Zenith Z32LC6D - 720p LCD HDTV Service manual

North/Latin America

Europe/Africa

Asia/Oceania

Internal Use Only

http://aic.lgservice.com

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LCD MONITOR TV

SERVICE MANUAL

CHASSIS : LP92C

MODEL : M197WAP M197WAP-PMM

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL63261606(1002-REV00) Printed in Korea

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................14

TROUBLE SHOOTING ............................................................................20

BLOCK DIAGRAM...................................................................................24

EXPLODED VIEW .................................................................................. 25

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.

Only for training and service purposes

- 2 -

LGE Internal Use Only

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

•There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the

Exploded View It is essential that these critical parts

should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

•Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

WARNING

BE CAREFUL ELECTRIC SHOCK !

•If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about

650Vrms.

•Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

•Must mount the module using mounting holes arranged in four corners.

•Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

•Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

•Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

•Make certain that treatment person’s body are grounded through wrist band.

•Do not leave the module in high temperature and in areas of high humidity for a long time.

•The module not be exposed to the direct sunlight.

•Avoid contact with water as it may a short circuit within the module.

•If the surface of panel become dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)

Leakage Current Hot Check Circuit

AC Volt-meter

To Instrument's exposed

METALLIC PARTS

0.15uF

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE,

CONDUIT etc.

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

Ω

*Base on Adjustment standard

• Replaceable batteries

* CAUTION

RISK OF EXPLOSION IF BATTERY IS REPLACED BY

AN INCORRECT TYPE.

DISPOSE OF USED BATTERIES ACCORDING TO

THE INSTRUCTIONS

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.



- 3 LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly.

b. Disconnecting or re-connecting any receiver electrical plug or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) is opropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.

Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.

Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.




IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the

IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device


1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5.

Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor


1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.



- 5 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

LGE Internal Use Only

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application Range.

This spec sheet is applied to the 47 cm(18.5 inch) LCD

Monitor TV used LP92C chassis. the adjustment.

3. Test method

2. Specification

Each part is tested as below without special appointment

3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification

Safety : CE, IEC specification, UL6500

EMC : CE, IEC, FCC Part 15Class A/ B

2.1 Temperature : 25 °C ± 5 °C (77 °F ± 9 °F),

CST : 40 °C ± 5° C

2.2 Relative Humidity : 65 % ±10 %

2.3 Power Voltage : Standard input voltage

(100 V - 240 V ~, 50 / 60 Hz)

• Standard Voltage of each products is marked by models

2.4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM .

2.5 The receiver must be operated for about 5 minutes prior to

Safety : IEC/EN60065

EMI : EN55013

EMS : EN55020




4. Module Specification

1) LGD LM185WH1_TLF7 ( P/N : EAJ60989201)

10

11

12

13

7

8

9

14

15

5

6

3

4

No

1

2

Item

Type

Diagonal Size

Active Display area

Outline Dimension

Aspect Ratio

Pixel Number

Pixel Pitch

Color arrangement

Color Depth

Electrical Interface

Surface Treatment

Operating Mode

Backlight Unit

Response Time

Color Gamut

Specification

TFT Color LCD Module

18.51 inches (470.1mm) diagonal

413.4(H) x 234.0(V)

430.4(H) x 254.6(V) x 13.0(D)

16:9

1366 x RGB x 768

0.30(H) x 0.30(V)

RGB vertical Stripe

16.7M color with Advanced FRC

LVDS 1port

Hard coating(3H) & Anti-glare

Transmissive mode & Normally White

2 CCFL (2 lamps)

Rising Time : 1.1 + Falling Time : 3.9

Normal 72% Panel(CIE1931)

2) LGD, LM185WH1-TLF8 ( P/N : EAJ61009301)

10

11

12

13

8

9

6

7

14

15

No

1

4

5

2

3

Item

Type

Diagonal Size

Active Display area

Outline Dimension

Aspect Ratio

Pixel Number

Pixel Pitch

Color arrangement

Color Depth

Electrical Interface

Surface Treatment

Operating Mode

Backlight Unit

Response Time

Color Gamut

Specification

TFT Color LCD Module

18.51 inches (470.1mm) diagonal

413.4(H) x 234.0(V)

430.4(H) x 254.6(V) x 13.0(D)

16:9

1366 x RGB x 768

0.10(H) x 0.30(V)

RGB vertical Stripe

16.7M color with Advanced FRC

LVDS 1port

Hard coating(3H) & Anti-glare

Transmissive mode & Normally White

2 CCFL (2 lamps)

Rising Time : 1.1 + Falling Time : 3.9

Normal 72% Panel(CIE1931) ms

Unit mm mm pixel mm ms

Unit Remark mm mm pixel mm

Typ. (Without Inverter)

Typ.

