SIMCom A7602X-H(E/SA) Hardware Design

A7600C&A7608SA-H

Hardware Design(LINUX)

LTE Module

SIMCom Wireless Solutions Limited.

SIMCom Headquarters Building, Building 3, No. 289 Linhong

Road, Changning District, Shanghai P.R. China

Tel: 86-21-31575100 [email protected]

www.simcom.com

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Document Title:

Version:

Date:

Status:

A7602E-H&A7608SA-H Hardware Design(LINUX)

V1.02

2022-03-03

Released

GENERAL NOTES

SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT

APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM.

THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO

SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH

FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN

THE CUSTOMER’S POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT

DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY

OF THE CUSTOMER OR THE CUSTOMER’S SYSTEM INTEGRATOR. ALL SPECIFICATIONS

SUPPLIED HEREIN ARE SUBJECT TO CHANGE.

COPYRIGHT

THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION WHICH IS THE

PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS

DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE

LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN THE

PROPRIETARY TECHNICAL INFORMATION ,INCLUDING BUT NOT LIMITED TO REGISTRATION

GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN

ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME.

SIMCom Wireless Solutions Limited

SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R.

China

Tel: +86 21 31575100

Email: [email protected]

For more information, please visit: https://www.SIMcom.com/download/list-863-en.html

For technical support, or to report documentation errors, please visit: https://www.SIMcom.com/ask/ or email to: [email protected]

Copyright © 2021 SIMCom Wireless Solutions Limited All Rights Reserved.

www.simcom.com

2 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Version History

Date

2021-08-30

2021-10-27

Version Description of change

1.00

Original

1.01

U pdate GPIO Interfaces

U pdate figure 1

Change PIN119 PIN84 PIN name

Author

Ma Hong Gang

Hu Peng Xiang

Ye Hai Bing

Hu Peng Xiang www.simcom.com

3 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Contents

Table Index..............................................................................................................................6

Figure Index............................................................................................................................7

1 Introduction ......................................................................................................................8

1.1

Product Outline ............................................................................................................................... 8

1.2

Hardware Interfaces Overview .......................................................................................................9

1.3

Hardware Block Diagram ............................................................................................................. 10

1.4

Functional Overview ..................................................................................................................... 11

2 Package Information..................................................................................................... 13

2.1

Pin Assignment Overview .............................................................................................................13

2.2

Pin Description ..............................................................................................................................17

2.3

Mechanical Information ................................................................................................................ 24

2.4

Footprint Recommendation ..........................................................................................................25

3 Interface Application..................................................................................................... 26

3.1

Power Supply ................................................................................................................................26

3.1.1

Power Supply Design Guide ............................................................................................. 27

3.1.2

Recommended Power Supply Circuit ............................................................................... 28

3.1.3

Voltage Monitor* ................................................................................................................ 29

3.2

Power on/Power off/Reset Function .............................................................................................29

3.2.1

Power on ............................................................................................................................29

3.2.2

Power off ............................................................................................................................31

3.2.3

Reset Function ...................................................................................................................33

3.3

UART Interfaces ........................................................................................................................... 34

3.3.1

MAIN UART Design Guide ................................................................................................34

3.3.2

RI and DTR Behavior ........................................................................................................ 36

3.4

USB Interface ............................................................................................................................... 37

3.4.1

USB Diagram .....................................................................................................................37

3.4.2

USB_BOOT ....................................................................................................................... 37

3.4.3

USB_ID .............................................................................................................................. 38

3.5

Analog Audio .................................................................................................................................40

3.6

USIM Interface ..............................................................................................................................42

3.6.1

USIM Application Guide .................................................................................................... 42

3.6.2

USIM Design Notice .......................................................................................................... 43

3.6.3

Recommended USIM Card Holder ................................................................................... 43

3.7

PCM Interface ...............................................................................................................................44

3.7.1

PCM Timing ....................................................................................................................... 45

3.7.2

PCM Application Guide ..................................................................................................... 47

3.8

GPIO Interfaces ............................................................................................................................47

3.9

SD Interface ..................................................................................................................................48

3.10 I2C Interface ................................................................................................................................. 49

3.11 SDIO Interface .............................................................................................................................. 50

3.12 SPI Interface ................................................................................................................................. 51

3.13 Network Status............................................................................................................................. 51

3.14 Flight Mode Control ...................................................................................................................... 52

3.15 RMII Interface ............................................................................................................................... 52

3.16 PCIe Interface* ............................................................................................................................. 53

3.17 GNSS Control Interface ................................................................................................................53

3.18 Other Interface ..............................................................................................................................55

3.18.1 ADC ....................................................................................................................................55

3.18.2 LDO ....................................................................................................................................55

4 RF Specifications...........................................................................................................56

www.simcom.com

4 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

4.1

GSM/UMTS/LTE RF Specifications ............................................................................................. 56

4.2

GSM /UMTS/LTE Antenna Design Guide .................................................................................... 59

4.3

GNSS ............................................................................................................................................61

4.3.1

GNSS Technical Specification ...........................................................................................61

4.3.2

GNSS Application Guide ................................................................................................... 62

5 Electrical Specifications............................................................................................... 64

5.1

Absolute Maximum Ratings ..........................................................................................................64

5.2

Operating Conditions ....................................................................................................................64

5.3

Operating Mode ............................................................................................................................65

5.3.1

Operating Mode Definition .................................................................................................65

5.3.2

Sleep Mode ........................................................................................................................66

5.3.3

Minimum Functionality Mode and Flight Mode ................................................................. 66

5.4

Current Consumption ................................................................................................................... 67

5.5

ESD Notes .................................................................................................................................... 69

6 SMT Production Guide .................................................................................................. 70

6.1

Top and Bottom View of Module .................................................................................................. 70

6.2

Label Information ..........................................................................................................................71

6.3

Typical SMT Reflow Profile .......................................................................................................... 71

6.4

Moisture Sensitivity Level (MSL) ..................................................................................................72

6.5

Recommend Dimensions of SMT Stencil .................................................................................... 73

6.6

Stencil Foil Design Recommendation ..........................................................................................73

7 Packaging.......................................................................................................................74

8 Appendix........................................................................................................................ 76

8.1

Coding Schemes and Maximum Net Data Rates over Air Interface ........................................... 76

8.2

Related Documents ...................................................................................................................... 78

8.3

Terms and Abbreviations.............................................................................................................. 80

8.4

Safety Caution .............................................................................................................................. 82

www.simcom.com

5 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table Index

Table 1: Module Frequency Bands ................................................................................................................................................... 8

Table 2: General Features ................................................................................................................................................................11

Table 3: Pin Definition ....................................................................................................................................................................... 14

Table 4: IO Parameters Definition ...................................................................................................................................................17

Table 5: Electric Feature ...................................................................................................................................................................17

Table 6: Pin Description ....................................................................................................................................................................18

Table 7: VBAT Electronic Characteristic .........................................................................................................................................26

Table 8: Recommended TVS List ....................................................................................................................................................28

Table 9: Power On Timing and Electronic Characteristic ............................................................................................................ 30

Table 10: Power Off Timing and Electronic Characteristic ..........................................................................................................31

Table 11: RESET Electronic Characteristic ................................................................................................................................... 33

Table 12: USB_BOOT Description ..................................................................................................................................................37

Table 13: USB_ID Description .........................................................................................................................................................39

Table 14: Audio Interface Definition ................................................................................................................................................ 40

Table 15: Audio Input Parameter .....................................................................................................................................................41

Table 16: Audio Output Parameter ..................................................................................................................................................41

Table 17: USIM Electronic Characteristic in 1.8 V Mode (USIM_VDD=1.8 V) ........................................................................ 42

Table 18: USIM Electronic Characteristic 3.0V Mode (USIM_VDD=2.95V) .............................................................................42

Table 19: Amphenol USIM Socket Pin Description ...................................................................................................................... 44

Table 20: PCM Format ......................................................................................................................................................................45

Table 21: PCM Timing Parameters (2G/3G mode) ...................................................................................................................... 46

Table 22: PCM Timing Parameters (4G mode) .............................................................................................................................46

Table 23: GPIO Resources .............................................................................................................................................................. 47

Table 24: 3.0V IO MMC/SD Electronic Characteristic (SD_DATA0-SD_DATA3,SD_CLK and SD_CMD) * ....................... 48

Table 25: 1.8V IO MMC/SD Electronic Characteristic (SD_DATA0-SD_DATA3,SD_CLK and SD_CMD) * ....................... 48

Table 26: WIFI Interface ....................................................................................................................................................................50

Table 27: NETLIGHT Status ............................................................................................................................................................ 51

Table 28: FLIGHTMODE Status ......................................................................................................................................................52

Table 29: RMII interface ....................................................................................................................................................................52

Table 30: ADC1 Electronic Characteristics ....................................................................................................................................55

Table 31: LDO Electronic Characteristic ........................................................................................................................................ 55

Table 32: GSM/UMTS/LTE Conducted Transmission Power .................................................................................................... 56

Table 33: Operating Frequencies ....................................................................................................................................................57

Table 34: E-UTRA Operating Bands ...............................................................................................................................................57

Table 35: Conducted Receive Sensitivity .......................................................................................................................................58

Table 36: Reference Sensitivity (QPSK) ........................................................................................................................................ 58

Table 37: Trace Loss ......................................................................................................................................................................... 59

Table 38: Recommended TVS .........................................................................................................................................................60

Table 39: Recommended Passive Antenna Characteristics .......................................................................................................61

Table 40: Recommended LNA and SAW Filter .............................................................................................................................63

Table 41: Absolute Maximum Ratings ............................................................................................................................................ 64

Table 42: Recommended Operating Ratings ................................................................................................................................ 64

Table 43: 1.8V Digital I/O Characteristics* .....................................................................................................................................64

Table 44: Operating Temperature ....................................................................................................................................................65

Table 45: Operating Mode Definition .............................................................................................................................................. 65

Table 46: Current Consumption on VBAT Pins (VBAT=3.8V) .................................................................................................... 67

Table 47: The ESD Performance Measurement Table (Temperature: 25 ℃ , Humidity: 45%) .............................................. 69

Table 48: The Description of Label Information ............................................................................................................................ 71

Table 49: Moisture Sensitivity Level and Floor Life ......................................................................................................................72

Table 50: Tray Size ............................................................................................................................................................................75

Table 51: Small Carton Size .............................................................................................................................................................75

Table 52: Big Carton Size .................................................................................................................................................................75

Table 53: Coding Schemes and Maximum Net Data Rates over Air Interface ........................................................................ 76

Table 54: Related Documents ......................................................................................................................................................... 78

Table 55: Terms and Abbreviations .................................................................................................................................................80

Table 56: Safety Caution .................................................................................................................................................................. 82

www.simcom.com

6 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure Index

Figure 1: Module Block Diagram .....................................................................................................................................................10

Figure 2: Pin Assignment Overview ................................................................................................................................................13

Figure 3: Mechanical Dimensions (Unit: mm) ...............................................................................................................................24

Figure 4: Footprint Recommendation (Unit: mm) .........................................................................................................................25

Figure 5: VBAT Voltage Drop during Burst Emission (GSM/GPRS) ......................................................................................... 26

Figure 6: Power Supply Application Circuit ................................................................................................................................... 27

Figure 7: Linear Regulator Reference Circuit ............................................................................................................................... 28

Figure 8: Switching Mode Power Supply Reference Circuit .......................................................................................................28

Figure 9: Reference Power On/off Circuit ......................................................................................................................................29

Figure 10: Power On Timing Sequence .........................................................................................................................................30

Figure 11: Power Off Timing Sequence ......................................................................................................................................... 31

Figure 12: Reference Reset Circuit ................................................................................................................................................ 33

Figure 13: UART Full Modem .......................................................................................................................................................... 34

Figure 14: UART Null Modem ..........................................................................................................................................................34

Figure 15: Reference Circuit of Level Shift ....................................................................................................................................35

Figure 16: Level Matching Circuit With Triode .............................................................................................................................. 35

Figure 17: RI Behaviour （ SMS and URC report ） ......................................................................................................................36

Figure 18: RI Behaviour （ Voice Call ） ..........................................................................................................................................36

Figure 19: USB Reference Circuit ...................................................................................................................................................37

Figure 20: USB_BOOT Circuit .........................................................................................................................................................38

Figure 21: USB Download Port ....................................................................................................................................................... 38

