Loading Specifications. Intel Xeon 3500 Series

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

4.4

Loading Specifications

The socket will be tested against the conditions listed in Chapter 7 with heatsink and

the ILM attached, under the loading conditions outlined in this chapter.

Table 4-3

provides load specifications for the LGA1366 socket with the ILM installed.

The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Exceeding these limits during test may result in component failure. The socket body should not be used as a mechanical reference or load-bearing surface for thermal solutions.

Table 4-3.

Socket and ILM Mechanical Specifications

Parameter

Static compressive load from ILM cover to processor IHS

Heatsink Static Compressive Load

Total Static Compressive Load

(ILM plus Heatsink)

Dynamic Compressive Load

(with heatsink installed)

Pick and Place Cover Insertion / Removal force

Load Lever actuation force

Min

470 N [106 lbf]

0 N [0 lbf]

470 N (106 lbf)

N/A

N/A

N/A

Max

623 N [140 lbf]

266 N [60 lbf]

890 N (200 lbf)

890 N [200 lbf]

Notes

3

,

4 , 7

1

,

2 , 3

3

,

4

1

,

3 , 5 , 6

10.2 N [2.3 lbf]

38.3 N [8.6 lbf] in the vertical direction

10.2 N [2.3 lbf] in the lateral direction.

Notes:

1.

These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

2.

This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits.

3.

Loading limits are for the LGA1366 socket.

4.

This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts.

5.

Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.

6.

Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass.

The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this dynamic load.

7.

Conditions must be satisfied at the beginning of life and the loading system stiffness for non-reference designs need to meet a specific stiffness range to satisfy end of life loading requirements.

4.5

Electrical Requirements

LGA1366 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated.

24 Thermal/Mechanical Design Guide