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Intel® Xeon® Processor 3500 Series
Thermal / Mechanical Design Guide
March 2009
Document Number: 321461-001
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Copyright © 2009, Intel Corporation.
2
Thermal and Mechanical Design Guide
Contents
1
Introduction .............................................................................................................. 7
1.1
References ......................................................................................................... 8
1.2
Definition of Terms .............................................................................................. 8
2
LGA1366 Socket ...................................................................................................... 11
2.1
Board Layout .................................................................................................... 13
2.2
Attachment to Motherboard ................................................................................ 14
2.3
Socket Components........................................................................................... 14
2.3.1 Socket Body Housing .............................................................................. 14
2.3.2 Solder Balls ........................................................................................... 14
2.3.3 Contacts ............................................................................................... 15
2.3.4 Pick and Place Cover............................................................................... 15
2.4
Package Installation / Removal ........................................................................... 16
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 16
2.5
Durability ......................................................................................................... 17
2.6
Markings .......................................................................................................... 17
2.7
Component Insertion Forces ............................................................................... 17
2.8
Socket Size ...................................................................................................... 17
2.9
LGA1366 Socket NCTF Solder Joints..................................................................... 18
3
Independent Loading Mechanism (ILM)................................................................... 19
3.1
Design Concept................................................................................................. 19
3.1.1 ILM Cover Assembly Design Overview ....................................................... 19
3.1.2 ILM Back Plate Design Overview ............................................................... 20
3.2
Assembly of ILM to a Motherboard....................................................................... 20
4
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 23
4.1
Component Mass............................................................................................... 23
4.2
Package/Socket Stackup Height .......................................................................... 23
4.3
Socket Maximum Temperature ............................................................................ 23
4.4
Loading Specifications........................................................................................ 24
4.5
Electrical Requirements ...................................................................................... 24
4.6
Environmental Requirements .............................................................................. 25
5
Sensor Based Thermal Specification Design Guidance.............................................. 27
5.1
Sensor Based Specification Overview ................................................................... 27
5.2
Sensor Based Thermal Specification ..................................................................... 28
5.2.1 TTV Thermal Profile ................................................................................ 28
5.2.2 Specification When DTS value is Greater than TCONTROL ............................ 29
5.3
Thermal Solution Design Process ......................................................................... 30
5.3.1 Boundary Condition Definition .................................................................. 30
5.3.2 Thermal Design and Modelling.................................................................. 31
5.3.3 Thermal Solution Validation ..................................................................... 32
5.4
Fan Speed Control (FSC) Design Process .............................................................. 33
5.4.1 Fan Speed Control Algorithm without TAMBIENT Data ................................. 34
5.4.2 Fan Speed Control Algorithm with TAMBIENT Data ...................................... 35
5.5
System Validation ............................................................................................. 36
5.6
Specification for Operation Where Digital Thermal Sensor Exceeds TCONTROL ........... 37
6
ATX Reference Thermal Solution.............................................................................. 39
6.1
Operating Environment ...................................................................................... 39
6.2
Heatsink Thermal Solution Assembly.................................................................... 40
6.3
Geometric Envelope for the Intel® Reference ATX Thermal Mechanical Design ........... 41
6.4
Reference Design Components ............................................................................ 42
Thermal and Mechanical Design Guide
3
6.5
6.6
6.7
6.8
7
A
B
C
D
6.4.1 Extrusion ...............................................................................................42
6.4.2 Clip.......................................................................................................43
6.4.3 Core .....................................................................................................44
Mechanical Interface to the Reference Attach Mechanism ........................................44
Heatsink Mass and Center of Gravity ....................................................................46
Thermal Interface Material ..................................................................................46
Absolute Processor Temperature ..........................................................................46
Thermal Solution Quality and Reliability Requirements ............................................47
7.1
Reference Heatsink Thermal Verification ...............................................................47
7.2
Mechanical Environmental Testing........................................................................47
7.2.1 Recommended Test Sequence ..................................................................47
7.2.2 Post-Test Pass Criteria.............................................................................48
7.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................48
7.3
Material and Recycling Requirements....................................................................48
Component Suppliers ...............................................................................................49
Mechanical Drawings ...............................................................................................51
Socket Mechanical Drawings ....................................................................................65
Processor Installation Tool ......................................................................................71
Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
3-1
3-2
3-3
4-1
5-1
5-2
5-3
5-4
5-5
5-6
5-7
6-1
6-2
6-3
6-4
6-5
6-6
6-7
6-8
B-1
B-2
B-3
B-4
B-5
4
Processor Thermal Solution & LGA1366 Socket Stack .................................................... 7
LGA1366 Socket with Pick and Place Cover Removed ...................................................11
LGA1366 Socket Contact Numbering (Top View of Socket) ............................................12
LGA1366 Socket Land Pattern (Top View of Board) ......................................................13
Attachment to Motherboard ......................................................................................14
Pick and Place Cover................................................................................................15
Package Installation / Removal Features ....................................................................16
LGA1366 NCTF Solder Joints .....................................................................................18
ILM Cover Assembly ................................................................................................20
ILM Assembly .........................................................................................................21
Pin1 and ILM Lever..................................................................................................22
Flow Chart of Knowledge-Based Reliability Evaluation Methodology ................................26
Comparison of Case Temperature vs. Sensor Based Specification...................................28
Thermal Profile .......................................................................................................29
Thermal solution Performance...................................................................................30
Required YCA for various TAMBIENT Conditions ...........................................................31
Thermal Solution Performance vs. Fan Speed ..............................................................33
Fan Response Without TAMBIENT Data.......................................................................34
Fan Response with TAMBIENT Aware FSC ...................................................................35
ATX Heatsink Reference Design Assembly...................................................................40
ATX KOZ 3-D Model Primary (Top) Side......................................................................41
RCBF5 Extrusion .....................................................................................................42
RCBF5 Clip .............................................................................................................43
Core ......................................................................................................................44
Clip Core and Extrusion Assembly..............................................................................45
Critical Parameters for Interface to the Reference Clip ..................................................45
Critical Core Dimensions ..........................................................................................46
Socket / Heatsink / ILM Keepout Zone Primary Side (Top) ............................................52
Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom) ...................................53
Socket / Processor / ILM Keepout Zone Primary Side (Top) ...........................................54
Socket / Processor / ILM Keepout Zone Secondary Side (Bottom) ..................................55
Reference Design Heatsink Assembly (1 of 2)..............................................................56
Thermal and Mechanical Design Guide
B-6
B-7
B-8
B-9
B-10
B-11
B-12
C-1
C-2
C-3
C-4
D-1
Reference Design Heatsink Assembly (2 of 2) ............................................................. 57
Reference Fastener Sheet 1 of 4 ............................................................................... 58
Reference Fastener Sheet 2 of 4 ............................................................................... 59
Reference Fastener Sheet 3 of 4 ............................................................................... 60
Reference Fastener Sheet 4 of 4 ............................................................................... 61
Reference Clip - Sheet 1 of 2.................................................................................... 62
Reference Clip - Sheet 2 of 2.................................................................................... 63
Socket Mechanical Drawing (Sheet 1 of 4).................................................................. 66
Socket Mechanical Drawing (Sheet 2 of 4).................................................................. 67
Socket Mechanical Drawing (Sheet 3 of 4).................................................................. 68
Socket Mechanical Drawing (Sheet 4 of 4).................................................................. 69
Processor Installation Tool ....................................................................................... 72
Tables
1-1
1-2
4-1
4-2
4-3
4-4
5-1
6-1
7-1
A-1
A-2
A-3
B-1
C-1
Reference Documents ................................................................................................. 8
Terms and Descriptions .............................................................................................. 8
Socket Component Mass ........................................................................................... 23
1366-land Package and LGA1366 Socket Stackup Height............................................... 23
Socket and ILM Mechanical Specifications.................................................................... 24
Electrical Requirements for LGA1366 Socket ................................................................ 25
Thermal Solution Performance above TCONTROL.......................................................... 37
Processor Thermal Solution Requirements & Boundary Conditions................................... 39
Use Conditions (Board Level) ..................................................................................... 47
Reference Heatsink Enabled Components .................................................................... 49
LGA1366 Socket and ILM Components ........................................................................ 49
Supplier Contact Information ..................................................................................... 49
Mechanical Drawing List ............................................................................................ 51
Mechanical Drawing List ............................................................................................ 65
Thermal and Mechanical Design Guide
5
Revision History
Revision
Number
-001
Description
•
Initial release
Revision Date
March 2009
§
6
Thermal and Mechanical Design Guide
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for the:
• Intel® Xeon® Processor 3500 Series
Unless specifically required for clarity, this document will use “processor” in place of the
specific product names. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
Figure 1-1.
