LG KG370 Service Manual

Date: October, 2007 / Issue 1.0

Service Manual

MG370/KG370

Internal Use Only

Editor Date

REVISED HISTORY

Issue Contents of Changes S/W Version

The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.

This manual provides the information necessary to install, program, operate and maintain the MG370.

Copyright © 2007 LG Electronics. Inc. All right reserved.

Only for training and service purposes

- 1 LGE Internal Use Only

LGE Internal Use Only - 2 Copyright © 2007 LG Electronics. Inc. All right reserved.


Table Of Contents

Table Of Contents

1. INTRODUCTION ...............................5

1.1 Purpose .................................................. 5

1.2 Regulatory Information............................ 5

1.3 ABBREVIATION ......................................7

2. PERFORMANCE...............................9

2.1 Product Name ..........................................9

2.2 Supporting Standard ................................9

2.3 Main Parts: GSM Solution........................9

2.4 H/W Features.........................................10

3. TECHNICAL BRIEF ........................14

3.1 Digital Main Processor(PMB7880).........14

3.2 Power Amplifier Module (SKY77318) ....22

3.3 26 MHz Clock (DCXO)...........................24

3.4 RTC(32.768KHz Crystal) .......................25

3.5 LCD Interface(3-wire SPI interface) .......26

3.6 SIM Card Interface.................................28

3.7 KEYPAD Interface .................................29

3.8 Battery Charging Block Interface ...........30

3.9 RF Interface ...........................................31

3.10 Audio Interface.....................................33

3.11 Key LED Interface................................37

3.12 Vibrator Interface .................................38

3.13 Memory Interface .................................39

3.14 Power Block Interface ..........................40

3.15 MG370a, MG370b,KG370,KG375

Function difference ..............................42

3.16 BOM difference ....................................43

4. TROUBLE SHOOTING ...................44

4.1 Trouble Test Set-up ...............................44

4.2 Power On Trouble..................................45

4.3 Charging Trouble ...................................47

4.4 Vibrator Trouble .....................................49

4.5 SIM Card Trouble...................................51

4.6 KEY backlight Trouble ...........................53

4.7 RTC Trouble ..........................................54

4.8 LCD Trouble...........................................55

4.9 Speaker Trouble ....................................57

4.10 Receiver Trouble..................................59

4.11 Headphone Trouble .............................60

4.12 Microphone Trouble .............................62

4.13 RF Components...................................63

4.14 RX Receiver Part .................................64

4.14 RX Receiver Part .................................66

4.15 TX Transmitter Part..............................67

5. DOWNLOAD.......................................71

5.1 Download Setup.....................................71

5.2 Download Process .................................72

6. BLOCK DIAGRAM ..........................77

7. CIRCUIT DIAGRAM ........................79

8. BGA IC Pin Check .............................83

9. PCB LAYOUT ..................................85

10. Calibration ....................................87

10.1 Calibration Steps..................................87

11. Stand-alone Test ..........................92

11.1 Test Program Setting ...........................92

11.2 Tx Test .................................................94

11.3 Rx Test.................................................95

12. EXPLODED VIEW &

REPLACEMENT PART LIST ....... 97

12.1 Exploded View .................................... 97

12.2 Replacement Parts ..............................99

12.3 Accessory ......................................... 111






1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the MG370

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG370 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the MG370 must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.




1. INTRODUCTION

E. Notice of Radiated Emissions

The MG370 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

An MG370 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.



2. PERFORMANCE

LCD

LDO

LED

OPLL

PAM

PCB

PGA

FPCB

GMSK

GPIB

GSM

IPUI

1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB MG370

BER

CC-CV

Bit Error Ratio

Constant Current - Constant Voltage

DAC

DCS dBm

DSP

Digital to Analog Converter

Digital Communication System dB relative to 1 milliwatt

Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

Flexible Printed Circuit Board

Gaussian Minimum Shift Keying

General Purpose Interface Bus

Global System for Mobile Communications

International Portable User Identity

Liquid Crystal Display

Low Drop Output

Light Emitting Diode

Offset Phase Locked Loop

Power Amplifier Module

Printed Circuit Board

Programmable Gain Amplifier




2. PERFORMANCE

PLL

PSTN

RLR

RMS

FEM

SIM

SLR

SRAM

STMR

TDD

TDMA

UART

VCO

VCTCXO

WAP

Phase Locked Loop

Public Switched Telephone Network

Receiving Loudness Rating

Root Mean Square

Front End Module

Subscriber Identity Module

Sending Loudness Rating

Static Random Access Memory

Side Tone Masking Rating

Time Division Duplex

Time Division Multiple Access

Universal Asynchronous Receiver/Transmitter

Voltage Controlled Oscillator

Voltage Control Temperature Compensated Crystal Oscillator

Wireless Application Protocol



2. PERFORMANCE

2. PERFORMANCE

2.1 Product Name

MG370 : Support GSM

2.2 Supporting Standard

Item

Supporting Standard

Frequency Range

Application Standard

Feature

GSM850/PCS1900

Dual-Band (850/1900) with seamless handover

Phase 2+(include AMR)

SIM Toolkit : Class 1,2,3

GSM850 TX : 824 - 849 MHz

GSM850 RX : 869 - 894 MHz

PCS1900 TX : 1850 - 1910 MHz

PCS1900 RX : 1930 - 1990 MHz

SMS : Yes

2.3 Main Parts: GSM Solution

Item Part Name

Digital Baseband

RF Chip

EGOLD voice (PMB7880)

SKY77318

Comment

Comment




2. PERFORMANCE

2.4 H/W Features

Item

Form Factor

Battery

Size

Weight

PCB

AVG TCVR current (mA)

Standby Current

Standby time

Charging time

Talk time

RX sensitivity

TX output power

SIM card type

Display

Keypad

Feature

Clam shell type

Capacity

Standard : Li-Ion, 750mAh(Min)

Packing Type: Soft Pack

Standard: 85.0 x 45.0 x 19.8 mm

68g

One PCB : 6Layers, 0.8t

Max : 250 mA (GSM, Power Level 5)

Max : 120 mA (GSM, Power Level 19)

3 mA

Up to 250 hours

Below 3 hours

Min : 2.5hr@Power Level 5(GSM850)

Min : 2.5hr@Power Level 0(PCS)

GSM 850 : -108 dBm

PCS : -106 dBm

GSM 850 : 33 dBm

PCS : 30 dBm

Plug-In SIM 3V

MAIN LCD : 65K Color CSTN (128 X128)

Backlight : White LED

Alphanumeric Key : 12

Function Key :10

Total Number of Keys : 22

Comment

LCD : 65K CSTN, 128 x128

Cell Size: Standard

4.9(L)x34.2(W)x46.6(H)mm

LxWxH

With Battery

@ Paging Period 6

@ Paging Period 6

@ Power Off /1000mAh

@ 750 mAh

Condition: conducted

Class4 (GSM850)

Class1 (PCS)

Function Key:

4 Key Navigation with Confirm key,

F1, F2, SND, END/PWR, Clear



2. PERFORMANCE

Item

Antenna

System connector

Ear Phone Jack

PC synchronization

Memory

Speech coding

Data & Fax

Feature

Built in antenna Type

18 Pin

18 Pin

Yes

Flash : 64Mbit / UtRAM : 32Mbit

FR, EFR, HR, AMR

No

Vibrator Built in Vibrator

MIDI (for Buzzer Function) 16 Poly (ADPCM real music tone )

Voice Recording

Travel Adapter

Yes

Yes

Ear-Microphone

Options Cigarette Lighter Adapter

Data Cable

Dual-band

Comment

Data cable (option)

SEC (Samsung)

