Texas Instruments bq500414Q bqTESLA Wireless Power TX EVM (Rev. A) User guide

User's Guide

SLVUA40A – March 2014 – Revised January 2015

bq500414Q bqTESLA Wireless Power TX EVM

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The bqTESLA™ wireless power transmitter evaluation module from Texas Instruments is a highperformance, easy-to-use development module for the design of wireless power solutions. The bq500414Q EVM evaluation module (EVM) provides all the basic functions of a Qi-compliant three coil, A6 type, wireless charger pad. The EVM is intended to be used with the bq51013BEVM-764 or any other Qicompliant receiver. Both the WPC 1.0 and WPC 1.1 receivers are supported with this design. The bq500414QEVM-629 is a 12-V input design

Contents

Applications

...................................................................................................................

2

bq500414QEVM-629 Electrical Performance Specifications

..........................................................

2

Modifications

..................................................................................................................

2

Connector and Test Point Descriptions

...................................................................................

3

4.1

4.2

Connector and Test Point Descriptions

Test Point Descriptions

Schematic and Bill of Materials

..........................................................................

3

............................................................................................

3

............................................................................................

6

Test Setup

...................................................................................................................

12

6.1

6.2

Equipment

..........................................................................................................

12

Equipment Setup

..................................................................................................

13

bq500414QEVM-629 Assembly Drawings and Layout

................................................................

16

Reference

...................................................................................................................

22

List of Figures

bq500414QEVM-629 Schematic

...........................................................................................

6


...........................................................................................

7


..........................................................................................

8

Equipment Setup

...........................................................................................................

13

Efficiency versus Power, bq500414QEVM-629 Transmitter and HPA764 Receiver

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14

Assembly Top

...............................................................................................................

16

Top Overlay

.................................................................................................................

17

Top Solder

...................................................................................................................

18

Top Layer

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19

Inner Layer 1

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20

Inner Layer 2

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21

Bottom Layer

................................................................................................................

22

List of Tables

bq500414QEVM-629 Electrical Performance Specifications

Bill of Materials

..........................................................

2

..............................................................................................................

9

bqTESLA is a trademark of Texas Instruments.

Avid is a registered trademark of Avid Technology, Inc..

SLVUA40A – March 2014 – Revised January 2015

Submit Documentation Feedback bq500414Q bqTESLA Wireless Power TX EVM

Copyright © 2014–2015, Texas Instruments Incorporated

1

Applications

1 Applications

www.ti.com

The bq500414QEVM-629 evaluation module demonstrates the transmitter portion of the bqTESLA™ wireless power system. This transmitter EVM is a complete transmitter-side solution that powers a bqTESLA™ receiver. The EVM requires only input power for operation, 12 Vdc at 1 A. All transmitter-side electronics and transmitter coils are on a single 4-layer printed-circuit board (PCB). The open design allows easy access to key points of the electrical schematic.

This EVM has the following features:

• WPC A6-Type transmitter coil, 70 mm × 20 mm free positioning area

• Designed for 12-Vdc systems

• Optional input power SEPIC converter to produce 12 Vdc from 6 V to 16 V

• Fully WPC 1.1 Foreign Object Detection (FOD) and WPC 1.0 Parasitic Metal Object Detection (PMOD)

• Reduced parts count from the legacy bq500410A design

• LED indicates power transfer or power fault state

2 bq500414QEVM-629 Electrical Performance Specifications

Table 1

provides a summary of the EVM performance specifications. All specifications are given for an ambient temperature of 25°C.

Table 1. bq500414QEVM-629 Electrical Performance Specifications

Min Typ Max Unit Parameter Notes and Conditions

Input Characteristics

V

I

IN

IN

Input voltage bq500414Q

Input current

Input no-load current

Input stand-by current

V

IN

= 12 V, RX I

OUT

= 1 A at 5 V

V

IN

= 12 V, I

OUT

= 0 A

V

IN

= 12 V

I

Output Characteristics – Receiver bq51013BEVM-764

V

OUT

OUT

Output voltage

Output ripple

V

IN

= Min to Max

Output overcurrent

V

IN

= Nom, I

OUT

V

IN

= Nom, I

OUT

= Max

V

IN

= Min to Max

V

IN

= Nom

= Nom

Systems Characteristics

F

S

ηpk

Switching frequency

Peak efficiency

η Full-load efficiency

Switching frequency varies with load

V

IN

= 12 V, P Out RX = 2.5 W

V

IN

= Nom, I

OUT

= Max

6 12

570

72

18.75

4.5

0

120

5

75%

73.6%

16 V mA mA mA

5.1

V

200 mV

PP

1 A

1.1

A

205 kHz

3 Modifications

See the data sheet ( SLUSBE4 ) when changing components.

Use LED mode – resistor R23 to change the behavior of the status LED, D2, D8 and D9. The standard value is 42.2 k

Ω for control option 1, see the datasheet for additional settings.

FOD threshold setting can be changed using R3. If R3 is removed then FOD function is disabled.

PMOD threshold setting can be changed using R22. If R22 is removed then PMOD function is disabled.

FOD_CAL can be used to change the slope of the FOD LOSS curve for better FOD performance, R52.

Addition of EMI Filter Shield, PWR633 to reduce emissions, see section 6.2.2.6

2

bq500414Q bqTESLA Wireless Power TX EVM


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4 Connector and Test Point Descriptions

This section contains descriptions for the connectors and the test points.