Processor Thermal Solution & LGA1366 Socket Stack
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the appropriate
processor Datasheet.
Thermal/Mechanical Design Guide
7
Introduction
1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
Document
Location
Notes
Intel® Xeon® Processor 3500 Series Processor Datasheet,
Volume 1
321332
1
Intel® Xeon® Processor 3500 Series Processor Datasheet,
Volume 2
321344
1
Intel® Xeon® Processor 3500 Series Processor Specification
Update
321333
1
Notes:
1.
Available electronically
1.2
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Term
8
Description
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC
Fan Speed Control
IHS
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM
Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
IOH
Input Output Hub: a component of the chipset that provides I/O connections to PCIe,
drives and other peripherals
LGA1366 socket
The processor mates with the system board through this surface mount, 1366-contact
socket.
PECI
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
ΨCA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. Heat source should always be specified for Ψ measurements.
ΨCS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total
Package Power.
ΨSA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS – TLA) / Total Package Power.
TCASE
The case temperature of the TTV measured at the geometric center of the topside of the
IHS.
TCASE_MAX
The maximum case temperature as specified in a component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
TCONTROL
TCONTROL is a static value below TCC activation used as a trigger point for fan speed
control.
Thermal/Mechanical Design Guide
Introduction
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
Description
TDP
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile
Line that defines case temperature specification of the TTV at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TAMBIENT
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
§
Thermal/Mechanical Design Guide
9
Introduction
10
Thermal/Mechanical Design Guide
LGA1366 Socket
2
LGA1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
Intel® Xeon® Processor 3500 Series. The socket provides I/O, power and ground
contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the
socket with lead-free solder balls for surface mounting on the motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a
43x41 grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Chapter 4.
Figure 2-1.
LGA1366 Socket with Pick and Place Cover Removed
package
socket
cavity
Thermal/Mechanical Design Guide
11
LGA1366 Socket
BA
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
41
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35
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23
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BA
42
AY
AW
43
AV
AU
T
V
Y
AB
AD
AF
AH
AK
AM
R
U
W
AA
AC
AE
AG
AJ
AL
AN
5
B
D
F
H
K
M
P
T
V
Y
AB
AD
AF
AH
AK
AM
P
6
A
N
AP
AT
AV
AY
AT
7
AR
8
AP
9
10
M
11
12
L
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K
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J
17
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H
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G
21
22
F
23
24
E
25
26
D
27
28
C
29
30
B
31
32
4
Thermal/Mechanical Design Guide
12
LGA1366 Socket Contact Numbering (Top View of Socket)
Figure 2-2.
LGA1366 Socket
2.1
Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
Figure 2-3.
LGA1366 Socket Land Pattern (Top View of Board)
A
C
B
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ AL AN AR AU AW BA
Y
AB AD AF AH AK AM AP AT AV AY
43
42
41
40
39
38
37
36
35
34
33
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31
30
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9
8
7
6
5
4
3
2
1
A
C
B
Thermal/Mechanical Design Guide
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ AL AN AR AU AW BA
Y
AB AD AF AH AK AM AP AT AV AY
13
LGA1366 Socket
2.2
Attachment to Motherboard
The socket is attached to the motherboard by 1366 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so on) to attach the
socket.
As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
Figure 2-4.
Attachment to Motherboard
ILM
LGA 1366 Socket
2.3
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to Appendix C for detailed
drawings.
2.3.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in Chapter 7.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
2.3.2
Solder Balls
A total of 1366 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217 °C. The alloy must be
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.
14
Thermal/Mechanical Design Guide
LGA1366 Socket
2.3.3
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in Chapter 7 without degrading.
As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
Figure 2-5.
Pick and Place Cover
ILM
Installation
Pin 1
Pick and
Place Cover
Thermal/Mechanical Design Guide
15
LGA1366 Socket
2.4
Package Installation / Removal
As indicated in Figure 2-6, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See Appendix D for information regarding a tool designed to provide mechanical
assistance during processor installation and removal.
.
Figure 2-6.
Package Installation / Removal Features
orientation
notch
Pin1 triangle
alignment
walls
access
orientation
post
Pin1 chamfer
2.4.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 4.2 for the calculated IHS height above the motherboard.
16
Thermal/Mechanical Design Guide
LGA1366 Socket
2.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6
Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
2.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
2.8
Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal
mechanical components.
Thermal/Mechanical Design Guide
17
LGA1366 Socket
2.9
LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality. Figure 2-7
identifies the NCTF solder joints.
.
Figure 2-7.
LGA1366 NCTF Solder Joints
A
C
B
E
D
G
F
J
H
L
K
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AA AC AE AG AJ
Y
AL AN AR AU AW BA
AB AD AF AH AK AM AP AT AV AY
43
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1
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AA AC AE AG AJ
Y
AL AN AR AU AW BA
AB AD AF AH AK AM AP AT AV AY
§
18
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
3
Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1366-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note:
The mechanical design of the ILM is integral to the overall functionality of the LGA1366
socket. Intel performs detailed studies on integration of processor package, socket and
ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be “build to print” from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's
detailed studies and may not incorporate critical design parameters.
3.1
Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM cover assembly and back plate.
3.1.1
ILM Cover Assembly Design Overview
The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and
the captive fasteners.
The load lever and load plate are stainless steel. The frame and fasteners are high
carbon steel with appropriate plating. The fasteners are fabricated from a high carbon
steel. The frame provides the hinge locations for the load lever and load plate.
The cover assembly design ensures that once assembled to the back plate and the load
lever is closed, the only features touching the board are the captive fasteners. The
nominal gap of the frame to the board is ~1 mm when the load plate is closed on the
empty socket or when closed on the processor package.
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
features shown in Figure 3-1. The reaction force from closing the load plate is
transmitted to the frame and through the captive fasteners to the back plate. Some of
the load is passed through the socket body to the board inducing a slight compression
on the solder joints.
Thermal/Mechanical Design Guide
19
Independent Loading Mechanism (ILM)
Figure 3-1.
ILM Cover Assembly
Load Lever
Captive Fastener (4x)
Load Plate
Frame
3.1.2
ILM Back Plate Design Overview
The back plate for single processor workstation products consists of a flat steel back
plate with threaded studs for ILM attach. The threaded studs have a smooth surface
feature that provides alignment for the back plate to the motherboard for proper
assembly of the ILM around the socket. A clearance hole is located at the center of the
plate to allow access to test points and backside capacitors. An insulator is pre-applied.
3.2
Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. In
step 1, (see Figure 3-2), the back plate is placed in a fixture. Holes in the motherboard
provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed
over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover
assembly to the back plate with the four captive fasteners. Torque to 8 ± 2 inchpounds. The length of the threaded studs accommodate board thicknesses from
0.062” to 0.100”.
20
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
.
Figure 3-2.
ILM Assembly
Socket Body Reflowed on board
Socket Body with Back Plate on board
Step 1
Thermal/Mechanical Design Guide
Step 2
21
Independent Loading Mechanism (ILM)
As indicated in Figure 3-3, socket protrusion and ILM key features prevent 180-degree
rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1
orientation with respect to the ILM lever.
Figure 3-3.
Pin1 and ILM Lever
Protrusion
ILM Key
ILM
Lever
Pin 1
§
22
Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4
LGA1366 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1366 socket and the Independent Loading Mechanism.
4.1
Component Mass
Table 4-1.
Socket Component Mass
Component
Mass
Socket Body, Contacts and PnP Cover
4.2
15 g
ILM Cover
43 g
ILM Back Plate
51 g
Package/Socket Stackup Height
Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and
LGA1366 socket with the ILM closed and the processor fully seated in the socket.