MG370a, MG370b,KG370,KG375 Function difference

RF Band

Design Market

Without

FM Radio

With

FM Radio

Europe

KG375

GSM900/ DCS1800

Asia / CIS

-

Latin

America

-

KG370 MG370b

GSM850/

PCS1900

Latin

America

-

MG370a




2. PERFORMANCE

Item

RSSI 0~6 level

Battery Charging 0~4 level

Key Volume 0~5 level

Effect sound volume 0~5 level

Audio Volume

Time/Date Display

0~5 level

Yes

Multi-language Yes

Quick Access Mode Yes

PC Sync

Speed Dial

Speaker Phone

CLIP/CLIR

Phonebook

Yes

Yes

Yes

Yes

Yes

Last Dial Number

Last Received

Number

Yes

Yes

Last Missed Number Yes (10)

Search Number/Name Name only

Group No

Fixed Dial Number Yes

Service Dial Number Yes

Own Number

Voice Memo

Yes

Yes

Call Remainder Yes

Network Selection No

Feature

LGE Internal Use Only - 12 -

English /Spanish /Portuguese

Profiles / Phonebook

Calendar / Message

8EA

Total 300 members

10EA

10EA

10EA

30sec

Comment



2. PERFORMANCE

Item

Call Divert

Call Barring

Call Charge (AoC)

Call Duration

SMS

EMS melody/Picture

Send/ Receive/ Save

SMS Over GPRS

E-Mail

Long Message

Cell Broadcast

Download Melody /

Wallpaper

Game

Calendar

Memo Pad

World Clock

Unit Convert

Fax & Data

Wall Paper

WAP Browser

Download

SIM Lock

SIM Toolkit

MMS

AMR

CPHS

Hold / Retrieve

Conference Call

DTMF

Yes

Yes

Yes

Yes

100

No

No

No

Yes

Yes

Yes

Yes

Yes

Yes

Yes

Yes

No

Yes

No

No

Yes

Class 1, 2, 3

No

Yes

Yes

Yes

Yes

Yes

Feature



- 13 -

Comment

Max. 459 Characters

Default 3EA

Operator Dependent

Max. 6

LGE Internal Use Only

3. TECHNICAL BRIEF


3.1 Digital Main Processor(PMB7880)


Figure. 3-1 PMB7880 FUNCTIONAL BLOCK DIAGRAM

- 14 Copyright © 2007 LG Electronics. Inc. All right reserved.



3.1.1 Overview of E-GOLDvoice

The E-GOLD voice is a GSM base band modem including RF transceiver covering the low bands

GSM850 /GSM900 and high bands GSM1800 / GSM1900 bands. E-GOLD voice is Dual Band, therefore, it supports by default a low / high pair of bands at the same time:

1. GSM850 / GSM1800

2. GSM850 / GSM1900

3. GSM900 / GSM1800

4. GSM900 / GSM1900

The E-GOLD voice is optimized for voice-centric Mobile Phone applications.

The E-GOLD voice is designed as a single chip solution that integrates the digital, mixed-signal, RF functionality and a direct-to-battery Power Management Unit.

The transceiver consists of:

• Constant gain direct conversion receiver with an analog I/Q base band interface

• Fully integrated Sigma/Delta-synthesizer capability

• Fully integrated two-band RF oscillator

• Two-band digital GMSK modulator with digital TX interface

• Digitally controlled crystal oscillator generating system clocks.

The E-GOLD voice supports a direct battery connection, hence eliminating the need for an external

Power Management Unit. The E-GOLD voice has different power down modes and an integrated power up sequencer.

The E-GOLD voice is powered by the C166®S MCU and TEAKLite® DSP cores. The operating temperature range from -40˚C to 85˚C. It is manufactured using the 0.13 µm CMOS process.





3.1.2 Features

]

Baseband

• High performance fixed-point TEAKlite DSP

• C166S high performance microcontroller

• There are several Interfaces:

- I2S interface for DAI connections (for Tape Approval)

- High Speed SSC Interface for connection of external peripherals

- SIM Interface

- Keypad Interface (6x4 or 5x5 keys)

- EBU for external RAM/FLASH connection

- Asynchronous serial interface

- JTAG Interface

- Black & white and color displays are supported

- PWM source to drive vibrator

- Keypad and display backlight supported.

]

Receiver

• Constant gain, direct conversion receiver with fully integrated blocking filter

• Two integrated LNAs

• No need of interstage and IF filter

• Highly linear RF quadrature demodulator

• Programmable DC output level

• Very low power budget.

] Transmitter

• Digital Sigma-Delta modulator for GMSK modulation, typical -163.5 dBc/Hz@20 MHz

• Single ended outputs to PA, Pout = +3.5 dBm

• Very low power budget.

] RF-Synthesizer

• Σ∆ Synthesizer for multi-slot operation

• Fast lock-in times (< 150 µs)

• Integrated loop filter

• RF Oscillator

• Fully integrated RF VCO.

] Crystal Oscillator

• Fully digital controlled crystal oscillator core with a highly linear tuning characteristic.




] Mixed Signal and Power Management Unit

• DC/DC boost for voltages up to 15V for driving White or Blue LEDs

• 8-Ohm loud speaker driver (250/350mW)

• 16-Ohm earpiece driver

• 32-Ohm headset driver

• 4 measurement interfaces (PA temperature, battery voltage, battery temperature, and ambient temperature)

• Differential microphone input

• System start up circuitry

• Charger circuitry for NiCd, NiMh and LiIon cells

• Integrated regulators for direct connection to battery.





3.1.3 GSM System Description

The E-GOLD voice is suited for mobile stations operating in the GSM850/900/1800/1900 bands.

In the receiver path the antenna input signal is converted to the baseband, filtered, and then amplified to target level by the RF transceiver chipset.

Two A-to-D converters generate two 6.5 Mbit/s data streams. The decimation and narrowband channel filtering is done by a digital baseband filter in each path.

The DSP performs:

1. The GMSK equalization of the received baseband signal (SAIC support available)

2. Viterbi channel decoding supported by an hardware accelerator.

The recovered digital speech data is fed into the speech decoder.

The E-GOLD voice supports fullrate, halfrate, enhanced fullrate and adaptive multirate speech

CODEC algorithms. The generated voice signal passes through a digital voiceband filter. The resulting 4 Mbit/s data stream is D-to-A converted by a multi-bit-oversampling converter, postfiltered, and then amplified by a programmable gain stage. The output buffer can drive a handset ear-piece or an external audio amplifier, an additional output driver for external loud speaker is implemented.

In the transmit direction the differential microphone signal is fed into a programmable gain amplifier.

The prefiltered and A-to-D converted voice signal forms a 2 Mbit/s data stream. The oversampled voice signal passes a digital decimation filter.

The E-GOLD voice performs speech and channel encoding (including voice activity detection (VAD) and discontinuous transmission (DTX)) and digital GMSK modulation. In the RF transceiver part, the baseband signal modulates the RF carrier at the desired frequency in the 850 MHz, 900 MHz, 1.8

GHz, and 1.9 GHz bands using an I/Q modulator. The E-GOLD voice supports dual band applications.

Finally, an RF power module amplifies the RF transmit signal at the required power level. Using software, the E-GOLD voice controls the gain of the power amplifier by predefined ramping curves (16 words, 11 bits). For baseband operation, the E-GOLD voice supports:

• Making or receiving a voice call

• Sending or receiving an SMS.




3.1.4 PMU Details

The E-GOLD voice includes battery charger support (various sensor connections for temperature, battery technology, voltage, etc.) and a ringer buffer. E-GOLD voice avoids the need for an external power management component because its internal power management unit contains:

• Voltage regulators for the On-chip and Off-chip functional blocks

• Charger circuitry for NiCd, NiMh and LiIon cells.

3.1.5 Bus Concept

The E-GOLDvoice has two cores (a microcontroller and a DSP), each with its own bus.

There is an interconnection between the TEAKlite bus and the C166S X-Bus.

3.1.6 C166S Buses

The C166S is connected to three buses:

1. Local Memory (LM) bus

2. X-Bus

3. PD-Bus.

3.1.7 TEAKLite Bus

The TEAKlite is connected to the TEAKlite bus.

