NXP TDA3674AT Low dropout voltage/quiescent current 5 V voltage regulator Data Sheet

INTEGRATED CIRCUITS

DATA SHEET

TDA3674

Low dropout voltage/quiescent current 5 V voltage regulator with enable

Preliminary specification

Supersedes data of 2000 Feb 01

File under Integrated Circuits, IC01

2001 Jan 24

Philips Semiconductors

Low dropout voltage/quiescent current 5 V voltage regulator with enable

Preliminary specification

TDA3674

FEATURES

•

Fixed 5 V, 100 mA regulator with enable function

•

Supply voltage range up to 45 V

•

Very low quiescent current of 15

µ

A (typical value)

•

Very low dropout voltage

•

High ripple rejection

•

Very high stability:

– Electrolytic capacitors: Equivalent Series Resistance

(ESR) < 22

Ω

at worst-case condition

– Other capacitors: 100 nF at 200

µ

A

≤

I

REG

•

Pin compatible family TDA3672 to TDA3676

≤

100 mA.

•

Protections:

– Reverse polarity safe (down to

−

25 V without high reverse current)

– Negative transient of 50 V (R

– ESD protection on all pins

S

= 10

(supply line may be short-circuited)

Ω

, t < 100 ms)

– Able to withstand voltages up to 18 V at the output

– DC short-circuit safe to ground and V

P

of the regulator output

– Temperature protection (at T j

> 150

°

C).

GENERAL DESCRIPTION

The TDA3674 is a fixed 5 V voltage regulator with very low dropout voltage and quiescent current, which operates over a wide supply voltage range.

QUICK REFERENCE DATA

SYMBOL

Supply

V

P

I q

PARAMETER supply voltage quiescent supply current

CONDITIONS regulator on

V

V

P

= 14.4 V; I

REG

I(EN)

= 5 V

= 0 mA;

3

−

MIN.

TYP.

14.4

15

MAX.

45

30

V

µ

UNIT

A

Voltage regulator

V

REG regulator output voltage

V

REG(drop) dropout voltage

8 V

≤

V

P

≤

22 V; I

REG

= 0.5 mA

6 V

≤

V

0.5 mA

P

≤

≤

45 V; I

REG

I

REG

= 0.5 mA

≤

100 mA;

V

P

= 14.4 V

V

T

P

= 4.5 V; I

REG amb

≤

85

°

C

= 50 mA;

4.8

5.0

4.75

5.0

4.75

5.0

−

0.18

5.2

5.25

V

5.25

0.3

V

V

V

ORDERING INFORMATION

TYPE

NUMBER

TDA3674AT

NAME

SO8

PACKAGE

DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm

VERSION

SOT96-1

2001 Jan 24 2

Philips Semiconductors


BLOCK DIAGRAM


TDA3674 handbook, halfpage

VP

8

EN

REGULATOR

1

5

BAND GAP

TDA3674

THERMAL

PROTECTION

2, 3, 6, 7

MGS597

GND

REG

Fig.1 Block diagram.

PINNING

SYMBOL

REG

GND n.c.

EN

V

P

PIN (SO8) DESCRIPTION

1 regulator output

2, 3, 6 and 7 ground; note 1

4

5

8 not connected enable input supply voltage

Note

1. All GND pins are connected to the lead frame and can also be used to reduce the total thermal resistance

R th(j-a)

by soldering these pins to a ground plane.

The ground plane on the top side of the PCB acts like a heat spreader.

handbook, halfpage

REG 1

GND 2

GND 3 n.c.

4

8 VP

7 GND

TDA3674

6 GND

5 EN

MGS598

Fig.2 Pin configuration.

2001 Jan 24 3




TDA3674

FUNCTIONAL DESCRIPTION

The TDA3674 is a fixed 5 V regulator which can deliver output currents up to 100 mA. The regulator is available in an SO8 package with fused centre pins connected to the lead frame. The regulator is intended for portable, mains, telephone and automotive applications. To increase the lifetime of batteries, a specially built-in clamp circuit keeps the quiescent current of this regulator very low, also in dropout and full load conditions.

The regulator remains operating down to very low supply voltages and below it switches off.

A temperature protection circuit is included, which switches off the regulator output at a junction temperatures above 150

°

C.

A new output circuit guarantees the stability of the regulator for a capacitor output circuit with an ESR

(worst-case) up to 22

Ω

, see Figs 4 and 5. If only a 100 nF

I capacitor is used, the regulator is fully stable when

REG

> 200

µ

A. This is very attractive as the ESR of an electrolytic capacitor increases strongly at low temperatures (no expensive tantalum capacitor is required).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

CONDITIONS SYMBOL

V

P

V

P(rp)

P tot

T

T

T j stg amb

PARAMETER supply voltage reverse polarity supply voltage total power dissipation storage temperature ambient temperature junction temperature non-operating temperature of copper area is 25

°

C non-operating operating operating

−

−

−

MIN.