Table 4-2.
1366-land Package and LGA1366 Socket Stackup Height
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
7.729 ± 0.282 mm
Notes:
1.
This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor datasheet.
2.
This value is a RSS calculation.
4.3
Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 96 °C
Thermal/Mechanical Design Guide
23
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4.4
Loading Specifications
The socket will be tested against the conditions listed in Chapter 7 with heatsink and
the ILM attached, under the loading conditions outlined in this chapter.
Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed.
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
Table 4-3.
Socket and ILM Mechanical Specifications
Parameter
Min
Max
Static compressive load from ILM cover to
processor IHS
470 N [106 lbf]
623 N [140 lbf]
Notes
3, 4, 7
Heatsink Static Compressive Load
0 N [0 lbf]
266 N [60 lbf]
1, 2, 3
Total Static Compressive Load
(ILM plus Heatsink)
470 N (106 lbf)
890 N (200 lbf)
3, 4
Dynamic Compressive Load
(with heatsink installed)
N/A
890 N [200 lbf]
1, 3, 5, 6
Pick and Place Cover Insertion / Removal force
N/A
10.2 N [2.3 lbf]
Load Lever actuation force
N/A
38.3 N [8.6 lbf] in the
vertical direction
10.2 N [2.3 lbf] in the
lateral direction.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3.
Loading limits are for the LGA1366 socket.
4.
This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass.
The dynamic portion of this specification in the product application can have flexibility in specific values, but
the ultimate product of mass times acceleration should not exceed this dynamic load.
7.
Conditions must be satisfied at the beginning of life and the loading system stiffness for non-reference
designs need to meet a specific stiffness range to satisfy end of life loading requirements.
4.5
Electrical Requirements
LGA1366 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
24
Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-4.
Electrical Requirements for LGA1366 Socket
Parameter
Value
Comment
<3.9nH
The inductance calculated for two contacts,
considering one forward conductor and one return
conductor. These values must be satisfied at the
worst-case height of the socket.
Mated loop inductance, Loop
Mated partial mutual inductance, L
Maximum mutual capacitance, C.
NA
<1 pF
Bulk Resistance Increase
Dielectric Withstand Voltage
Insulation Resistance
4.6
The capacitance between two contacts
15.2 mΩ
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the resistance
of each chain minus resistance of shorting bars
divided by number of lands in the daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
≤ 100 mΩ
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
Socket Average Contact Resistance
(EOL)
Max Individual Contact Resistance
(EOL)
The inductance on a contact due to any single
neighboring contact.
≤ 3 mΩ
The bulk resistance increase per contact from
24 °C to 107 °C
360 Volts RMS
800 MΩ
Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure 4-1.
Thermal/Mechanical Design Guide
25
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Figure 4-1.
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Freeze stressing
requirements and perform
additional data turns
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
A detailed description of this methodology can be found at:
ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.
§
26
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
5
Sensor Based Thermal
Specification Design Guidance
The introduction of the sensor based thermal specification presents opportunities for
the system designer to optimize the acoustics and simplify thermal validation. The
sensor based specification utilizes the Digital Thermal Sensor information accessed
using the PECI interface.
This chapter will review thermal solution design options, fan speed control design
guidance & implementation options and suggestions on validation both with the TTV
and the live die in a shipping system.
5.1
Sensor Based Specification Overview
Create a thermal specification that meets the following requirements:
• Use Digital Thermal Sensor (DTS) for real-time thermal specification compliance.
• Single point of reference for thermal specification compliance over all operating
conditions.
• Does not required measuring processor power & case temperature during
functional system thermal validation.
• Opportunity for acoustic benefits for DTS values between TCONTROL and -1.
The current specification based on the processor case temperature has some notable
gaps to optimal acoustic design. When the ambient temperature is less than the
maximum design point, the fan speed control system (FSC) will over cool the processor.
The FSC has no feedback mechanism to detect this over cooling. This is shown in the
top half of Figure 5-1.
The sensor based specification will allow the FSC to be operated at the maximum
allowable silicon temperature or TJ for the measured ambient. This will provide optimal
acoustics for operation above TCONTROL. See lower half of Figure 5-1.
Thermal/Mechanical Design Guide
27
Sensor Based Thermal Specification Design Guidance
Figure 5-1.
Comparison of Case Temperature vs. Sensor Based Specification
Ta = 43.2 C
Tcontrol
Ta = 30 C
Ψ-ca = 0.292
Power
TDP
Current Specification (Case Temp)
Ψ-ca = 0.292
Ψ-ca = 0.362
Tcontrol
Ta = 30 C
TDP
Power
Sensor Based Specification (DTS Temp)
5.2
Sensor Based Thermal Specification
The sensor based thermal specification consists of two parts. The first is a thermal
profile that defines the maximum TTV TCASE as a function of TTV power dissipation. The
thermal profile defines the boundary conditions for validation of the thermal solution.
The second part is a defined thermal solution performance (ΨCA) as a function of the
DTS value as reported over the PECI bus when DTS is greater than TCONTROL. This
defines the operational limits for the processor using the TTV validated thermal
solution.
5.2.1
TTV Thermal Profile
For the sensor based specification the only reference made to a case temperature
measurement is on the TTV. Functional thermal validation will not require the user to
apply a thermocouple to the processor package or measure processor power.
Note:
28
All functional compliance testing will be based on fan speed response to the reported
DTS values above TCONTROL. As a result no conversion of TTV TCASE to processor TCASE
will be necessary.
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
As in previous product specifications, a knowledge of the system boundary conditions is
necessary to perform the heatsink validation. Section 5.3.1 will provide more detail on
defining the boundary conditions. The TTV is placed in the socket and powered to the
recommended value to simulate the TDP condition. See Figure 5-2 for an example of
the processor TTV thermal profile.
Figure 5-2.
Thermal Profile
70.0
y = 43.2 + 0.19 * P
65.0
TTV Tcase in C
60.0
55.0
50.0
45.0
40.0
0
10
20
30
40
50
60
70
80
90
100
110
120
130
TTV Power (W)
Note:
This graph is provided as a reference. Please refer to the appropriate processor
datasheet for the specification.
5.2.2
Specification When DTS value is Greater than TCONTROL
The product specification provides a table of ΨCA values at DTS = TCONTROL and
DTS = -1 as a function of TAMBIENT (inlet to heatsink). Between these two defined
points, a linear interpolation can be done for any DTS value reported by the processor.
A copy of the specification is provided as a reference in Table 5-1 of Section 5.6.
The fan speed control algorithm has enough information using only the DTS value and
TAMBIENT to command the thermal solution to provide just enough cooling to keep the
part on the thermal profile.
As an example, the data in Table 5-1 has been plotted in Figure 5-3 to show the
required ΨCA at 25, 30, 35, and 39 °C TAMBIENT. The lower the ambient, the higher the
required ΨCA which means lower fan speeds and reduced acoustics from the processor
thermal solution.
In the prior thermal specifications this region, DTS values greater than TCONTROL, was
defined by the processor thermal profile. This required the user to estimate the
processor power and case temperature. Neither of these two data points are accessible
in real time for the fan speed control system. As a result, the designer had to assume
the worst case TAMBIENT and drive the fans to accommodate that boundary condition.
Thermal/Mechanical Design Guide
29
Sensor Based Thermal Specification Design Guidance
Figure 5-3.
Thermal solution Performance
5.3
Thermal Solution Design Process
Thermal solution design guidance for this specification is the same as with previous
products. The initial design must take into account the target market and overall
product requirements for the system. This can be broken down into several steps:
• Boundary condition definition
• Thermal design / modelling
• Thermal testing
5.3.1
Boundary Condition Definition
Using the knowledge of the system boundary conditions (e.g., inlet air temperature,
acoustic requirements, cost, design for manufacturing, package and socket mechanical
specifications and chassis environmental test limits) the designer can make informed
thermal solution design decisions.