3.1.8 Bus Interconnections

The interconnection between the X-Bus and the TEAKlite Bus uses:

• Multicore Synchronization

• Shared Memory.

3.1.9 Clock Concept

The E-GOLD voice has a flexible clock control.

3.1.10 Interrupt Concept

The C166 MCU carries out the E-GOLD voice interrupt system.

3.1.11 Debug Concept

The E-GOLD voice includes a multi-core debug. The C166 and TEAKlite cores can be debugged in parallel with:

• A single JTAG port (that is, on a single host)

• Mutual breakpoint control.





3.1.12 C166 Debug Concept

The debugging of the C166 uses the OCDS and the Cerberus.

3.1.13 TEAKLite Debug Concept

TEAKlite debugging uses the OCEM and the SEIB.

3.1.14 Power Management

The E-GOLDvoice provides the power management unit (PMU) for the complete mobile phone application. The integrated PMU is directly connected to the battery and provides a set of linear voltage regulators (LDO’s). These LDO’s generate all required supply voltages and currents needed in a low feature mobile phone. A charger control circuit charges NiCd, NiMH and LiIon batteries.

The charger control supports hardware controlled pre-charging and software controlled charging. It offers a wide charger voltage range, making half wave/ full-wave charging with cheap transformers possible. White/blue backlight generation is supported with a special driver for very a low external parts count. Power consumption during operation phases is minimized due to flexible clock switching

In the Standby Mode most parts of the device are switched off, only a small part is running at 32kHz and the controller RAM is switched to a power saving mode. The TEAKLite ROM can be switched off during Standby via SW.

3.1.15 On-Chip Security Concept

Secure boot is based on a public/private key approach. Flash images that are not signed with the private key during phone manufacture cannot be loaded. Verification of the Flash code is done with the public key. The public key as well as hash and verify algorithms are stored in the ROM, which ensures a hardware secured boot procedure.

The following security features are supported:

• Prevention of illegal Flash programming

• Flash programming makes use of the E-GOLD voice ID for personalization checks with IMEI and

SIM-lock protection




The security features use the following mechanism:

• Boot ROM flow:

- Controls the boot transition to external flash

- Controls the flash update

• Flash tied to the individual chip via an ID using e-fuses, that is, each E-GOLD voice chip has its own fused ID.

Further details on the E-GOLD voice security concept are not publicly documented

3.1.16 Asynchronous Operation Mode Concept

The E-GOLD voice can operate in either:

• The traditional synchronous mode with the 26MHz system clock synchronized on the base station

• A special asynchronous mode (XO concept).

In the asynchronous mode the 26MHz clock input is not synchronized with the base station; the residual frequency offset is compensated in the digital signal processing domain. This processing includes frequency and timing compensation of the baseband and voiceband signals.

3.1.17 Receiver Antenna Bar Display

Antenna display

Antenna Bar Number

5->4

4->3

3->2

2->1

1->0

RX Power (dBm)

-88dBm~ -84dBm

-93dBm~ -89dBm

-98dBm~ -94dBm

-103dBm~ -99dBm

-107dBm~ -103dBm





3.2 Power Amplifier Module (SKY77318)

Figure. 3-2 SKY77318 FUNCTIONAL BLOCK DIAGRAM

The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.

The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of separate GSM PA and DCS1800/PCS1900 PA blocks, impedance-matching circuitry for 50

Ω input and output impedances and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one

Heterojunction Bipolar Transistor (HBT) PA block supports the GSM bands and the other supports the

DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current.

The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

RF input and output ports of the SKY77318 are internally matched to a 50 load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains band select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal.




In Figure 1 below, the BS pin selects the PA output (DCS/PCS_OUT or GSM_OUT) and the Analog

Power Control (VAPC) controls the level of output power.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC TM ) function, which is insensitive to variations in temperature, power supply, process, and input power.

The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.





3.3 26 MHz Clock (DCXO)

Figure. 3-3 E-Glod Voice DCXO Overview

DCXO (Digitally Controlled Crystal Oscillator) and VCTCXO (Voltage Controlled Temperature

Compensated Crystal Oscillator) are two different techniques used to maintain the mobile’s reference oscillator’s accuracy over time. The reference oscillator’s accuracy over time will vary due to initial crystal frequency offset, temperature drift and aging. These static and dynamic frequency variations have to be compensated, otherwise the mobile would be in danger of losing connection to the network.

The technique used to perform the frequency compensation is generally termed Automatic Frequency

Control (AFC). To summarize the operation of DCXO, GSM Baseband processor will calculate the

AFC compensation (which is continuously updated) required based on the measured frequency error.

Then the required AFC compensation is sent to the LUXO (Lineari-Zation Unit of Crystal Oscillator), which in turns control the DCXO core and generates the 26MHz system clock.




3.4 RTC(32.768KHz Crystal)

32.768KHz

1 2

C121

4

X101

C122

3

MC-146_12_5PF

18p 18p

Figure. 3-4 E-Gold Voice RTC Interface

The integrated Real Time Clock (RTC) is able to provide programmable alarm functions and external interrupts. Due to its extreme low power consumption the RTC can be supplied from a small backup battery. This allows the generation of external interrupts, even when the main PMB7880 supply voltage is switched off. For this purpose the RTC is powered by own voltage supply pins VDD_RTC and VSS_RTC.

The RTC shall be driven by a 32.768 kHz (32k) clock which needs to be applied via the PMB7880

F32K and OSC32K pins. The clock can be fed from either an external clock source or use the on chip

32 KHz oscillator module.

The low clock frequency and the optimized low power design give the possibility to run the chip with a minimum of power dissipation. For example, for this specific application the 26 MHz reference oscillator can be switched off during system standby and a low- power time reference can be kept when the 32k clock is provided to the RTC.

The RTC consists of an PMB7880 specific RTC shell, containing the RTC macro, as well as the 32 kHz oscillator, as described in the following sections. The module RTC Shell solely performs level translation of the 32KHz clock to the VDD_LD1 power supply domain, and is not functionally associated with the RTC.





3.5 LCD Interface(3-wire SPI interface)

D(0:7)

A(7)

_WR

_LCD_CS

LCD_RESET

6

5

4

3

2

1

INOUT_A6 INOUT_B6

8


9


10


11


12


13

FL200

ICVE31186E150R101FR

6

5

4

3

2

1

INOUT_A6

INOUT_A5

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B6

INOUT_B5

8

INOUT_B4

INOUT_B3

9

10

11

INOUT_B2

12

INOUT_B1

13

FL201

ICVE31186E150R101FR

C221

1000p

Figure 3-5-1. LCD Interface

26

25

24

23

22

21

20

30

29

28

27

19

18

17

16

CN200

7

8

5

6

9

10

11

1

2

3

4

12

13

14

15

2V85_VIO VBAT

LCD_ID

MLED2

MLED1

MLED

MOTOR_P

IND_LED_B

IND_LED_R

SPK_RCV_P

SPK_RCV_N

MLED

W_LED_EN

VBAT

C202 0.1u

R210 C217

100K 2.2u

5

U200

IN

AAT3157ITP-T1

C1+

10

8

11

4

CP

EN_SET

GND

C1-

C2+

9

7

C2-

6

D1

D2

D3

NC

1

2

3

12

C203

1u

C205

1u

MLED1

MLED2

Figure 3-5-2. Charge pump interface




Signals

_LCD_CS

D[0:7]

A(7)

LCD_RESET

MLED

MLED1/2

2V85_VIO

Description

This signal enable to access to the driver IC of LCD.

This signal transfer 8bit parallel data to driver IC.

Data / Command switch

This signal makes driver IC to HW default status.

This signal provide power to white LEDs.

The white LED current sink ports

This signal provides power to LCD modules.(2.8V)

The AAT3157 is a low noise, constant frequency charge pump DC/DC converter that uses a tri-mode load switch (1X), fractional (1.5X), and doubling (2X) conversion to maximize efficiency for white LED applications. The AAT3157 is capable of driving up to three channels of LEDs at 20mA per channel from a 2.7V to 5.5V input.