Connector and Test Point Descriptions

4.1

Connector and Test Point Descriptions

The connection points are described in

Section 4.1.1

through

Section 4.1.3

.

4.1.1

J1 – (Pin 1)V

IN,

(Pin 2) GND

Pin 1 - Input power 12 Vdc ±500 mV,

Pin 2 - Return for 12Vdc Input (Ground)

4.1.2

J2 – PMBus

Pin 6 - AGND

Pin 9 - PM_CLK

Pin 10 - PM_DATA

4.1.3

J3 –JTAG

Factory use only.

4.1.4

Control Headers

4.1.4.1

JP1 PMOD and FOD Enable / Disable

Shorting Jumper installed = Enable, removed = Disable

4.1.4.2

JP2 LED select bypass

Shorting Jumper installed = LED Bin 0

Default is not installed.

4.2

Test Point Descriptions

The test points are described in

Section 4.2.1

through

Section 4.2.15

.

4.2.1

TP1 – Unused

Reserved – no connection.

4.2.2

TP2 – BUZ_DC

Output from IC to drive DC buzzer, signals start of power transfer.

4.2.3

TP3 – FOD

Select for FOD threshold

4.2.4

TP4 – COIL1.2

Output from bq500414Q, low enables coil 2 drive.

4.2.5

TP5 – PMOD

Select for PMOD threshold




3


4.2.6

TP6 – Reserved


4.2.7


Reserved – no connection

4.2.8

TP8 – COIL1.3


4.2.9

TP9 – 12Vdc

System regulated 12V from VIN www.ti.com

4.2.10

TP10 - Reserved

Reserved – no connection

4.2.11

TP11 – Shield / No Shield

Input to configure bq500414Q to operate with EMI shield, PWR633. Low = no shield, high (3.3V) = shield

4.2.12

TP12 – 12Vdc Feedback

Feedback circuit for 12V regulator

4.2.13

TP13 – GND

Ground test point connection

4.2.14

TP14 – I_SENSE

Current as measured in the system 12V supply

4.2.15

TP15 – COMM-

Sample of coil voltage return for communications with RX

4.2.16

TP16 – COMM+

Sample of coil voltage for communications with RX

4.2.17



4.2.18

TP18 – DPWM-1A

PWM Output to half bridge drivers

4.2.19



4.2.20

TP20 – GND


4





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4.2.21

TP21 – GND


4.2.22

TP22 – AGND

Analog ground test point connection

4.2.23

TP23 – COIL1.1


4.2.24

TP24 – AGND

Analog ground test point connection

4.2.25

TP25 – 3.3Vdc_EN

3.3Vdc enable signal to the regulator

4.2.26

TP26 – EN_PWR

Enable signal for the 12Vdc system regulator

4.2.27

TP27 – PWRGD

Power good signal from the 3.3Vdc regulator

4.2.28

TP28 – TANK3

Coil 3 Resonant Tank Drive Signal

4.2.29

TP29 – PHSE3

Coil 3 Drive signal

4.2.30

TP30 – GND


4.2.31

TP31 – PHSE1

Coil 1 Drive signal

4.2.32

TP32 – TANK2


4.2.33

TP33 – TANK1


4.2.34

TP34 – GND


4.2.35

TP35 – PHSE2

Coil 2 Drive signal





5

Schematic and Bill of Materials

5 Schematic and Bill of Materials

This section includes the schematics and bill of materials for the EVM.

Figure 1

illustrates the schematic for this EVM.