The thermal boundary conditions for an ATX tower system are as follows:
• TEXTERNAL = 35 °C. This is typical of a maximum system operating environment
• TRISE = 4 °C. This is typical of a chassis compliant to CAG 1.1
• TAMBIENT = 39 °C (TAMBIENT = TEXTERNAL + TRISE)
Based on the system boundary conditions, the designer can select a TAMBIENT and ΨCA
to use in thermal modelling. The assumption of a TAMBIENT has a significant impact on
the required ΨCA needed to meet TTV TCASEMAX at TDP. A system that can deliver lower
assumed TAMBIENT can utilize a design with a higher ΨCA, which can have a lower cost.
Figure 5-4 shows a number of satisfactory solutions for the processor.
30
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
Note:
If the assumed TAMBIENT is inappropriate for the intended system environment, the
thermal solution performance may not be sufficient to meet the product requirements.
The results may be excessive noise from fans having to operate at a speed higher than
intended. In the worst case this can lead to performance loss with excessive activation
of the Thermal Control Circuit (TCC).
Figure 5-4.
Required ΨCA for various TAMBIENT Conditions
Note:
If an ambient of greater than 43.2 °C is necessary based on the boundary conditions a
thermal solution with a ΨCA lower than 0.19 °C/W will be required.
5.3.2
Thermal Design and Modelling
Based on the boundary conditions the designer can now make the design selection of
the thermal solution components. The major components that can be mixed are the
fan, fin geometry, heat pipe or air cooled solid core design. There are cost and acoustic
trade-offs the customer must make.
To aide in the design process Intel provides TTV thermal models. Please consult your
Intel Field Sales Engineer for these tools.
Thermal/Mechanical Design Guide
31
Sensor Based Thermal Specification Design Guidance
5.3.3
Thermal Solution Validation
5.3.3.1
Test for Compliance to the TTV Thermal Profile
This step is the same as previously suggested for prior products. The thermal solution
is mounted on a test fixture with the TTV and tested at the following conditions:
• TTV is powered to the TDP condition
• Thermal solution fan operating at full speed
• TAMBIENT at the boundary condition from Section 5.3.1
The following data is collected: TTV power, TTV TCASE, and TAMBIENT, and used to
calculate ΨCA, which is defined as:
ΨCA = (TTV TCASE – TAMBIENT) / Power
This testing is best conducted on a bench to eliminate as many variables as possible
when assessing the thermal solution performance. The boundary condition analysis as
described in Section 5.3.1 should help in making the bench test simpler to perform.
5.3.3.2
Thermal Solution Characterization for Fan Speed Control
The final step in thermal solution validation is to establish the thermal solution
performance,ΨCA and acoustics as a function of fan speed. This data is necessary to
allow the fan speed control algorithm developer to program the device. It also is
needed to asses the expected acoustic impact of the processor thermal solution in the
system.
The characterization data should be taken over the operating range of the fan. Using
the RCHF5 as the example the fan is operational from 600 to 3500 RPM. The data was
collected at several points and a curve was fit to the data see Figure 5-5. Taking data at
6 evenly distributed fan speeds over the operating range should provide enough data to
establish a 3-variable equation. By using the equation from the curve fitting a complete
set of required fan speeds as a function of ΨCA be developed. The results from the
reference thermal solution characterization are provided in Table 5-1.
The fan speed control device may modulate the thermal solution fan speed (RPM) by
one of two methods a pulse width modulation (PWM) signal or varying the voltage to
the fan. As a result the characterization data needs to also correlate the RPM to PWM or
voltage to the thermal solution fan. The fan speed algorithm developer needs to
associate the output command from the fan speed control device with the required
thermal solution performance as stated in Table 5-1. Regardless of which control
method is used, the term RPM will be used to indicate required fan speed in the rest of
this document.
Note:
32
When selecting a thermal solution from a thermal vendor, the characterization data
should be requested directly from them as a part of their thermal solution collateral.
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
0.50
5.9
0.40
5.4
4.9
0.30
4.4
3.9
0.20
3.4
2.9
0.10
0.00
600
1100
1600
2100
2600
3100
Bels (BA)
Thermal Solution Performance vs. Fan Speed
Psi-ca
Figure 5-5.
2.4
1.9
3600
RPM
Psi-ca
System (BA)
Note:
This data is taken from the validation of the RCBF5 reference processor thermal
solution. The ΨCA vs. RPM data is available in Table 5-1 at the end of this chapter.
5.4
Fan Speed Control (FSC) Design Process
The next step is to incorporate the thermal solution characterization data into the
algorithms for the device controlling the fans.
As a reminder, the requirements are:
• When the DTS value is at or below TCONTROL, the fans can be slowed down; just as
with prior processors.
• When DTS is above TCONTROL, FSC algorithms will use knowledge of TAMBIENT and
ΨCA vs. RPM to achieve the necessary level of cooling.
This chapter discusses two implementations. The first is a FSC system that is not
provided the TAMBIENT information and a FSC system that is provided data on the
current TAMBIENT. Either method will result in a thermally compliant solution and some
acoustic benefit by operating the processor closer to the thermal profile. But only the
TAMBIENT aware FSC system can fully use the specification for optimized acoustic
performance.
In the development of the FSC algorithm it should be noted that the TAMBIENT is
expected to change at significantly slower rate than the DTS value. The DTS value will
be driven by the workload on the processor and the thermal solution will be required to
respond to this much more rapidly than the changes in TAMBIENT.
An additional consideration in establishing the fan speed curves is to account for the
thermal interface material performance degradation over time.
Thermal/Mechanical Design Guide
33
Sensor Based Thermal Specification Design Guidance
5.4.1
Fan Speed Control Algorithm without TAMBIENT Data
In a system that does not provide the FSC algorithm with the TAMBIENT information, the
designer must make the following assumption:
• When the DTS value is greater than TCONTROL the TAMBIENT is at boundary condition
derived in Section 5.3.1.
This is consistent with our previous FSC guidance to accelerate the fan to full speed
when the DTS value is greater than TCONTROL. As will be shown below, the DTS thermal
specification at DTS = TCONTROL can reduce some of the over cooling of the processor
and provide an acoustic noise reduction from the processor thermal solution.
In this example the following assumptions are made:
• TAMBIENT = 39 °C
• Thermal Solution designed / validated to a 39 °C environment
• TCONTROL = -20
• Reference processor thermal solution (RCFH5)
• Below TCONTROL the fan speed is slowed down as in prior products
For a processor specification based on a TCASE thermal profile, when the DTS value is
equal to or greater than TCONTROL, the fan speed must be accelerated to full speed. For
the reference thermal solution full speed is 3500 RPM (dashed line in Figure 5-6). The
DTS thermal specification defines a required ΨCA and therefore the fan speed is
2500 RPM. This is much less than full speed even if the assumption is a
TAMBIENT = 39 °C (solid line in Figure 5-6). The shaded area displayed in Figure 5-6 is
where DTS values are less than TCONTROL. For simplicity, the graph shows a linear
acceleration of the fans from TCONTROL – 10 to TCONTROL as has been Intel’s guidance
for simple fan speed control algorithms.
As the processor workload continues to increase, the DTS value will increase and the
FSC algorithm will linearly increase the fan speed from the 2500 RPM at DTS = -20 to
full speed at DTS value = -1.
Figure 5-6.
34
Fan Response Without TAMBIENT Data
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
5.4.2
Fan Speed Control Algorithm with TAMBIENT Data
In a system where the FSC algorithm has access to the TAMBIENT information and is
capable of using the data the benefits of the DTS thermal specification become more
striking.
As will be demonstrated below, there is still over cooling of the processor, even when
compared to a nominally ambient aware thermal solution equipped with a thermistor.
An example of these thermal solutions are the RCFH5 or the boxed processor thermal
solutions. This over cooling translates into acoustic margin that can be used in the
overall system acoustic budget.
In this example the following assumptions are made:
•
•
•
•
•
•
TAMBIENT = 35 °C
Thermal Solution designed / validated to a 39 °C environment
TCONTROL = -20
FSC device has access to TAMBIENT
Reference processor thermal solution (RCFH5)
Below TCONTROL the fan speed is slowed down as in prior products
For a processor specification based on a TCASE thermal profile, when the DTS value is
equal to or greater than TCONTROL, the fan speed is accelerated to maximum fan speed
for the TAMBIENT as controlled by the thermistor in thermal solution. For the RCFH5, this
would be about 2500 RPM at 35 °C. This is graphically displayed as the dashed line in
Figure 5-7.
