Texas Instruments CC2650 Bluetooth keyboard module Reference design
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Bluetooth
®
Smart Keyboard Module
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Design Resources
TIDC-Bluetooth-Smart-
Keyboard-Module
CC2650
Tool Folder Containing Design Files
Product Folder
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Design Features
• Low-Power Consumption and Industry-Best
Product Battery Life
• Easily Adaptable to any Keyboard Matrix
• Small Form-factor Castellation Design
• Interoperable With Android™, iOS™, and
Windows ®
• HID Over GATT Profile (HOGP) Compliant, Which
Includes Support for Keyboard and Consumer
Control Inputs
• Smart Master Switch Feature for Switching
Between Pre-paired Masters With the Push of a
Button
• Integrated On-board 2.4-GHz Small PCB Antenna
• On-board JTAG Provision for Application
Programming and Debugging
• On-board Slow Clock to Wake Up From Standby
Keyboard-Module Modes
Featured Applications
• Bluetooth ® Smart HID Keyboard
JTAG
CC2650
Balun
Crystal
24 MHz
Crystal
32 KHz
Antenna
31 GPIOs
An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information.
SmartRF, SimpleLink are trademarks of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
iOS is a trademark of Apple Inc.
iPad Mini is a registered trademark of Apple Inc.
Bluetooth is a registered trademark of Bluetooth SIG.
Android is a trademark of Google Inc.
Windows, Microsoft are registered trademarks of Microsoft Corporation.
ZigBee is a trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.
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Bluetooth
®
Smart Keyboard Module 1
Key System Specifications
1 Key System Specifications
PARAMETER
Bluetooth Smart chip
Main Crystal
Slow clock
Antenna
Vin
Vout www.ti.com
Table 1. System Specifications
SPECIFICATION
The CC2650 is a wireless MCU targeting
Bluetooth Smart, ZigBee™ and 6LoWPAN, and
ZigBee RF4CE remote-control applications
24-Mhz crystal
32.768-Khz crystal resonator
Integrated 2.4-Ghz PCB antenna
DETAILS
Refer to the following link: http://www.ti.com/product/CC2650
Refer to the following link: http://www.epsondevice.com/docs/qd/en/D ownloadServlet?id=ID000658
Refer to the following link: http://www.eea.epson.com/portal/pls/portal
/docs/1/1699449.PDF
Refer to
Small 2.4-GHz PCB Antenna
Application Note ( SWRA117 )
Input voltage 3.3 V, DC powered
Output voltage 3.3 V, powers the Bluetooth Smart module
2 System Description
Antenna
Balun
JTAG
CC2650
Crystal
24 MHz
Crystal
32 KHz
31 GPIOs
2
Figure 1. Keyboard Module Block Diagram
The TI Keyboard module contains the CC2650 Bluetooth Smart Wireless MCU. This module can be integrated with a keyboard motherboard to achieve a very-low power keyboard solution.
The main features of the module are as follows:
• Fully integrated module with CC2650 Bluetooth Smart Wireless MCU, crystal filters, matching circuit, and on-board 2.4-GHz PCB antenna
• Small factor, castellation design
• The keyboard module is tested by integrating it with a third-party keyboard matrix (105 keys)
• The functionality of the keyboard is tested by connecting to host devices with these operating systems:
– Android 4.3 and above
– iOS 6.0 and above
– Microsoft ® Windows 8
• JTAG availability for debugging
• Easy access to ADC pins to check and monitor low battery conditions
Bluetooth
®
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• On-board 32.768 KHz to enable wake-up from deep modes
2.1
CC2650—Bluetooth Smart Wireless MCU
System Description
SimpleLink™ ULP wireless MCU platform cJTAG
Main CPU
ROM
ARM
Cortex
®
® -M3
Up to
128 KB
Flash
8 KB cache
20 KB
SRAM
General peripherals / modules
4× 32-bit timers
RF core
2.4 GHz
Sub-1GHz
ADC
ADC
Digital PLL
DSP modem
Radio controller
4 KB
SRAM
ROM
Sensor controller
Sensor controller engine
UART 2× SSI (SPI, µW, TI)
12-bit ADC, 200 ks/s
I2S Watchdog timer
2× Analog comparators
10 / 15 / 31 GPIOs TRNG
AES
32 ch. µDMA
Temp. / batt. monitor
RTC
DC / DC converter
Constant current source
Time-to-digital converter
2 KB SRAM
Figure 2. CC2650 Block Diagram
The CC2650 is a wireless MCU targeting Bluetooth Smart application. The device is a member of the
CC26xx family of cost-effective, ultralow-power, 2.4-GHz RF devices. Very-low active RF and MCU currents and low-power mode current consumption provide excellent battery life and allow operation on small coin-cell batteries and in energy-harvesting applications.