The current sinks may be operated individually or in parallel for driving higher current LEDs. A low external parts count (two 1µF flying capacitors and two small 1µF capacitors at VIN and VOUT) make this part ideally suited for small, battery-powered applications. Analogic Tech's S2Cwire TM (Simple

Serial Control TM ) serial digital input is used to enable, disable, and set current for each LED with 16 settings down to 50µA.

The low-current mode supply current can be as low as 50µA to save power.

Data

1

2

3

4

7

8

5

6

Output (mA/Ch)

20.0

17.0

14.0

12.0

10.0

8.6

7.0

6.0

Data

9

10

11

12

13

14

15

16

Figure 3-5-3. Charge pump Output Current

Output (mA/Ch)

5.0

4.2

3.4

2.8

1.0

0.5

0.1

0.05





3.6 SIM Card Interface

2V85_VSIM 2V85_VSIM

SIM_DATA

R113

4.7K

C123

22p

J100

6

10

9

4

5

GND1

VPP

IO

GND5

VCC

RST

CLK

GND2

GND4 GND3

3

7

8

1

2

C124 C125

0.1u

22p

SIM_RST

SIM_CLK

Figure 3-6. SIM CARD Interface

The E-Gold Voice provides SIM Interface Module. The AD6527 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.

Signals

SIM_RST

SIM_CLK

SIM_DATA

This signal makes SIM card to HW default status.

This signal is transferred to SIM card.

This signal is interface datum.

Description




3.7 KEYPAD Interface

KEY_IN(0:4)

KEY_OUT(0:4)

R229

680

R230

680

R227

680

R228

680

R231 680

R232 680

R233 680

R235 680

R236 680

R237 680

200

203

206

STAR

201

204

207

209

202

205

208

SHARP

OK

LEFT

UP

RIGHT

MENU

SEL

SEND

DOWN CLEAR

PWRON

R234

1K

C242

100p

END

2V0_VRTC

Figure 3-7 KEY MAXTRIX Interface

The keypad interface is connected to the X-Bus, together with the XBIU and the shared Memory

Register, using a single Bus Interface.

The keypad supports two scan modes:

• By default, the keypad is a 5x5 scan matrix 5 input and 5 output pins).

• To set the keypad to a 5x5 scan matrix (5 input and 5 output pins)

The scan mode should be determined at the very beginning of the system start because changes are not allowed later.





3.8 Battery Charging Block Interface

CHG_DT

_EOC

2V85_VIO VCHG

R220

1.8K

R218

10K

R222

100K

R223

C233

NA

1 uF

U201

1

VIN

2

_PPR

3

_CHG

4

9

_EN

PGND

ISL6294

BAT

8

IREF

7

IMIN

6

GND

5

VBAT

R224 R225

C234

240K 30K 0.1u

Figure 3-8. Charging IC Interface

The ISL6294 is a high performance battery charger designed to charge single cell lithiumion/polymer batteries with up to 400mA of current from an external power source.

It is a stand-alone charging solution, with just one external component required for complete functionality. The ISL6294 precisely regulates battery charge voltage and current for 4.2V lithiumion/polymer battery cells.

The ISL6294 has four basic modes for the battery charge cycle: pre-conditioning/trickle charge; constant current/fast charge; constant voltage; and end of charge.




3.9 RF Interface

VC1

VC2

C423

27p

C424

27p

FL401

9

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

5

8

10

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4

LMSP2PAA-575TEMP

MODE

850/900 TX

1800/1900 TX

850/900/1800/1900 RX

VC1

H

L

L

VC2

L

H

L

Figure 3-9-1. ASM interface

1

FL400 B9310

I1

O1_1

9

O1_2

O2_1

8

7

4

I2

2 3 5 10

O2_2

6

(B9308 for 900 Band)

C419

3p

C421

3p

C422

3p

C425

3p

Figure 3-9-2. SAW Filter interface

L404

5.1nH

L405

18nH

DCS_PCS_RXP

DCS_PCS_RXN

GSM_RXP

GSM_RXN

E-GOLD voice features a fully integrated constant-gain direct conversion receiver, i.e. there is no interstage filter needed and the baseband level at the analogue IQ- interface follows directly the RF input level. Depending on the baseband ADC dynamic range, single- or multiple-step gain switching schemes are possible.

An integrated, selfaligning, low-pass filter ensures the receivers to function under blocking and reference interference conditions and avoids aliasing by baseband sampling. An automatic DC-offset compensation is implemented and can beswitched depending on the gain setting.





C400

10u

(2012 size)

C401

12p

C402

0.01u

C403

33p

C404

18p

C405

27p

C406

0.01u

TX_RAMP

C411

NA

L401

1.5nH

C412

1.8p

R403

1K

C408

39p

15

DCS_PCS_OUT

11

EGSM_OUT

U400

SKY77318

DCS_PCS_IN

3

EGSM_IN

4

19

RSVD_GND

21

P_GND

ENABLE

18

BS

1

C417

NA

L402

2.7nH

C418

2.2p

C414

27p

C415

27p

TXON_PA

BAND_SEL

3

4

5

1

2

8

9

6

7

SC400

Shield CAN

R404

NA

C409

100p

R405

NA

R406

NA

C416

100p

R407

NA

10

11

12

13

14

15

16

17

18

19

DCS_PCS_OUT

GSM_OUT

Figure 3-9-3. PAM (Power Amplifier Module) interface

The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design with a reduced external component count.

The modulation is transferred between baseband- and RF-part of the PMB7880 via a digital interface signal into the digital modulator. The following Gaussian filter shapes the digital data stream for the

GMSK modulation. Additionally a pre-distortion filter compensates the attenuation of the PLL transfer function resulting in a very low distortion at the transmit output. The filtered digital data stream is scaled appropriately and added to the channel word.

This sum is fed into the MASH modulator. The output of the MASH modulator is a sequence of integer divider values representing the high resolution fractional input signal. This sequence controls the MMD

(multi modulus divider) at a sample rate of 26MHz. Thus a tightly controlled frequency modulation of the VCO is achieved.




3.10 Audio Interface

PAOUT1

P13

LOUD2

LOUD1

K14

L15

VMIC

MICP2

MICN2

MICP1

MICN1

EPPA1

EPP1

EPN1

P12

P11

R12

P15

R13

M14

M12

N15

TX_RAMP

SPK-

SPK+

HS_MIC_P

HS_MIC_N

MIC_P

MIC_N

HS_OUT

RCV_P

RCV_N

VMIC

C114

1000p

Figure 3-10-1 Audio interface

The audio front-end of E-GOLD voice offers the digital and analog circuit blocks for both receive and transmit audio operation and ringing. It features a high-quality, digital-to-analog path with amplifying stages for connecting acoustic transducers to the E-GOLD voice. In the transmit direction the supply voltage generation for microphones, low-noise amplifier and analog to digital conversion are integrated on the E-GOLD voice.

For E-GOLD voice the EPp1/EPn1 driver are used as differential Earpiece-Driver, EPPa1 is used as single-ended Headset-Driver.

The audio front-end itself can be considered to be organized in three sub-blocks:

• Interface to processor cores (TEAKlite and - indirectly - C166S)

• Digital filters

• Analog part.





The interface to the processor cores consists of a direct physical connection to the TEAKlite DSP bus and a set of firmware commands to handle communication between the C166S and the audio frontend which serves as the interface peripheral for audio algorithms running on the DSP or the controller.

The audio front-end generates interrupts on certain occasions, for example, when exchange of data is requested. The core interface part of the audio front-end also contains the control and status registers which are used to set up certain operation modes of the peripheral.

The section next to the core interface contains the digital filters for interpolation and decimation of the audio signals being received and transmitted. The data path for the receive direction can be set up to process sampling rates between 8kHz and 48kHz.

The interpolation filters for the respective sampling rates are implemented in a dedicated hardware block and are automatically selected to suite the chosen sampling rate.