−

55

−

40

−

40

MAX.

45

−

25

4.1

+150

+125

+150

°

C

°

C

°

C

V

V

W

UNIT

THERMAL CHARACTERISTICS

SYMBOL

R th(j-a)

R th(j-c)

PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611E”.

CONDITIONS in free air; soldered to centre pins; soldered

VALUE

125

30

UNIT

K/W

K/W

2001 Jan 24 4




TDA3674

CHARACTERISTICS

V

P

= 14.4 V; T amb

= 25

°

C; measured in test circuit of Fig.3; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN.

TYP.

MAX.

Supply voltage: pin V

P

I

V q

P supply voltage quiescent current regulator operating; note 1

V

P

= 14.4 V; I

V

I(EN)

= 0 V

REG

= 0 mA;

V

P

= 14.4 V; I

REG

V

I(EN)

= 5 V

6 V

≤

V

P

≤

22 V; I

REG

6 V

≤

V

P

= 0 mA;

≤

22 V; I

REG

= 10 mA

= 50 mA

Enable input: pin EN

V

I(EN)

I

I(EN) enable input voltage enable input current enable off; V

REG enable on; V

REG

≤

0.8 V

≥

4.5 V

V

I(EN)

= 5 V

I

I

Regulator output: pin REG

V

V

V

∆

REG

REG(drop)

REG(stab)

∆

V

V

REG(line)

REG(load) output voltage dropout voltage

8 V

≤

V

P

≤

22 V; I

REG

8 V

≤

V

P

T amb

≤

22 V; I

≤

125

°

C

REG

= 0.5 mA

= 0.5 mA;

0.5 mA

≤

I

REG

6 V

≤

V

P

≤

≤

100 mA

45 V; I

REG

= 0.5 mA

V

P

= 4.5 V; T

I

REG

= 50 mA amb

≤

85

°

C; long-term stability line input regulation voltage 8 V

≤

V

P

7 V

≤

V

P load output regulation

≤

16 V; I

≤

22 V; I

REG

REG

= 0.5 mA

= 0.5 mA

7 V

≤

V

P

≤

45 V

0.5 mA

≤

I

REG

≤

50 mA voltage

SVRR

REG(crl)

LO(rp) supply voltage ripple rejection current limit output leakage current at reverse polarity f i

= 120 Hz; V

I

REG

= 0.5 mA i(ripple)

= 1 V (RMS);

V

REG

V

P

> 4.5 V

=

−

15 V; V

REG

≤

0.3 V

3

−

−

−

−

−

−

−

−

−

−

−

−

1

3.0

−

4.8

4.75

4.75

50

0.13

14.4

4

15

0.2

1.4

−

−

0.3

5.0

5.0

5.0

4.75

5.0

0.18

20

1

1

1

10

60

0.25

1

45

15

30

0.5

2.5

+1.0

18

−

5.2

5.25

5.25

5.25

0.3

−

10

30

50

50

−

−

500

V

µ

µ mA mA

V

V

µ

V

V

V

V

V mV/1000 h mV mV mV mV

A

µ

A

A

A dB

A

UNIT

Note

1. The regulator output will follow V

P if V

P

< V

REG

+ V

REG(drop)

.

2001 Jan 24 5



TEST AND APPLICATION INFORMATION


TDA3674

(1)

MDA961

10

2 handbook, halfpage

ESR

(

Ω

)

10 andbook, halfpage

VP

C1

(1)

1

µ

F

VI(EN)

8 1

TDA3674

5

2, 3, 6, 7

MGS599

VREG = 5 V

C2

10

µ

F

1 stable region

V

I(EN)

= 5 V.

(1) C1 is optional (to minimize supply noise only).

Fig.3 Test circuit.

Noise

The output noise is determined by the value of the output capacitor. The noise figure is measured at a bandwidth of

10 Hz to 100 kHz (see Table 1).

Table 1 Noise figures

OUTPUT

CURRENT

I

REG

(mA)

0.5

50

NOISE FIGURE (

µ

V)

C2 = 10

µ

F C2 = 47

µ

F C2 = 100

µ

F

550

650

320

400

300

400

Stability

The regulator is stabilized with an external capacitor connected to the output. The value of this capacitor can be selected using the diagrams shown in Figs 4 and 5.

The following four examples show the effects of the stabilization circuit using different values for the output capacitor.