Vin = 6 to 16 VDC

Vin

J1

Gnd

2

1

L1

C2

1µF

TP20 TP21 TP22 TP24

GND

Net-Tie

GND AGND

C6

1µF

3V3_VCC

EN_PWR

R14

NoPop

TP26

R51

100k

C12

270pF

R11

205k

C13

0.22µF

VIN_FLTR

R13

4.70

1

2

3

4

5

RC

SS

DIS/EN

COMP

FB

U1

TPS40210DGQ

VDD

BP

GDRV

ISNS

GND

8

7

6

10

9

C7 1µF

GND

C8

1µF

GND

C18

4.7µF

C9

270pF

GND

GND GND GND

C36

150pF

C17

2700pF

R12

5.10k

GND

GND

R6

49.9k

R24

3.09k

GND

C10

4.7µF

R29

4.70

R26

1.00k

GND

R30

0.025

GND

L2

C34

4.7µF

C35

4.7µF

Q1

BSZ0902NS

GND

D4

B560C

12VDC

C11

22µF

C37

22µF

GND GND

Figure 1. bq500414QEVM-629 Schematic

TP9

TP12

R50

49.9

12VDC

R15

10.0

R64

0.04

C40

1µF

R18

10.0

U9

AGND

2

GND

3

3V3_VCC

C30

0.01µF

R62

1.00k

AGND

I_SENSE

TP14

C57

0.1µF

VIN_BRD

AGND www.ti.com

6





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12VDC

R7

249k

R65

150k

Q5

BC847CL

V_GATE

VIN_BRD

DPWM-1A

COIL1.2

V_GATE

7

4

6

3

U3

TPS28225-Q1

VDD

PWM

UGATE

BOOT

EN/PG

GND

PHSE

LGATE

1

R60 10.0

2

8

C53

5

R36

0

0.22uF

C54

0.1µF

TP30

GND GND

Q3A

DMG4800LSD

TP35

Q3B

DMG4800LSD

L4B

Middle Coil

C51

TP32

0.068uF

C49

4700pF

C52

0.068uF

GND

C14

5600pF

TANK2

C15

5600pF

GND

C50

22µF

3V3_VCC

C66

0.1µF

GND

R19

200k

R21

23.2k

GND GND 3V3_VCC

C32 0.1µF

R16

10.0

R34

10.0

D6

BAT54SW

TP4

COIL1.2

6

5

4

S B2

1

2

VCC GND

A B1

3

U5 SN74LVC1G3157-Q1

R20

10.0k

C28

33pF

AGND

DPWM-1A

COIL1.1

V_GATE

6

3

7

4

VIN_BRD

U7

TPS28225-Q1

VDD

PWM

EN/PG

GND

UGATE

BOOT

PHSE

LGATE

1 R27 10.0

2

8

C64

5

R35

0

0.22uF

C65

0.1µF

TP34

GND GND

Q2A

DMG4800LSD

Q2B

TP31

DMG4800LSD

TP16

GND

3V3_VCC

C55 0.1µF

COIL1.1

TP23

6

5

4

S

VCC

A

U4

B2

1

2

GND

B1

3

SN74LVC1G3157-Q1

R2

TP15

10.0

L4A

R61

10.0

C56

4700pF

C59

0.068uF

TP33

R28

200k

R66

10.0k

C62

0.068uF

GND

R63

23.2k

C63

33pF

C21

NoPop

TANK1

C23

NoPop

GND

C58

22µF

3V3_VCC

D5

BAT54SW

VIN_BRD

DPWM-1A

COIL1.3

V_GATE

7

4

6

3

U2

TPS28225-Q1

VDD

PWM

UGATE

BOOT

EN/PG

GND

PHSE

LGATE

1

R59 10.0

2

8

C47

5

R41

0

0.22uF

C48

0.1µF

TP13

GND GND

COIL1.3

AGND


3V3_VCC

TP8

GND

C38 0.1µF

Q4A

DMG4800LSD

TP29

Q4B

DMG4800LSD

6

5

4

S

VCC

A

U6

B2

1

2

GND

B1

3

SN74LVC1G3157-Q1

R37

10.0

L4C

R43

10.0

C43

4700pF

C45

TP28

0.068uF

R38

200k

R39

10.0k

AGND

C46

0.068uF

GND

C33

33pF

C24

NoPop

R42

23.2k

TANK3

C27

NoPop

GND

C44

22µF

3V3_VCC

D7

BAT54SW





7


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3V3_VCC

VIN_FLTR VIN_FLTR

R67

10k

R48

348k

R47

1.00

U8

TPS54040-Q1

TP25

R49

226k

AGND

C41

4.7µF

C60

0.01µF

AGND

R55

887k

AGND AGND

5

8

2

VIN

3

4

EN

SS/TR

RT/CLK

COMP

PH

BOOT

VSENSE

PWRGD

PP

GND

C42

R56

76.8k

2700pF

10

1

7

6

11

9

TP27

AGND

C61 0.1µF

D10

MBR0530T1G

D3

BAT54SW N/C

COMM+

12VDC

R33

15.4k

C4

330pF

R10

NoPop

C31

R31

2.00k

4700pF

VIN_FLTR

R4

15.4k

R1

2.00k

L3

330uH

R44

31.6k

R54

10.0k

C29

47µF

R25

10.0k

R46

22

C19 4.7µF

C25

4700pF

NTC

AGND

3V3_VCC

R5

10.0k

STATUS

C16

4700pF

R9

D8 D2

C1 1µF

C22

0.1µF

41

48

AGND

5

475

R32

AGND

TP10

TP1

I_SENSE

PMOD

TP5

475

R53 475

EN_PWR

EMI_SHIELD

FOD_CAL

18

21

22

COMM+

COMM-

37

38

39

40

46

45

42

4

3

2

1

8

9

6

7

D9

AGND

RESERVED

ADCREF

RESET

Unused

Unused

T_SENSE

COIL_PEAK

Unused

V_SENSE

I_SENSE

PMOD

LED_A

LED_B

LED_C

EN_PWR

EMI_SHIELD

FOD_CAL

COMM_A+

COMM_A-

COMM_B+

COMM_B-

TP11

EMI_SHIELD

U10

BQ500414Q

AGND

AGND AGND AGND AGND

3V3_VCC

R40

1.00k

C26

0.1µF

D1

D_LED_LTW-170TK

AGND

3V3_VCC

TCK

TDO

TDI

/TRST

TMS

C39

1µF

C5 4.7µF PM_CLK

PM_DATA

C3 1µF

BPCAP

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

PMB_DATA

PMB_CLK

DPWM_A

FOD

Unused

COIL1.1

COIL1.2

COIL1.3

AGND

35

31

30

29

28

27

12

13

14

15

16

17

20

19

11

10

/TRST

TMS

TDI

TDO

TCK

TP6

TP7

PM_DATA

PM_CLK

FOD

TP3

TP19

COIL1.1

COIL1.2

COIL1.3

AGND

R8

10.0

C20

1µF

TP18

R17

3.57k

AGND

DPWM-1A

TP17

RESERVED

COIL_SEL

BUZ_DC

BUZ_AC

26

25

24

23

TP2

1

R45

BUZ

2

10.0k

3V3_VCC

R70

NoPop

R69

10.0k

3V3_VCC

AGND

R58

NoPop

R57

10.0k

LED_MODE

LOSS_THR

44

43 1

PMOD

JP2

R22

133k

2

R23

42.2k

JP1

AGND AGND

FOD

R3

56.2k

AGND

FOD_CAL

R52

0


FOR DEVELOPMENT ONLY

R68

10k

L5

L6

AGND

L7

8

9

10

3

4

1

2

5

6

7

14

13

12

11

10

9

8

7

6

5

2

1

4

3

J3

NoPop

J2

Table 2

contains the BOM for this EVM.