Low-pass interpolation filtering, which produces an unsigned 16-bit data stream with a sampling rate of

4 MHz, is performed digitally. D-to-A conversion, post-filtering, and final amplification are performed on the analog part. The amplifier buffer for voice-band receive does also support ringer functionality. The ringer functionality is activated by setting bits RINGSELPN or RINGSELPA in the voice-band part of the analog control register.

In transmit direction, amplification, pre-filtering and A-to-D conversion (analog ∑∆ modulation) are performed on the analog part. The resulting 2-Mbit/s data stream is filtered by a digital low-pass decimation filter for further processing by DSP firmware. Two sampling rates, 8kHz and 16kHz, are supported.

The analog section contains all the necessary analog functional blocks including microphone supply generation, output and input amplifiers and analog filtering.

Signals

EPp1

EPn1

EPpa1

Loud1

Loud2

MICP1

MICN1

MICP2

MICN2

VMIC

Description

Main Receiver Positive signal(Differential signal)

Main Receiver Negative signal(Differential signal)

Headset signal(Single Ended signal)

Speaker Output Positive signal(Differential signal)

Speaker Output Negative signal(Differential signal)

Main Microphone Positive signal(Differential signal)

Main Microphone Negative signal(Differential signal)

Headset Microphone Positive signal(Differential signal)

Headset Microphone Negative signal(Differential signal)

Main/Headset Microphone supply power




SPK_N

SPK_RCV_N

SPK_RCV_SEL

RCV_N

R115

10

VBAT

1

U102

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

4

IN1

5

NC1

COM2

9

IN2

8

NC2

7

GND

6

C131

100p

R112

10

C132

100p

SPK_P

SPK_RCV_P

RCV_P

Figure 3-10-2 Main Receiver interface

HS_FM_L

SPK+

SPK-

SPK_AMP_EN

C115 330p

C116 220n R107 20K

R108

82K

C117 220n R109 20K A3

U101 NCP2890AFCT2G

INP OUTB

C2

C118 220n R110 20K

C119

A1

INM

C3

_SD

R114

C1

BYPASS

OUTA

VM

VP

A2

B2

B3

330p 82K

R117

100K

C126

0.47u

VBAT

C127

2.2u

SPK_P

SPK_N

Figure 3-10-3 Main Speaker interface





MIC_P

MIC_N

VMIC

R217

1K

L205

1K

C230

18p

L206

1K

C227

39p

C228

10u

C229 0.1u

R219

2.2K

39p

C226

C232 0.1u

C231

39p

R221

2.2K

C235

39p

1

2

MIC200

OB4-15L42-C33L

Figure 3-10-4 Main Microphone interface

HS_MIC_N

HS_MIC_P

C200 0.1u

C204 0.1u

C206

39p

MLED1

MLED2

HS_MMI_L

HS_MMI_R

TXD

RXD

HS_DETECT

RPWRON

DSR

TXD

RXD

VMIC

C213

C215

R200

1.5K

R201

2.2K

22u

22u

L200 100nH

R294 47

C212

39p

L201

L202

R299

R298

100nH

100nH

0

0

2V85_VIO

R205

R206

R207

R208

R209

4.7

4.7

47

47

47

R211 1K

R212

R213

R214

47

NA

NA

HSEJ-18S04-25R

9

10

7

8

4

5

6

1

2

3

21

19

11

12

13

14

15

16

17

18

20

22

CN201

FM_ANT


Figure 3-10-5 Headset interface

- 36 Copyright © 2007 LG Electronics. Inc. All right reserved.



3.11 Key LED Interface

VBAT

C133

1u

R120 R121 R122 R123 R124 R125 R126 R127 R128 R129

100ohm 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm 100ohm

C134

1u

KEY_BACKLIGHT

R132 10K

R133

100K

KTC4075E

Q101

Figure 3-11 Key LED interface

This handset has 8 LEDs that illuminates blue color.

Control signal is controlled by E-Gold-voice with PWM and handset has 3 methods, ON, OFF and dimming.





3.12 Vibrator Interface

MOTOR_P

VIBRATOR_EN

VBAT

C241

0.1u

R226

20

3

Q2_C

2

Q1_B

Q1_E

1

Q200

Q2_E

4

Q2_B

5

Q1_C

6

C236

27p

Figure 3-12 Vibrator interface

This handset has vibrator operation. VIBRATOR_EN signal is controlled by E-Gold-voice




3.13 Memory Interface

MEMORY (64M FLASH + 32M SRAM)

D(0:15)

2V85_VMEM

C111 C112

0.1u

0.1u

A(1:22)

U100

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

F5

H6

E6

G7

G2

E3

H3

F4

G6

F6

H7

F7

H2

F3

G3

H4

G4

VCCF

G5

VCCS

G8

E2

D8

E7

F8

H5

VSS1

VSS2

NC1

NC2

NC3

NC4

K5L6331CAM-D270

E1

A0

A1

D1

C1

A2

A3

B1

D2

A4

A5

C2

B2

A6

A7

A2

A6

A8

A9

C6

D6

A10

A11

A7

B7

A12

A13

C7

D7

A14

A15

B8

E8

A16

A17

D3

C3

A18

A19

B6

C5

A20

A21

C8

_OE

_WE

_LB

_UB

_CE

_CS1

CS2

RY__BY

_WP_ACC

_RESETR

F2

A5

A3

B3

F1

G1

B5

C4

A4

B4

_RD

_WR

A(100

BHE_N

_FLASH_CS

_SRAM_CS

_RY_BY

2V85_VMEM

_RD

_WR

A(0)

BHE_N

_FLASH_CS

_SRAM_CS

R101

100K

R102

100K

2V85_VMEM

R103

10K

C113

1000p

Figure 3-13 Memory interface

In E-Gold voice, the 16bits demultiplex X-bus interface is used for memory device support. NOR Flash memory is supported. (The NAND Flash memory is not supported). The page mode can be supported forflash memories.

Up to 8MBytes of external RAM and/or ROM can be connected to the MCU via its external bus interface. Up to 3 external CS signals can be generated to save external glue logic.

Access to very slow memories is supported via a special ‘Ready’ function.

The system MCU clock is set to run with 26Mhz.





3.14 Power Block Interface

VBAT

FB100

C109

0.1u

C105

2.2u

C106

1u

C107

1u

C108

1u

C8

KP0

C100

1u

C101

1u

C102

1u

C103

1u

R100

C110

22K

220n

C104

4.7u

REXT

D12

XOX

A9

A8

Figure 3-14-1 Power Block interface

The E-Gold voice integrated power management unit (PMU) supports direct connection to battery

(DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage regulators. The input of these linear voltage regulators is the battery voltage. The external memory and

SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal generated supply voltages.

The integrated power management also provides the control state machine for system start up, including start up with discharged batteries, trickle charging and system reset control. After system start up several methods are implemented for active and idle power saving.




Name

LRTC

LD1

LIO

LRFXO

LMEM

LANA

LSIM

LBUF

LRFRX

LRFTRX

Output Voltage(V) Output Current (mA) Comment

2.0

4 Used for the real time and digital PMU supply

1.2/1.5

1.8/2.85

2.5

1.8/2.85

150

30

10

100

Used for the core supplies (MCU and DSP via switch)

Used for the I/O pad supply and, for example, the display

Used for the crystal oscillator supply

Used for the external memory supply, voltage can be configured during startup

2.5

100

1.8/2.85

2.6/2.8/3.0/3.2

2.5

1.5

30

300

100

120

Used for analog (audio and baseband processing) and headset driver

Used of the SIM card supply

Used for the loudspeaker and earpiece driver

Used for the RF RX part

Used for the RF TX/TX part

Figure 3-14-2 EGlod Voice PMU

LDO output voltage selection

• LD1, LIO, LSIM, LBUF output voltage programmable by software.

• LMEM output voltage is selectable by pin configuration upon startup.

Active and idle power saving options:

• The flexible clock switching options allow minimizing the power consumption during the operation phases of the E-GOLD voice.

• Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is switched off and the controller RAM is switched to a power saving mode.

Start-up and Reset Control State Machine Features

• Power up upon battery insertion, push button, alarm, charger connection.

• Detection of battery exchange or re-insertion.

• Complete start-up sequence management.

• System turn-on, system turn-off operation management including emergency (under-voltage) and programmed shutdown functions.

• Internal reset of the baseband, including silent reset.

• Tri-state function of the baseband module.

• Standby mode controlled by VCXO_EN provided by SCCU module.





3.15 MG370a, MG370b,KG370,KG375 Function difference

RF Band

Design Market

Without

FM Radio

With

FM Radio

Europe

KG375

-

GSM900/ DCS1800

Asia / CIS

-

KG370

Latin

America

-

MG370b

GSM850/

PCS1900

Latin

America

-

MG370a

< Internal Antenna >

MG370b , KG370, KG375 MG370a




3.16 BOM difference

Part Block

Baseband

I/O

FM

Radio

MG370b, MG370b, KG370

L200~202 : ELCH0005009 (100nH)

L204 : ELCH0010302 (100nH)

R294~295 : ECZH0000826 (27pF)

R296 : ELCH0005009 (100nH)

R297~299 : ECZH0000826 (27pF)

C301: ECZH0000813

C302: ECZH0001216

C303: ECZH0001216

C304: ECCH0004904

C305: ECCH0000182

C306: ECCH0004904

C307: ECCH0004904

C308: ECCH0000182

C309: ECCH0000182

C310: ECCH0004904

C311: ECCH0000182

R300: ERHZ0000476

R301: ERHZ0000438

R302: ERHZ0000438

R303: ERHZ0000476

R304: ERHZ0000405

R305: ERHZ0000406

R306: ERHZ0000485

R307: ERHZ0000485

R308: ERHZ0000406

R309: ERHZ0000406

R310 : ERHZ0000454 (27 K Ω )

R311,R312 : N.A (0 Ω pad, Open)

U300: EUSY0320801

U301: EUSY0142501

U302: EUSY0223002

U303: EUSY0300101

KG375

L200~202 : N.A

L204: ERHZ0000701 (0 Ω )

R294: ERHZ0000483 (47 Ω )

R295~299 : N.A

C300~311 : N.A

R300~309 : N.A

R310: ERHY0003601 (2.7K

Ω )

R311,R312 : N.A (0 Ω pad,Short)

U300~303 : N.A

Part

RF

Block

Tx , Rx matching

MG370b, KG370, KG375

FL400 : SFSB0001401

C418 : ECZH0000822 (1.5pF)

L401 : ELCH0004709 (3.3nH)

C412 : ECZH0000822 (1.5pF)

L404 : ELCH0009104 (6.8nH)

Antenna matching

C410 : ELCH0004723 (1.8nH)

L403 : ECZH0000813 (100pF)

L400 : ELCH0001031 (15nH)

MG370a

FL400 : SFSB0001301

C418 : ECCH0000901 (2.2pF)

L401 : ELCH0004704 (1.5nH)

C412 : ECCH0000183 (1.8pF)

L404 : ELCH0009110 (5.1nH)

C410 : ECZH0000813 (100pF)

L403 : ELCH0004726 (1.5nH)

L400 : ELCH0004711 (22nH)




4. TROUBLE SHOOTING


4.1 Trouble Test Set-up

4.000V 0.0000A

Power on all of test equipment

- Connect PIF-UNION JIG or dummy battery to the DUT for power up.

- Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.

- Follow trouble shooting procedure




4.2 Power On Trouble

TEST POINT

Check Points

-Battery Voltage( Need to over 3.35V)

-Power-On Key detection (PWRON signal)

-Outputs of LDOs from EGV

U103

CIRCUIT

FB100

C109

0.1u

C105

2.2u

C106

1u

C107

1u

C108

1u

C8

KP0



- 45 -

VBAT

C100

1u

C101

1u

C102

1u

C103

1u

R100

C110

22K

220n

C104

4.7u

REXT

D12

XOX

XO

A9

A8



CHECKING FLOW

START

Check Battery Voltage

> 3.35V

YES

Push power-on key

And check the level change of PWRKEY

YES

Check the voltage of

The LDO outputs at U103

NO

Charge or Change Battery

NO

Check the contact of power key

Or dome-switch

Replace U103

YES

Check the clock signal on X100

32.768KHz/0.5V

YES

NO

Replace U103

THE PHONE WILL

POWER ON.



4.3 Charging Trouble

TEST POINT

Check Points

- Connection of TA (check TA voltage 5.1V)

- Charging Current Path component voltage drop

- Battery voltage

- Charging IC

U201


CIRCUIT

CHG_DT

_EOC

2V85_VIO VCHG

R220

1.8K

R218

10K

R222

100K

R223

C233

NA

1 uF

U201

1

VIN

2

_PPR

3

_CHG

4

9

_EN

PGND

ISL6294

BAT

8

IREF

7

6

IMIN

GND

5

VBAT

R224 R225

C234

240K 30K 0.1u





Checking Flow

START

I/O Connector(CN201)

Is well-soldered ?

YES

Voltage at anode of

C233 = 5.1V ?

YES

The Voltage of R222

Is 0V

YES

Battery is charged?

YES

Charging is properly operating

NO

NO

NO

NO

Resolder the CN201

Pin 12,13 : VCHARGE

The TA is out of order

Change the TA

Replace the

U201

The battery may have problems.

Change the battery.




4.4 Vibrator Trouble

TEST POINT

Check Points

-Vibrator contact is right

-Tr is working correctly

CIRCUIT

MOTOR_P

VIBRATOR_EN

VBAT

C241

0.1u

R226

20

3

Q2_C

2

Q1_B

Q1_E

1

Q200

Q2_E

4

Q2_B

5

Q1_C

6

C236

27p





CHECKING FLOW

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

Is the voltage at pin 2 of Q200 high ?

YES

Is the voltage at pin 4 of Q200 = VBAT ?

YES

Check the contact of CN200 ?

YES

Check the connection vibrator ?

YES

Replace vibrator

YES

Vibrator

Working well !

NO

NO

NO

NO

Resolder Q200

Check the battery voltage level

Check contact problem and clean the contact

Reconnect vibrator



4.5 SIM Card Trouble

TEST POINT

Check Points

-Socket soldering

-Proper SIM is used


CIRCUIT

2V85_VSIM 2V85_VSIM

SIM_DATA

R113

4.7K

C123

22p

J100

6

10

9

4

5

GND1

VPP

VCC

RST

IO

GND5

CLK

GND2

GND4 GND3

3

7

8

1

2

C124 C125

0.1u

22p

SIM_RST

SIM_CLK





Checking Flow

START

Does the SIM cards supports 3V ?

YES

NO

Change the SIM Card. Our phone supports only 3V SIM card.

NO

Voltage at pin1 of

J100is 2.85V?

Re-solder J100

YES

Change the SIM Card

And try again.

Does it work

Properly?

YES

Change SIM Card

NO Re-download SW.

Does it work

Properly?

YES

SIM Card will be detected.

NO

Change the U103




4.6 KEY backlight Trouble

TEST POINT

VBAT

C133

1u

R120 R121 R122 R123 R124 R125 R126 R127 R128 R129


C134

1u

KEY_BACKLIGHT

R132 10K

R133

100K

KTC4075E

Q101

CHECKING FLOW

START

Is the level at R132

High?

YES

NO

Check U103(Main board)

NO

Are all LEDs

Working?

YES

Check the soldering each R and LED

R120~R129

LD100~LD109

NO

Backlight will work properly.

