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TRF1123 www.ti.com
SLWS167B – APRIL 2005 – REVISED SEPTEMBER 2006
APPLICATION INFORMATION
Figure 9. Package Drawing
A typical application schematic is shown in
and a mechanical drawing of the package outline (LPCC
Quad 5 mm x 5 mm, 32-pin) is shown in
The recommended PCB layout mask is shown in
, along with recommendations on the board material
and construction
.
VDD
10
m
F*
1
m
F
0.1
m
F
100 pF
0.1
m
F
100 pF
Vdet
8
32 31 30 29 28 27 26 25
RFI
VNEG
1
m
F
0.1
m
F 100 pF
BASE
1
GND
2
GND
3
GND
4
RFI
5
GND
6
VG1
7
GND
8
VNEG
9 10 11 12 13
VDD3A
24
GND
23
GND
22
RFO
21
GND
20
GND
19
GND
18
VDD3B
17
100 pF
RF_OUT
100 pF
0.1
m
F
0.1
m
F
14 15 16
VPOS
PACNT
PAGAIN1
PAGAIN0
1
m
F
0.1
m
F 100 pF
0.1
m
F
*10 mF May Need to be 100 mF For High
Speed Pulse Applications
Place 100 pF Capacitors Close to Package
Pins and Minimize Parstic Inductance
Figure 10. Recommended TRF1123 Application Schematic
Table 2. PCB Recommendations
Board Material
Board Material Core Thickness
Copper Thickness (starting)
FR4
10 mil
1 oz
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TRF1123
SLWS167B – APRIL 2005 – REVISED SEPTEMBER 2006
Table 2. PCB Recommendations (continued)
Prepreg Thickness
Recommended Number of Layers
Via Plating Thickness
Final Plate
Final Board Thickness
8 mil
4
0.5 oz
White immersion tin
33-37 mil
3.80
0.50 TYP
0.20 TYP
PIN 1
0.75 TYP
3.80
3.50
0.75 TYP
0.60 TYP
DIA 0.38
TYP
0.25 TYP
3.50
SOLDER MASK: NO SOLDERMASK UNDER CHIP, ON LEAD PADS
OR ON GROUND CONNECTIONS.
25 VIA HOLES, EACH 0.38 mm.
DIMENSIONS in mm
Figure 11. Recommended Pad Layout
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9
TRF1123
SLWS167B – APRIL 2005 – REVISED SEPTEMBER 2006
35 Mil
Dia 15 Mil 1 oz Copper + 1/2 oz Copper Plated
Upper and Lower Surfaces
10 Mil Core FR4
8 Mil
Prepreg
1 oz Copper
1 oz Copper
10 Mil Core FR4 www.ti.com
DuPont CB 100 Conductive Via Plug
1/2 oz Copper Plated
Figure 12. PCB Via Cross Section
10
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PACKAGE OPTION ADDENDUM
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
TRF1123IRTMR
TRF1123IRTMRG3
TRF1123IRTMT
TRF1123IRTMTG3
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
QFN
QFN
QFN
QFN
Package
Drawing
RTM
RTM
RTM
RTM
Eco Plan
(2)
Pins Package
Qty
32 3000 Green (RoHS & no Sb/Br)
Lead/Ball Finish MSL Peak Temp
(3)
CU SN Level-3-260C-168 HR
32 CU SN Level-3-260C-168 HR
32
3000 Green (RoHS & no Sb/Br)
250 Green (RoHS & no Sb/Br)
CU SN Level-3-260C-168 HR
32 250 Green (RoHS & no Sb/Br)
CU SN Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
19-Mar-2008
*All dimensions are nominal
Device
TRF1123IRTMR
TRF1123IRTMT
Package
Type
Package
Drawing
QFN
QFN
RTM
RTM
Pins
32
32
SPQ
3000
250
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
330.0
12.4
330.0
12.4
A0 (mm)
5.3
5.3
B0 (mm)
5.3
5.3
K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
1.5
1.5
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
www.ti.com
PACKAGE MATERIALS INFORMATION
19-Mar-2008
*All dimensions are nominal
Device
TRF1123IRTMR
TRF1123IRTMT
Package Type Package Drawing Pins
QFN
QFN
RTM
RTM
32
32
SPQ
3000
250
Length (mm) Width (mm) Height (mm)
340.5
340.5
333.0
333.0
20.6
20.6
Pack Materials-Page 2
IMPORTANT NOTICE
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
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Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
RFID www.ti-rfid.com
RF/IF and ZigBee® Solutions www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless
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