8





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Table 2. Bill of Materials

(1)

Designator

BUZ

C1, C3, C7, C20, C39, C40

C2, C6

C4

C5, C19

C8

C9, C12

C10, C18, C34, C35

C11, C37

C13

C14, C15

C16, C31, C43, C49, C56

C17, C42

C22, C32, C38, C48, C54, C55,

C57, C61, C65, C66

C26

C28, C33, C63

C29

C30, C60

C36

C41

C44, C50, C58

C45, C46, C51, C52, C59, C62

C47, C53, C64

D1

D2

D3, D5, D6, D7

D4

D8

D9

D10

H52

J2

L1

L2

L3

L4A, L4B, L4C

L5, L6, L7

Q1

Q2, Q3, Q4

(1)

1

1

1

1

1

3

1

3

1

1

1

1

1

6

3

1

1

4

1

2

1

1

3

1

3

2

1

2

4

2

Quantity

1

6

2

1

2

10

1

2

5

Value

Buzzer

1uF

1uF

330pF

4.7uF

1uF

270pF

4.7uF

22uF

0.22uF

5600pF

4700pF

2700pF

0.1uF

0.1uF

33pF

47uF

0.01uF

150pF

4.7uF

22uF

0.068uF

0.22uF

LTW-170TK

RED

BAT54SW

B560C

GREEN

YELLOW

30V

N2510-6002-RB

330uH

1000 ohm

BSZ0902NS

DMG4800LSD

Description

Piezoelectronic, 12 mm

CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603

CAP, CERM, 1uF, 50V, +/-10%, X7R, 1210

CAP, CERM, 330pF, 50V, +/-5%, C0G/NP0, 0603

CAP, CERM, 4.7uF, 10V, +/-10%, X5R, 0603

CAP, CERM, 1uF, 50V, +/-10%, X7R, 0805

CAP, CERM, 270pF, 50V, +/-5%, C0G/NP0, 0603

CAP, CERM, 4.7uF, 50V, +/-10%, X7R, 1210

CAP, CERM, 22uF, 16V, +/-20%, X7R, 1210

CAP, CERM, 0.22uF, 16V, +/-10%, X7R, 0603

CAP, CERM, 5600pF, 100V, +/-5%, C0G/NP0, 1206

CAP, CERM, 4700pF, 50V, +/-10%, X7R, 0603

CAP, CERM, 2700pF, 50V, +/-5%, C0G/NP0, 0603

CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603

CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603

CAP, CERM, 33pF, 50V, +/-5%, C0G/NP0, 0603

CAP, CERM, 47uF, 25V, +/-20%, X5R, 1206

CAP, CERM, 0.01uF, 50V, +/-10%, X7R, 0603

CAP, CERM, 150pF, 50V, +/-5%, C0G/NP0, 0603

CAP, CERM, 4.7uF, 25V, +/-10%, X5R, 0805

CAP, CERM, 22uF, 25V, +/-10%, X5R, 1210

Capacitor, Ceramic, 100V, C0G, 5%

Capacitor, Ceramic, 50V, X7R, 10%

Diode. LED, 70 mW, 20mA

Diode. LED, RED

Diode, Dual Schottky, 200mA, 30V

Diode, 5A, 60V

Diode. LED, GREEN

Diode. LED, YELLOW

Diode, Schottky, 30V, 0.5A, SOD-123

Comb filter PCB 5.080"x3.050" x 0.031"

Connector, Male Straight 2x5 pin, 100mil spacing, 4 Wall

Inductor, SMT Dual Winding, CMC

Inductor, SMT Dual Winding, SEPIC

Inductor, SMT

WPC A6 Coil Assembly, Triple coil

0.2A Ferrite Bead, 1000 ohm @ 100MHz, SMD

MOSFET, NChan, 30V, 13A, 9.4 milliOhm

MOSFET, DUAL NFET, 30V,

0603

1206

0603

0603

0603

0603

0805

0603

1210

1210

Package Reference

12 mm

0603

1210

0603

0603

0603

1206

0603

0603

0805

1210

1210

603

0805

0805

SOT323

SMC

0805

0805

SOD-123

5.080"x3.050" x 0.031"

0.338 x 0.788 inch

0.492 x 0.492 inch

0.492 x 0.492 inch

0.189 x 0.189 inch

0603

QFN3.3x3.3 mm

SO8

PartNumber

PS1240P02CT3

C1608X7R1C105K

GRM32RR71H105KA01L

C1608C0G1H331J

C0603C475K8PACTU

GRM21BR71H105KA12L

C0603C271J5GACTU

GRM32ER71H475KA88L

C3225X7R1C226M

C1608X7R1C224K

GRM3195C2A562JA01D

C0603X472K5RACTU

C1608C0G1H272J

GCM188R71H104KA57B

Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.

