11.0 IDD Specification Parameters Definition. Samsung M378T5663EH3-CE6


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11.0 IDD Specification Parameters Definition. Samsung M378T5663EH3-CE6 | Manualzz

UDIMM DDR2 SDRAM

11.0 IDD Specification Parameters Definition

(IDD values are for full operating range of Voltage and Temperature)

Symbol

IDD0

IDD1

IDD2P

IDD2Q

IDD2N

IDD3P

IDD3N

IDD4W

IDD4R

IDD5B

IDD6

IDD7

Proposed Conditions

Operating one bank active-precharge current;

tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRASmin(IDD); CKE is HIGH, CS is HIGH between valid commands;

Address bus inputs are SWITCHING; Data bus inputs are SWITCHING

Operating one bank active-read-precharge current;

IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD = tRCD(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W

Precharge power-down current;

All banks idle; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are

FLOATING

Precharge quiet standby current;

All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING

Precharge standby current;

All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are SWITCHING;

Data bus inputs are SWITCHING

Active power-down current;

All banks open; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING

Fast PDN Exit MRS(12) = 0

Slow PDN Exit MRS(12) = 1

Active standby current;

All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING

Operating burst write current;

All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING

Operating burst read current;

All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCH-

ING; Data pattern is same as IDD4W

Burst auto refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS is HIGH between valid commands;

Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING

Self refresh current;

CK and CK at 0V; CKE ≤ 0.2V; Other control and address bus inputs are

FLOATING; Data bus inputs are FLOATING

Normal

Low Power

Operating bank interleave read current;

All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD), tFAW = tFAW(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; Refer to the following page for detailed timing conditions

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Note

15 of 25

Rev. 1.02 October 2008

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Key Features

  • 2 GB DDR2 667 MHz
  • 1 x 2 GB
  • CAS latency: 5
  • 1.8 V

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