Remark

Typ.

Typ.




5. General Specification

5.1 TV

No

1

2

Item

Market

Broadcasting system

3

4

Receiving system

Receiving system

Specification

Central and South America

NTSC

PAL-M

PAL-N

BAND NTSC

VHF 2 ~ 13

UHF 14 ~ 69

CATV 1 ~ 125

Upper Heterodyne

5 Component Input (1EA)

6

7

8

9

CVBS Input (1EA)

RGB Input

HDMI Input (1EA)

Audio Input (3EA)

10 Earphone out (1EA)

Y/Cb/Cr

Y/Pb/Pr

PAL, SECAM, NTSC

RGB-PC

HDMI1-DTV/PC

RGB-PC/ DVI Audio

Component

CVBS

Antenna, AV, Component,

RGB-PC, HDMI1

Remarks

4 System(Rear) :PAL50, SECAM, NTSC, PAL60

Analog(D-SUB 15Pin)

HDMI version 1.3 , Support HDCP

L/R Input




5.2 RGB - PC

No

1

2

Item

Supported Sync. Type

Operating Frequency

Specification

Separate Sync.(RGB), Digital(DVI)

Analog

Digital

Horizontal

Vertical

Horizontal

30 ~ 61kHz

56 ~ 61 Hz

30 ~ 61kHz

3

4

5

6

Resolution

Input Voltage

Inrush Current

Operating Condition

Power S/W On

Analog

Digital

On Typ. On/On mode Max On/On

Sleep mode Off/On

On/Off

Vertical

Max.

56 ~ 61 Hz

1366x768 @ 60Hz

Recommend 1360x768 @ 60Hz

Max.

1366x768 @ 60Hz

Recommend 1360x768 @ 60Hz

Voltage :100 – 240 Vac, 50 or 60Hz

Cold Start : 50 A Hot : 120 A

Sync (H/V) Video LED Wattage

Active

Active

Off

Blue

Blue

Amber

25W

30W

1W

Power S/W Off Off mode Off Off 0.5W

7 MTBF

8 Using Altitude

9

10

Operating Environment

Storage Environment

50,000 HRS with 90% Confidence leve

5,000 m (for Reliability) 3,000m(for FOS)

Temp : 10°C ~ 35°C

Humidity : 20 % ~ 80 %

Temp : -10°C~60°C non condensing

Humidity : 5 % ~ 90 % non condensing

Remarks

RGB

Just operate power key and remote controller power button

Lamp Life: 50,000 Hours(min)




6. Chroma & Brightness

18.5” LCD Module (for more details, refer to the module spec.)

No.

Item

1 Viewing Angle[CR>10]

2 Luminance

3 Contrst Ratio

4 Color Coordinates [CIE1931]

Specification

Right/Left

Up/Down

Luminance (cd/m2)

Variation(%)

CR

White

RED

Green

Blue

W

X

W

Y

X r

Y r

X g

Y g

X b

Y b

Min.

70/70

60/70

180

75

600

Typ.

-0.03

Typ.

85/85

75/85

250

1000

0.313

0.329

0.644

0.335

0.304

0.613

0.146

0.071

* Optical Test Condition

- Surrounding Brightness Level : dark

- Surrounding Temperature : 25±5°C

- warm-up Time : 30 Min

- Contrast, Brightness : Outgoing condition

- *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.

* Active area

1. Active area of LCD PANEL is in bezel of cabinet.

2. Interval between active area and bezel

|A-B|<1.0 mm , |C-D|<1.0 mm

A: Interval between left of active area and bezel

B: Interval between right of active area and bezel

C: Interval between top of active area and bezel

D: Interval between bottom of active area and bezel

C

Active Area

A B

D

Bezel

Max.

-

Remark

CR >10

-

Min/ Max

Full white/Full black

Typ.

+0.03

RGB

Vivid, 6500K

Full white(100IRE)




7. SET Optical Feature

7.1 PC Mode (-Mode : Outgoing condition, Input signal : 100IRE White pattern(Pattern #4 : MSPG series))

No Item module

Min

Luminance (cd/m 2 )

Typ Max

C/R(min)

Min Typ

1 19” inch 180 250 700:1 71000:1

Remark

RGB

DFC 30000:1

7.2 Special feature(DFC)

-DFC Working Condition : Full Black Pattern(All Black, No pattern(MSPG Pattern#2)) signal in D-sub

No

1

Item

19” inch module Min

24000:1

Typ

30000:1

Max Remark

PC Mode(D-sub, DVI) For Checking Black Luminance, wait for over 1 minute.