GRM188R71H104KA93D

GRM1885C1H330JA01D

C3216X5R1E476M160AC

GRM188R71H103KA01D

GRM1885C1H151JA01D

GRM21BR61E475KA12L

GRM32ER61E226KE15L

C3225C0G2A683J230AA

C1608X7R1H224K080AB

LTW-170TK

150080SS75000

BAT54SWT1G

B560C-13-F

150080VS75000

150080YS75000

MBR0530

PWR633

N2510-6002RB

744284100

744871220

744042331

760308106

74279266

BSZ0902NS

DMG4800LSD-13



Manufacture

TDK

TDK

MuRata

TDK

Kemet

MuRata

Kemet

MuRata

TDK

TDK

MuRata

Kemet

TDK

MuRata

MuRata

MuRata

TDK

MuRata

MuRata

MuRata

MuRata

TDK

TDK

Lite-on

Wurth

On Semi

Diodes Inc.

Wurth

Wurth

On Semi

Any

3M

Wurth

Wurth

Wurth

Wurth

Wurth

Infineon Technologies

Diodes, Inc


9


R47

R48

R49

R50

R51

R31

R33

R35, R36, R41, R52

R44

R46

R55

R56

R64

R65

R67

U1

U2, U3, U7

Designator

Q5

R2, R8, R15, R16, R18, R27,

R34, R37, R43, R59, R60, R61

R3

R22

R5, R20, R25, R39, R45, R54,

R57, R66, R69

R6

R7

R9, R32, R53

R11

R12

R13, R29

R17

R19, R28, R38

R21, R42, R63

R23

R24

R26, R40, R62

R30

U4, U5, U6

U8

Value

BC847CL

10.0

56.2k

133k

10.0k

1.00

348k

226k

49.9

100k

2.00k

15.4k

0

31.6k

22

3.57k

200k

23.2k

42.2k

3.09k

1.00k

0.025

49.9k

249k

475

205k

5.10k

4.70

887k

76.8k

0.04

150k

10k

TPS40210DGQ

TPS28225-Q1

SN74LVC1G3157-Q1

TPS54040-Q1

Quantity

1

12

1

1

1

1

1

1

1

3

1

1

1

3

1

1

1

1

1

3

1

1

1

3

3

1

3

1

1

2

1

1

3

1

1

1

9

10



(1)

(continued)