Replace or re-soldering component





4.7 RTC Trouble

CIRCUIT

_

RESET_N

SAFE_RES

OSC32K

F32K

CLKOUT

P5

M7

N7

P6

R5

B4

T_OUT8

T_OUT4

T_OUT3

T_OUT2

T_OUT0

B7

A5

A6

B6

A7

OE_N

ADV N

N5

M6

CHECKING FLOW

_

_RESET

PWRON

32.768KHz

HS_FM_SEL

BAND_SEL

32K_OUT

VC2

VC1

TXON_PA

_RD

FM RADIO EN

1 2

C121

4

X101

C122

3

MC-146_12_5PF

18p 18p

START

Is the frequency about 32Khz

YES

Replace X101 and try again.

YES

RTC will work properly




4.8 LCD Trouble

TEST POINT

-LCD assembly status ( FPCB)

-SPI Interface’s status

-Connector combination

MLED

W_LED_EN

VBAT

C202 0.1u

R210 C217

100K 2.2u

5

U200

IN

AAT3157ITP-T1

C1+

10

8

11

4

CP

EN_SET

GND

C1-

C2+

9

7

C2-

6

D1

D2

D3

NC

1

2

3

12

C203

1u

C205

1u

MLED1

MLED2

U200

CN200

CIRCUIT

D(0:7)

A(7)

_WR

_LCD_CS

LCD_RESET

6

5

4

3

2

1


8


9


10


11


12


13

FL200

ICVE31186E150R101FR

4

3

2

1

6

5

INOUT_A6

INOUT_A5

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B6

INOUT_B5

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

8

9

10

11

12

13

FL201

ICVE31186E150R101FR

C221

1000p

27

26

25

24

23

22

21

20

30

29

28

19

18

17

16

CN200

6

7

4

5

1

2

3

8

9

10

11

12

13

14

15

2V85_VIO VBAT

LCD_ID

MLED2

MLED1

MLED

MOTOR_P

IND_LED_B

IND_LED_R

SPK_RCV_P

SPK_RCV_N





CHECKING FLOW

START

Is the connection of

FPCB with connector on

PCB(CN200) ok ?

YES

Check the soldering of

CN200 ?

YES

Check the voltage

Of 2V85_VIO ?

YES

Check the signals of

LCD data & command

YES

Does LCD work properly ?

YES

LCD working well !

NO

NO

NO

NO

NO

Reassemble FPCB with CN200connector

Re-soldering CN200

Check the U103

Check the FL200, FL201

Replace LCD module




4.9 Speaker Trouble

TEST POINT

Check Points

-Speaker spring contact

-Audio amp soldering

CIRCUIT

HS_FM_L

SPK+

SPK-

SPK_AMP_EN

C115 330p

C116 220n R107 20K

R108

82K

C117 220n

R109

C118 220n R110

20K

20K

C119 R114

A3

U101 NCP2890AFCT2G

C2

INP OUTB

OUTA

A2 A1

INM

C3

_SD

C1

BYPASS

VM

VP

B2

B3

330p 82K

R117

100K

C126

0.47u

VBAT

C127

2.2u

SPK_P

SPK_N



- 57 -



Checking Flow

Start

Check the voltage level of

U101ís C127 = Vbat?

Yes

Check the Signal,

R109,R110

Yes

Check the Level of

R117 = Low ?

Yes


FPCB speaker solder

Yes

Check the Contact

Of CN200

Yes

Replace FPCB

No Check

The battery

No

No

No

No

Check

U103

Check

U103

Re-solder

Speaker wires

Re-Assemble or Re-place

Speaker




4.10 Receiver Trouble

CIRCUIT

VBAT

SPK_N

SPK_RCV_N

SPK_RCV_SEL

RCV_N

R115

10

1

U102

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

4

IN1

COM2

9

IN2

8

NC2

7

5

NC1 GND

6

C131

100p

R112

10

C132

100p

SPK_P

SPK_RCV_P

RCV_P

CHECKING FLOW

Start

Check the Contact ofCN200

Yes


R114, R112

Yes

Replace FPCB

No Clear the contact

No

Check

U103





4.11 Headphone Trouble

TEST POINT

Check Points

-18pin IO connector

-Passive Parts soldering Status

CIRCUIT

HS_MIC_N

HS_MIC_P

C200 0.1u

C204 0.1u

C206

39p

MLED1

MLED2

HS_MMI_L

HS_MMI_R

TXD

RXD

HS_DETECT

RPWRON

DSR

TXD

RXD

VMIC

C213

C215

R200

1.5K

R201

2.2K

22u

22u

L200 100nH

R294 47

C212

39p

L201

L202

R299

R298

0

0

100nH

100nH

2V85_VIO

R205

R206

R207

R208

R209

4.7

4.7

47

47

47

R211 1K

R212

R213

R214

47

NA

NA

HSEJ-18S04-25R

5

6

7

2

3

4

21

19

1

13

14

15

10

11

8

9

12

16

17

18

20

22

CN201

FM_ANT




CHECKING FLOW

START

Does the audio profile of the phone change to the earphone mode?

Yes

No

Check the voltage Level

CN201ís 8pin = Low?

No

Yes

Re-solder CN201 or Change another Ear- Mic set and Try again

Replace U103 or Change Board

Mic

Go to MIC

Trouble section

Check the signal Level at

AUX_MIC.

Is it about 1.2~1.5V DC with a few tens mV AC?

No Re-solder causal component

(CN201)

Yes

Change another Ear-Mic set and Try again

Earphone

Acoustic

Does waveform at

U102.EPPA1

fluctuate?

Yes

Does waveform at

CN201ís 4 and 5pin fluctuate?

No

Replace U103 or

Change the board

No Re-solder causal component

Change another Ear-Mic set and Try again





MIC_P

MIC_N

4.12 Microphone Trouble

CIRCUIT

VMIC

R217

1K

C230

18p

L205

1K

L206

1K

C227

39p

C228

10u

R219

2.2K

39p

C226

C229 0.1u

C232 0.1u

C231

39p

R221

2.2K

C235

39p

1

2

MIC200

OB4-15L42-C33L

CHECKING FLOW

START

Voltage VMIC of U103

= 2.0V?

Yes

Check the Solder condition

No

No

Replace U103 or Change the board

Re-solder or replace the Component

Yes

Check the signal Level at MIC_P(Key).

Is it about 1.2~1.5V DC with a few tens mV

AC?

Yes

Microphone will work properly.

No

Re-solder or replace the microphone




4.13 RF Components

RF Components Placement

U400

SW400

FL401

FL400

X100

U102

VC1

VC2

C423

27p

<ASM interface>

C424

27p

FL401

9

5

8

10

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4


MODE

850/900 TX

1800/1900 TX

850/900/1800/1900 RX

VC1

H

L

L

VC2

L

H

L

FL400

1

I1

B9310

O1_1

9

4

I2

O1_2

O2_1

8

7

O2_2

6


2 3 5 10

<SAW Filter interface>

C419

3p

C421

3p

C422

3p

C425

3p

L404

5.1nH

L405

18nH

DCS_PCS_RXP

DCS_PCS_RXN

GSM_RXP

GSM_RXN

REFERENCE

U400

X100

FL401

SW400

FL400

PART Description

PAM (Power Amp. Module)

DCXO (26MHz)

ASM (Antenna Switch Module)

Mobile Switch

RX SAW Filter





4.14 RX Receiver Part

CHECKING FLOW

START

Setup Test Equipment

Cell Power : -74d Bm

GSM850 CH190

PCS CH660

Check point.

DCXO(X100)

Check point mobile SW &

ASM & SAW

Filter(SW400,F

L400,FL401)

Re-Download S/W &

CAL

RX Receiver Part

U400

SW400

FL401

FL400

X100

U102




DCXO

Checking Points

CHECKING FLOW

Is the waveform of Pin3 similar to

DCXO(X100)

Waveform?

Yes

DCXO Circuit is OK.

See next page to check

PLL Circuit.

No

Replace X101

X100

Pin 1: 26MHz

REXT

D12

XOX

XO

A9

A8

TX2

TX1

A13

A14

X100

4

GND2

1 HOT1

NX3225SA

HOT2 3

GND1

2

26MHz

DCS_PCS_OUT

GSM_OUT

< DCXO Circuit>

Waveform

Pin 2

Pin 1

<DCXO Waveform>





4.14 RX Receiver Part

Mobile S/W & ASM & SAW Filter

CHECKING FLOW

Check Pin 1, 2 of

SW400 with RF Cable

Signal is

OK ?