Figure 22: USB_OTG Diagram ........................................................................................................................................................39

Figure 23: Receiver Circuit ...............................................................................................................................................................40

Figure 24: Microphone Circuit ......................................................................................................................................................... 40

Figure 25: USIM Interface Reference Circuit ................................................................................................................................ 42

Figure 26: USIM Interface Reference Circuit with USIM_DET ...................................................................................................43

Figure 27: Amphenol SIM Card Socket ..........................................................................................................................................44

Figure 28: PCM_SYNC Timing ........................................................................................................................................................45

Figure 29: EXT Codec to Module Timing .......................................................................................................................................45

Figure 30: Module to Codec Timing ................................................................................................................................................46

Figure 31: Audio Codec Reference Circuit .................................................................................................................................... 47

Figure 32: SD Reference Circuit ..................................................................................................................................................... 49

Figure 33: I2C Reference Circuit .....................................................................................................................................................50

Figure 34: NETLIGHT Reference Circuit ....................................................................................................................................... 51

Figure 35: Flight Mode Switch Reference Circuit .........................................................................................................................52

Figure 36: RMII Circuit Diagram ......................................................................................................................................................53

Figure 37: GNSS Circuit Diagram (NMEA to host UART) ...........................................................................................................54

Figure 38: Antenna Matching Circuit (MAIN_ANT) ...................................................................................................................... 59

Figure 39: Antenna Matching Circuit (AUX_ANT) ........................................................................................................................ 60

Figure 40: Active Antenna Circuit ....................................................................................................................................................62

Figure 41: Passive Antenna Circuit (Default) ................................................................................................................................ 62

Figure 42: Top and Bottom View of Module ...................................................................................................................................70

Figure 43: Label Information ............................................................................................................................................................71

Figure 44: The Ramp-soak-spike Reflow Profile of Module ....................................................................................................... 72

Figure 45: Recommend SMT Stencil ..............................................................................................................................................73

Figure 46: Packaging Diagram ........................................................................................................................................................74

Figure 47: Tray Drawing ................................................................................................................................................................... 74

Figure 48: Small Carton Drawing ....................................................................................................................................................75

Figure 49: Big Carton Drawing ........................................................................................................................................................ 75

www.simcom.com

7 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the SIMCom module. With the help of this document and other software application notes/user guides, users can understand and use module to design and develop applications quickly.

1.1 Product Outline

Aimed at the global market, the module support GSM, WCDMA, LTE-TDD and LTE-FDD. Users can choose the module according to the wireless network configuration. The supported radio frequency bands are described in the following table.

Tabl e 1: Module Frequency Bands

Standard

GSM

WCDMA

LTE-FDD

LTE-TDD

Frequency bands

A7602E-H

850MHz

900MHz

1800MHz

1900MHz

BAND1

BAND2

BAND5

BAND8

LTE-FDD B1

LTE-FDD B2

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B20

LTE-FDD B28

LTE-FDD B66

LTE TDD B34

LTE TDD B38





















 www.simcom.com

































Module

A7608SA-H





















A7600C







8 / 82

Category

GNSS

Aux ANT

Main ANT

/

/

/

/

LTE TDD B39

LTE TDD B40

LTE TDD B41

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02





CAT4

Optional

Optional

Optional





CAT4

Optional

Optional

Optional







CAT4

Optional

Optional

Optional

With a small physical dimension of 30*30*2.5 mm and with the functions integrated, the module can meet almost any space requirement in users’ applications, such as smart phone, PDA, industrial handhold, machine-to-machine and vehicle application, etc.

1.2 Hardware Interfaces Overview

The interfaces are described in detail in the next chapter include:

 Power Supply

 USB2.0 Interface

 UART Interfaces

 MMC/SD Interface

 SDIO Interface

 USIM Interface

 GPIOs

 ADC

 Two channels LDO Power Output

 PCM Interface

 SPI Interface

 I2C Interface

 RMII Interface

 PCIe Interface*

 Analog Audio Interface www.simcom.com

9 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1.3 Hardware Block Diagram

The block diagram of the module is shown in the figure below.

Figure 1: Module Block Diagram www.simcom.com

10 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1.4 Functional Overview

Table 2: General Features

Feature

Power supply

Power saving

Radio frequency bands

Transmitting power

Data Transmission

Throughput

Antenna

GNSS

SMS

USIM interface

USIM application toolkit

Phonebook management

Audio feature

Implementation

Single supply voltage 3.4

～ 4.2 V, recommend 3.8 V.

Current in sleep mode : <5 mA

Please refer to the table 1

GSM/GPRS power class:

--GSM850: 4 (2W)

--EGSM900: 4 (2W)

--DCS1800: 1 (1W)

--PCS1900: 1 (1W)

EDGE power class:

--GSM850: E2 (0.5W)

--EGSM900: E2 (0.5W)

--DCS1800: E1 (0.4W)

--PCS1900: E1 (0.4W)

UMTS power class:

--WCDMA :3 (0.25W)

LTE power class: 3 (0.25W)

GPRS multi-slot class 12

EDGE multi-slot class 12

UMTS R99 speed: 384 kbps DL/UL

HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)

HSDPA/HSUPA: 2.2 Mbps(UL), 2.8 Mbps(DL)

LTE-FDD CAT4 ： 150 Mbps (DL),50 Mbps (UL)

LTE-TDD CAT4 ： 130 Mbps (DL),35 Mbps (UL)

GSM/UMTS/LTE main antenna.

UMTS/LTE auxiliary antenna

GNSS antenna

GNSS engine (GPS,GLONASS and BD)

Protocol: NMEA

MT, MO, CB, Text and PDU mode

SMS storage: USIM card or ME(default)

Transmission of SMS alternatively over CS or PS.

Support identity card: 1.8 V / 3 V

Support SAT class 3, GSM 11.14 Release 98

Support USAT

Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

Support PCM interface

Only support PCM master mode and short frame sync, 16-bit linear data formats www.simcom.com

11 / 82

UART interfaces eMMC/SD

SDIO

USB

PCIe

RMII

Firmware upgrade

Physical characteristics

Temperature range

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Support analog audio interface

MAIN UART:

A full modem serial port by default

Baud rate: 9600 bps to 3.6Mbps(default:115200 bps)

Can be used as the AT commands or data stream channel

Support RTS/CTS hardware handshake

Multiplex ability according to GSM 07.10 Multiplexer Protocol

UART2:

Receive GNSS data

Debug UART:

Used for Software console and log output

Baud rate: 9600 bps to 3.6 Mbps(default:115200 bps)

GNSS UART ：

GNSS UART communication interface;

Baud rate: 9600 bps or 115200 bps(default:9600 bps)

Support eMMC and SD Cards with 2.85 V on SD port

Support SDIO with 1.8 V only on SDIO port

USB2.0 high speed interface

Support PCIe Gen1 Host mode for WiFi connection*(in developping)

Single Lane

Support 100M/1000M Ethernet

Support 3.3v or 1.8v phy

Firmware upgrade over USB interface

Size:30*30*2.5 mm

Weight:5.7 g

Normal operation temperature: -30 °C to +80 °C

Extended operation temperature: -40 °C to +85 °C*

Storage temperature -45 °C to +90 °C

NOTE

Module is able to make and receive voice calls, data calls, SMS and make GPRS/UMTS/HSPA+/LTE traffic in -40 ℃ ~ +85 ℃ . The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

www.simcom.com

12 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

2 Package Information

2.1 Pin Assignment Overview

All functions of the module will be provided through 172 pads that will be connected to the customers’ platform. The following Figure is a high-level view of the pin assignment of the module.

Figure 2: Pin Assignment Overview

NOTE

The pins that have 2 or 3 names means the pin have different function, the black color is the default function, and the red color is the multiplex function.

www.simcom.com

13 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 3: Pin Definition

Pin No.

Pin name

55

57

59

61

47

49

51

53

39

41

43

45

31

33

35

37

63

65

67

69

71

73

23

25

27

29

15

17

19

21

5

7

1

3

9

11

13

GND

PWRKEY

GND

SPI_MISO

SPI_CS

USB_VBUS

USB_DP

VDD_1V8

USIM_DATA

USIM_CLK

SD_CMD

SD_DATA1

SD_DATA3

SDIO_DATA1

PCIE_WK_IN/SDIO_CMD

SDIO_DATA3

WL_PWR_EN/GPIO11

NC

GND

VBAT

GND

GND

GPIO13

ADC1

WL_PDN

NETLIGHT/GPIO17

USIM_DET

SCL

GND

AUX_ANT

GND

VBAT

GND

CTS

RI

TXD

GPIO24/PCM_OUT www.simcom.com

Pin No.

Pin name

56

58

60

62

48

50

52

54

40

42

44

46

32

34

36

38

64

66

68

70

72

74

24

26

28

30

16

18

20

22

6

8

2

4

10

12

14

GND

RESET

SPI_CLK

SPI_MOSI

GND

USB_DN

GND

USB_ID

USIM_RST

USIM_VDD

SD_DATA0

SD_DATA2

SD_CLK

SDIO_DATA2

SDIO_DATA0

PCIE_RSTN/SDIO_CLK

I2S_MCLK/GPIO12

NC

VBAT

GND

DBG_TXD

VDD_AUX

ADC1

SD_DET

TXD2/GPIO16

RXD2/GPIO18

FLIGHTMODE

SDA

GND

GND

VBAT

GND

RTS/MAC_RST

RXD

DCD/PCIE_CHIP_EN/LCD_RST

DTR/LCD_DC_RS

GPIO25/PCM_IN

14 / 82

115

117

119

121

107

109

111

113

123

125

127

129

131

99

101

103

105

91

93

95

97

83

85

87

89

75

77

79

81

133

135

137

139

141

143

145

147

149

151

153

155

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

116

118

120

122

108

110

112

114

124

126

128

130

132

100

102

104

106

92

94

96

98

84

86

88

90

76

78

80

82

134

136

138

140

142

144

146

148

150

152

154

156 www.simcom.com

GPIO26/PCM_SYNC

GND

GNSS_ANT

GND

NC

USB_BOOT*

NC

GND

GND

GND

GND

GND

GND

GND

GND

GND

NC

NC

AGND

GNSS_RXD

WL_CLK_EN

NC

GPIO04

32KHZ*

NC

GND

GND

GND

GND

MIC_N

EAR_N

GND

MAC_MDO

RMII_RX_DV

RMII_INT

VGNSS_BACKUP

PCIE_REFCLK_N

PCIE_TX_P

GND

PCIE_RX_N

GND

15 / 82

GPIO27/PCM_CLK

GND

GND

MAIN_ANT

Reserved

NC

GND

GND

GND

GND

GND

GND

GND

GND

GND

DBG_RXD

NC

AGND

GNSS_TXD

LCD_BK_EN

1PPS*

GND

MAC_MDC

NC

NC

RMII_TX_EN

RMII_CLK

VGNSS

PCIE_REFCLK_P

GND

PCIE_TX_N

PCIE_RX_P

GND

GND

GND

GND

GND

MIC_P

EAR_P

MIC_BIAS

GND

165

167

169

171

157

159

161

163

GND

VDDMAC_IO

RMII_TXD0

RMII_RXD1

GND

GND

GND

GND

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

166

168

170

172

158

160

162

164

GND

RMII_TXD1

RMII_RXD0

GND

GND

GND

GND

GND

Before the normal power on, the USB_BOOT cannot be pull down to ground, otherwise module will not be powered up normally.

www.simcom.com

16 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

2.2 Pin Description

Table 4: IO Parameters Definition

Pin Type

PI

PO

AI

AIO

I/O

DI

DO

DIO

DOH

DOL

PU

PD

Description

Power input

Power output

Analog input

Analog input/output

Bidirectional input /output

Digital input

Digital output

Digital input/output

Digital output with high level

Digital output with low level

Pull up

Pull down

Table 5: Electric Feature

Power domain

P3

P5,P8

P6

Symbol

VIH

VIL

Rpu

Rpd

3.0 V

VOH

1.8 V

VOH

VOL

VIH

VIL

Rpu

Rpd

1.8 V

VOH

VOL

VOL

VIH

VIL

Rpu

Rpd

1.8 V

Description

Output high

Output low

Input high

Input low

Pull-up resiter

Pull-down resiter

Output high

Output low

Input high

Input low

Pull-up resiter

Pull-down resiter

Output high

Output low

Input high

Input low

Pull-up resiter

Pull-down resiter www.simcom.com

Min

1.6 V

0 V

1.26 V

-0.3 V

55 K Ω

51 K Ω

1.6 V

0 V

1.26 V

-0.3 V

55 K Ω

51 K Ω

2.4 V

0 V

2 V

-0.3 V

26 K Ω

27 K Ω

Typ

-

-

1.8 V

0 V

79 K Ω

87 K Ω

-

-

-

1.8 V

79 K Ω

87 K Ω

-

-

-

0 V

47 K Ω

54 K Ω

Max

1.8 V

0.2 V

2.0 V

0.54 V

121 K Ω

169 K Ω

1.8 V

0.2 V

2.0 V

0.54 V

121 K Ω

169 K Ω

-

0.4 V

3.3 V

0.8 V

72 K Ω

267 K Ω

17 / 82

VOH

VOL

VIH

VIL

Rpu

Rpd

3.3 V

VOH

VOL

VIH

VIL

Rpu

Rpd

Output high

Output low

Input high

Input low

Pull-up resiter

Pull-down resiter

Output high

Output low

Input high

Input low

Pull-up resiter

Pull-down resiter

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1.6 V

0 V

1.26 V

-0.3 V

55 K Ω

51 K Ω

2.4 V

0 V

2 V

-0.3 V

26 K Ω

27 K Ω

-

-

-

-

-

-

1.8 V

79 K

87 K

0 V

47 K

54 K

Ω

Ω

Ω

Ω

-

1.8 V

0.2 V

2.0 V

0.54 V

121 K

169 K

0.4 V

3.6 V

0.8 V

72 K Ω

267 K

Ω

Ω

Ω

Table 6: Pin Description

Pin Name

Power supply

VBAT

VDD_AUX

VDD_1V8

GND

RESERVED

NC

PWRKEY

RESET

Pin N o .