Description

TRANSISTOR, NPN, HIGH-PERFORMANCE, 500mA

RES, 10.0 ohm, 1%, 0.1W, 0603


SOT-23

0603

RES, 56.2k ohm, 1%, 0.1W, 0603

RES, 133k ohm, 1%, 0.1W, 0603

RES, 10.0k ohm, 1%, 0.1W, 0603

RES, 49.9k ohm, 1%, 0.1W, 0603

RES, 249k ohm, 1%, 0.1W, 0603

RES, 475 ohm, 1%, 0.1W, 0603

RES, 205k ohm, 1%, 0.1W, 0603

RES, 5.10k ohm, 1%, 0.1W, 0603

RES, 4.70 ohm, 0.5%, 0.1W, 0603

RES, 3.57k ohm, 1%, 0.1W, 0603

RES, 200k ohm, 1%, 0.1W, 0603

RES, 23.2k ohm, 1%, 0.1W, 0603

RES, 42.2k ohm, 1%, 0.1W, 0603

RES, 3.09k ohm, 1%, 0.1W, 0603

RES, 1.00k ohm, 1%, 0.1W, 0603

RES, 0.025 ohm, 1%, 0.5W, 1206

RES, 2.00k ohm, 1%, 0.1W, 0603

RES, 15.4k ohm, 1%, 0.1W, 0603

RES, 0 ohm, 5%, 0.1W, 0603

RES, 31.6k ohm, 1%, 0.1W, 0603

RES, 22 ohm, 5%, 0.125W, 0805

RES, 1.00 ohm, 1%, 0.1W, 0603

RES, 348k ohm, 1%, 0.1W, 0603

RES, 226k ohm, 1%, 0.1W, 0603

RES, 49.9 ohm, 1%, 0.1W, 0603

RES, 100k ohm, 1%, 0.1W, 0603

RES, 887k ohm, 1%, 0.1W, 0603

RES, 76.8k ohm, 1%, 0.1W, 0603

RES, 0.04 ohm, 1%, 1W, 2010

RES, 150k ohm, 1%, 0.1W, 0603

Resistor, Metal Strip, 1 W, 1%

IC, 4.5V-52V I/P, Current Mode Boost Controller

IC, High Frequency 4-Amp Sink Synchronous Buck

MOSFET Driver

IC, SPDT Analog Switch

IC, Swift DC-DC Converter With Eco-Mode, 0.5A, 42V

0603

0603

0603

0603

0603

0603

0603

0603

0603

0603

0603

0603

0805

0603

0603

0603

0603

0603

0603

1206

0603

0603

0603

0603

0603

0603

0603

0603

2010

0603

0.083 x 0.158 inch

DGQ0010D

SO8

SOT23-6

DGQ0010D

Copyright © 2014–2015, Texas Instruments Incorporated www.ti.com

PartNumber

BC847CLT1G

CRCW060310R0FKEA

CRCW060356K2FKEA

CRCW0603133KFKEA

RC0603FR-0710KL

CRCW060349K9FKEA

CRCW0603249KFKEA

CRCW0603475RFKEA

CRCW0603205KFKEA

RC0603FR-075K1L

RT0603DRE074R7L

CRCW06033K57FKEA

CRCW0603200KFKEA

CRCW060323K2FKEA

CRCW060342K2FKEA

CRCW06033K09FKEA

RC0603FR-071KL

CSR1206FK25L0

CRCW06032K00FKEA

CRCW060315K4FKEA

CRCW06030000Z0EA

CRCW060331K6FKEA

CRCW080522R0JNEA

CRCW06031R00FKEA

CRCW0603348KFKEA

CRCW0603226KFKEA

CRCW060349R9FKEA

CRCW0603100KFKEA

CRCW0603887KFKEA

CRCW060376K8FKEA

CSRN2010FK40L0

RC0603FR-07150KL

CSC09A0110K0FEK

TPS40210DGQ

TPS28225D

SN74LVC1G3157DBV

TPS54040DGQ



Manufacture

ON Semi

Vishay-Dale

Vishay-Dale

Vishay-Dale

Yageo America

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Yageo America

Yageo America

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Yageo America

Stackpole Electronics Inc

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Vishay-Dale

Stackpole Electronics Inc

Yageo America

Vishay

Texas Instruments

TI

TI

Texas Instruments

www.ti.com

Designator

U9

U10

C21, C23, C24, C27

C25

J3

R1

R4

R10, R70

R14

R58

R68

Quantity

1

0

0

0

0

0

1

0

0

0

0

Value

INA213-Q1

BQ500414Q

NoPop

4700pF

NoPop

2.00k

15.4k

NoPop

NoPop

NoPop

NoPop


(1)

(continued)

Description

IC, Voltage Output, High or Low Side Measurement, Bi-

Directional Zerø-Drift Series

IC, Qi Compliant Wireless Power Transmitter Manager

CAP, CERM, 5600pF, 100V, +/-5%, C0G/NP0, 1206

CAP, CERM, 4700pF, 50V, +/-10%, X7R, 0603

Header, 2x7 pin, 100mil spacing, Straight, 4 Wall

RES, 2.00k ohm, 1%, 0.1W, 0603

RES, 15.4k ohm, 1%, 0.1W, 0603

RES, 10.0k ohm, 1%, 0.1W, 0603

RES, 100k ohm, 1%, 0.1W, 0603

RES, 0 ohm, 5%, 0.1W, 0603

Resistor, Chip, 1/16W, 1%


SC-70

0603

0603

0603

0603

603

VQFN

1206

0603

0.338 x 0.988 inch

0603


PartNumber

INA213AIDCKR

BQ500414RGZ

GRM3195C2A562JA01D

C0603X472K5RACTU

2514-6002UB

CRCW06032K00FKEA

CRCW060315K4FKEA

RC0603FR-0710KL

CRCW0603100KFKEA

CRCW06030000Z0EA

STD

Manufacture

TI

TI

MuRata

Kemet

3M

Vishay-Dale

Vishay-Dale

Yageo America

Vishay-Dale

Vishay-Dale

STD





11

Test Setup

6 Test Setup

6.1

Equipment

www.ti.com

6.1.1

bqTESLA™ Receiver

Use the bq51013BEVM-764 or a Qi-compliant receiver to work with this EVM.

6.1.2

Voltage Source

The input voltage source must provide a regulated DC voltage of 12 V and deliver at least 1-A continuous load current; current limit must be set to 2 A.

CAUTION

To help assure safety and integrity of the system and minimize risk of electrical shock hazard, always use a power supply providing suitable isolation and supplemental insulation (double insulated). Compliance to IEC 61010-1, Safety

Requirements for Electrical Equipment for Measurement, Control and

Laboratory Use, Part 1, General Requirements, or its equivalent is strongly suggested, including any required regional regulatory compliance certification approvals. Always select a power source that is suitably rated for use with this

EVM as referenced in this user manual.

External Power Supply Requirements:

Nom Voltage: 12.0 VDC

Max Current: 2.0 A

Efficiency Level V

External Power Supply Regulatory Compliance Certifications: Recommend selection and use of an external a power supply which meets TI’s required minimum electrical ratings in addition to complying with applicable regional product regulatory and safety certification requirements such as (by example)

UL, CSA, VDE, CCC, PSE, and so forth.

6.1.3

Meters

Monitor the output voltage at the bq51013BEVM-764 test point TP7 with a voltmeter. Monitor the input current into the load with an appropriate ammeter. The transmitter input current and voltage can be monitored, but the meter must use the averaging function for reducing error, due to communications packets.

6.1.4

Loads

A single load is required at 5 V with a maximum current of 1 A. The load can be resistive or electronic.

6.1.5

Oscilloscope

Use a dual-channel oscilloscope with appropriate probes to observe the COMM_DRV signal at bq51013BEVM-764 TP3 and other signals.

6.1.6

Recommended Wire Gauge

For proper operation, use 22-AWG wire when connecting the EVM to the input supply and the bq51013BEVM-764 to the load.

12





www.ti.com

Test Setup

6.2

Equipment Setup

• With the power supply OFF, connect the supply to the bqTESLA™ transmitter.

• Connect the V

IN to J1 Pin 1.

positive power source to J1 Pin 2, and connect the negative terminal of the V

IN source

• Do not place the bqTESLA™ receiver on the transmitter. Connect a load to the receiver J3 with a return to J4, monitor current through the load with the ammeter, and monitor the current to the load at

TP7. All voltmeters must be Kelvin connected (at the pin) to the point of interest.

6.2.1

Equipment Setup Diagram

The diagram in

Figure 4

shows the test setup.

