Environmental Requirements. Intel Xeon 3500 Series

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Table 4-4.

Electrical Requirements for LGA1366 Socket

Parameter

Mated loop inductance, Loop

Value

Mated partial mutual inductance, L

Maximum mutual capacitance, C.

Socket Average Contact Resistance

(EOL)

Max Individual Contact Resistance

(EOL)

Bulk Resistance Increase

Dielectric Withstand Voltage

Insulation Resistance

≤

<3.9nH

NA

<1 pF

15.2 mΩ

≤

100 mΩ

3 mΩ

360 Volts RMS

800 MΩ

Comment

The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket.

The inductance on a contact due to any single neighboring contact.

The capacitance between two contacts

The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing, with a chain contact resistance defined as the resistance of each chain minus resistance of shorting bars divided by number of lands in the daisy chain.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land.

The specification listed is at room temperature and has to be satisfied at all time.

Socket Contact Resistance: The resistance of the socket contact, solderball, and interface resistance to the interposer land; gaps included.

The bulk resistance increase per contact from

24 °C to 107 °C

4.6

Environmental Requirements

Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points.

The reliability targets in this chapter are based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor

dependent. A simplified process flow of this methodology can be seen in Figure 4-1

.

Thermal/Mechanical Design Guide 25

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

Figure 4-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology

Establish the market/expected use environment for the technology

Develop Speculative stress conditions based on historical data, content experts, and literature search

Freeze stressing requirements and perform additional data turns

Perform stressing to validate accelerated stressing assumptions and determine acceleration factors

A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.

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26 Thermal/Mechanical Design Guide