level, it restores power to the DPEs and the LCCs restore power to their drives.
Shipping and storage requirements
CAUTION: Systems and components must not experience changes in temperature and humidity that are likely to cause condensation to form on or in that system or component. Do not exceed the shipping and storage temperature gradient of 45°F/hr (25°C/hr).
Table 13. Shipping and storage requirements
Requirement Description
Ambient temperature -40° F to 149°F (-40°C to 65°C)
Technical specifications 17
Table 13. Shipping and storage requirements (continued)
Requirement
Temperature gradient
Description
45°F/hr (25°C/hr)
Relative humidity 10% to 90% noncondensing
Elevation -50 to 35,000 ft (-16 to 10,600 m)
Storage time (unpowered) Recommendation Do not exceed 6 consecutive months of unpowered storage.
Shock and vibration
Products have been tested to withstand the shock and random vibration levels. The levels apply to all three axes and should be measured with an accelerometer on the equipment enclosures within the cabinet and shall not exceed:
Platform condition
Non operational shock
Operational shock
Non operational random vibration
Operational random vibration
Response measurement level
10 G’s, 7 ms duration
3 G’s, 11 ms duration
0.40 Grms, 5–500 Hz, 30 minutes
0.21 Grms, 5–500 Hz, 10 minutes
Systems that are mounted on an approved package have completed transportation testing to withstand the following shock and vibrations in the vertical direction only and shall not exceed:
Packaged system condition
Transportation shock
Transportation random vibration
Response measurement level
10 G’s, 12ms duration
● 1.15 Grms
● 1 hour Frequency range 1–200 Hz
Fire suppressant disclaimer
Fire prevention equipment in the computer room should always be installed as an added safety measure. A fire suppression system is the responsibility of the customer. When selecting appropriate fire suppression equipment and agents for the data center, choose carefully. An insurance underwriter, local fire marshal, and local building inspector are all parties that you should consult during the selection of a fire suppression system that provides the correct level of coverage and protection.
Equipment is designed and manufactured to internal and external standards that require certain environments for reliable operation. We do not make compatibility claims of any kind nor do we provide recommendations on fire suppression systems. It is not recommended to position storage equipment directly in the path of high pressure gas discharge streams or loud fire sirens so as to minimize the forces and vibration adverse to system integrity.
NOTE: The previous information is provided on an “as is” basis and provides no representations, warranties, guarantees or obligations on the part of our company. This information does not modify the scope of any warranty set forth in the terms and conditions of the basic purchasing agreement between the customer and the manufacturer.
Air quality requirements
The products are designed to be consistent with the requirements of the American Society of Heating, Refrigeration and Air
Conditioning Engineers (ASHRAE) Environmental Standard Handbook and the most current revision of Thermal Guidelines for
Data Processing Environments, Second Edition, ASHRAE 2009b.
Cabinets are best suited for Class 1 datacom environments, which consist of tightly controlled environmental parameters, including temperature, dew point, relative humidity and air quality. These facilities house mission-critical equipment and are typically fault-tolerant, including the air conditioners.
18 Technical specifications
The data center should maintain a cleanliness level as identified in ISO 14664-1, class 8 for particulate dust and pollution control.
The air entering the data center should be filtered with a MERV 11 filter or better. The air within the data center should be continuously filtered with a MERV 8 or better filtration system. In addition, efforts should be maintained to prevent conductive particles, such as zinc whiskers, from entering the facility.
The allowable relative humidity level is 20 to 80% non condensing, however, the recommended operating environment range is 40 to 55%. For data centers with gaseous contamination, such as high sulfur content, lower temperatures and humidity are recommended to minimize the risk of hardware corrosion and degradation. In general, the humidity fluctuations within the data center should be minimized. It is also recommended that the data center be positively pressured and have air curtains on entry ways to prevent outside air contaminants and humidity from entering the facility.
For facilities below 40% relative humidity, it is recommended to use grounding straps when contacting the equipment to avoid the risk of Electrostatic discharge (ESD), which can harm electronic equipment.
As part of an ongoing monitoring process for the corrosiveness of the environment, it is recommended to place copper and silver coupons (per ISA 71.04-1985, Section 6.1 Reactivity), in airstreams representative of those in the data center. The monthly reactivity rate of the coupons should be less than 300 Angstroms. When monitored reactivity rate is exceeded, the coupon should be analyzed for material species and a corrective mitigation process put in place.
Storage time (unpowered) recommendation: do not exceed 6 consecutive months of unpowered storage.
Technical specifications 19
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Key Features
- All-flash architecture for exceptional performance
- Scalable design to meet growing storage needs
- Advanced data protection features to ensure data integrity
- Easy-to-use management interface for simplified administration
- Compact 2U form factor for space-saving deployment