Wireless Transmitter

Bq500414EVM-629

V

IN

+

–

A

V

J1

Pin 2

POS

AC1

Coil L1

L

P

J2

Pin 1

RTN

AC2

AC1

Coil L2

L

P

AC2

AC1

Coil L3

L

P

AC2

L

S

AC1

Wireless Receiver

Bq51013EVM-764

OUT-J2

OUT-TP7

VRECT-TP12

AC2

GND-J4

V

A

R L

V Voltmeter A Ammeter

+

–

Power Supply

Figure 4. Equipment Setup

Oscilloscope

6.2.2

EVM Procedures

This section is provided as a guide through a few general test procedures to exercise the functionality of the presented hardware. Some key notes follow:

6.2.2.1

Start-Up No Receiver

Turn on V

IN

, and observe that the green power LED, D1, illuminates. Status LEDs D2, D8 and D9 are OFF until the power transfer starts.

Apply the scope probe to test point, TP18, and observe single-pulse bursts approximately every 500 ms.

This is a digital ping to begin communications with a receiver placed on the TX coil.




13

Test Setup

www.ti.com

6.2.2.2

Apply Receivers

Place the bq51013BEVM-764 EVM on the top of the transmitting coil. Align the centers of the receiving and transmitting coils across each other. In the next few seconds, observe that the status LED, D6, flashes green, indicating that communication between the transmitter and the receiver is established and that power transfer has started.

• The status LED, D8, flashes a green light during power transfer.

• Typical output voltage is 5 V, and the output current range is 0 mA to 1 A.

6.2.2.3

Efficiency

To measure system efficiency, measure the output voltage, output current, input voltage, and input current and calculate efficiency as the ratio of the output power to the input power. Connect voltage meters at the input and output of TX and RX (see

Figure 4

). Average the input current; the comm pulses modulate the input current, distorting the reading. See

Figure 5

for efficiency.

Figure 5

shows efficiency with standard

EVM.

This shows the efficiency from transmitter input to receiver output. The input power SEPIC converter is included in this circuit and loss is higher due to power loss in two converters. For this test, an input voltage of 13.6 V was used.

Figure 5. Efficiency versus Power, bq500414QEVM-629 Transmitter and HPA764 Receiver

6.2.2.4

Efficiency

Efficiency is affected by changes in the power section. Higher R

DSON design decision and a trade off between cost and performance.

MOSFET increases loss. This is a

Parts selected for the EVM design are optimized for efficiency.

Note that changing the efficiency of the unit and reducing loss (or increasing loss) changes the FOD and the PMOD performance and may require re-calibration. This would require the FOD_CAL resistor (R52) to change along with FOD_Threshold resistor (R3) and PMOD resistor (R22). The FOD and PMOD calibration procedure must be repeated.

6.2.2.5

Input Power DC / DC Converter

To support the input voltage range for an automotive application, an optional wide input voltage converter is installed on the board. The TPS40210 is configured as a Single-Ended Primary-Induction Converter

(SEPIC) providing a 12-V output from an input voltage that can be above and below 12V.

6.2.2.6

EMI Shield

The EVM is designed to support an EMI Shield above the coils to reduce emissions. The shield, PWR633, is a comb-type filter that is effective between 100 kHz and 2 MHz.

14





www.ti.com

Test Setup

To install the shield:

Remove clear plastic cover and hardware. Install the PWR633 filter using metal hardware provided. The filter is grounded though the metal hardware to the TX coil area.

Circuit changes:

EMI_Shield select pin 21 ground = no shield, high(3.3V) = shield

FOD_CAL R52 no shield = 16.2 k Ω, shield = 8.06 kΩ

NOTE: if ONLY EMI behavior is to be evaluated with the addition of the shield, then circuit changes are not required.

6.2.2.7

Configuration Resistor

Some functions can be configured by an external resistor pull up and connections, see the data sheet

( SLUSBE4 ) for more info:

1. Coil Select R58 and R57, configure for type of coil used

2. Shield / no shield Pin 21, configure for shield or no shield

3. Operating freq pin 26, R70 and R69, option to reduce operating range

6.2.2.8

Thermal Protection, NTC

Thermal protection is provided by an NTC resistor network is connected to pin 2. At 1 V on the sense side

(U10-2), the thermal fault is set, and the unit is shut down, The status LED, D7, illuminates red. The system tries to restart in 5 minutes.

6.2.2.9

Foreign Object Detection

The bq500414Q EVM incorporated the Foreign Object Detection (FOD) call in WPC 1.1. Power loss is calculated by comparing the power sent to the receiver (RX) with the power the RX reported receiving, less know power loss. The transmitter determines the power sent to the RX by measuring input power and calculating internal losses. The RX measures the power it received and also calculates losses. The RX sends this information to the driver (TX) in a digital word, message packet. Unaccounted for power loss is presumed to be a foreign object on the charging pad. Should this lost power exceed the threshold set by

R34, a FOD fault is set and power transfer is stopped.

Three key measurements for the TX FOD calculation:

• Input Power – Product of input voltage and current. Input voltage is measured at pin 45 though R33 and R31. Input current is measured using sense resistor R64 and current sense amp U9. Both measurements must be very accurate.

• Power Loss in Transmitter – This is an internal calculation based on the operating point of the transmitter. The calculation is adjusted using FOD_Cal resistor, R52. This calculation changes with external component changes in the power path such as MOSFETs, resonate capacitors, and TX coil.

Recalculation of R52 and R3 is required.