The CC2650 contains a 32-bit ARM ® Cortex ® -M3 running at 48-MHz as the main processor and a rich peripheral feature set, including a unique ultralow-power sensor controller, which is ideal for interfacing external sensors or collecting analog and digital data autonomously while the rest of the system is in standby mode.
Click here for more information on the CC2650.
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Bluetooth
®
Smart Keyboard Module 3
System Design Theory
3 System Design Theory
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The Bluetooth Smart module is designed to cater to the HID keyboard and other markets where the similar-dimension modules are used. The module is a four-layer printed circuit board with integrated 2.4-
GHz PCB antenna. This section covers the technologies and procedures used.
The keyboard module is connected to the keypad matrix through a set of GPIOs. A key press / release is detected by the keyboard application by using a key-scan algorithm, which refers to the GPIO state. The key detections are communicated to the connected host device using the Bluetooth Smart communication mechanism. The HID over GATT Protocol (HOGP) is used between the keyboard and host device for interpreting the key strokes. The working of the keyboard module is visualized in
KBD Application
Key Scan HOGP
BLE STACK
Figure 3. HID Keyboard Blocks
3.1
Bluetooth Smart
For the keyboard to work, it must establish a Bluetooth Smart connection with the host device. Also, the host device operating system must support a Bluetooth Smart-enabled keyboard. Windows 8.1, Android
4.3, and iOS 6.0 onwards devices can be used as the host because these devices support Bluetooth
Smart keyboards through a HID over GATT profile (HOGP).
During the Bluetooth Smart connection, the keyboard will be the slave / peripheral device, and the
Windows / Android / iOS devices will be the master / host device. When first connecting, the host device
“pairs” with the keyboard and uses the “pairing” information to connect with the keyboard subsequently.
describes the various states of the keyboard.
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®
Smart Keyboard Module
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System Design Theory
Keystroke
Idle Active
Key Release
Connecting to
Host
Key Stroke
Advertising State
Power
On
Power
Off
No Activity
Inactivity
>120 s
Sleep State
Power
Off
Power
Off
Power Down State
Figure 4. Keyboard State Diagram
1. Connected State
The keyboard enters a connected state when the Bluetooth Smart connection with a host device (after pairing with host) is successful. The keyboard connected state can be divided into two sub states:
(a) Idle
In Idle mode, the Bluetooth Smart connection is established and maintained with the host device.
The keyboard sends periodic Bluetooth Smart activity data to maintain connection, but no keyboard-related data is sent to host by the Bluetooth Smart radio. The keyboard remains in ‘Idle’ state until a key-stroke detection or until the inactivity timer times out.
(b) Active
The keyboard moves into ‘Active’ state when a key stroke is detected. The key stroke triggers an interrupt, and the key-scan algorithm is used to detect the key pressed. The detected keys are sent to the host as HID reports. The keyboard remains in ‘Active’ state until the key press is released.
Upon release of all active keys, the device goes back to ‘Idle’ state.
2. Standby State
During prolonged periods of inactivity (>120 seconds), the keyboard terminates the Bluetooth Smart connection to conserve power and enters ‘Standby state. No Bluetooth Smart or key-press activity occurs in this state. The keyboard can be woken up from this state by a key press.