8. Component Video Input (Y, PB, PR)

No.

Resolution

1.

720*480

2.

720*480

3.

720*576

4.

720*480

5.

720*480

6.

720*576

7.

1280*720

8.

1280*720

9.

1280*720

10.

1920*1080

11.

1920*1080

12.

1920*1080

13.

1920*1080

14.

1920*1080

15.

1920*1080

45.00

37.50

33.72

33.75

28.125

56.25

67.432

67.5

H-freq(kHz)

15.73

15.75

15.625

31.47

31.50

31.25

44.96

Specification

V-freq(Hz)

59.94

60.00

50.00

59.94

60.00

50.00

59.94

60.00

50.00

59.94

60.00

50.00

50

59.94

60.00

74.250

74.25

74.176

74.250

74.250

148.5

148.350

148.5

Pixel clock(MHz)

13.500

13.514

13.500

27.000

27.027

27.000

74.176

Remark

SDTV, DVD 480I(525I)


SDTV, DVD 576I(625I) 50Hz

SDTV 480P

SDTV 480P

SDTV 576P 50Hz

HDTV 720P

HDTV 720P

HDTV 720P 50Hz

HDTV 1080I

HDTV 1080I

HDTV 1080I 50Hz,

HDTV 1080P

HDTV 1080P

HDTV 1080P




9. RGB Input ( PC )

No. Resolution

1 640*480

2 800*600

3 1024*768

4 1280*720

5 1360*768

H-freq(kHz)

31.469

37.879

48.363

47.77

47.71

V-freq(Hz)

59.94

60.317

60.0

59.85

60.02

Pixel clock(MHz)

25.175

40.0

65.0

74.5

85.5

Remark

10. HDMI Input (DTV)

No. Resolution

1 720*480

2 720*480

3 720*576

4 7Z20*480

5 720*480

6 720*576

7 1280*720

8 1280*720

9 1280*720

10 1920*1080

11 1920*1080

12 1920*1080

13 1920*1080

14 1920*1080

15 1920*1080

44.96

45.00

37.50

33.72

33.75

28.125

67.432

67.5

56.250

H-freq(kHz)

15.75

15.73

15.625

31.47

31.50

31.25

59.94

60.00

50.00

59.94

60.00

50.00

59.94

60

50

V-freq(Hz)

60.00

59.94

50.00

59.94

60.00

50.00

Pixel clock(MHz)

13.514

13.500

13.500

27.000

27.027

27.000

74.176

74.250

74.25

74.176

74.250

74.250

148.350

148.5

148.5

Proposed



SDTV, DVD 576I(625I) 50Hz

SDTV 480P

SDTV 480P

SDTV 576P 50Hz

HDTV 720P

HDTV 720P

HDTV 720P 50Hz

HDTV 1080I

HDTV 1080I

HDTV 1080I 50Hz

HDTV 1080P

HDTV 1080P

HDTV 1080P 50Hz




11. Mechanical specification

Item No.

1. Product

Dimension

2. Product

Weight

3.

Container

Loading

Quantity

4. Stand

Assy

Before Packing

After Packing

Only SET

With BOX

Individual or

Palletizing

Type

Size(W x D x H)

Tilt Degree

Tilt force

Swivel Degree

Swivel Force

Width(W)

454.7

517

Content

Length(D)

193.2

403

3.5

4.8

Height(H)

362.8

135

Indi.

1037

20ft

Wooden

810

Indi.

40ft

2159

Detachable ( Base detachable)

271.2x 193.2x 108.4

-5~15 degree

0.8~3.5kgf

Wooden

1800 none

Unit mm mm mm

Kg

Kg

5.

Appearance General Refer to Standard of LG(55)G1-1020

Remark

*Appearance Gap spec

Front: 0.5 mm

Back & Bottom : 1.0 m




ADJUSTMENT INSTRUCTION

1. Application

This document is applied to LP92C chassis 19” LCD Monitor

TV which is manufactured in Monitor Factory or is produced on the basis of this data.

Adjustment method

The input methods are same as other chassis.(Use IN-START

Key on the Adjust Remocon.)