This is an improvement over the ambient unaware system but is not fully optimized for
acoustic benefit. The DTS thermal specification required ΨCA and therefore the fan
speed in this scenario is 1450 RPM. This is less than thermistor controlled speed of
2500 RPM - even if the assumption is a TAMBIENT = 35 °C. This is graphically displayed
in Figure 5-7.
The shaded area displayed in Figure 5-7 is where DTS values are less than TCONTROL.
For simplicity, the graph shows a linear acceleration of the fans from TCONTROL - 10 to
TCONTROL as has been Intel’s guidance for simple fan speed control algorithms.
As the processor workload continues to increase, the DTS value will increase and the
FSC algorithm will linearly increase the fan speed from the 1450 RPM at DTS = -20 to
2250 RPM at DTS value = -1.
Figure 5-7.
Fan Response with TAMBIENT Aware FSC
Thermal/Mechanical Design Guide
35
Sensor Based Thermal Specification Design Guidance
5.5
System Validation
System validation should focus on ensuring the fan speed control algorithm is
responding appropriately to the DTS values and TAMBIENT data as well as any other
device being monitored for thermal compliance.
Since the processor thermal solution has already been validated using the TTV to the
thermal specifications at the predicted TAMBIENT, additional TTV based testing in the
chassis is not expected to be necessary.
Once the heatsink has been demonstrated to meet the TTV Thermal Profile, it should be
evaluated on a functional system at the boundary conditions.
In the system under test and Power/Thermal Utility Software set to dissipate the TDP
workload confirm the following item:
• Verify if there is TCC activity by instrumenting the PROCHOT# signal from the
processor. TCC activation in functional application testing is unlikely with a
compliant thermal solution. Some very high power applications might activate TCC
for short intervals this is normal.
• Verify fan speed response is within expectations - actual RPM (ΨCA) is consistent
with DTS temperature and TAMBIENT.
• Verify RPM vs. PWM command (or voltage) output from the FSC device is within
expectations.
• Perform sensitivity analysis to asses impact on processor thermal solution
performance and acoustics for the following:
— Other fans in the system.
— Other thermal loads in the system.
In the same system under test, run real applications that are representative of the
expected end user usage model and verify the following:
• TCC activation is not occurring.
• Verify fan speed response vs. expectations as done using Power/Thermal Utility
SW.
• Validate system boundary condition assumptions: Trise, venting locations, other
thermal loads and adjust models / design as required.
36
Thermal/Mechanical Design Guide
Sensor Based Thermal Specification Design Guidance
5.6
Specification for Operation Where Digital Thermal
Sensor Exceeds TCONTROL
Table 5-1 is provided as reference for the development of thermal solutions and the fan
speed control algorithm.
Table 5-1.
Thermal Solution Performance above TCONTROL
TAMBIENT1
ΨCA at
DTS = TCONTROL2
RPM for ΨCA at
DTS = TCONTROL5
ΨCA at
DTS = -13
RPM for ΨCA at
DTS = -15
43.2
0.190
N/A
0.190
N/A
42.0
0.206
N/A
0.199
N/A
41.0
0.219
N/A
0.207
N/A
40.0
0.232
3250
0.215
N/A
39.0
0.245
2600
0.222
3500
38.0
0.258
2200
0.230
3150
37.0
0.271
1900
0.238
2400
36.0
0.284
1700
0.245
2500
35.0
0.297
1450
0.253
2500
34.0
0.310
1300
0.261
2100
33.0
0.323
1200
0.268
1900
32.0
0.336
1100
0.276
1700
31.0
0.349
1000
0.284
1650
30.0
0.362
900
0.292
1550
29.0
0.375
850
0.299
1450
28.0
0.388
800
0.307
1350
27.0
0.401
700
0.315
1250
26.0
0.414
700
0.322
1200
25.0
0.427
650
0.330
1100
24.0
0.440
600
0.338
1050
23.0
0.453
600
0.345
1000
22.0
0.466
600
0.353
950
21.0
0.479
600
0.361
900
20.0
0.492
600
0.368
900
19.0
0.505
600
0.376
850
18.0
0.519
600
0.384
800
Notes:
1.
The ambient temperature is measured at the inlet to the processor thermal solution
2.
This column can be expressed as a function of TAMBIENT by the following equation:
ΨCA = 0.19 + (43.2 - TAMBIENT) * 0.013
3.
This column can be expressed as a function of TAMBIENT by the following equation:
ΨCA = 0.19 + (43.2 - TAMBIENT) * 0.0077
4.
This table is provided as a reference please consult the product specification for current values.
5.
Based on the testing performed a curve was fit to the data in the form
Psi_ca = (1+a*RPM)/(b+c*RPM) where
a = 0.000762, b = 0.667637, c = 004402
§
Thermal/Mechanical Design Guide
37
Sensor Based Thermal Specification Design Guidance
38
Thermal/Mechanical Design Guide
ATX Reference Thermal Solution
6
ATX Reference Thermal
Solution
Note:
The reference thermal mechanical solution information shown in this document
represents the current state of the data and may be subject to modification.The
information represents design targets, not commitments by Intel.
The design strategy is to use the design concepts from the prior Intel® Radial Curved
Bifurcated Fin Heatsink Reference Design (Intel® RCBFH Reference Design) designed
originally for the Intel® Pentium® 4 processors.
This chapter describes the overall requirements for the ATX heatsink reference thermal
solution including critical-to-function dimensions, operating environment, and
validation criteria.
6.1
Operating Environment
Table 6-1 provides the target heatsink performance for the ATX heatsink reference
thermal solution supporting the processor at several system and ambient conditions.
The exhaust air flow from the processor thermal solution is the inlet air flow to the IOH
reference thermal solution and other components such as the voltage regulator. This
airstream is assumed to be approaching the IOH heatsink at a 30° angle from the
processor thermal solution, see the Intel® X58 Express Chipset Thermal and
Mechanical Design Guide for more details.
Table 6-1 summarizes the boundary conditions for designing and evaluating the
processor thermal solution. In addition to the power dissipation a set of three system
level boundary conditions for the local ambient TA and external ambient will be used.
• Low external ambient (25 °C)/ idle power for the components (Case 3). This covers
the system idle acoustic condition.
• Low external ambient (25 °C)/ TDP for the components (Case 2). The processor
thermal solution fan speed is limited by the thermistor in the fan hub.
• High ambient (35 °C)/ TDP for the components (Case 1). This covers the maximum
fan speed condition of the processor thermal solution.
.
Table 6-1.
Processor Thermal Solution Requirements & Boundary Conditions
Case
External
Ambient
IOH
Power
Processor
Power
TA-Local
Target
Psi-ca
Output
Airflow
1
35 °C
TDP
TDP
39 °C
0.23 °C/W
756 LFM[3.8 m/S]
2
25 °C
TDP
TDP
30 °C
0.30 °C/W
420 LFM[2.1 m/S]
3
25 °C
Idle
Idle
30 °C
1.54 °C/W
163 LFM[0.83 m/S]
Notes:
1.
The values in Table 6-1 are preliminary and subject to change.
2.
Output airflow targets are the minimum inlet requirements for the IOH.
3.
For Case 3 the minimum fan speed is projected to deliver 0.54 °C/W.
4.
All measurements will be evaluated at sea level.
Thermal/Mechanical Design Guide
39
ATX Reference Thermal Solution
6.2
Heatsink Thermal Solution Assembly
The reference thermal solution for the processor is an active fan solution similar to the
prior designs for the Intel® Pentium® 4 and Intel® Core™2 Duo processors. The
design uses a copper core with an aluminum extrusion. It attaches to the motherboard
with a fastener design reused from the RCBFH3 and RCFH4. The clip design is new to
span the larger size of the LGA1366. The thermal solution assembly requires no
assembly prior to installation on a motherboard. Figure 6-1 shows the reference
thermal solution assembly in an exploded view.
The first step in assembling the thermal solution is to verify the fasteners are aligned to
the mounting holes on the motherboard. The fasteners are pressed firmly to lock the
thermal solution to the motherboard.
Figure 6-1.