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Bluetooth
®
Smart Keyboard Module 5
System Design Theory www.ti.com
3.
Advertising State
When a key press occurs in ‘Standby’ state, the keyboard wakes up and enters ‘Advertising’ state. In this state, the keyboard sends a Bluetooth Smart advertisement, which can be detected by host devices. If a pre-paired host detects these advertisement packets, the host device will enter into a connection with the keyboard, and the keyboard moves to ‘Connected-Idle’ state. If no host device initiates a connection to the keyboard, the keyboard will move back to ‘Standby’ state after advertising for a fixed duration in ‘Advertising’ state.
4. Power Down State
The keyboard goes into ‘Power Down State’ when the power switch is turned OFF. The device can enter ‘Power Down’ state from any state, but it can come out of ‘Power Down’ state only when power switch is turned ON, and it always goes into ‘advertising’ state.
3.2
HOGP
The keyboard uses a HID slave implementation of HID over GATT protocol (HOGP). The host device uses the HID host implementation of HOGP. The HOGP HID slave implementation uses various services, such as one or more instances of HID service, one instance of device-info service, one or more instance of battery service, and others along with the HID slave role as shown in
Report Host
Scan parameters
Profile
HID Device
Device
Information
Service
HID Profile
Scan
Parameters
Service
Battery
Service
Other
Optional
Services
Figure 5. HID Host and HID Device (Keyboard) Roles / Service Relationships
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®
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Hwi App HID BLE Stack
System Design Theory
When a Bluetooth Smart connection is formed between the host device and keyboard, the HID host reads the services supported by the keyboard. The keystrokes and their releases are sent as HID reports that are interpreted by the HID host with the help of the HID report map, which the HID host read earlier when the connection was formed. This process is shown in
.
HID Host Device
Hw Init
BLE Stack Init
Adverstisement
Conn.
Noti
Connection Request
Connection Response
Service Discovery and HID Report Map Read
Enable Notification for Key Input and CC Input
Key
HID Rpt
Release
HID Rpt
HID report as GATT Notification
Empty HID report for Key release
Figure 6. HID Service Discovery
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Bluetooth
®
Smart Keyboard Module 7
System Design Theory
3.3
Key Scan Application
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3.3.1
Key Matrix
The keyboard controller presented in this document implements a key matrix of rows and columns. The implementation shown uses a 16 row × 8 column matrix, which allows up to 128 keys but only uses 80 keys in total. An example key matrix is shown in
.
KI -0 KI -1 KI- 2 KI -3 KI-N
KO -0
KO -1
KO - 2
KO - 3
~
1
Q
A f1
2
W
S
R
D f3
4 f5
7
T
Y del
BS
Ent
KO - M
Z X V B
Figure 7. Key Matrix Configuration
The pins labeled KI-0 to KI-N are configured as input pins with a weak internal pull-up (input pins with high value that can be overridden by external signals). Interrupts are enabled on these input pins for a fallingedge scenario. The pins labeled KO-0 to KO-M are configured as output pins with a low value driven to them.
When a key gets pressed, the input line and output line gets shorted, which drives a low value on the input pin and triggers the interrupt for that input pin. For example, when a user presses the letter ‘W’, the input line KI-1 gets shorted to output line KO-2, triggering an interrupt on KI-1. The interrupts are handled using a Hwi task by RTOS (Real-Time Operating System—For more details, refer to SimpleLink Bluetooth
Low Energy CC2640 Wireless MCU Software Developers Guide [ SWRU393 ]). The Hwi task saves the pin that triggered the interrupt and posts an event to the application task, which handles the key-scan logic to determine the actual key being pressed. The key press is detected by toggling the input-line and outputline configuration and then by reading the input-pin values. The following detailed steps show the process for key detection.