2. Designation

1) The adjustment is according to the order which is designated and which must be followed, according to the plan which can be changed only on agreeing.

2) Power Adjustment: Free Voltage

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specification Standard

5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25°C±5°C

Relative humidity : 65 ±10%

Input voltage : 220V, 60Hz

6) Adjustment equipment: Color Analyzer (CA-210 or CA-

110), Pattern Generator (MSPG-925L or Equivalent), DDC

Adjustment Jig equipment, SVC remote controller

7) Don’t push The “IN STOP KEY” after completing the function inspection.

F L W 9 1 A L P L L 2 2 F H D

M a i n V 1 . 0 0

HDCP 0

F U T T X X

Tool Option 1 37000

Tool Option 2

Area Option

112

20

1) Push the IN-START key in the Adjust R/C.

2) Input the Option Number that was specified in the BOM, into the Shipping area.

3) Select “Tool Option/ Area Option” by using E/D(CH+/-) key

, and press the number key(0~9) consecutively ex) If the value of Tool Option1 is 7, input the data using number key “7”

(If not changed the option, the input menu can differ from the model spec.)

* Refer to Job Expression of each main chassis ass’y

(EBTxxxxxxxx) for Option value

3. Adjustment items

PCB assembly adjustment items

1) Download the MSTAR main software (IC603, Mstar ISP

Utility)

2) Auto Color Balance(ADC) - RGB

3) Auto Color Balance(ADC) – Component

4) Input Tool-Option/Area option.

5) Check SW Version.

SET assembly adjustment items

1) DDC Data input.

2) HDCP data input

3) Adjustment of White Balance.

4) Preset CH information

5) Factoring Option Data input.

4. PCB assembly adjustment method

4.1 Input Tool-Option, Area Option

Option adjustment following BOM (Tool Option 1, Area Option)

* Required Equipments

- Remote controller for adjustment

* Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market.

* Before PCB check, you have to change the Tool option,

Areaoption and have to AC off/on (Plug out and in)

(If missing this process, set can operate abnormally)

* Never push the IN-STOP KEY after completing the function inspection.

4.2 S/W program download

(Using MSTAR Download program)

Profile : This is for downloading the s/w to the flash memory of

IC603

Equipment

1) PC

2) ISP_tool program

3) Download jig

Connection structure

Connection condition

1) IC name and circuit number : Flash Memory and IC603

2) Use voltage : 3.3V (5 pin)

3) SCL : 15 pin

4) SDA : 12 pin

5) Tact time : about 2min




4.2.1 Preliminary steps

(1) Download method 1 (PCB Assy)

(4) Read and write bin file

Click ”(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

(2) Connect the download jig to D-sub jack

4.2.2 Download Steps

(1) Execute ‘ISP Tool’ program in PC, then a main window will be opened

(5) Click “Auto(2)” tab and set as below

(6) click “Run(3)”.

(7) After downloading, check “OK(4)” message.

(2) Click the connect button and confirm “Dialog Box”.

(3) Click the Config button and Change speed

E2PROM Device setting : over the 350Khz




4.3. ADC Process

4.3.1 ADC calibration

* MSPG-925

- Component: series Model : 216 (720P@60Hz)

- RGB: Model : 60(1024X768@60Hz)

4.3.2 PC input ADC

4.3.2.1 Auto RGB Gain/Offset Adjustment

- Convert to PC in Input-source

- Signal equipment displays

Output Voltage: 700 m Vp-p

Impress Resolution XGA (1024 x 768 @ 60Hz)

Model : 60 in Pattern Generator

Pattern : 29 in Pattern Generator (MSPG-925 SERIES)

- Adjust by commanding AUTO_COLOR_ADJUST.

4.3.3.2 Confirmation

- We confirm to address “0xF3 (offset), 0xF4 (gain)” in page

“0x0E” of EEPROM the value is “0xAA’ or not.

- If the value is not “xAA”, we adjust once more.

- We can write the ADC values from “0x06~0x0B” addresses in a page “0x0E”.

*Manual ADC process using Service Remocon. After enter

Service Mode by pushing "ADJ" key, execute "Auto-RGB" by pushing " " key at "Auto-RGB".

Adjustment pattern (PC )

- Adjust by commanding AUTO_COLOR_ADJUST.

4.3.2.2 Confirmation

- We confirm to address “0xF3 (offset), 0xF4 (gain)” in page

“0x0E” of EEPROM the value is “0xAA’ or not.

- If the value is not “xAA”, we adjust once more.