ATX Heatsink Reference Design Assembly
Wire Guard
Impeller /
Motor Assy
Extrusion
Fastener
Cap
Clip
Fastener
Base
Core
40
Thermal/Mechanical Design Guide
ATX Reference Thermal Solution
6.3
Geometric Envelope for the Intel® Reference ATX
Thermal Mechanical Design
Figure 6-2 shows a 3-D representation of the board component keep out for the
reference ATX thermal solution. A fully dimensioned drawing of the keepout information
is available at Figure B-1 and Figure B-2 in Appendix B. A DXF version of these
drawings is available as well as the 3-D model of the board level keep out zone is
available. Contact your field sales representative for these documents.
Figure 6-2.
ATX KOZ 3-D Model Primary (Top) Side
Socket / ILM
Keep In Zone
27.0 mm
Maximum Component
Height (3 – places)
10.10 mm
Maximum
Component
Height
(4 – places)
2.50 mm Maximum
Component Height
(5 – places)
1.80 mm Maximum
Component Height
1.20 mm Maximum
Component Height
The maximum height of the reference thermal solution above the motherboard is
71.12 mm [2.8 inches], and is compliant with the motherboard primary side height
constraints defined in the ATX Specification and the microATX Motherboard Interface
Specification found at http://www.formfactors.org.
The reference solution requires a chassis obstruction height of at least 81.28 mm
[3.2 inches], measured from the top of the motherboard. This allows for appropriate
fan inlet airflow to ensure fan performance, and therefore overall cooling solution
performance. This is compliant with the recommendations found in both ATX
Specification and microATX Motherboard Interface Specification documents.
.
Thermal/Mechanical Design Guide
41
ATX Reference Thermal Solution
6.4
Reference Design Components
6.4.1
Extrusion
The aluminum extrusion is a 51 fin 102 mm diameter bifurcated fin design. The overall
height of the extrusion is 38 mm tall. To facilitate reuse of the core design the center
cylinder ID and wall thickness are the same as RCFH4.
Figure 6-3.
42
RCBF5 Extrusion
Thermal/Mechanical Design Guide
ATX Reference Thermal Solution
6.4.2
Clip
Structural design strategy for the clip is to provide sufficient load for the Thermal
Interface Material (TIM).
The clip is formed from 1.6 mm carbon steel, the same material as used in previous clip
designs. The target metal clip nominal stiffness is 376 N/mm [2150 lb/in]. The
combined target for reference clip and fasteners nominal stiffness is 260 N/mm
[1489 lb/in]. The nominal preload provided by the reference design is 191 N ± 42 N
[43 lb ± ~10 lb].
Note:
Intel reserves the right to make changes and modifications to the design as necessary
to the Intel RCBF5 reference design, in particular the clip.
Figure 6-4.
RCBF5 Clip
Thermal/Mechanical Design Guide
43
ATX Reference Thermal Solution
6.4.3
Core
The core is the same forged design used in RCFH4. This allows the reuse of the fan
attach and if desired the same extrusion as used in RCFH4. The machined flange height
has been reduced from the RCFH4 design to match the IHS height for the Intel®
Xeon® Processor 3500 Series when installed in the LGA1366 socket. The final height of
the flange will be an output of the design validation and could be varied to adjust the
preload. See Section 6.5 for additional information on the critical to function interfaces
between the core and clip.
Figure 6-5.
Core
6.5
Mechanical Interface to the Reference Attach
Mechanism
The attach mechanism component from the Intel RCBF5 Reference Design can be used
by other 3rd party cooling solutions. The attach mechanism consists of:
• A metal attach clip that interfaces with the heatsink core, see Figure B-11 and
Figure B-12 for the clip drawings.
• Four plastic fasteners, see Figure B-7, Figure B-8, Figure B-9, and Figure B-10 for
the component drawings.
Figure 6-6 shows the reference attach mechanism (clip, core and extrusion) portion of
the Intel RCBF5 Reference Design. The clip is assembled to the heatsink during copper
core insertion, and is meant to be trapped between the core shoulder and the extrusion
as shown in Figure 6-7.
The critical to function mechanical interface dimensions are shown in Figure 6-7 and
Figure 6-8. Complying with the mechanical interface parameters is critical to
generating a heatsink preload compliant with the minimum preload requirement for the
selected TIM and to not exceed the socket design limits.
44
Thermal/Mechanical Design Guide
ATX Reference Thermal Solution
Figure 6-6.
Clip Core and Extrusion Assembly
Clip
Core shoulder
traps clip in place
Figure 6-7.
Critical Parameters for Interface to the Reference Clip
Fan
Fin Array
Core
See Detail A
Clip
Fin Array
Clip
1.6 mm
Core
Detail A
Thermal/Mechanical Design Guide
45
ATX Reference Thermal Solution
Figure 6-8.
Critical Core Dimensions
Dia 38.68 +/- 0.30mm
Dia 36.14 +/- 0.10 mm
Gap required to avoid
core surface blemish
during clip assembly.
Recommend 0.3 mm min.
1.00 +/- 0.10 mm
Core
1.00 mm min
R 0.40 mm max
R 0.40 mm max
2.45 +/- 0.10 mm
6.6
Heatsink Mass and Center of Gravity
• Total assembly mass ≤ 550 gm (grams), excluding clip and fasteners
• Total mass including clip and fasteners < 595 g
• Assembly center of gravity ≤ 25.4 mm, measured from the top of the IHS
6.7
Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heat
sink. The reference thermal solution uses Shin-Etsu G751*. The TIM application is
0.25 g, which will be a nominal 26 mm diameter (~1.0 inches).
6.8
Absolute Processor Temperature
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the processor datasheet for details regarding use of IA32_TEMPERATURE_TARGET
register to determine the minimum absolute temperature at which the TCC will be
activated and PROCHOT# will be asserted.
§
46
Thermal/Mechanical Design Guide
Thermal Solution Quality and Reliability Requirements
7
Thermal Solution Quality and
Reliability Requirements
7.1
Reference Heatsink Thermal Verification
Each motherboard, heatsink and attach combination may vary the mechanical loading
of the component. Based on the end user environment, the user should define the
appropriate reliability test criteria and carefully evaluate the completed assembly prior
to use in high volume. The Intel reference thermal solution will be evaluated to the
boundary conditions in Table 7-1.
The test results, for a number of samples, are reported in terms of a worst-case mean
+ 3σ value for thermal characterization parameter using real processors (based on the
TTV correction offset).
7.2
Mechanical Environmental Testing
The Intel reference heatsinks will be tested in an assembled condition, along with the
LGA1366. Details of the Environmental Requirements, and associated stress tests, can
be found in Table 7-1are based on speculative use condition assumptions, and are
provided as examples only.
Table 7-1.
Use Conditions (Board Level)
Test (1)
Requirement
Pass/Fail Criteria (2)
Mechanical Shock
3 drops each for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops)
Profile: 50 g, Trapezoidal waveform,
4.3 m/s [170 in/s] minimum velocity change
Visual Check and Electrical
Functional Test
Random Vibration
Duration: 10 min./axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual Check and Electrical
Functional Test
Notes:
1.
It is recommended that the above tests be performed on a sample size of at least ten assemblies from
multiple lots of material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
7.2.1
Recommended Test Sequence
Each test sequence should start with components (i.e., baseboard, heatsink assembly,
etc.) that have not been previously submitted to any reliability testing.
Prior to the mechanical shock & vibration test, the units under test should be
preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation
during burn-in stage.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
Thermal/Mechanical Design Guide
47
Thermal Solution Quality and Reliability Requirements
7.2.2
Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
7.2.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors. Intel PC
Diags is an example of software that can be utilized for this test.
7.3
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials, such as PVC formulations, certain
polyurethane compositions (e.g., polyester and some polyethers), plastics which
contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.
Material used shall not have deformation or degradation in a temperature life test.
Any plastic component exceeding 25 grams should be recyclable per the European Blue
Angel recycling standards.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either
(1) below all applicable substance thresholds as proposed by the EU or (2) an
approved/pending exemption applies.
Note:
RoHS implementation details are not fully defined and may change.
