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- Data Sheet
11.0 IDD Specification Parameters Definition. Samsung M378T5663EH3-CE6
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Samsung M378T5663EH3-CE6 is a high-performance DDR2 SDRAM module designed for use in servers, workstations, and other demanding computing applications. With a speed of DDR2-667 and a capacity of 2GB, this module offers fast data transfer rates and ample memory for even the most demanding tasks. It features a 256Mx64 organization and is non-ECC, making it ideal for use in systems that do not require error correction. Thanks to its JEDEC standard VDD of 1.8V ± 0.1V power supply, it operates efficiently and reliably.
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UDIMM DDR2 SDRAM
11.0 IDD Specification Parameters Definition
(IDD values are for full operating range of Voltage and Temperature)
Symbol
IDD0
IDD1
IDD2P
IDD2Q
IDD2N
IDD3P
IDD3N
IDD4W
IDD4R
IDD5B
IDD6
IDD7
Proposed Conditions
Operating one bank active-precharge current;
tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRASmin(IDD); CKE is HIGH, CS is HIGH between valid commands;
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Operating one bank active-read-precharge current;
IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD = tRCD(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data pattern is same as IDD4W
Precharge power-down current;
All banks idle; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are
FLOATING
Precharge quiet standby current;
All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING
Precharge standby current;
All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
Active power-down current;
All banks open; tCK = tCK(IDD); CKE is LOW; Other control and address bus inputs are STABLE; Data bus inputs are FLOATING
Fast PDN Exit MRS(12) = 0
Slow PDN Exit MRS(12) = 1
Active standby current;
All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Operating burst write current;
All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Operating burst read current;
All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are SWITCH-
ING; Data pattern is same as IDD4W
Burst auto refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS is HIGH between valid commands;
Other control and address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Self refresh current;
CK and CK at 0V; CKE ≤ 0.2V; Other control and address bus inputs are
FLOATING; Data bus inputs are FLOATING
Normal
Low Power
Operating bank interleave read current;
All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD), AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD), tFAW = tFAW(IDD), tRCD = 1*tCK(IDD); CKE is HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDD4R; Refer to the following page for detailed timing conditions
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Note
15 of 25
Rev. 1.02 October 2008
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Key Features
- 2 GB DDR2 667 MHz
- 1 x 2 GB
- CAS latency: 5
- 1.8 V
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Table of contents
- 4 1.0 DDR2 Unbuffered DIMM Ordering Information
- 4 2.0 Features
- 4 3.0 Address Configuration
- 5 4.0 x64 DIMM Pin Configurations (Front side/Back side)
- 6 5.0 x72 DIMM Pin Configurations (Front side/Back side)
- 6 6.0 Pin Description
- 7 7.0 Input/Output Function Description
- 8 8.0 Functional Block Diagram
- 13 9.0 Absolute Maximum DC Ratings
- 13 10.0 AC & DC Operating Conditions
- 15 11.0 IDD Specification Parameters Definition
- 16 12.0 Operating Current Table
- 19 13.0 Input/Output Capacitance
- 19 14.0 Electrical Characteristics & AC Timing for DDR
- 22 15.0 Physical Dimensions