- We can write the ADC values from “0x06~0x0B” addresses in a page “0x0E”.

*Manual ADC process using Service Remocon. After enter

Service Mode by pushing "ADJ" key, execute "Auto-RGBB" by pushing " " key at "Auto-RGB".

4.3.3 COMPONENT input ADC

4.3.3.1 Component Gain/Offset Adjustment

- Convert to Component in Input-source

- Signal equipment displays

Impress Resolution 720p

MODEL : 216 in Pattern Generator(720P/60Hz 100% Color

Bar Mode)

PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)

Adjustment pattern (COMPONENT )




5. EDID

(The Extended Display

Identification Data ) / DDC(Display

Data Channel) download

* Caution 1: Use the proper cables below for EDID Writing

* Caution 2: Write EDID data to EEPROM by using DDC2B

Protocol.

5.1 Profile : To be possible for plug and play

5.2 Equipment

1) Adjusting PC with S/W for writing EDID Data.(S/W : EDID

TESTER Ver.2.5)

2) A Jig for EDID Download

3) Cable : D-sub 15Pin cable, HDMI cable.

For Analog EDID For HDMI EDID

5.5.1. RGB EDID Data

1) M197WAP

** ***

5.5.2. HDMI EDID Data

1) M197WAP

** ***

*

*

****

5.3 DDC EDID Write (RGB 128Byte )

- Connect D-sub Signal Cable to D-Sub Jack.

- Write EDID DATA to EEPROM (24C02) by using DDC2B protocol.

- Check whether written EDID data is correct or not.

5.4 DDC EDID Write (HDMI 256Byte)

- Connect HDMI Signal Cable to HDMI Jack.

- Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

- Check whether written EDID data is correct or not

5.5 EDID data

1) M197WAP

No.

Item

1 Manufacturer ID

2 ProductID

3

4

5

6

Year

Version

Revision

Model Name content

GSM

19410(Analog)

19412(HDMI)

2009

Analog : 1

Digital : 1

Analog :

Digital :

M197WP

16bit Data

1E6D

4BD2

4BD4

13

1

3

- All data are HEXA

- Adjustable Data :

**: week

***: year ex) when year 2008 : input “12”

**** : CHECK SUM (deferent along week, year)

****

****




6.HDCP(High-Bandwidth Digital

Contents Protection)

* confirmation

* Before HDCP Download, you have to Set the Configuration that CMD delay.

-> Configuration -> Option-> I2C delay(Write Byte : 0.5

ms, Read Byte : 0.5ms,

Read CMD Byte : 0.5ms)

* Change the DDC -> After Write Data delay Time 20ms

* Check the Communication Clock -> 45KHz.

1) Connect D-sub Signal Cable to D-Sub Jack.

2) Input HDCP key with HDCP-key- in-program.

3) HDCP Key value is stored on Main M-STAR IC(LGE7871) which is 0x80~0xA0 addresses of 0x00~0x01 page(EEPROM MAP PAGE0~PAGE1 / START :A080).

4) AC off/on and on HDCP button of MSPG925 and confirm whether picture is displayed or not of using MSPG925.

5) HDCP Key value is different among the sets

7.Adjustment of White Balance

7.1 Purpose and Principle for adjustment of the color temperature

- Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

- Principle : To adjust the white balance without the saturation,Fix the one of R/G/B gain to C0 and decrease the others.

- Adjustment mode : Cool , Medium , Warm

** Required Equipment

- Remote controller for adjustment

- Color Analyzer : CA-210

- CH : 09 (LCD MNT, Normal) Ë M197WAP / M227WAP/

M237WAP

- Auto W/B adjustment instrument(only for Auto adjustment)

- PC (for communication through RGB)

- Pattern Generator (MSPG-925FS series. )

7.2 Connecting diagram of equipment for measuring (For Automatic Adjustment)

- Maintain the DDC adjustment mode with same condition of Heat-run

-> Maintain after AC off/on in status of Heat-run pattern display)

(2) Release the DDC adjustment mode

- Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode)

- Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment)

- Need to transmit the aging off command to TV set after finishing the adjustment.)

- Check DDC adjust mode release by exit key and release

DDC adjust mode)

(3) Enter the adjust mode of white balance

Enter the white balance adjustment mode with aging command(F3, 00, FF)

* Target Value CA-210(LCD MNT, Normal: CH 09

( Standard color coordinate and temperature when using the

CA210 equipment)

* Luminance min value is 130cd/m 2 in the cool/ medium/ warm

Color coordinate

Mode Temp

X Y

Cool

Medium

Warm

0.285±0.003

0.295±0.003

0.313±0.003

0.293±0.003

0.305±0.003

0.329±0.003

11,000K

8,000K

6,500K mode(Typ: 170)

* Test Signal: Inner pattern (216gray,85IRE)

* After done all adjustments, Press “In-start” button and compare

Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable.