§
48
Thermal/Mechanical Design Guide
Component Suppliers
A
Component Suppliers
Note:
The part numbers listed below identifies the reference components. End-users are
responsible for the verification of the Intel enabled component offerings with the
supplier. These vendors and devices are listed by Intel as a convenience to Intel's
general customer base, but Intel does not make any representations or warranties
whatsoever regarding quality, reliability, functionality, or compatibility of these devices.
Customers are responsible for thermal, mechanical, and environmental validation of
these solutions. This list and/or these devices may be subject to change without notice.
Table A-1.
Reference Heatsink Enabled Components
Item
Delta
Nidec
ITW
D95135-005
Z1ML005001 N/A
N/A
N/A
Heatsink Assembly
(DBX-A)
E31964-001
N/A
E31964-001
N/A
N/A
Heatsink Assembly
(DBA-A)
E29477-002
N/A
E29477-002
E29477-002 N/A
Clip
D94152-002
A208000308 N/A
N/A
N/A
N/A
Base: C33389
Cap: C33390
N/A
N/A
Base: C33389
Cap: C33390
LGA1366 Socket and ILM Components
Item
Table A-3.
AVC
Heatsink Assembly
(RCBF5)
(Core, Fan,
Extrusion, TIM)
Fastener
Table A-2.
Intel PN
Intel PN
Foxconn
Tyco
ILM
D92428-002
PT44L12-4101
1939738-1
Back Plate
D92430-001
PT44P11-4101
1939739-1
LGA1366
D86205-002
PE136627-4371-01F
1939737-1
Supplier Contact Information
Supplier
AVC
(Asia Vital
Corporation)
Contact
Phone
Email
David Chao
+886-2-2299-6930 ext. 7619
david_chao@avc.com.tw
Rachel Hsu
+886-2-2299-6930 ext. 7630
raichel_hsi@avc.com.tw
ITW Fastex
Roger Knell
773-307-9035
rknell@itwfastex.com
Foxconn
Julia Jiang
408-919-6178
juliaj@foxconn.com
Tyco
Billy Hsieh
+81 44 844 8292
billy.hsieh@tycoelectronics.com
The enabled components may not be currently available from all suppliers. Contact the
supplier directly to verify time of component availability.
§
Thermal/Mechanical Design Guide
49
Component Suppliers
50
Thermal/Mechanical Design Guide
Mechanical Drawings
B
Mechanical Drawings
Table B-1 lists the mechanical drawings included in this appendix.
Table B-1.
Mechanical Drawing List
Drawing Description
“Socket / Heatsink / ILM Keepout Zone Primary Side (Top)”
Figure Number
Figure B-1
“Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)”
Figure B-2
“Socket / Processor / ILM Keepout Zone Primary Side (Top)”
Figure B-3
“Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)”
Figure B-4
“Reference Design Heatsink Assembly (1 of 2)”
Figure B-5
“Reference Design Heatsink Assembly (2 of 2)”
Figure B-6
“Reference Fastener Sheet 1 of 4”
Figure B-7
“Reference Fastener Sheet 2 of 4”
Figure B-8
“Reference Fastener Sheet 3 of 4”
Figure B-9
“Reference Fastener Sheet 4 of 4”
Figure B-10
“Reference Clip - Sheet 1 of 2”
Figure B-11
“Reference Clip - Sheet 2 of 2”
Figure B-12
Thermal/Mechanical Design Guide
51
A
B
C
D
E
F
6
5
4
3
2
52.00
48.70
2X 43.51
32.50
35.80
40.00
28.51
7.15
2 0.00
7.15
30.60
29.64
32.28
35.62
37.00
19.51
18.23
38.92
40.77
42.72
52.00
2X 49.55
2X 43.51
2X 41.06
40.21
38.92
2
0.00
(
104.00 )
2X 49.55
52.00
38.92
5.40
10.50
9.40
8
7
6
5
4
3
2
7 . COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW.
6 NON-GROUNDED COPPER SURFACE ADDED TO INCREASE PCB DURABILITY.
ILM BOUNDARY 5
PACKAGE BOUNDARY
LEVER UNHOOKED POSITION
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.
3. BOARD COMPONENT KEEP-INS AND MECHANICAL COMPONENT KEEP-OUTS
TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES,
ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS.
4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.
5 REFER TO INTEL PART DRAWING D82246 FOR ILM AND SOCKET KEEPIN VOLUME DIMENSIONS.
(80.00 )
(36.00 )
40.00
38.92
32.28
29.64
28.51
28.00
43.51
2X 41.06
2X 40.77
2X 49.55
(80.00 )
19.51
(104.00 )
9.40
BOARD PRIMARY SIDE
30.60
21.51
G
7
32.28
H
8
29.64
27.31
52
38.20
2X 41.06
2X 43.51
45.50
6.00 NO ROUTE
1
2X 49.55
30.00
37.01
40.00
2X 41.06
26.00
29.71
18.00
4X
6.00 NO ROUTE
( 5.95 +0.05 -0.03 COPPER
SURFACE ON PAD) 5 6
+0.05
3.80
NPTH
-0.03
LOCATION 0.1 RADIAL TRUE POSITION
RELATIVE TO SOCKET CENTER.
4X
18.00
29.71
40.00
2X 43.51
2X 42.72
4X
TOP
PART NUMBER
02
-
THIRD ANGLE PROJECTION
04
DWG. NO
REVISION HISTORY
LEGEND
INCREASED 1.8MM ZONE TO 1.97.
ADDED NOTE 7
ADDED SECONDARY SIDE 2.54 MM MAX
COMPONENT HEIGHT ZONE
02/23/09
02/5/09
11/20/08
ADDED CLEARANCE FOR
FASTNERS CAPS IN 27MM ZONE
SHT.
04/23/08
DATE
D82245
PRODUCTION RELEASE (NPI REV J)
DESCRIPTION
DATE
FINISH
N.A.
APPROVED BY
D.CARTER
MATERIAL
N.A.
T.BYQUIST
P.BORNEMANN -
DATE
11/09/06
DATE
08/25/06
DATE
PARTS LIST
7
7
7
R
-
-
04
T. BYQUIST
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE
D82245
DO NOT SCALE DRAWING SHEET 1 OF
DRAWING NUMBER
SCALE: NONE
A1
2
REV
04
LGA 1366 SOCKET B ATX KEEP-INS
TITLE
DEPARTMENT
DESCRIPTION
26 MM MAX COMPONENT HEIGHT
27 MM MAX COMPONENT HEIGHT
BOARD ROUTING KEEP-OUT
7
7
1.2 MM MAX COMPONENT HEIGHT
1.97 MM MAX COMPONENT HEIGHT
7
2.5 MM MAX COMPONENT HEIGHT
10.10 MM MAX COMPONENT HEIGHT
REV
APPROVED
1
cMTE090601-03
SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS
D4
PG2
03
A8
01
-
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
S.LOFLAND
IN ACCORDANCE WITH ASME Y14.5M-1994
DRAWN BY
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
S.LOFLAND
DIMENSIONS ±0.3
CHECKED BY
ANGLES ±0.5
QTY ITEM NO
SOCKETB_ATX_MB_KEEPIN
(104.00 )
(80.00 )
+0.05
4X
4.03
NPTH
-0.03
LOCATION 0.1 RADIAL TRUE POSITION
RELATIVE TO SOCKET CENTER.
REV
ZONE
A
B
C
D
E
F
G
H
Figure B-1.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
Mechanical Drawings
Socket / Heatsink / ILM Keepout Zone Primary Side (Top)
Thermal/Mechanical Design Guide
A
B
C
D
E
F
G
7
6
5
4
(36.00 )
8
2
(80.00 )
R2.00 4X
(30.60 )
LEGEND
6
5
2.54 MM MAX COMPONENT HEIGHT
ROUTING AND COMPONENT KEEP-OUT
COMPONENT KEEP-OUT
7
23.50
0.00
23.50
36.10
3
4
(19.00 )
(72.20 )
3
(30.60 )
BOARD SECONDARY SIDE
0.00
Thermal/Mechanical Design Guide
2
H
8
2
2
36.10
1
(47.00 )
6.00
4X
(14.00 )
10.00
4X
SOCKET& PROCESSOR
VOLUMETRIC KEEP-IN
INTEL PN D82246
(80.00 )
DEPARTMENT
SOCKET& PROCESSOR
VOLUMETRIC KEEP-IN OUTLINE
COMPONENT VOLUMETRIC
KEEPINS
ROUTING KEEP-OUTS
R
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE
D82245
D82245
SHT.