38,39,62,63

44 -

-

Power

Domain

Defalt

Stats

PI

PO

Description Comment

Power supply for the module.

LDO power output for other external circuits with

Max 150 mA current output. Its output voltage is 2.85 V fixed.

1.8 V output with Max 50 mA current output for external circuit, such as level shift circuit.

Power supply, voltage range:

3.4

～ 4.2 V.

If unused, keep it open.

If unused, keep it open.

15

1,2,5,10,14,3

7,40,41,43,57

,58,60,61,64,

65,77,78,80,8

1,88~105,118

,134,137,140

~149,155~15

8,164~172

84

35,36,83,86,8

7,107~109,11

7,122~124

-

3 -

-

4

-

PO

Ground

-

DI,PU

DI, PU www.simcom.com

System power on/off control input, active low.

System reset control input, active low.

Keep these pins unconnected

Keep these pins unconnected

It has been pulled up to VBAT via 50

K Ω resistor internally.

It has been pulled up to VBAT via 50

K Ω resistor internally.

18 / 82

SD Interface

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

SD_CLK

USIM Interface

USIM_DATA 17

USIM_RST

USIM_CLK

USIM_VDD

18

19

20

USIM_DET 53

USB Interface

USB_VBUS 11

USB_DN 12

21

22

23

24

25

26

SD_DET 48

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

P8

P8

P8

P8

P8

-

-

-

P8

P3

P5

P5

P5

P3

I/O, PU

I/O, PU

I/O, PU

I/O, PU

I/O, PU

I/O, PD

SD Card Bidirectional command/response signal.

SD Card Bidirectional data signal bit 0.

SD Card Bidirectional data signal bit 1.

SD Card Bidirectional data signal bit 2.

SD Card Bidirectional data signal bit 3.

SD Card clock.

The power domain of SD I/O pins depends on

P8. If unused, keep them open.

DI, PU SD hot-plug detect.

Default: GPIO

Optional: SD card detecting input.

H: SD card is removed

L: SD card is inserted.

Pull it up to

VDD_EXT with a

100 kΩ resistor.If

unused, keep it open.

I/O, PU USIM Card data.

which has been pulled up via 4.7

K Ω resistor to

USIM_VDD internally. Do not pull it up or down externally.

DO, PU USIM Card reset.

DO, PU USIM Card clock.

PO

DI,PU

USIM Card power supply.

USIM Card hot-plug detect.

its output Voltage depends on USIM card type automatically. Its output current is up to 50 mA.

Default: GPIO

Optional: USIM card detecting input.

H: USIM is removed

L: USIM is inserted

AI

AIO www.simcom.com

Valid USB detection input with 3.6~5.25 V detection voltage.

Negative line of the differential, bi-directional

For USB connection detection only, not power supply.

Requires differential

19 / 82

USB_DP 13

USB_ID

MAIN UART

TXD

RXD

RTS

CTS

RI

DCD

DTR

GNSS UART

TXD2

16

50

RXD2

Debug UART

DBG_TXD

DBG_RXD

PCM Interface

PCM_OUT

PCM_IN

PCM_SYNC

PCM_CLK

52

42

106

73

74

75

76

71

68

66

67

69

70

72

I2S_MCLK 34

SPI Interface

SPI_CLK

SPI_MISO

6

7

SPI_MOSI 8

SPI_CS 9

LCD Control Interface

LCD_DC_RS 72

LCD_RST

LCD_BK_EN

I2C interface

70

114

SCL 55

-

-

P3

P3

P3

P3

P3

P3

P3

P3

P3

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

AIO

DI, PU

USB signal.

Positive line of the differential, bi-directional

USB signal.

USB ID input impedance of 90

Ω. USB 2.0

supports downward compatibility .

Keep it open.

DO, PU Transmit data.

DI,PU Receive data

DO,PU

DI,PU

DTE request to send.

DCE clear to send.

DO,PU Ring Indicator

DO, PU Data carrier detect.

DI, PU

Data terminal ready, sleep mode control.

DO,PU

DI, PU

DO, PU

DI, PU

Transmit data for GNSS communication.

Receive data for GNSS communication.

Transmit data for debug.

Receive data for debug.

Print Kernel log

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

DO, PD PCM data output.

DI, PD

DO,PD

PCM data input.

PCM data frame sync signal.

DO, PD PCM data bit clock.

DO, PD

Provides digital clock output for external audio codec.

If unused, please keep them open.

DO, PD SPI clock output

DI, PD

DO, PD

SPI master in/slave out data

SPI master out/slave in data

DO, PD SPI chip-select output

DO,PU

DO,PU

DO,PD

LCD data/command select

LCD reset

LCD Backlight control

If unused, please keep them open.

OD,PU www.simcom.com

I2C serial clock output

It has been pulled up to VDD_1V8 via 2.2 KΩ

20 / 82

SDA 56

SDIO Interface

SDIO_DATA0 30

SDIO_DATA1

SDIO_DATA2

SDIO_DATA3

SDIO_CLK

27

28

31

32

SDIO_CMD 29

WIFI Control Interface

WL_PDN 49

WL_PWR_EN 33

WL_CLK_EN 115

PCIe Interface*

PCIE_WK_IN 29

PCIE_RST 32

PCIE_CHIP_EN 70

PCIE_REFCLK

_P

PCIE_REFCLK

_N

PCIE_TX_P

132

133

135

PCIE_TX_N

PCIE_RX_P

136

138

PCIE_RX_N 139

Analog Audio Interface

AGND 110,111

MIC_P 150

MIC_N 151

EAR_P

EAR_N

MIC_BIAS

RMII Interface

RMII_CLK

RMII_INT

RMII_TXD0

RMII_TXD1

152

153

154

128

129

161

160

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

-

-

-

-

-

-

P3

P3

P3

-

-

-

-

-

-

I/O, PU

I/O, PU

I/O, PU

I/O, PU

DO, PU

I/O, PU

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

OD,PU

I2C serial data input/output resistor internally.

If unused, keep them open.

Secure digital controller data bit 0

Secure digital controller data bit 1

Secure digital controller data bit 2

Secure digital controller data bit 3

Secure digital controller clock

Secure digital Controller command/response signal

DO, PU

DO, PD

DO, PD

WIFI chip enable.

WIFI power enable.

WIFI Clock enable.

Active high.If

unused, please keep them open.

If unused, please keep it open.

DI,PU

DO,PU

DO,PU

AIO

AIO

AO

AO

AI

AI

PCIe wake up host

PCIe reset signal

Chip enable

PCIe reference clock positive

PCIe reference clock negative

PCIe transmit positive

PCIe transmit negative

PCIe receive positive

PCIe receive negative

PI

AI

AI

AO

AO

PO

Analog Ground

Microphone input positive

Microphone negative input

Earphone output positive

Earphone output negative

Microphone bias voltage

P6

P6

P6

P6

DI,PU

DI, PU

DO,PU

DO,PU www.simcom.com

RMII Clock

PHY interrupt output

RMII transmit data bit 0

RMII transmit data bit 1

Only support host mode, it can connect WiFi chip or other chip.

21 / 82

RMII_RXD0

RMII_RXD1

RMII_RX_DV

RMII_TX_EN

162

163

127

126

VDDMAC_IO 159

MAC Control Interface

MAC_MDC 120

MAC_MDIO 125

GNSS Control Interface

VGNSS 130

VGNSS_BACK

UP

131

GNSS_TXD

GNSS_RXD

112

113

1PPS*

GPIO Interface

116

GPIO11 33

GPIO12

GPIO13

GPIO24

GPIO25

GPIO26

GPIO27

RF Interface

34

45

73

74

75

76

MAIN _ANT 82

GNSS_ANT 79

AUX_ANT 59

Other Interface

ADC1 46,47

NETLIGHT 51

FLIGHTMODE 54

USB_BOOT* 85

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

-

P6

P6

P6

P6

P6

P6

P6

DI, PU

DI, PU

DI, PU

DO,PD

PI

DO,PD

OD,PU

PI

RMII receive data bit 0

RMII receive data bit 1

RMII receive control

RMII transmit control

MAC IO voltage configure

MAC management Clock

MAC management data

GNSS supply voltage

GNSS backup battery

-

GNSS NMEA data port

GNSS NMEA data port

Need pull it up to

PHY VIO with an external 1.5

K Ω resistor;

Power supply, voltage range:

1.7

～ 1.9 V.

Power supply, voltage range:

1.4

～ 3.6 V.

In developing

-

-

-

PI

-

DO

DI

-

P3

P3

P3

P3

P3

P3

P3

P3

P3

P3

DIO,PD General input/output 11

DIO,PD General input/output 12

DIO,PU General input/output 13

DIO,PD General input/output 24

DIO,PD General input/output 25

DIO,PD General input/output 26

DIO,PD General input/output 27

AIO

AI

AI

AI

DO,PD

DI,PD

DI,PD www.simcom.com

MAIN antenna soldering pad

GNSS antenna soldering pad

Auxiliary soldering pad antenna

Analog-digital converter input 1

LED control output as network status indication.

Flight Mode control input.

High level(or open):

Normal Mode

Low level: Flight Mode

Forces the module to enter download mode emergency

Max input voltage

1.8V

22 / 82

32KHZ* 121 -

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

DO,PD In developing www.simcom.com

23 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

2.3 Mechanical Information

The following figure shows the package outline drawing of module.

Figure 3: Mechanical Dimensions (Unit: mm) www.simcom.com

24 / 82

2.4 Footprint Recommendation

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 4: Footprint Recommendation (Unit: mm) www.simcom.com

25 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3 Interface Application

3.1 Power Supply

The power supply pins of module include 4 pins (pin 62&63, pin 38&39) named VBAT.

The 4 VBAT pads supply the power to RF and baseband circuits directly.

On VBAT pads, the ripple current up to 2 A typically, due to GSM/GPRS emission burst (every 4.615 ms), may cause voltage drop. So the power supply for these pads must be able to provide sufficient current up to more than 2 A in order to avoid the voltage drop is more than 300 mV.

The following figure shows the VBAT voltage ripple wave at the maximum power transmit phase.

Figure 5: VBAT Voltage Drop during Burst Emission (GSM/GPRS)

The test condition: The voltage of power supply for VBAT is 3.8 V, Cd=100 µF tantalum capacitor

(ESR=0.7 Ω) and Cf=100 nF (Please refer to Figure 6 application circuit).

Table 7: VBAT Electronic Characteristic

Symbol

VBAT

I

VBAT(peak)

I

VBAT(average)

Description

Module power voltage

Module power peak current in normal mode.

Module power average current in normal mode

I

VBAT (sleep)

Power supply current in sleep mode

I

VBAT (power-off)

Module power current in power off mode.