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®
Smart Keyboard Module
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System Design Theory
Initial Configuration
1. Configure the 24 GPIOs of CC26XX as 16 input pins and 8 output pins (refer to the pin-mapping Excel sheet in the download section).
• The 8 output pins are pulled low, and the 16 inputs pins are configured for falling-edge interrupt.
Interrupt Detection
2. Press a key to cause the output line (for example, KO-2) to come in contact with the input line and cause an interrupt on the input line (for example, KI-1).
• This input line (KI-1) is reported to the application by the ISR.
3. Disable interrupts and clear the interrupt flag.
• After the de-bounce timeout, the application checks for the output line responsible for triggering the interrupt on the input line (KI-1).
Polling State
4. For this check, make all output lines as inputs ("KI'') with weak pull up.
5. Toggle only one line from "KI'' to the output line with low value.
6. Read the status of the input lines.
• All other input lines should read high except the input lines, which share the pressed keys with the output line used in step 5.
7. Use the schematics of the keypad matrix to find the key press corresponding to a particular combination of input and output lines.
8. Toggle another line as output similar to step 5.
9. Redo steps 5 to 8 until all lines from "KI'' are checked.
10. Continue polling operations until no key press is detected on the keyboard.
Re-Enabling Initial Configuration
11. Revert the pin configuration to the original configuration.
12. Enable interrupt on the input lines.
NOTE: This detected key is checked for potential 'ghost' keys. If the detected key passes the ghostkey test, it will be sent to the host device in the form of an HID report. The key release is handled in the software; when a key is released, an empty HID report is sent to signal the release to the HID host device.
A HID report is constructed for each new key press. This HID report also consists of the status of the modifier keys (Left / Right Shift / Alt / Ctl / GUI). These reports are then sent to the HID task, which sends them out to the host device, while only the last reported Key release is sent to the HID host.
The key release and detection of new keys on the same input line are carried out by setting software timers and checking the input line status regularly when these timers finish. A key release is notified by sending a blank HID report. Only the recently sent key release is notified. The flow chart of the key detection and release process is given in
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Bluetooth
®
Smart Keyboard Module 9
System Design Theory
Hwi Task
Store Interrupt Pin
Start De-bounce
Clock
Exit Hwi Task
Release
Clock End?
Sleep
De-bounce
Clock End?
Save Event & Switch to Main
App Task
Key Press?
Ghost Key?
Sleep
Sleep
Sleep www.ti.com
Check for New Keys on
Same Input Line
Save Key and Start Release
Timer
Key
Released?
Prepare and Send HID Report
10
Sleep
Restart Release Timer
Figure 8. Key Detection and Release Procedure
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®
Smart Keyboard Module
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Getting Started Hardware
3.3.2
Ghost Key
When three or more keys sharing rows and columns are pressed at the same time, unwanted “keys” can be falsely detected as shown in
Figure 9 . For example, when keys ‘W’, ‘2’, and ‘4’ are pressed together,
the key scan algorithm will also detect key ‘R’, which is a false detection. The software present in the keyscan algorithm tries to eliminate these wrongly detected keys known as ghost keys.
~
Q f
2
W f3
4
R
Figure 9. Ghost Key
4 Getting Started Hardware
The Bluetooth Smart keyboard module is brought out as a castellation form factor with dimensions of 15 mm × 28.2 mm.
Figure 10. Bluetooth Smart Keyboard Module
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®
Smart Keyboard Module 11
Getting Started Hardware www.ti.com
4.1
Integration with a Motherboard
The keyboard module fits any similar-dimension keyboard motherboard, and it provides access to all the
GPIOs and peripherals present in the CC2650 wireless MCU, as shown in
Third party motherboard TI Keyboard Module
Figure 11. Keyboard Module Integrated with Third-Party Mother Board
The motherboard would have provisions for a pinout area, which matches the keyboard-module-pad dimensions and comprises an LDO, key matrix connector (depending on the number of keys), and an ON
/ OFF switch.