2
2
DO NOT SCALE DRAWING SHEET 2 OF
DRAWING NUMBER
SCALE: 1.000
A1
DWG. NO
REV
04
04
REV
A
B
C
D
E
F
G
H
Figure B-2.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
Mechanical Drawings
Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)
53
Mechanical Drawings
Figure B-3.
54
Socket / Processor / ILM Keepout Zone Primary Side (Top)
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-4.
Socket / Processor / ILM Keepout Zone Secondary Side (Bottom)
Thermal/Mechanical Design Guide
55
Mechanical Drawings
Figure B-5.
56
Reference Design Heatsink Assembly (1 of 2)
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-6.
Reference Design Heatsink Assembly (2 of 2)
Thermal/Mechanical Design Guide
57
Mechanical Drawings
Figure B-7.
58
Reference Fastener Sheet 1 of 4
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-8.
Reference Fastener Sheet 2 of 4
Thermal/Mechanical Design Guide
59
Mechanical Drawings
Figure B-9.
60
Reference Fastener Sheet 3 of 4
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-10. Reference Fastener Sheet 4 of 4
Thermal/Mechanical Design Guide
61
62
A
B
C
D
E
F
G
H
8
7
6
5
4
3
2
7
8
SEE DETAIL
105.94
[ 4.171 ]
A
C
7
6
B
SEE DETAIL
5
45.19
[ 1.779 ]
PERMANENTLY MARK PART
NUMBER AND REVISION LEVEL
APPROXIMATELY WHERE SHOWN
XXXXXX-XXX REV XX
105.94
[ 4.171 ]
B
7
4
SECTION A-A
D
D
3
7
A B
5
2
A
0.5 [.019]
SQ 53.5
0.2
[ 2.11 .00 ]
36.44 0.2
[ 1.435 .007 ]
0.5 [.019]
4X 10 0.2
[ .394 .007 ]
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
1
2 0.2
[ .079
A B
7
3.34 0.2
[ .132 .007 ]
.007 ]
A
SEE DETAIL
A
DWG. NO
REVISION HISTORY
DESCRIPTION
01 PRODUCTION RELEASE
REV
3/27/08
DATE
D94152
PART NUMBER
D94152-002
THIRD ANGLE PROJECTION
03/16/07
03/16/07
DATE
03/19/07
FINISH
SEE NOTES
C. KOEPSELL
K.KOZYRA
APPROVED BY
P.JOHNSON
MATERIAL
SEE NOTES
DATE
03/15/07
DATE
03/15/07
DATE
PARTS LIST
CLIP, STEEL, STAMPED
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
M. BRAZEL
IN ACCORDANCE WITH ASME Y14.5M-1994
DRAWN BY
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
M. BRAZEL
DIMENSIONS ±0.1
CHECKED BY
ANGLES ±0.5
QTY ITEM NO
TOP
A1
CORP.
R
REV
01
C KOEPSELL
APPROVED
1
D94152
DO NOT SCALE DRAWING SHEET 1 OF
2
REV
01
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SHT.
RCBF5 HS CLIP, 35mm core
DRAWING NUMBER
SCALE: NONE
SIZE
TITLE
DEPARTMENT
DESCRIPTION
8 COINING REQUIRED AS SPECIFIED
9. SECONDARY UNIT TOLERANCES SHOULD BE CALCULATED FROM PRIMARY
UNITS TO AVOID ROUND OFF ERROR.
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D
DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE
APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS
INDICATED OTHERWISE.
2. MATERIAL:
A) TYPE: AISI 1065 COLD DRAWN STEEL OR EQUIVALENT
1.6MM THICKNESS
.02 [.063"]
B) CRITICAL MECHANICAL MATERIAL PROPERTIES
FOR EQUIVALENT MATERIAL SELECTION:
ELASTIC MODULUS > 206.8 GPA [29,900 KSI]
MIN TENSILE YIELD STRENGTH (ASTM D638) > 385 MPa [71KSI]
C) MASS - 38.6 GRAMS (REF)
3. SECONDARY OPERATIONS:
A) FINISH: NICKEL PLATE REQUIRED AFTER FORMING
4. ALL DIMENSIONS AND TOLERANCES ARE SHOWN AFTER PLATING
5 PUNCH DIRECTION
6. BREAK ALL SHARP CORNERS AND BURRS
7 CRITICAL TO FUNCTION DIMENSION
NOTES:
REMOVE ALL BURRS OR SHARP EDGES AROUND
PERIMETER OF PART. SHARPNESS OF THE EDGES SUBJECT
TO HANDLING ARE REQUIRED TO MEET THE UL1439 TEST.
-
ZONE
A
B
C
D
E
F
G
H
Mechanical Drawings
Figure B-11. Reference Clip - Sheet 1 of 2
Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide
A
B
C
D
8
7
6
8
5.3
[ .209 ]
2X R0.3
MIN
[ .012 ]
7
W
A B
0.2 [.007]
BOUNDARY 7
A B
0.1 [.003]
2X R3.6
[ .142 ]
R0.3
MIN TYP
[ .012 ]
1.06
[ .042 ]
1.65
[ .0650 ]
6
R5.66
[ .223 ]
THIS POINT CORRESPONDS TO THE 45.19
DIMENSION ON SHEET 1 ZONE B7
DETAIL A
SCALE 10
TYPICAL 4 PLACES
7.45
[ .293 ]
7.312
[ .2879 ]
135
W
5
5
140
X
3.5
[ .138 ]
4
A
3
A
3
TMD
DEPARTMENT
***
SECTION D-D
SCALE 8
DETAIL B
SCALE 20
A B
A B
0.4 [.015]
X 4X
4
R0.45
MIN
[ .018 ]
0.5 [.019]
R4.63
[ .182 ]
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SHT.
2
8
REV
01
2
D
SCALE: 1
X
SIZE CAGE CODE
D94152
1
1
DO NOT SCALE DRAWINGSHEET 2 OF 2
DRAWING NUMBER
DETAIL C
SCALE 10
TYPICAL 4 PLACES
0.05
D94152
45 X 0.25
[ .0098 ]
DWG. NO
01
REV
A
B
C
D
Mechanical Drawings
Figure B-12. Reference Clip - Sheet 2 of 2
§
63
Mechanical Drawings
64
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
C
Socket Mechanical Drawings
Table C-1 lists the mechanical drawings included in this appendix.
Table C-1.
Mechanical Drawing List
Drawing Description
Figure Number
“Socket Mechanical Drawing (Sheet 1 of 4)”
Figure C-1
“Socket Mechanical Drawing (Sheet 2 of 4)”
Figure C-2
“Socket Mechanical Drawing (Sheet 3 of 4)”
Figure C-3
“Socket Mechanical Drawing (Sheet 4 of 4)”
Figure C-4
Thermal/Mechanical Design Guide
65
Socket Mechanical Drawings
Figure C-1.
66
Socket Mechanical Drawing (Sheet 1 of 4)
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
Figure C-2.
Socket Mechanical Drawing (Sheet 2 of 4)
Thermal/Mechanical Design Guide
67
Socket Mechanical Drawings
Figure C-3.
68
Socket Mechanical Drawing (Sheet 3 of 4)
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
Figure C-4.
Socket Mechanical Drawing (Sheet 4 of 4)
§
Thermal/Mechanical Design Guide
69
Socket Mechanical Drawings
70
Thermal/Mechanical Design Guide
Processor Installation Tool
D
Processor Installation Tool
The following optional tool is designed to provide mechanical assistance during
processor installation and removal.
Contact the supplier for availability:
Billy Hsieh
billy.hsieh@tycoelectronics.com
+81 44 844 8292
Thermal/Mechanical Design Guide
71
Processor Installation Tool
Figure D-1. Processor Installation Tool
§
72
Thermal/Mechanical Design Guide
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