Min. Typ. Max. Unit

3.4

3.8

4.2

V

2 A

Please refer to the table 34

150 uA www.simcom.com

26 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.1.1

Power Supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4 V, even during a transmit burst, when current consumption may rise up to 2 A. If the voltage drops below 3.4 V, the RF performance may be affected.

If the power supply for VBAT pins can support up to 2 A, more than 300 uF capacitors are recommended. Otherwise users must use a total of 1000 uF capacitors typically, in order to avoid of the voltage drop more than 300 mV.

Some multi-layer ceramic chip (MLCC) capacitors (0.1/1 uF) with low ESR in high frequency band can be used for EMC.

These capacitors should be put as close as possible to VBAT pads. Also, users should keep VBAT trace on circuit board wider than 2 mm to minimize PCB trace impedance. The following figure shows the recommended circuit. Recommend part of FB101 is BLM21PG300SN1D or MPZ2012S221A 。

Figure 6: Power Supply Application Circuit

In addition, in order to guard for ESD or surge protection, it is suggested to use a TVS to protect the module.

Customer could only power pin 62, 63 or only power pin 38, 39, for these pins are connected inside the module.

www.simcom.com

27 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 8: Recommended TVS List

5

6

3

4

No Manufacturer Part Number

1

2

Js-ele

Prisem

Reverse Stand-Off Voltage Package

ESDBW5V0A1 5 V

PESDHC2FD4V5BH 4.5 V

DFN1006-2L

DFN1006-2L

Way-on

Will semi

Will semi

Way-on

WS05DPF-B

ESD5611N

ESD56151W05

WS4.5DPV

5 V

5 V

5 V

4.5 V

DFN1006-2L

DFN1006-2L

SOD-323

DFN1610-2L

3.1.2

Recommended Power Supply Circuit

It is recommended that a switching mode power supply or a linear regulator power supply is used. It is important to make sure that all the components used in the power supply circuit can resist a peak current up to 2 A.

The following figure shows the linear regulator reference circuit with 5 V input and 3.8 V output.

Figure 7: Linear Regulator Reference Circuit

If there is a big voltage difference between input and output for VBAT power supply, or the efficiency is extremely important, then a switching mode power supply will be preferable. The following figure shows the switching mode power supply reference circuit.

Figure 8: Switching Mode Power Supply Reference Circuit www.simcom.com

28 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1.

The Switching Mode power supply solution for VBAT must be chosen carefully against Electro

Magnetic Interference and ripple current from depraving RF performance.

2.

If the DC input is 12 V, customer must select a buck circuit to get better power efficiency.

3.1.3

Voltage Monitor*

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

For monitoring the VBAT voltage outside or within a special range, the AT command “AT+CVALARM” can be used to enable the under-voltage warning function.

If users need to power off module, when the VBAT voltage is out of a range, the AT command “AT+CPMVT” can be used to enable under-voltage power-off function.

1. Under-voltage warning function and under-voltage power-off function are disabled by default. For more information about these AT commands, please refer to Document [1].

2. “*” means under development.

3.2 Power on/Power off/Reset Function

3.2.1

Power on

Module can be powered on by pulling the PWRKEY pin down to ground.

The PWRKEY pin has been pulled up with a diode to VBAT internally, so it does not need to be pulled up externally. It is strongly recommended to put an ESD protection diode, close to the PWRKEY pin as it would strongly enhance the ESD performance of PWRKEY pin. Please refer to the following figure for the recommended reference circuit.

Figure 9: Reference Power On/off Circuit www.simcom.com

29 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Module could be automatically power on by connecting PWRKEY pin to ground via 0 Ω resistor directly.

The power-on scenarios are illustrated in the following figure.

Figure 10: Power On Timing Sequence

Table 9: Power On Timing and Electronic Characteristic

Symbol Parameter

T on

The time of active low level impulse of PWRKEY pin to power on module

T on(uart)

The time from power-on issue to UART port ready

T on(vdd_aux)

The time from power-on issue to VDD_AUX ready

T

0(vdd_aux)

T on(vdd_1V8)

T on(usb)

The VDD_AUX is on before the software ready

The time from power-on issue to VDD_1V8 ready

The time from power-on issue to USB port ready

V

IH

Input high level voltage on PWRKEY pin

V

IL

Input low level voltage on PWRKEY pin

Min.

Typ. Max. Unit

500 1000 2000 ms

15

20

3

100

20

0.7*V

BAT

-0.3

-

-

-

-

25

VBAT

0

-

-

-

-

-

VBAT

+0.3

0.5

s s s ms s

V

V

The time may vary for the different software version;

When the Ton time less than 500ms, the module might power on, but only the Ton time more than 500 ms, the module will power on is guaranteed.

www.simcom.com

30 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.2.2

Power off

The following methods can be used to power off module.

●

Method 1: Power off module by pulling the PWRKEY pin down to ground.

●

●

●

Method 2: Power off module by AT command “AT+CPOF”.*

Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by AT command “AT+CPMVT”. *

Method 4: Over-temperature or under-temperature automatic power off.

If the temperature is outside the range of -30~+80 ℃ , some warning will be reported via AT port. If the temperature is outside the range of -40~+85 ℃ , module will be powered off automatically.

“AT+CPOF” and “AT+CPMVT” in developing;

These procedures will make module disconnect from the network and allow the software to enter a safe state, and save data before module be powered off completely.

The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

Figure 11: Power Off Timing Sequence

Table 10: Power Off Timing and Electronic Characteristic

Symbol

T off

Parameter

The active low level time pulse on PWRKEY pin to power off module

The time from power-off issue to UART port off T off(uart)

T off(usb)

The time from power-off issue to USB port off

T off(VDD_AUX)

The time from power-off issue to vdd_aux off www.simcom.com

Min. Typ. Max. Unit

2.5

-5.0

s

TBD TBD -

TBD TBD -

TBD s s s

31 / 82

T off(VDD_1V8)

T off-on

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

The time from power-off issue to vdd_1V8f

The buffer time from power-off issue to power-on issue

TBD -

3 -

s s

1. It is suggested that the host can cut off the power off the module, when the module could not switch off by PWRKEY of RESET interface, customer could cut off the power to restart the module.

2. If the PWERKY and RESET key works normally, it is not suggested to switch off module by remove the power supply for that might damage the flash.

3. The power off time may vary for the local net status.

www.simcom.com

32 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.2.3

Reset Function

Module can be reset by pulling the RESET pin down to ground.

This function is only used as an emergency reset, when AT command “AT+CPOF” and the PWRKEY pin all have lost efficacy.

The RESET pin has been pulled up with a 40 K Ω resistor to VBAT internally, so it does not need to be pulled up externally. It is strongly recommended to put a100 pF capacitor and an ESD protection diode close to the RESET pin. Please refer to the following figure for the recommended reference circuit.

Figure 12: Reference Reset Circuit

Table 11: RESET Electronic Characteristic

Symbol

T reset

V

IH

V

IL

Parameter

The active low level time impulse on

RESET pin to reset module

Input high level voltage

Input low level voltage

Min.

500

0.7*VBAT

-0.3

Typ.

Max.

Unit

1000

VBAT

0

2000 ms

VBAT+

0.3

0.5

V

V

1. When the module could not switch off by PWRKEY of RESET interface, customer should cut off the power to restart the module.

2. If the PWERKY and RESET key works normally, it is not suggested to switch off module by remove the power supply for that might damage the flash.

www.simcom.com

33 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.3 UART Interfaces

The module provides three UART interfaces: one MAIN UART interface, one Debug UART interface, and one GNSS UART interface.

 MAIN UART : Module provides a 7-wire UART (universal asynchronous serial transmission) interface as

DCE (Data Communication Equipment). AT commands and data transmission can be performed through UART interface.

 Debug UART : Used for Linux console and log output.

Default baud rate: 115200 bps

 GNSS UART : Used for GNSS communication.

Default baud rate: 9600bps

3.3.1

MAIN UART Design Guide

The following figures show the reference design.

Figure 13: UART Full Modem

Figure 14: UART Null Modem

The module UART is 1.8 V voltage interface. If user’s UART application circuit is 3.3 V voltage interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR provided by Texas

Instruments is recommended. The following figure shows the voltage matching reference design.

www.simcom.com

34 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 15: Reference Circuit of Level Shift

Customers can use another level shifter circuits as follow.

Figure 16: Level Matching Circuit With Triode

1.

User need to use high speed transistors such as MMBT3904.

2.

MAIN UART supports the following baud rates: 9600, 19200, 38400, 57600, 115200, 230400,

460800, 921600, 1843200, 3686400 bps. The default band rate is 115200 bps.

www.simcom.com

35 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.3.2

RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application CPU.

Normally RI will keep high level until certain conditions such as receiving SMS, or a URC report coming, and then it will change to low level.

Figure 17: RI Behaviour （ SMS and URC report ）

Normally RI will be kept at a high level until a voice call, then it will output periodic rectangular wave with

5900 ms low level and 100ms high level. It will output this kind of periodic rectangular wave until the call is answered or hung up.

Figure 18: RI Behaviour （ Voice Call ）

For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake module from sleep. When module enters sleep mode, pulling down DTR can wake module.

www.simcom.com

36 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.4 USB Interface

The module contains a USB interface compliant with the USB2.0 specification as a peripheral, but the USB charging function is not supported.

3.4.1

USB Diagram

Module can be used as a USB device. module supports the USB suspend and resume mechanism which can reduce power consumption. If there is no data transmission on the USB bus, module will enter suspend mode automatically, and will be resumed by some events such as voice call, receiving SMS, etc.

The USB interface is a frequency used debug port; it is suggested to reserved test point.

Figure 19: USB Reference Circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the junction capacitance of the ESD component on USB data lines. Typically, the capacitance should be less than 1 pF.

It is recommended to use an ESD protection component such as ESD9L5.0ST5G provided by On

Semiconductor (www.onsemi.com ).

The USB_DN and USB_DP nets must be traced by 90 Ω +/-10% differential impedance.

3.4.2

USB_BOOT

Module can enter in download mode by USB_BOOT.

Table 12: USB_BOOT Description

PIN No PIN Name I/O description Power domain Default status Index

85 USB_BOOT DI USB boot 1.8 V B-PU

If the module download failed, then customer can make module enter download mode via this Pin.

Before the module power on, pull the USB_BOOT to ground , then push the PWRKEY to power on module, when the module enter download mode, the pull down should be removed.

www.simcom.com

37 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 20: USB_BOOT Circuit

Customer can check the download port in the device management.

Figure 21: USB Download Port

3.4.3

USB_ID

Module support OTG function , but the USB_VBUS(PIN 11) cannot supply device with 5 V, so customer should design the circuit to power the USB device.

www.simcom.com

38 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 13: USB_ID Description

PIN

No

PIN

Name

I/O Function description

High level: module in USB device mode.

16 USB_ID DI

Low level: module in USB host mode.

Domain Default

Status

1.8 V DI-PH

index

Figure 22: USB_OTG Diagram www.simcom.com

39 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.5 Analog Audio

The module support 1 pair of audio input(MIC_P,MIC_N) for microphone, and support 1 pair of audio output for earphone.

Table 14: Audio Interface Definition

PIN No

150

151

152

153

154

110,111

PIN

Name

MIC_P

MIC_N

EAR_P

EAR_N

I/O Function description

AI

AI

Mic input positive

Mic input negative

AO Earphone output positive

AO Earphone output negative

MIC_BIAS PO Mic bias voltage

AGND Analog ground -

-

-

-

-

-

Power domain

-

-

-

-

-

-

Default Index

Customer could use “ AT+CMIC ” to tune the gain of microphone input signal, “ AT+CLVL ” could used to tune the gain of output gain.

The following figure shows the reference circuit.

Figure 23: Receiver Circuit

Figure 24: Microphone Circuit www.simcom.com

40 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 15: Audio Input Parameter

Parameter

Mic bias voltage

Test condition

Working current

Dynamic Range Measured as THD+N at

60dB below full scale, 0dB

Peak-SNDR

PGA gain,20~20KHz

-4dBFS output, at 0dB gain

THD

PGA+ADC gain options

-1dBFS output, at 0dB gain

GAIN=

(0dB,6dB,12dB,18dB,24dB)

-

-

-

-

-

-

Min

86

80

12

Typ

1.8

-

91

-

-

-

-

Max

-

2.0

Unit

V mA dB dB dB

Table 16: Audio Output Parameter

Parameter

Output

DAC

Class-AB

Test condition

RL=32 Ω eraphone

RL=10K Ω

Mono,32 Ω, differential

-

Dynamic Range

（

Typ

）

101 dBA

100 dBA

THD+N(Typ)

15

-96 dB(@vout -

2 dBv)

-90 dB(0.00316%)

(@20 mW output)

Power

（

1%

THD

）

90

1.59 Vp

37 mW

GSM signal can interfere with audio through coupling and conduction .