To ensure optimum performance, users must take care in the design to place the antenna part away from the motherboard (as depicted in
), with no battery or metal above or beneath it.
4.2
Download and Debugging
There are provisions for programming and debugging the CC2650 Wireless MCU chip using the on-board
JTAG pins. To start this process, connect the four JTAG pins available on the keyboard module, to a 10pin ARM debug connector (P410) on a SmartRF™06 board.
Details are provided on page 26 of the SmartRF06 user guide .
5 Getting Started Firmware
In this section, we discuss how to build and flash the keyboard software for the keyboard layout. Use the following software and tools to build the keyboard binary:
1. The Bluetooth Low-Energy Stack (BLE-STACK-v2.1) available for download here
2. The keyboard patch file provided along with this reference design
3. IAR 7.30.4 or later for building and flashing the keyboard binary through JTAG
4. SmartRF Flash Programmer v2 (optional) available for download here .
5.1
Installation Instructions
1. Download the Bluetooth Low-Energy SDK v2.1 and follow the instructions to install the Bluetooth Low-
Energy SDK along with associated tools (SimpleLink™ and XDC tools). Install the SDK in the default location.
2. Unzip the keyboard patch file to the SDK installation directory (C:/ti/simplelink/ble_cc26xx_2_01_00_xx if the default location is used).
3. The HID keyboard project is under <PROJ_LOC>/Projects/ble location.
4. The default board files will be created under
<PROJ_LOC>/Projects/ble/common/cc26xx/boards/keyboard_cc26xx.
5. Several other files will be updated in the SDK.
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Getting Started Firmware
5.2
Update of Board Files
1. In the keyboard patch file, there will be a KeyScanGenerator Tool in the Accessories folder.
2. Follow the instructions in the Key_Matrix_Generator.doc to update the key_matrix.xlsx as per the board layout.
3. Run the Key_Scan.exe as described in the Key_Matrix_Generator.doc to create new board files.
4. As instructed in the Key_Matrix_Generator.doc, copy the board files to
<ProJ_LOC>/Projects/ble/common/cc26xx/boards/keyboard_cc26xx.
5. Ensure that Board_HIDUsagekey.h is replaced in
<ProJ_LOC>/Projects/ble/HIDKeyBoard/CC26xx/Source/Application.
5.3
Building and Flashing of Keyboard Binary
1. Open the HID keyboard project in IAR 7.30.4 and import the CC26xx-RTOS variables using Tools →
Configure Custom Argument variables if not already imported.
2. Connect the JTAG on the keyboard to the SmartRF06 evaluation board JTAG connector, which will be connected to the PC running IAR.
3. Build the app-and-stack sub-projects.
4. Download the app-and-stack projects either through IAR → Project → Download → Download Active
Application option or through flash programmer.
5.4
Pairing and Connecting to Host
1. Prepare the Bluetooth Smart host by turning on Bluetooth, and start scanning for Bluetooth devices.
2. Turn on the keyboard. The keyboard appears in the list of available devices.
3. The keyboard should be listed as ‘TI BLE HIDKeyboard’; click on it and select Pair to pair and bind the keyboard with the tablet or phone.
4. Wait until the operation is successful. The keyboard only needs to be bound one time with the tablet or phone; to bind the keyboard to another device, remove the binding from this device first or turn off
Bluetooth on this device.
5. After the keyboard is paired and bound to the host, the keyboard will connect to the host.
6. Now any key stroke on keyboard will be sent to the host. Open any application like Notes or Email to start typing using the connected Bluetooth Smart keyboard.
7. To save power, the keyboard automatically goes into standby mode if there is no user input for around
120 seconds.
8. Any keystroke on the keyboard will wake up the keyboard and it will try to connect with the host
(except in power off mode). If the host is ready, the Bluetooth Smart connection is established automatically.