• Receiver Reported Power – The receiver calculates and reports power it receives in the message packet “Received Power Packet (0X04)”.

The FOD threshold on the EVM is set to 550 mW, R3 is set to 86.6 k Ω. Increasing R3 increases the threshold and reduces the sensitivity to foreign objects.

This loss threshold is determined after making a measurement of transmitter performance using a FOD calibration receiver similar to the unit manufactured by Avid

®

Technology. Contact Texas Instruments for the FOD calibration procedure for bq500414Q.

6.2.2.10

WPC Certification

The bq500414QEVM-629 was tested and certified to WPC version 1.2.




15

bq500414QEVM-629 Assembly Drawings and Layout

7 bq500414QEVM-629 Assembly Drawings and Layout

www.ti.com

Figure 6

through

Figure 7

show the design of the bq500414QEVM PCB. The EVM has been designed using a 4-layer, 2-oz, copper-clad circuit board 15.24 cm × 13.335 cm, but components fit into an 8cm × 5.0-cm area on the top side. All parts are easy to view, probe, and evaluate the bq500414Q control

IC in a practical application. Moving components to both sides of the PCB or using additional internal layers offers additional size reduction for space-constrained systems. Gerber files are available for download from the EVM product folder.

A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer

PCB presents a high risk of poor performance. Grounding between the bq500414Q GND EPAD, pin 47,

36, and 32 and filter capacitor returns C19, C1, C5, and C3 should be a good low-impedance path.

Coil Grounding – A ground plane area under the coil is recommended to reduce noise coupling into the receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point back to the circuit area.

Note: The clear plastic cover thickness (0.093 in or 2.4 mm) is the z-gap thickness for the transmitter.

Components marked ‘DNP’ should not be populated, and may not be listed in the bill of materials.

Figure 6. Assembly Top

16





www.ti.com


Figure 7. Top Overlay




17


www.ti.com

Figure 8. Top Solder

18





www.ti.com


Figure 9. Top Layer




19


www.ti.com

Figure 10. Inner Layer 1

20





www.ti.com


Figure 11. Inner Layer 2




21

Reference

www.ti.com

Figure 12. Bottom Layer

8 Reference

For additional information about the bq500414QEVM-629 low-power, wireless, power evaluation kit from

Texas Instruments, visit the product folder on the TI Web site at http://www.ti.com/product/bq500414Q

22





www.ti.com

Revision History

Revision History

Changes from Original (March 2014) to A Revision

.......................................................................................................

Page

• Changed the Input Voltage values of

Table 1

From: MIN = 11.50, TYP = 12.0, MAX = 12.50 To: MIN = 6, TYP = 12, MAX

= 16

.........................................................................................................................................

2

• Deleted the Input current value of MAX = 1000 mA from

Table 1

.................................................................

2

• Changed

Figure 1

and added

Figure 2

and

Figure 3

.

• Changed R3, R22, R52 in the

Table 2

................................................................................

6

.................................................................................................

8

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.




Revision History

23

FCC and IC Regulatory Compliance

REGULATORY COMPLIANCE INFORMATION

As noted in the EVM User’s Guide and/or EVM itself, this EVM is subject to the Federal Communications Commission (FCC), Industry

Canada (IC) and European Union CE Mark rules.

FCC – FEDERAL COMMUNICATIONS COMMISSION Part 18 Compliant

Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 18 of the FCC

Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Note: There is no required maintenance of this device from a FCC compliance perspective.

IC – INDUSTRY CANADA ICES-001 Compliant

This ISM device complies with Canadian ICES-001.

Cet appareil ISM est conforme à la norme NMB-001 du Canada.

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES

1.

Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.

Acceptance of the EVM is expressly subject to the following terms and conditions.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.

2 Limited Warranty and Related Remedies/Disclaimers:

2.1

These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM.

2.3

If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.

3

Regulatory Notices:

3.1

United States

3.1.1

Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1

For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur

3.3 Japan

3.3.1

Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2

Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan are NOT certified by

TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:

1.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for

Enforcement of Radio Law of Japan,

2.

Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to

EVMs, or

3.

Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】

本開発キットは技術基準適合証明を受けておりません。

本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。

日本テキサス・インスツルメンツ株式会社

東京都新宿区西新宿６丁目２４番１号

西新宿三井ビル

3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ

い。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

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4

EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.

User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

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6.

Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE

DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER

WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED

WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY

THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND

CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY

OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD

PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY

INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF

THE EVM.

7.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS

LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,

EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY

HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION

SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY

OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8.

Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE

TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS

BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED

TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS

OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,

LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL

BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION

ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM

PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER

THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE

OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND

CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.

Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2015, Texas Instruments Incorporated spacer

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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Wireless Connectivity www.ti.com/audio amplifier.ti.com

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2015, Texas Instruments Incorporated

Texas Instruments bq500414Q bqTESLA Wireless Power TX EVM (Rev. A) User guide

User's Guide

bq500414Q bqTESLA Wireless Power TX EVM

1 Applications

2 bq500414QEVM-629 Electrical Performance Specifications

3 Modifications

4 Connector and Test Point Descriptions

4.1

Connector and Test Point Descriptions

4.2

Test Point Descriptions

5 Schematic and Bill of Materials

6 Test Setup

6.1

Equipment

6.2

Equipment Setup

7 bq500414QEVM-629 Assembly Drawings and Layout

8 Reference

Revision History

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