Users can filter out coupling interference by adding 33 pF and 10 pF capacitors to the audio path. The 33 pF capacitor mainly filters out the interference in the GSM900 frequency band, and the 10 pF capacitor mainly filters out the interference in the DCS1800 frequency band. The coupling interference of TDD has a lot to do with the user's PCB design. In some cases, TDD in the 900 frequency band is more serious, and in some cases, the TDD interference in the 1800 frequency band is more serious.Therefore, the user can select the required filter capacitor according to the actual test results, and sometimes it is not necessary to paste the filter capacitor.

The antenna of GSM is the main source of coupling interference for TDD, so users should pay attention to keeping the audio trace away from the RF antenna and VBAT during PCB layout and wiring. It is best to place a set of audio filter capacitors close to the module end and another set close to the interface end. The audio output should be routed in accordance with the differential signal rules.

The conduction interference is mainly caused by the voltage drop of VBAT. If Audio PA is directly powered by VBAT, it is easier to hear a "squeak" sound at the output of SPK. Therefore, it is best to connect the input of Audio PA in parallel when designing the schematic. Some large value capacitors and series magnetic beads.

TDD and GND are also closely related. If GND is not handled well, many high-frequency interference signals will interfere with MIC and Speaker through bypass capacitors and other components.

Therefore, it is important for users to ensure good GND performance during the PCB design stage.

www.simcom.com

41 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.6 USIM Interface

Module supports both 1.8 V and 3.0 V USIM Cards.

Table 17: USIM Electronic Characteristic in 1.8 V Mode (USIM_VDD=1.8 V)

Symbol

USIM_VDD

V

V

V

V

IH

IL

OH

OL

Parameter

LDO power output voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min.

1.75

0.65*USIM_VDD -

-0.3

0

Typ.

1.8

USIM_VDD -0.45 -

0 0

Max.

1.95

USIM_VDD +0.3

V

0.35*USIM_VDD V

Unit

V

USIM_VDD

0.45

V

V

Table 18: USIM Electronic Characteristic 3.0V Mode (

USIM_VDD

=2.95V)

Symbol

USIM_VDD

V

IH

V

IL

V

OH

V

OL

Parameter

LDO power output voltage

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min.

2.75

0.65*USIM_VDD -

-0.3

0

Typ. Max.

2.95

3.05

USIM_VDD +0.3

0.25*USIM_VDD

USIM_VDD -0.45 -

0 0

USIM_VDD

0.45

V

V

V

V

Unit

V

3.6.1

USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin SIM card holder reference circuit.

Figure 25: USIM Interface Reference Circuit www.simcom.com

42 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

1. USIM_DATA has been pulled up with a 10 KΩ resistor to USIM_VDD in module. A 100 nF capacitor on USIM_VDD is used to reduce interference.

2. For more details of AT commands about USIM, please refer to document [1]. USIM_CLK is very important signal, the rise time and fall time of USIM_CLK should be less than 40ns, otherwise the

USIM card might not be initialized correctly.

The USIM_DET pin is used for detection of the USIM card hot plug in. User can select the 8-pin USIM card holder to implement USIM card detection function.

The following figure shows the 8-pin SIM card holder reference circuit.

Figure 26: USIM Interface Reference Circuit with USIM_DET

If the USIM card detection function is not used, user can keep the USIM_DET pin open.

3.6.2

USIM Design Notice

USIM card circuit is susceptible; the interference may cause the SIM card failures or some other situations, so it is strongly recommended to follow these guidelines while designing:

 Make sure that the SIM card holder should be far away from the antenna while in PCB layout.

 SIM traces should keep away from RF lines, VBAT and high-speed signal lines.

 The traces should be as short as possible.

 Keep SIM holder’s GND connect to main ground directly.

 Shielding the SIM card signal by ground.

 Recommended to place a 0.1

～ 1 uF capacitor on USIM_VDD line and keep close to the holder.

 The rise/fall time of USIM_CLK should not be more than 40ns.

 Add some TVS and the parasitic capacitance should not exceed 60pF.

3.6.3

Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by Amphenol. User can visit http://www.amphenol.com for more information about the holder.

www.simcom.com

43 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 27: Amphenol SIM Card Socket

Table 19: Amphenol USIM Socket Pin Description

Pin

C1

C2

C3

C5

C6

C7

Signal

USIM_VDD

USIM_RST

USIM_CLK

GND

VPP

USIM_DATA

Description

USIM Card Power supply.

USIM Card Reset.

USIM Card Clock.

Connect to GND.

USIM Card data I/O.

3.7 PCM Interface

Module provides a PCM interface for external codec, which can be used in master mode with short sync and 16 bits linear format.

www.simcom.com

44 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 20: PCM Format

Characteristics

Line Interface Format

Data length

PCM Clock/Sync Source

PCM Clock Rate

PCM Sync Format

Data Ordering

Specification

Linear (Fixed)

16bits(Fixed)

Master Mode(Fixed)

2048kHz （ 2G/3G ） ,4096Khz (4G)

Short sync(Fixed)

MSB

For more details about PCM AT commands, please refer to document [1].

3.7.1

PCM Timing

Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 28: PCM_SYNC Timing

Figure 29: EXT Codec to Module Timing www.simcom.com

45 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 30: Module to Codec Timing

Symbol

T(sync)

T(synch)

T(syncl)

T(clk)

T(clkh)

T(clkl)

T(susync)

T(hsync)

T(sudin)

T(hdin)

T(pdout)

T(zdout)

Table 21: PCM Timing Parameters (2G/3G mode)

Parameter Min.

Typ.

Max.

Unit

PCM_SYNC cycle time

PCM_SYNC high level time

PCM_SYNC low level time

PCM_CLK cycle time

PCM_CLK high level time –

PCM_CLK low level time

PCM_SYNC setup time high before falling edge of PCM_CLK

PCM_SYNC hold time after falling edge of

PCM_CLK

PCM_IN setup time before falling edge of

PCM_CLK

–

–

–

60

PCM_IN hold time after falling edge of PCM_CLK 10

Delay from PCM_CLK rising to PCM_OUT valid –

Delay from PCM_CLK falling to PCM_OUT

HIGH-Z

–

–

–

–

–

125

488

124.5

–

488 –

–

–

244

244

–

–

244

244

–

–

–

160 -

–

–

–

–

60 ns ns ns ns ns ns

μs ns

μs ns ns ns

Table 22: PCM Timing Parameters (4G mode)

Symbol

T(sync)

T(synch)

T(syncl)

T(clk)

T(clkh)

T(clkl)

T(susync)

T(hsync)

Parameter

PCM_SYNC cycle time

PCM_SYNC high level time

PCM_SYNC low level time

PCM_CLK cycle time

PCM_CLK high level time

PCM_CLK low level time

PCM_SYNC setup time high before falling edge of PCM_CLK

PCM_SYNC hold time after falling edge of www.simcom.com

–

–

Min.

Typ.

Max.

Unit

–

–

–

–

–

–

62.5

244

62.256 –

244 –

122

122

–

–

–

–

μs ns

μs ns ns ns

122

122

–

– ns ns

46 / 82

T(sudin)

T(hdin)

T(pdout)

T(zdout)

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

PCM_CLK

PCM_IN setup time before falling edge of

PCM_CLK

122

PCM_IN hold time after falling edge of PCM_CLK 122

Delay from PCM_CLK rising to PCM_OUT valid –

Delay from PCM_CLK falling to PCM_OUT

HIGH-Z

–

–

–

–

–

–

–

122

122 ns ns ns ns

3.7.2

PCM Application Guide

The following figure shows the external codec reference design.

Figure 31: Audio Codec Reference Circuit

This function is still in developing.

PIN No

49

73

74

33

34

45

3.8 GPIO Interfaces

Table 23: GPIO Resources

PIN Name Int

WL_PWR_EN/GPIO11

I2S_MCLK/GPIO12

GPIO13

WL_PDN

GPIO24/PCM_OUT

GPIO25/PCM_IN

√

√

√

√

√

√ www.simcom.com

Power Domain

P3

P3

P3

P3

P3

P3

PD

PU

PU

PD

PD

Default

Status

PD

47 / 82

75

76

119

GPIO26/PCM_SYNC

GPIO27/PCM_CLK

GPIO04

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

√

√

√

P3

P3

P3

PD

PD

PU

3.9 SD Interface

Module provides a 4-bit SD/MMC interface with clock rate up to 200 MHz, The voltage of MMC/SD interface is 3.0 V, which is compatible with SDIO Card Specification (version 3.0) and Secure Digital

(Physical Layer Specification, version 3.0). It supports up to 32GB SD cards.

*

Table 24: 3.0V IO MMC/SD Electronic Characteristic (SD_DATA0-SD_DATA3,SD_CLK and SD_CMD)

Symbol

V

IH

V

IL

V

OH

V

OL

Parameter

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min.

2

-0.3

2.4

0 -

Typ.

-

-

0

Max.

3.6

-

0.8

0.4

V

V

Unit

V

V

*

Table 25: 1.8V IO MMC/SD Electronic Characteristic (SD_DATA0-SD_DATA3,SD_CLK and SD_CMD)

Symbol

V

IH

V

IL

V

OH

V

OL

Parameter

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

Min.

1.26

-0.3

2.4

0 -

-

0

Typ.

1.8

Max.

2.0

-

0.8

0.4

V

V

Unit

V

V

SD_DET is 1.8 V operation voltage ,which is different from SD_DATA0-SD_DATA3,SD_CLK and

SD_CMD.

www.simcom.com

48 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Users should provide 2.85 V to power SD card system and the current should more than 500 mA, which is showed below as VDD_SD. ESD/EMI components should be arranged beside SD card socket. Refer to the following application circuit.

Figure 32: SD Reference Circuit

SD card layout guide lines:

●

Protect other sensitive signals/circuits from SD card signals

●

●

Protect SD card signals from noisy signals (clocks, SMPS, etc.)

Up to 200 MHz clock rate, 50 Ω nominal, ±10% trace impedance

●

●

●

●

●

CLK to DATA/CMD length matching < 1 mm

15–24 Ω termination resistor on clock lines near module

Total routing length < 50 mm recommended

Routing distance from module clock pin to termination resistor < 5 mm

Spacing to all other signals = 2x line width

●

Bus capacitance < 15 pF

3.10 I2C Interface

Module provides a I2C interface compatible with I2C specification, version 5.0, with clock rate up to 400 kbps. Its operation voltage is 1.8 V.

The following figure shows the I2C bus reference design.

www.simcom.com

49 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 33: I2C Reference Circuit

PIN No

31

32

49

33

27

28

29

30

SDA and SCL do not have pull-up resistors in module. So, 2 externals pull up resistors are needed in application circuit.

3.11 SDIO Interface

Module provides a 4 bit 1.8 V SDIO interface for WLAN solution.

Table 26: WIFI Interface

PIN Name

SDIO_DATA1

IO P3

SDIO_DATA2 IO P3

SDIO_CMD IO P3

SDIO_DATA0 IO P3

SDIO_DATA3 IO P3

SDIO_CLK DO P3

WL_PDN DO P3

WL_PWR_EN DO P3

Function

Description

SDIO data bus bit1

SDIO data bus bit2

SDIO bus command

SDIO data bus bit0

SDIO data bus bit3

SDIO bus clock

WIFI enable signal

WIFI power enable

Index

www.simcom.com

50 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.12 SPI Interface

Module provides a SPI interface as a master only. Its operation voltage is 1.8 V, and its clock rate is up to

50 MHz.

3.13Network Status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the following figure.

Figure 34: NETLIGHT Reference Circuit

The value of the resistor named “R” depends on the LED characteristic.