10


ESR

(

Ω

)

10

2

22

10

1

10

−

1

1 stable region

10

MDA962

10

2

IREG (mA)

10

3

Fig.5

ESR as a function of I

REG

for selecting the value of the output capacitor.

2001 Jan 24 6

(2)

10

−

1

10

−

1

1 10

C2 (

µ

F)

10

2

(1) Maximum ESR at 200

µ

A

≤

I

(2) Minimum ESR only when I

REG

REG

≤

100 mA.

≤

200

µ

A.

Fig.4

Graph for selecting the value of the output capacitor.




TDA3674

E XAMPLE 1

The regulator is stabilized with an electrolytic capacitor of

68

µ

F (ESR = 0.5

Ω

). At T amb

=

−

40

°

C, the capacitor value is decreased to 22

µ

F and the ESR is increased to 3.5

Ω

. The regulator will remain stable at a temperature of T amb

=

−

40

°

C.

E XAMPLE 2

The regulator is stabilized with an electrolytic capacitor of

10

µ

F (ESR = 3.3

Ω

). At T amb

=

−

40

°

C, the capacitor value is decreased to 3

µ

F and the ESR is increased to

20

Ω

. The regulator will remain stable at a temperature of

T amb

=

−

40

°

C.

E XAMPLE 3

The regulator is stabilized with a 100 nF MKT capacitor connected to the output. Full stability is guaranteed when the output current is larger than 200

µ

A. Because the thermal influence on this capacitor value is almost zero, the regulator will remain stable at a temperature of

T amb

=

−

40

°

C.

E XAMPLE 4

The regulator is stabilized with a 100 nF capacitor in parallel with a electrolytic capacitor of 10

µ

F connected to the output.

The regulator is now stable under all conditions and independent of:

•

The ESR of the electrolytic capacitor

•

The value of the electrolytic capacitor

•

The output current.

Application circuits

The maximum output current of the regulator equals:

I

)

=

R

150 th(j-a)

× (

–

V

T

P amb

– V

REG

)

=

150

100

×

–

(

T

V amb

P

– 5

)

When T amb

A

= 21

120 to 50 K/W.

°

C and V current equals 140 mA.

P

= 14 V, the maximum output

For successful operation of the IC (maximum output current capability) special attention has to be given to the copper area required as heatsink (connected to all

GND pins), the thermal capacity of the heatsink and its ability to transfer heat to the external environment. It is possible to reduce the total thermal resistance from

PPLICATION CIRCUIT WITH BACKUP FUNCTION

Sometimes a backup function is needed to supply, for example, a microcontroller for a short period of time when the supply voltage spikes to 0 V (or even

−

1 V).

This function can easily be built with the TDA3674 by using an output capacitor with a large value. When the supply voltage is 0 V (or

−

1 V), only a small current will flow into pin REG from this output capacitor (a few

µ

A).

The application circuit is given in Fig.6.

handbook, halfpage

VP

C1

(1)

1

µ

F

VI(EN)

8

TDA3674

5

2, 3, 6, 7

1

MGS600

C2

(2)

VREG = 5 V

V

I(EN)

= 5 V.

(1) C1 is optional (to minimize supply noise only).

(2) C2

≤

4700

µ

F.

Fig.6 Application circuit with backup function.

2001 Jan 24 7




TDA3674

Additional application information

This section gives typical curves for various parameters measured on the TDA3674AT. Standard test conditions are:

V

P

= 14.4 V; T amb

= 25

°

C.

MDA947


Iq

(

µ

A)

20

15

10

5

0

0 10 20

VP (V)

30

I

REG

= 0 mA.

Fig.7

Quiescent current as a function of the supply voltage.

MDA949


Iq

(mA)

3

2

1

0

0 10 20 30 40

VP (V)

50

Fig.8

Quiescent current as a function of high supply voltage.

MDA951

Iq

(mA)

1.5

1

(1)

0.5

(2)

0

−

40 0 40 80 120

Tj (

°

C)

160

(1) I q at 50 mA load.

(2) I q at 10 mA load.

Fig.9

Quiescent current as a function of the junction temperature.

2001 Jan 24 8

0.48

handbook, halfpage

Iq

(mA)

0.44

0.40

0.36

5 10 15

MDA948

20

VP (V)

25

I

REG

= 10 mA.

Fig.10 Quiescent current as a function of the supply voltage.




TDA3674

MDA950


Iq

(mA)

1.8

1.6

1.4

5 10 15 20

VP (V)

25

I

O

= 50 mA.

Fig.11 Quiescent current as a function of the supply voltage.