For correct it to the model’s module from factory JIG model.

* Don’t push The “IN STOP KEY” after completing the function inspection.

*When doing Adjustment, Please make circumstance as below.

(1) Enter the adjustment mode of DDC

- Set command delay time : 50ms

- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key




7.3. Adjustment of White Balance for

Manual Adjustment

• Color analyzer(CA110, CA210) should be used in the calibrated ch by CS-1000(LCD : CH9)

• Operate the zero-calibration of the CA-100+ or CA-210, then stick sensor to the module when adjusting.

• For manual adjustment, it is also possible by the following sequence.

* Display and Sound check is executed by Remote controller

9. Preset CH write condition

1) AC on time on only one after assembled automatically

2) CH recover on SVC OSD manually

1) Push the ADJ key two times (Entering White Blalance mode)

2) Stick sensor to center of the screen and select each items

(Red/Green/Blue Gain and Offset) using / (CH + / -) key on R/C.

3) Adjust R/G/B Gain using / (VOL + / -) key on R/C.

(Fix the one of R/G/B and change the others).

4) Adjust all modes(Cool, Mediun, Warm): Fix the one of

R/G/B gain and change the others.

5) When adjustment is completed, Exit adjustment mode using EXIT key on R/C.

[CASE]

First adjust the coordinate much away from the target value(x, y).

1. x, y > target a) Decrease the R, G.

2. x, y < target a) First decrease the B gain, b) Decrease the one of the others.

- In case of decreasing the x, decreasing the R: fix G

- In case of decreasing the y , decreasing the G: fix R

3. x > target , y < target a) First decrease B, so make y a little more than the target.

b) Adjust x value by decreasing the R

4. x < target , y > target a) First decrease B, so make x a little more than the target.

b) Adjust x value by decreasing the G

** Caution **

Color Temperature: COOL, Medium, Warm

One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.

(when R/G/B Gain are all C0, it is the FULL Dynamic Range of of Module)

* W/B condition

- Surrounding Temperature : 20 % ~ 80 %

- Surrounding Temperature : 25±5 °C

8. Function Check

8.1 Check display and sound

• Check Input and Signal items (cf. work instructions)

1) TV

2) AV (SCART1/ SCART2/ CVBS/ S-Video)

3) COMPONENT (1080i)

4) RGB ( PC: 1920 x 1080 @ 60Hz)

5) DVI ( PC: 1920 x 1080 @ 60Hz)

6) HDMI

7) PC Audio In




TROUBLESHOOTING

1. TV/CATV doesn’ t display




2. AV, Component doesn’ t display




3. RGB-PC doesn’ t display




4. HDMI doesn’ t display




BLOCK DIAGRAM




EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.




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Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes LGE Internal Use Only

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LGE comfidencial

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E C on fiden tial




LGE comfidencial

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E C on fiden tial




LGE comfidencial

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LGE comfidencial

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Zenith Z32LC6D - 720p LCD HDTV Service manual

Internal Use Only

LCD MONITOR TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

marked on the schematic diagram and the

Exploded View It is essential that these critical parts

WARNING

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

Leakage Current Hot Check Circuit

CAUTION

SERVICING PRECAUTIONS

SPECIFICATION

1. Application Range.

3. Test method

2. Specification

4. Module Specification

5. General Specification

6. Chroma & Brightness

7. SET Optical Feature

8. Component Video Input (Y, PB, PR)

9. RGB Input ( PC )

10. HDMI Input (DTV)

11. Mechanical specification

ADJUSTMENT INSTRUCTION

1. Application

2. Designation

3. Adjustment items

4. PCB assembly adjustment method

4.2.1 Preliminary steps

4.2.2 Download Steps

4.3.1 ADC calibration

4.3.2 PC input ADC

5. EDID

(The Extended Display

Identification Data ) / DDC(Display

Data Channel) download

5.5.1. RGB EDID Data

5.5.2. HDMI EDID Data

6.HDCP(High-Bandwidth Digital

Contents Protection)

7.Adjustment of White Balance

9. Preset CH write condition

8. Function Check

TROUBLESHOOTING

BLOCK DIAGRAM

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

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