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Bluetooth
®
Smart Keyboard Module 13
Test Setup
6 Test Setup
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6.1
Current Measurement Setup
This section describes how to measure the power consumption of the keyboard. The keyboard is powered by a 3.0-V DC power supply. While describing power measurement, assume the keyboard to be powered by a 3.0-V DC supply and hence will mention only the current consumed by the keyboard. The power consumed by the keyboard can be calculated in the following manner:
Power (in Watts) = Voltage (in Volts) × Current (In Amperes) (1)
The measurement setup is described in
.
7
3.3-V DC Power
Supply
-
+
+
6.5-digit range
Ammeter
+
-
Keyboard
Figure 12. Current Measurement Setup
The ammeter is connected in a series with the power supply and keyboard. The ammeter used should be high precision; preferably one with a 6.5-digit accuracy to accurately measure standby current and small transient current.
Test Data
The current consumption test results for the various scenarios are listed in
. For testing, the keyboard was connected to an iPad Mini ® running iOS 8.2 on Bluetooth Smart.
SCENARIO
Advertising
Connected Idle
Disconnected (Standby)
Key-press at 300 keys / minute
Continuous key press without release
Table 2. Current Profile
CURRENT CONSUMPTION
Approximately 182 µA
Approximately 117 µA
Approximately1.8 µA
Approximately 400 µA
Approximately 900 µA
The connection parameters used are listed in
PARAMETER
Connection Interval
Slave Latency
Advertising Interval
Key Scan Polling Interval
Table 3. Connection Parameters
VALUE
15 ms
4
100 ms
4 ms
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®
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Test Data
7.1
Current Consumption Graphs
The following sections show current consumption graphs for Advertising, Connected-Idle, and Continuous-
Typing states.
7.1.1
Advertising
7.1.2
Connected Idle
Figure 13. Advertising State Current Consumption
Figure 14. Connected Idle State Current Consumption
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®
Smart Keyboard Module 15
Design Files
7.1.3
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Figure 15. Continuous Typing State Current Consumption
8 Design Files
8.1
Schematics
To download the schematics, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.2
Bill of Materials
To download the bill of materials (BOM), see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.3
Layer Plots
To download the layer plots, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.4
Altium Project
To download the Altium project files, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.5
Layout Guidelines
To download the layout guidelines, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.6
Gerber Files
To download the Gerber files, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.7
Assembly Drawings
To download the assembly drawings, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
8.8
Software Files
To download the software files, see the design files at TIDC-Bluetooth-Smart-Keyboard-Module .
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®
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9 Terminology
ATT— Attribute Protocol
BLE— Bluetooth Low Energy
BT— Bluetooth
GAP— Generic Access Profile
GATT— Generic Attribute Profile
IDE— Integrated Development Environment
HID— Human Interface Device
HOGP— HID over GATT
L2CAP— Logical Link Control and Adaptation Protocol
LE— Low Energy
LL— Link Layer
NV— Non-Volatile
10 References
1. CC26xx SimpleLink Wireless MCU ( SWCU117 )
2. SimpleLink Bluetooth Low Energy CC2640 Software Developer’s Guide ( SWRU393 )
3. HID over GATT Profile ( HOGP )
Terminology
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®
Smart Keyboard Module 17
About the Author www.ti.com
11 About the Author
ARUN MENON is a systems application engineer at TI, where he develops Bluetooth Smart reference design solutions for the HID market. Arun has experience in application support for Bluetooth Smart wireless products. Arun earned his Master of Engineering in Electrical Engineering (ME-EE) from the
Indian Institute of Science in Bangalore, India.
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®
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JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in
Buyer’s safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use.
Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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Changes from July 24, 2015 to August 24, 2015 .............................................................................................................
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• Updated from CC2640 to CC2650 throughout document
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Copyright © 2015, Texas Instruments Incorporated
TIDUAB1A – July 2015 – Revised August 2015
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IMPORTANT NOTICE FOR TI REFERENCE DESIGNS
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TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any
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ANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER’S USE OF TI REFERENCE DESIGNS.
TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per
JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.
Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in
Buyer’s safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use.
Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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