Table 27: NETLIGHT Status

NETLIGHT pin status

Always On

200 ms ON, 200 ms OFF

800 ms ON, 800 ms OFF

OFF

Module status

Searching Network; Call Connect (include VOLTE,SRLTE)

Data Transmit; 4G registered;

2G/3G registered network

Power off; Sleep

NETLIGHT output low level as “OFF”, and high level as “ON”.

www.simcom.com

51 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.14Flight Mode Control

The FLIGHTMODE pin can be used to control module to enter or exit the Flight mode. In Flight mode, the

RF circuit is closed to prevent interference with other equipment and minimize current consumption.

Bidirectional ESD protection component is suggested to add on FLIGHTMODE pin, its reference circuit is shown in the following figure.

Figure 35: Flight Mode Switch Reference Circuit

Table 28: FLIGHTMODE Status

FLIGHTMODE pin status

Input Low Level

Input High Level

Module operation

Flight Mode: RF is closed

AT+CFUN=4: RF is closed

AT+CFUN=1: RF is working

3.15 RMII Interface

Module provides one RMII Interface, Customers can design 100m network port based on this interface.

1.8V OR 3.3V need power supply for PIN159 Depending on PHY type.

Table 29: RMII interface

Pin Name Pin No.

127

128

129

160

34

120

125

126

161

162

I/O 电压域

MAC_RST

MAC_MDC

DO P6

DO P6

MAC_MDO IO P6

RMII_TX_EN DO P6

RMII_RX_DV DI

RMII_CLK DI

P6

P6

RMII_INT DI P6

RMII_TXD1 DO P6

RMII_TXD0 DO P6

RMII_RXD0 DI P6

功能描述

Reset signal

Management Data Clock

Management Data Input/Output

Transmit Enable

Receive Data Valid

RMII Clock

PHY interrupt output

Transmit Data [1]

Transmit Data [0]

Receive Data [0] www.simcom.com

信号名称

52 / 82

163 RMII_RXD1 DI P6

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Receive Data [1]

Figure 36: RMII Circuit Diagram

3.16 PCIe Interface*

Module provides 1 lane PCIe Gen1 interface, Only support host mode (RC mode),the maximum data rate could up to 2.5 Gbps.

Feature ：



PCI Express® Base Specification Revision 3.1 compliant

 32-bit PIPE interface, PIPE3.0 compliant

 Support 100 MHz differential reference clock, either with SSC or not

 SRIS (separate reference independent SSC) support

 Advanced Error Reporting (AER) support

 ECRC generation and check support

 Legacy PCI Power Management support

 Native Active State Power Management L0s and L1 state support

 Both WAKE# and beacon detection are supported

 MSI (up to 32) and INT message support

 Four reconfigurable DMA channels: 2 write and 2 read channels

 Up to 8 reconfigurable address translation tables for PCIe interface

3.17 GNSS Control Interface

The GNSS function is optional.

The GNSS is a stand-along function, the module integrated GNSS chip, and module provide VGNSS pin, customer provide a 1.8 V voltage for VGNSS and the GNSS function is started, the GNSS_TXD and

GNSS_RXD will provide NMEA sentences, customer could connect GNSS_UART to UART2 to module, so the GNSS NMEA information could be handled by module, the GNSS_UART also could connect to host side for other usage.

www.simcom.com

53 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

If customer need the GNSS in low power mode, customer could cut off the VGNSS power.

Figure 37: GNSS Circuit Diagram (NMEA to host UART) www.simcom.com

54 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

3.18 Other Interface

3.18.1

ADC

The module has a dedicated ADC named ADC1.It is available for digitizing analog signals such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 30: ADC1 Electronic Characteristics

Characteristics

Resolution

Conversion time

Input Range

Input serial resistance

Min.

–

–

0.1

1

Typ.

15

442

–

Max.

–

–

1.8

–

Unit

Bits us

V

MΩ

“AT+CADC=2” can be used to read the voltage, for more details, please refer to document [1].

3.18.2

LDO

Module has a LDO power output, named VDD_AUX. its output voltage is 2.8 V by default, Users can switch the LDO on or off by the AT command “AT+CVAUXS”.

Table 31: LDO Electronic Characteristic

Symbol

V

VDD_AUX

I

O

Description

Output voltage

Output current -

-

Min.

-

Typ.

2.80

For more details of AT commands about VDD_AUX, please refer to document [1].

-

Max.

150

Unit

V mA www.simcom.com

55 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

4 RF Specifications

4.1 GSM/UMTS/LTE RF Specifications

Table 32: GSM/UMTS/LTE Conducted Transmission Power

Frequency

GSM850

EGSM900

DCS1800

PCS1900

GSM850 (8-PSK)

EGSM900 (8-PSK)

DCS1800 (8-PSK)

PCS1900 (8-PSK)

WCDMA B1

WCDMA B2

WCDMA B5

WCDMA B8

LTE-FDD B1

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B18

LTE-FDD B19

LTE-FDD B20

LTE-FDD B26

LTE-FDD B28

LTE-TDD B38

LTE-TDD B40

LTE-TDD B41

Power

33dBm ±2 dB

33dBm ±2 dB

30dBm ±2 dB

30dBm ±2 dB

27dBm ±3 dB

27dBm ±3 dB

26dBm +3/-4 dB

26dBm +3/-4 dB

24dBm +1/-3 dB

24dBm +1/-3 dB

24dBm +1/-3 dB

24dBm + 1/-3 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

23dBm +/-2.7 dB

Min

5dBm ± 5 dB

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

5dBm ± 5 dB

0dBm ± 5 dB

0dBm ± 5 dB

5dBm ± 5 dB

5dBm ± 5 dB

0dBm ±5 dB

0dBm ±5 dB

<-50 dBm

<-50 dBm

<-50 dBm

<-50 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm

<-40 dBm www.simcom.com

56 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 33: Operating Frequencies

Frequency

GSM850

Receiving

869 ～ 894 MHz

Transmission

824 ～ 849 MHz

EGSM900

DCS1800

PCS1900

WCDMA B1

WCDMA B2

WCDMA B5

925 ～ 960 MHz

1805 ～ 1880 MHz

1930~1990 MHz

2110 ～ 2170 MHz

1930~1990 MHz

869 ～ 894 MHz

880 ～ 915 MHz

1710 ～ 1785 MHz

1850~1910 MHz

1920 ～ 1980 MHz

1850~1910 MHz

824 ～ 849 MHz

WCDMA B8 925 ～ 960 MHz 880 ～ 915 MHz

The LTE Operating frequencies are shown in the following table 24.

Note: Operating frequencies of LTE TDD B41 for the module is 100MHz BW, 2555 ～ 2655 MHz

GPS 1574.4

～ 1576.44 MHz -

GLONASS

BD

1598 ～ 1606 MHz

1559 ～ 1563 MHz

-

E-UTRA Band

LTE-FDD B1

LTE-FDD B2

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B18

LTE-FDD B19

LTE-FDD B20

LTE-FDD B26

LTE-FDD B28

LTE-TDD B38

LTE-TDD B40

LTE-TDD B41

Table 34: E-UTRA Operating Bands

Uplink (UL)

1920 ~1980 MHz

1850~1910 MHz

1710 ~1785 MHz

1710~1755 MHz

824 ～ 849 MHz

2500~2570 MHz

880 ~915 MHz

699~716 MHz

777~787 MHz

815~830 MHz

830~845 MHz

832~862 MHz

814~849 MHz

703~748 MHz

2570 ~2620 MHz

2300 ~2400 MHz

2496 ~2690 MHz

Downlink (DL)

2110 ~2170 MHz

1930~1990 MHz

1805 ~1880 MHz

2110~2155 MHz

869 ～ 894 MHz

2620~2690 MHz

925 ~960 MHz

728~746 MHz

746~757 MHz

860~875 MHz

875~890 MHz

791~ 821 MHz

859~894 MHz

758~803 MHz

2570 ~2620 MHz

2300 ~2400 MHz

2496 ~2690 MHz www.simcom.com

57 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 35: Conducted Receive Sensitivity

Frequency

GSM850

EGSM900

DCS1800

PCS1900

WCDMA B1

WCDMA B2

WCDMA B5

WCDMA B8

LTE FDD/TDD

Receive sensitivity (Typical)

< -109 dBm

< -109 dBm

< -109 dBm

< -109 dBm

< -110 dBm

< -110 dBm

< -110 dBm

< -110 dBm

See table 26.

Receive sensitivity (MAX)

3GPP

3GPP

3GPP

3GPP

3GPP

3GPP

3GPP

3GPP

3GPP

Table 36: Reference Sensitivity (QPSK)

E-UTRA band

LTE-FDD B1

LTE-FDD B2

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B18

LTE-FDD B19

LTE-FDD B20

LTE-FDD B26

LTE-FDD B28

LTE-TDD B38

LTE-TDD B40

LTE-TDD B41

-

-

-

1.4 MHz 3 MHz

-

-102.7

-101.7

-104.7

-103.2

-

-99.7

-98.7

-101.7

-100.2

-102.2

-101.7

-102.7

-99.2

-98.7

-

-

-

-99.7

-100.2

5 MHz

-100

-97

-97.5

-98.5

-100

-100

-99

-100

-98

-97

-100

-98

-98

-97

-97

-97

-100

Standard

-97

-94

-94.5

-95.5

-97

-97

-96

-94

-94

-94

-97

-97

-95

-94

-97

-95

-95

10 MHz 15 MHz 20 MHz

-95.2

-93.2

-92.2

-95.2

-94

-92

-91

-94

-93.2

-95.2

-95.2

-91.2

-92.7

-93.7

-95.2

-95.2

-94.2

-92

-90

-91

-94

-94

-93

Test Value

@10 MHz

-101

-98

-99

-99

-101

-101

-101

-101

-99

-99

-101

-99

-97

-102

-99

-99

-101 www.simcom.com

58 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

4.2 GSM /UMTS/LTE Antenna Design Guide

Users should connect antennas to module’s antenna pads through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50 Ω. SIMCom recommends that the total insertion loss between the antenna pads and antennas should meet the following requirements:

Table 37: Trace Loss

Frequency

700 MHz-960 MHz

1710 MHz-2170 MHz

2300 MHz-2650 MHz

Loss

<0.5 dB

<0.9 dB

<1.2 dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.

Figure 38: Antenna Matching Circuit (MAIN_ANT)

In above figure, the components R1, C1, C2 and R2 are used for antenna matching, the values of components can only be achieved after the antenna tuning and usually provided by antenna vendor. By default, the R1, R2 are 0 Ω resistors, and the C1, C2 are reserved for tuning. The component D1 is a TVS for ESD protection, and it is optional for users according to application environment.

The RF test connector is used for the conducted RF performance test, and should be placed as close as to the module’s MAIN_ANT pin. The traces impedance between module and antenna must be controlled in

50 Ω.

www.simcom.com

59 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 39: Antenna Matching Circuit (AUX_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4 are

0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is optional for users according to application environment.

Two TVS are recommended in the table below.

Table 38: Recommended TVS

Package

0201

0402

0402

Part Number

WE05DGCMS-BH

PESD0402-03

PESD0402-12

Vender

CYGWAYON

PRISEMI

PRISEMI

SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high bands in the designing of LTE-TDD, such as band38, band40 and band41. Because of the high insert loss of the

RF cable and layout lines, the receiver sensitivity of these bands above will have risk to meet the authentication without the diversity antenna. For more details about auxiliary antenna design notice, please refer to document [25].

www.simcom.com

60 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

4.3 GNSS

Module merges GNSS (GPS/GLONASS/BD/QZSS GALILEO) satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates.

4.3.1

GNSS Technical Specification

 Tracking sensitivity: -159 dBm （ GPS ） /-158 dBm （ GLONASS ） /-159 dBm （ BD ） /-159 dBm

（ GALILEO ）

 Cold-start sensitivity: -148 dBm

 Accuracy (Open Sky): 2.5 m (CEP50)

 TTFF (Open Sky): Hot start <1 s, Cold start<35 s

 Receiver Type: 16-channel, C/A Code

 GPS L1 Frequency: 1575.42±1.023 MHz

 GLONASS: 1597.5~1605.8 MHz

 BD: 1559.05~1563.14 MHz

 GALILEO: 1575.42±1.023 MHz

 Update rate: Default 1 Hz

 GNSS data format: NMEA-0183

 GNSS Current consumption: 100mA (GSM/UMTS/LTE Sleep ,in total on VBAT pins)

 GNSS antenna: Passive/Active antenna

Table 39: Recommended Passive Antenna Characteristics

Pa ssive

Direction

Gain

Input impedance

Efficiency

VSWR

Recommended standard

Omnidirectional

> -3 dBi（ Avg ）

50 Ω

>50%

<2

If the antenna is active type, the power should be given by main board because there is no power supply on the GPS antenna pad. If the antenna is passive, it is suggested that the external LNA should be used.

www.simcom.com

61 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

4.3.2

GNSS Application Guide

Users can adopt an active antenna or a passive antenna to module. If using a passive antenna, an external LNA is a must to get better performance.