MDA952


Iq

(mA)

3

2

1

0

0 20 40 60 80 100

IREG (mA)

Fig.12 Quiescent current as a function of the load current.

MDA953 MDA955

5.10

handbook, halfpage

VREG

(V)

5.05


VREG

(V)

4

5.00

2

4.95

−

50 0 50 100 150

Tj (

°

C)

200

I

REG

= 0 mA.

Fig.13 Output voltage as a function of the junction temperature.

2001 Jan 24 9

0

−

50 0 50 100 150

Tj (

°

C)

200

I

REG

= 0 mA.

Fig.14 Output voltage thermal protection as a function of the junction temperature.




TDA3674

MDA957

VREG(drop)

(mV)

400

300

200

100

0 40 80

IREG (mA)

120

Fig.15 Dropout voltage as a function of the output current.


VREG

(V)

4

2

MDA954

0

0 100 200

IREG (mA)

300

V

P

= 8 V with pulsed load.

Fig.16 Fold back protection mode.

−


SVRR

(dB)

−

40

MDA956

(1)

(2)

−

50

(3)

(1)

−

60

−

70

10

(3)

(2)

10

2

10

3

10

4 f (Hz)

10

5

I

REG

= 10 mA; C2 = 10

µ

F.

(1) SVRR at R

L

= 100

Ω.

(2) SVRR at R

(3) SVRR at R

L

L

= 500

Ω.

= 10 k

Ω

.

Fig.17 SVRR as a function of the ripple frequency.

2001 Jan 24 10



PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm


TDA3674

SOT96-1

8

Z y pin 1 index

1 e

D E A

X c

H

E

5 b p

4 w

M

A

2

A

1

L

L p detail X

Q

θ

A v

M A

0 2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A max.

A

1

A

2

A

3 b p c D

(1)

E

(2) e H

E mm inches

1.75

0.069

0.25

0.10

0.010

0.004

1.45

1.25

0.057

0.049

0.25

0.01

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

5.0

4.8

0.20

0.19

4.0

3.8

0.16

0.15

1.27

0.050

6.2

5.8

0.244

0.228

L L p

Q

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

v

0.25

0.01

w y Z

(1)

0.25

0.01

0.1

0.004

0.7

0.3

0.028

0.012

θ

8 o

0 o

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC EIAJ

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22

99-12-27

2001 Jan 24 11




TDA3674

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from

215 to 250

°

C. The top-surface temperature of the packages should preferable be kept below 220

°

C for thick/large packages, and below 235

°

C for small/thin packages.

Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used the following conditions must be observed for optimal results:

•

Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

•

For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

•

For packages with leads on four sides, the footprint must be placed at a 45

° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300

°

C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between

270 and 320

°

C.

2001 Jan 24 12




TDA3674

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS

PLCC (3) , SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO not suitable not suitable suitable

SOLDERING METHOD

WAVE

(2) not recommended (3)(4) not recommended (5)

REFLOW (1) suitable suitable suitable suitable suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45

°

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Jan 24 13




TDA3674

DATA SHEET STATUS

DATA SHEET STATUS

PRODUCT

STATUS

DEFINITIONS (1)

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS

Short-form specification



The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition



Limiting values given are in accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may affect device reliability.

Application information



Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

DISCLAIMERS

Life support applications



These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes



Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2001 Jan 24 14



NOTES


TDA3674

2001 Jan 24 15

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Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

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Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,

Tel: +36 1 382 1700, Fax: +36 1 382 1800

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

For all other countries apply to: Philips Semiconductors,

Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,

The Netherlands, Fax. +31 40 27 24825

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,

Tel. +66 2 361 7910, Fax. +66 2 398 3447

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 3341 299, Fax.+381 11 3342 553

Internet: http://www.semiconductors.philips.com

© Philips Electronics N.V.

2001 SCA 71

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

753503/03/pp 16 Date of release: 2001 Jan 24 Document order number: 9397 750 07558

NXP TDA3674AT Low dropout voltage/quiescent current 5 V voltage regulator Data Sheet

INTEGRATED CIRCUITS

DATA SHEET

Low dropout voltage/quiescent current 5 V voltage regulator with enable

Low dropout voltage/quiescent current 5 V voltage regulator with enable

TDA3674

Philips Semiconductors – a worldwide company

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NXP TDA3674AT Low dropout voltage/quiescent current 5 V voltage regulator Data Sheet

INTEGRATED CIRCUITS

DATA SHEET

Low dropout voltage/quiescent current 5 V voltage regulator with enable

Low dropout voltage/quiescent current 5 V voltage regulator with enable

TDA3674

Philips Semiconductors – a worldwide company

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