The following figures are the reference circuits.

Figure 40: Active Antenna Circuit

NOTE

If customer need save the power when the GNSS function is disabled, then customer should design a switch circuit to cut off the active antenna power to get a lower power consumption.

Figure 41: Passive Antenna Circuit (Default)

In above figures, the components C1, L1 and L2 are used for antenna matching. Usually, the values of the components can only be achieved after antenna tuning and usually provided by antenna vendor. C2 is used for DC blocking. L3 is the matching component of the external LNA, and the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active antenna and V_LNA need external power supplies which should be considered according to active antenna and LNA characteristic.

LDO/DCDC is recommended to get lower current consuming by shutting down active antennas and LNA when GNSS is not working.

www.simcom.com

62 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 40: Recommended LNA and SAW Filter

Material

GPS LNA

GPS LNA

GPS LNA

GPS SAW FILTER

GPS SAW FILTER

Part Number

MXDLN16TP

BGA725L6

BGA824N6

HDF1588E-B5

SAFFB1G56KB0F0A

Vendor

MAXSCEND

Infineon

Infineon

SHOULDER murata

GNSS can be tested by NMEA port. NMEA sentences can be obtained through UART or USB automatically. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GNSS, user should configure module in proper operating mode by AT command. Please refer to related documents for details. module can also get position location information through AT directly.

GNSS is closed by default and can be started by AT+CGPS. The AT command has two parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.

AGPS mode needs more support from the mobile telecommunication network. Please refer to document [24] for more details.

www.simcom.com

63 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

5 Electrical Specifications

5.1 Absolute Maximum Ratings

Absolute maximum ratings for digital and analog pins of module are listed in the following table.

Table 41: Absolute Maximum Ratings

Parameter

Voltage at VBAT

Voltage at USB_VBUS

Voltage at digital pins (RESET, SPI, Keypad,

GPIO, I2C, UART, PCM)

Voltage at digital pins (SD, USIM)

Voltage at PWRKEY

Min.

-0.3

-0.5

-0.3

-0.3

-0.3

-

-

-

-

-

Typ.

2.1

3.3

6

Max.

6

5.5

V

V

V

Unit

V

V

5.2 Operating Conditions

Table 42: Recommended Operating Ratings

Parameter

Voltage at VBAT

Voltage at USB_VBUS

Min.

3.4

3.6

Table 43: 1.8V Digital I/O Characteristics*

Parameter

V

IH

V

IL

V

OH

V

OL

I

OH

I

OL

I

IH

I

IL

Description

High-level input voltage

Low-level input voltage

High-level output voltage

Low-level output voltage

High-level output current (no pull-down resistor)

Low-level output current (no pull up resistor)

Input high leakage current (no pull-down resistor)

Input low leakage current (no pull up resistor)

-

-

-

Min.

1.26

-0.3

1.6

0

-1 www.simcom.com

Typ.

3.8

5.0

-

-

-

-

Typ.

1.8

0

2

-2

Max.

4.2

5.25

Unit

V

V

-

-

-

Max.

2

0.54

-

0.2

1

V

V

Unit

V

V mA mA uA uA

64 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

These parameters are for digital interface pins, such as SPI, GPIO (NETLIGHT, FLIGHTMODE,

STATUS, USIM_DET, SD_DET), I2C, UART, PCM, and USB_BOOT.

The operating temperature of module is listed in the following table.

Table 44: Operating Temperature

Parameter

Normal operation temperature

Extended operation temperature*

Storage temperature

Min.

-30

-40

-45

Typ.

25

25

25

Max.

80

85

+90

Unit

℃

℃

℃

Module is able to make and receive voice calls, data calls, SMS and make GSM/ UMTX/LTE traffic in -

40 ℃ ~ +85 ℃ . The performance will be reduced slightly from the 3GPP specifications if the temperature is outside the normal operating temperature range and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1

Operating Mode Definition

The table below summarizes the various operating modes of module product.

Table 45: Operating Mode Definition

Mode

GSM /UMTS/LTE

Sleep

Function

In this case, the current consumption of module will be reduced to the minimal level and the module can still receive paging message, call,

SMS and TCP/UDP.

GSM/UMTS/LTE

Talk

GPRS/EDGE/

UMTS/LTE Standby

GPRS/EDGE/

Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on,

FR/EFR/HR, hopping sequences, and antenna.

Module is ready for data transmission, but no data is currently sent or received. In this case, power consumption depends on network settings.

There is data transmission in progress. In this case, power www.simcom.com

65 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

UMTS/LTE transmission

Flight mode

Power off

Data

Minimum functionality mode consumption is related to network settings (e.g. power control level); uplink/downlink data rates, etc.

AT command “AT+CFUN=0” AT+CSCLK=1 can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work and the

USIM card will not be accessible, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode.

AT command “AT+CFUN=4” or pulling down the FLIGHTMODE pin can be used to set the module to flight mode without removing the power supply. In this mode, the RF part of the module will not work, but the serial port and USB port are still accessible. The power consumption in this mode is lower than normal mode.

Module will go into power off mode by sending the AT command

“AT+CPOF” or pull down the PWRKEY pin, normally. In this mode the power management unit shuts down the power supply, and software is not active. The serial port and USB are is not accessible.

5.3.2

Sleep Mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and module can still receive paging message and SMS and TCP/UDP.

Several hardware and software conditions must be satisfied together in order to let module enter into sleep mode:

●

UART condition

●

●

USB condition

Software condition

Before designing, pay attention to how to realize sleeping/waking function and refer to Document [26] for more details.

5.3.3

Minimum Functionality Mode and Flight Mode

Minimum functionality mode ceases a majority function of module, thus minimizing the power consumption.

This mode is set by the AT command which provides a choice of the functionality levels.

●

●

●

AT+CFUN=0: Minimum functionality

AT+CFUN=1: Full functionality (Default)

AT+CFUN=4: Flight mode

If module has been set to minimum functionality mode, the RF function and USIM card function will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM card will be unavailable.

www.simcom.com

66 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

If module has been set to flight mode, the RF function will be closed. In this case, the serial port and USB are still accessible, but RF function will be unavailable.

When module is in minimum functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

Table 46: Current Consumption on VBAT Pins (VBAT=3.8V)

GNSS

GNSS supply current

(AT+CFUN=0,without USB connection)

GSM sleep/idle mode

GSM/GPRS supply current

(GNSS off,without USB connection)

UMTS sleep/idle mode

WCDMA supply current

(GNSS off,without USB connection)

LTE sleep/idle mode

LTE supply current

(GNSS off,without USB connection)

EVDO supply current

(GNSS off,without USB connection)

GSM Talk

GSM850

EGSM900

DCS1800

PCS1900

UMTS Talk

WCDMA B1

WCDMA B2

WCDMA B5

WCDMA B8

GPRS

GSM850( 1 Rx,4 Tx )

EGSM900( 1 Rx,4 Tx )

DCS1800( 1 Rx,4 Tx )

PCS1900( 1 Rx,4 Tx )

GSM850( 3Rx, 2 Tx )

EGSM900( 3Rx, 2 Tx )

DCS1800( 3Rx, 2 Tx )

PCS1900( 3Rx, 2 Tx )

EDGE

@ -140 dBm,Tracking Typical:35 mA

Sleep mode@ BS_PA_MFRMS=2 Typical: 2.8 mA

Idle mode@ BS_PA_MFRMS=2 Typical: 18 mA

Sleep mode @DRX=9 Typical: 3.3 mA

Idle mode @DRX=9 Typical: 17.5 mA

Sleep mode Typical: 2.3 mA

Idle mode Typical: 17.5 mA

Sleep mode Typical: 2.0 mA

Idle mode Typical: 17.8 mA

@power level #5 Typical: 220 mA

@ power level #5 Typical: 230 mA

@power level #5 Typical: 16 2mA

@power level #5 Typical: 190 mA

@Power 24 dBm Typical: 540 mA

@Power 24 dBm Typical: 470 mA

@Power 24 dBm Typical: 530 mA

@Power 24 dBm Typical: 385 mA

@power level #5 Typical: 480 mA

@power level #5 Typical: 230 mA

@power level #0 Typical: 195 mA

@power level #0 Typical: 390 mA

@power level #5 Typical: 330 mA

@power level #5 Typical: 370 mA

@power level #0 Typical: 275 mA

@power level #0 Typical: 245 mA www.simcom.com

67 / 82

LTE-FDD B3

LTE-FDD B4

LTE-FDD B5

LTE-FDD B7

LTE-FDD B8

LTE-FDD B12

LTE-FDD B13

LTE-FDD B18

LTE-FDD B19

LTE-FDD B20

LTE-FDD B26

GSM850( 1 Rx,4 Tx )

EGSM900( 1 Rx,4 Tx )

DCS1800( 1 Rx,4 Tx )

PCS1900( 1 Rx,4 Tx )

GSM850( 3Rx, 2 Tx )

EGSM900( 3Rx, 2 Tx )

DCS1800( 3Rx, 2 Tx )

PCS1900( 3Rx, 2 Tx )

GSM850( 1 Rx,4 Tx )

EGSM900( 1 Rx,4 Tx )

DCS1800( 1 Rx,4 Tx )

HSDPA data

WCDMA B1

WCDMA B2

WCDMA B5

WCDMA B8

LTE data

LTE-FDD B1

LTE-FDD B2

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

@power level #8 Typical: 340 mA

@power level #8 Typical: 400 mA

@power level #2 Typical: 300 mA

@power level #2 Typical: 330 mA

@power level #8 Typical: 280 mA

@power level #8 Typical: 320 mA

@power level #2 Typical: 230 mA

@power level #2 Typical: 268 mA

@power level #8 Typical: 400 mA

@power level #2 Typical: 300 mA

@Power 24 dBm

@Power 23 dBm

@Power 24 dBm

@Power 24 dBm

Typical: 478 mA

Typical: 475 mA

Typical: 480 mA

Typical: 430 mA

@5MHz 22.3 dBm Typical: 577 mA

@10MHz 22.4 dBm Typical: 590 mA

@20MHz 22.4 dBm Typical: 630 mA

@5MHz 22.1 dBm Typical: 515 mA

@10MHz 22.4 dBm Typical: 544 mA

@20MHz 22.3 dBm Typical:575 mA

@5MHz 22.2 dBm Typical: 479 mA

@10MHz 22.1 dBm Typical: 498 mA

@20MHz 22.1 dBm Typical: 530 mA

@5MHz 22.0 dBm Typical: 527 mA

@10MHz 22.1 dBm Typical: 559 mA

@20MHz 22.6 dBm Typical: 555 mA

@5MHz 22.2 dBm Typical: 610 mA

@10MHz 22.1 dBm Typical: 600 mA

@20MHz 22.1 dBm Typical: 630 mA

@5MHz 22.2 dBm Typical: 650 mA

@10MHz 22.1 dBm Typical: 650 mA

@20MHz 22.1 dBm Typical: 630 mA

@5MHz 22.8 dBm Typical: 644 mA

@10MHz 22.8 dBm Typical: 646 mA

@5MHz 22.7 dBm Typical: 493 mA

@10MHz 22.7 dBm Typical: 510 mA

@5MHz 21.9 dBm Typical: 505 mA

@10MHz 22.0 dBm Typical: 497 mA

@5MHz 21.3 dBm Typical: 531 mA

@10MHz 22.5 dBm Typical: 523 mA

@15MHz 22.6 dBm Typical: 570 mA

@5MHz 22.4 dBm Typical: 532 mA

@10MHz 22.3 dBm Typical: 541 mA

@15MHz 22.5 dBm Typical: 590 mA

@5MHz 21.8 dBm Typical: 579 mA

@10MHz 21.8 dBm Typical: 590 mA

@20MHz 21.8 dBm Typical: 600 mA

@5MHz 22.4 dBm Typical: 525 mA www.simcom.com

68 / 82

LTE-FDD B28

LTE-TDD B38

LTE-TDD B40

LTE-TDD B41

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

@10MHz 22.7 dBm Typical: 570 mA

@15MHz 22.3 dBm Typical: 580 mA

@5MHz 22.4 dBm Typical: 612 mA

@10MHz 22.5 dBm Typical: 510mA

@20MHz 22.4 dBm Typical: 670 mA

@5MHz 21.8 dBm Typical: 370 mA

@10MHz 21.8 dBm Typical: 380 mA

@20MHz 21.8 dBm Typical: 403 mA

@5MHz 21.5 dBm Typical: 407 mA

@10MHz 21.7 dBm Typical: 416 mA

@20MHz 21.7 dBm Typical: 444 mA

@5MHz 21.6 dBm Typical: 390 mA

@10MHz 21.7 dBm Typical: 396 mA

@20MHz 21.7 dBm Typical: 420 mA

5.5 ESD Notes

Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is mounted on the users’ mother board, the ESD components should be placed beside the connectors which human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table shows the module ESD measurement performance without any external ESD component.

Table 47: The ESD Performance Measurement Table (Temperature: 25 ℃ , Humidity: 45%)

Part

VBAT, GND

Antenna port

USB

UART

Other PADs

Contact discharge Air discharge

+/-4 KV +/-8 KV

+/-4 KV +/-8 KV

+/-1 KV

+/-1 KV

+/-1 KV

+/-2 KV

+/-2 KV

+/-2 KV

Part

VBAT, GND

Antenna port

USB

UART

Other PADs www.simcom.com

69 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

6 SMT Production Guide

6.1 Top and Bottom View of Module

Figure 42: Top and Bottom View of Module www.simcom.com

70 / 82

6.2 Label Information

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 43: Label Information

Table 48: The Description of Label Information

D

E

F

B

C

No.

A

Description

LOGO

Module part number

Project name

Serial number

International mobile equipment identity

QR code

6.3 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore, the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints.

www.simcom.com

71 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Figure 44: The Ramp-soak-spike Reflow Profile of Module

For more details about secondary SMT, please refer to the document [21].

6.4 Moisture Sensitivity Level (MSL)

Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the prescribed time limit is exceeded, users should bake module for 192 hours in drying equipment (<5% RH) at 40+5/-0 °C, or 8 hours at 120+5/-5 °C. Note that plastic tray is not heat-resistant, and only can be baked at 45° C.

www.simcom.com

72 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.5 Recommend Dimensions of SMT Stencil

Figure 45: Recommend SMT Stencil

6.6 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.13mm.

www.simcom.com

73 / 82

7 Packaging

Module support tray packaging.

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Module tray drawing ：

Figure 46: Packaging Diagram

Figure 47: Tray Drawing www.simcom.com

74 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Table 50: Tray Size

Length

（

±3mm

）

242.0

Small carton drawing ：

Width

（

±3mm

）

161.0

Number

15

Figure 48: Small Carton Drawing

Table 51: Small Carton Size

Length

（

±10mm

）

Width

（

±10mm

）

Height

（

±10mm

）

270 180 120

Big carton drawing ：

Number

15*20=300

Figure 49: Big Carton Drawing

Table 52: Big Carton Size

Length

（

±10mm

）

Width

（

±10mm

）

Height

（

±10mm

）

380 280 280 www.simcom.com

Number

300*4=1200

75 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

8 Appendix

8.1 Coding Schemes and Maximum Net Data Rates over Air Interface

Table 53: Coding Schemes and Maximum Net Data Rates over Air Interface

Multislot definition(GPRS/EDGE)

Slot class

10

11

12

8

9

6

7

3

4

5

1

2

GPRS coding scheme

CS 1 = 9.05 kb/s / time slot

CS 2 = 13.4 kb/s / time slot

CS 3 = 15.6 kb/s / time slot

CS 4 = 21.4 kb/s / time slot

MCS 1 = 8.8 kb/s/ time slot

MCS 2 = 11.2 kb/s/ time slot

MCS 3 = 14.8 kb/s/ time slot

MCS 4 = 17.6 kb/s/ time slot

MCS 5 = 22.4 kb/s/ time slot

MCS 6 = 29.6 kb/s/ time slot

MCS 7 = 44.8 kb/s/ time slot

MCS 8 = 54.4 kb/s/ time slot

MCS 9 = 59.2 kb/s/ time slot

4

3

3

3

2

2

3

2

4

4

4

DL slot number UL slot number Active

1 1 2

1

2

2

3

1

2

1

2

2

3

4

5

5

4

4

3

3

4

4

5

5

5

slot

Modulation type Max data rata

（

4 slots

）

36.2 kb/s

53.6 kb/s

62.4 kb/s

85.6 kb/s

35.2 kb/s

44.8 kb/s

59.2 kb/s

70.4 kb/s

89.6 kb/s

118.4 kb/s

179.2 kb/s

217.6 kb/s

236.8 kb/s

GMSK

GMSK

GMSK

GMSK

GMSK

GMSK

GMSK

GMSK

8PSK

8PSK

8PSK

8PSK

8PSK

HSDPA device category

Category 1

Category 2

Category 3

Max data rate

（

peak

）

1.2M bps

1.2M bps

1.8M bps

Modulation type

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK www.simcom.com

76 / 82

Category 4

Category 5

Category 6

Category 7

Category 8

Category 9

Category 10

Category 11

Category 12

Category 13

Category 14

Category 15

Category 16

Category 17

Category 18

Category 19

Category 20

Category 21

Category 22

Category 23

Category 24

HSUPA device category

Category 1

Category 2

Category 3

Category 4

Category 5

Category 6

LTE-FDD device category

(Downlink)

Category 1

Category 2

Category 3

Category 4

LTE-FDD device category

(Uplink)

Category 1

Category 2

Category 3

Category 4

1.8 Mbps

3.6 Mbps

3.6 Mbps

7.2 Mbps

7.2 Mbps

10.2 Mbps

14.4 Mbps

0.9 Mbps

1.8 Mbps

17.6 Mbps

21.1 Mbps

23.4 Mbps

28 Mbps

23.4 Mbps

28 Mbps

35.5 Mbps

42 Mbps

23.4 Mbps

28 Mbps

35.5 Mbps

42.2 Mbps

Max data rate

（

peak

）

0.96 Mbps

1.92 Mbps

1.92 Mbps

3.84 Mbps

3.84 Mbps

5.76 Mbps

Max data rate

（

peak

）

10 Mbps

50 Mbps

100 Mbps

150 Mbps

Max data rate

（

peak

）

5 Mbps

25 Mbps

50 Mbps

50 Mbps www.simcom.com

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

64QAM

64QAM

16QAM

16QAM

64QAM

64QAM

64QAM

64QAM

16QAM

16QAM

64QAM

64QAM

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK

16QAM,QPSK

QPSK

QPSK

Modulation type

QPSK

QPSK

QPSK

QPSK

QPSK

QPSK

Modulation type

QPSK/16QAM/64QA

M

QPSK/16QAM/64QA

M

QPSK/16QAM/64QA

M

QPSK/16QAM/64QA

M

Modulation type

QPSK/16QAM

QPSK/16QAM

QPSK/16QAM

QPSK/16QAM

77 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

8.2 Related Documents

Table 54: Related Documents

NO Title

[1]

[2]

SIM7500_SIM7600 Series_AT

Command Manual_V1.xx

ITU-T Draft new recommendationV.25ter

[3] GSM 07.07

[4] GSM 07.10

[5]

[6]

[7]

[8]

[9]

[10]

[11]

[12]

[13]

[14]

[15]

[16]

GSM 07.05

GSM 11.14

GSM 11.11

GSM 03.38

GSM 11.10

3GPP TS 51.010-1

3GPP TS 34.124

3GPP TS 34.121

3GPP TS 34.123-1

3GPP TS 34.123-3

EN 301 908-02 V2.2.1

EN 301 489-24 V1.2.1

Description

AT Command Manual

Serial asynchronous automatic dialing and control

Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME)

Support GSM 07.10 multiplexing protocol

Digital cellular telecommunications (Phase 2+); Use of Data

Terminal Equipment – Data Circuit terminating Equipment

(DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the Subscriber

Identity Module – Mobile Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module – Mobile

Equipment (SIM – ME) interface

Digital cellular telecommunications system (Phase 2+);

Alphabets and language-specific information

Digital cellular telecommunications system (Phase 2) ；

Mobile Station (MS) conformance specification ； Part 1:

Conformance specification

Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment.

Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and reception (FDD)

User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites.

Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for

IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive

Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for www.simcom.com

78 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

[17]

[18]

[19]

[20]

[21]

[22]

[23]

[24]

[25]

[26]

[27]

IEC/EN60950-1(2001)

3GPP TS 51.010-1

GCF-CC V3.23.1

2002/95/EC radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment

Safety of information technology equipment (2000)

Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

Global Certification Forum - Certification Criteria

Directive of the European Parliament and of the Council of

27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(RoHS)

Module secondary SMT Guidelines

This document describes how to use UART interface of

SIMCom modules.

Module secondary-SMT-UGD-

V1.xx

SIM7X00

Series_UART_Application

Note_V1.xx

SIM7100_SIM7500_SIM7600

Series_USB

AUDIO_Application

Note_V1.xx

SIM7X00

Series_GPS_Application

Note_V1.xx

Antenna design guidelines for diversity receiver system

SIM7100_SIM7500_SIM7600_

Sleep Mode_Application

Note_V1.xx

7600CE-LAN-Reference

Design V1.0

USB AUDIO Application Note

GPS Application Note

Antenna design guidelines for diversity receiver system

Sleep Mode Application Note

HSIC Application Note www.simcom.com

79 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

8.3 Terms and Abbreviations

Table 55: Terms and Abbreviations

Abbreviation

ADC

GNSS

GPRS

GPS

GSM

HR

HSPA

I2C

IMEI

ESD

ETS

EVDO

FCC

FD

FDMA

FR

GMSK

LTE

MO

MS

MT

NMEA

DRX

DSP

DTE

DTR

DTX

EFR

EGSM

EMC

ARP

BER

BTS

CS

CSD

CTS

DAC

Description

Analog-to-Digital Converter

Antenna Reference Point

Bit Error Rate

Base Transceiver Station

Coding Scheme

Circuit Switched Data

Clear to Send

Digital-to-Analog Converter

Discontinuous Reception

Digital Signal Processor

Data Terminal Equipment (typically computer, terminal, printer)

Data Terminal Ready

Discontinuous Transmission

Enhanced Full Rate

Enhanced GSM

Electromagnetic Compatibility

Electrostatic Discharge

European Telecommunication Standard

Evolution Data Only

Federal Communications Commission (U.S.)

SIM fix dialing phonebook

Frequency Division Multiple Access

Full Rate

Gaussian Minimum Shift Keying

Global Navigation Satellite System

General Packet Radio Service

Global Positioning System

Global Standard for Mobile Communications

Half Rate

High Speed Packet Access

Inter-Integrated Circuit

International Mobile Equipment Identity

Long Term Evolution

Mobile Originated

Mobile Station (GSM engine), also referred to as TE

Mobile Terminated

National Marine Electronics Association www.simcom.com

80 / 82

PAP

PBCCH

PCB

PCS

RF

RMS

RTC

SIM

SMS

SPI

SMPS

TDMA

TE

TX

UART

VSWR

SM

NC

EDGE

HSDPA

HSUPA

ZIF

WCDMA

VCTCXO

USIM

UMTS

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

Password Authentication Protocol

Packet Switched Broadcast Control Channel

Printed Circuit Board

Personal Communication System, also referred to as GSM 1900

Radio Frequency

Root Mean Square (value)

Real Time Clock

Subscriber Identification Module

Short Message Service serial peripheral interface

Switched-mode power supply

Time Division Multiple Access

Terminal Equipment, also referred to as DTE

Transmit Direction

Universal Asynchronous Receiver & Transmitter

Voltage Standing Wave Ratio

SIM phonebook

Not connect

Enhanced data rates for GSM evolution

High Speed Downlink Packet Access

High Speed Uplink Packet Access

Zero intermediate frequency

Wideband Code Division Multiple Access

Voltage control temperature-compensated crystal oscillator

Universal subscriber identity module

Universal mobile telecommunications system www.simcom.com

81 / 82

A7602E-H&A7608SA-H Hardware Design(LINUX) V1.02

8.4 Safety Caution

Table 56: Safety Caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.

www.simcom.com

82 / 82