Yes

No Replace

Mobile SW

(SW400)

Check Pin 4,6 of

FL401 ?

Yes

No

Replace ASM

(FL401)

Check Pin 6,7 and 8,9 of

FL400 ?

No

Replace SAW

Filter (FL400)

Yes

Mobile SW & ASM is OK.

See next page

Pin 4

SW400

FL401

FL400

Pin 6

* FL400 6,7 and 8,9 output are balanced



4.15 TX Transmitter Part

TX Transmitter Part

CHECKING FLOW

Setup Test Equipment

Cell Power : - 74dBm

GSM850 CH190

PCS CH661

Check point

DCXO(X100)

Check point

ULC2(U102)Outp ut Signal

Check point

PAM(U400)

Control Signal

Check

ASM & Mobile

S/W & SAW

(FL401,SW400

,FL400)

Re-Download S/W & RF

CAL

U400

SW400

FL401

FL400

X100

U102






ULC2 RF Output Signals

C400

10u

(2012 size)

C401

12p

C402

0.01u

C403

33p

C404

18p

C405

27p

C406

0.01u

7

8

5

6

9

3

4

1

2

SC400

Shield CAN

17

18

19

13

14

15

16

10

11

12

L401

1.5nH

C412

1.8p

R403

1K

C408

39p

15

DCS_PCS_OUT

11

19

EGSM_OUT

RSVD_GND

U400

SKY77318

DCS_PCS_IN

3

EGSM_IN

4

ENABLE

18

21

P_GND BS

1

L402

2.7nH

C418

2.2p

C414

27p

C415

27p

TXON_PA

BAND_SEL

R404

NA

C409

100p

R405

NA

R406

NA

C416

100p

R407

NA

DCS_PCS_OUT

GSM_OUT

U400

HB RF Input

LB RF Input

Paon & BS ASM

Vapc

CHECKING FLOW

Check Control

Signals

Signals are

Normal ?

Yes

PAM Control

Signal is OK.

See next page to check

ASM & Mobile SW

Circuit.

No

Check

ULC2(U102)




Mobile S/W & ASM

L400

15nH

C410

100p

C413

1p

L403

1.2nH

RF-800

SW400

VC1

VC2

C420

22p

C423

27p

C424

27p

FL401

3

7

9

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

5

8

10

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4


SW400

U400

FL401

FL400

X100

U102

Mode

VC1

VC2

GSM850 TX

H(2.7V)

L

PCS1900 TX

L

H(2.7V)

GSM850 RX

L

L

PCS1900 RX

L

L





Mobile S/W & ASM

CHECKING FLOW

Check Pin 1, 2 of

SW400 with RF Cable

Signal is

OK ?

Yes

Check Pin 1,2 of

FL401 ?

Yes

No

Replace Mobile

SW (SW400)

Control

Signal is

OK ?

Yes

No

Check ULC2

(U102)

Pin 3,7

Signal is normal ?

Yes

No

Replace ASM

(FL401)

Mobile SW & ASM is

OK.

Check Antenna.

Pin 3

FL400

FL401

Pin 2

SW400

Pin 7

Pin 1



5. DOWNLOAD

5.1 Download Setup

Figure 5-1 describes Download setup

5. DOWNLOAD

UART

(If you have battery, no TA is needed)

Figure 5-1. Download Setup




5. DOWNLOAD

5.2 Download Process

5.2.1. Download step[1]

: Start or Stop download

: Selected configuration DLL file

: File name donwloading

File(F) > Exit(X) : End program

Setting(S)

>

Configuration : configuration download condition DLL, SW files and etc.

About(H) > MultiGSM : Provide version information

First, select Setting Menu.




5. DOWNLOAD

: Select a appropriated DLL file

- You must select MG370_xxxxxx.DLL file.

: Select configuration file

You must select cmd.m0 file

: Select download speed

You must 460800. System supports maximum 460800bps.

: Select port select start and end port be operated




5. DOWNLOAD


: Select files downloaded

MG370 have 4 files, *.eep, *.fls, *.dffs and *.cust.

But You must not select *.eep file.




5. DOWNLOAD

: Start download and stop download next step.

If configuration is finished, then push start button and then button is changed to STOP.

Turn on power of multi download and connector phones.

If download is started, then push start button else program will download repeatedly.




5. DOWNLOAD


: This region appears donwload status.

If download is finished, PASS or FAIL.message is showed.



6. BLOCK DIAGRAM

B

/ H

L

X

R

6. BLOCK DIAGRAM

Charger De tect

AU XIN

AU X O U T

UART

2.8V

V_M EM

A16

D16






7. CIRCUIT DIAGRAM

E

F

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

F

A

B

C

D

E

C

3

BASEBAND + RF (ALL IN ONE)

FB100

C109

0.1u

C105

2.2u

C106

1u

C107

1u

C108

1u

KEY_OUT(0:4)

KEY_IN(0:4)

RXD

TXD

HS_DETECT

DSR

LED_B_EN

SPK_RCV_SEL

KEY_UNLOCK

LCD_RESET

FM_SCL

FM_SDA

SIM_DATA

FM_INT

SIM_CLK

SIM_RST

SPK_AMP_EN

2V0_VRTC

TDO

TDI

TMS

TCK

TRSTn

TRIG_OUT

TRIG_IN

_FM_RST

C120

1u

D(0:15)

A(0:10)

R111

D9

C6

C9

D8

C8

D6

D7

C7

F9

F8

KP0

KP1

KP2

KP3

KP4

KP5

KP6

KP7

KP8

KP9

2V85_VIO

G7

H7

H8

G8

RXD

TXD

RTS_N

CTS_N

J6

K6

G6

H6

SSC0_CLK

SSC0_MRST

SSC0_MTSR

DISP_REST

H9

H10

SCL

SDA

2V85_VIO

2V85_VIO

2V85_VIO

R8

M9

P7

R10

N8

CCIO

CCVZ_N (2V85_VIO)

2V85_VSIM CCLK

CCRST

CCIN

M1

N1

L2

K2

J1

M4

K1

J2

P3

R2

R4

P1

P2

N2

L1

M2

P8

M10

P9

R9

K9

B5

C5

F7

100K

N6

N9

D2

D3

D4

D5

D6

TDO

TDI

TMS

TCK

TRST_N

2V85_VIO

TRIG_OUT

TRIG_IN

NMI_N

MON1

MON2

(2V0_VRTC)

0 : VMEM 1.8V

1 : VMEM 2.85V

0 : BOOT Int

1 : BOOT Ext

D0

D1

D7

D8

D9

D10

D11

D12

D13

D14

D15

C2

D5

TP101 F4

E4

D4

G4

D2

H4

C1

F1

F2

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

1V5_VCORE 1V5_VRF0

MEMORY (64M FLASH + 32M SRAM)

C100

1u

C101

1u

C102

1u

C103

1u

R100

C110

22K

220n

VBAT

PMB7880

U103

M0,2 : ~1.92V

M7,9 : ~0.96V

(30uA)

(VOLTAGE SENSING)

(30uA)

(90uA)

REXT

D12

XOX

XO

A9

A8

TX2

TX1

A13

A14

RX34

RX34X

RX12

RX12X

E15

D15

C15

B15

ADC

2V5_VANA

2V85_VIO

(3V2_VBUF)

(3V2_VBUF)

M9

M0

M7

M2

N10

R14

R11

P10

PAOUT1

P13

LOUD2

LOUD1

K14

L15

(3V2_VBUF)

(3V2_VBUF)

VMIC

MICP2

MICN2

MICP1

MICN1

EPPA1

EPP1

EPN1

P12

P11

R12

P15

R13

M14

M12

N15

2V85_VIO

T2IN

VIB_CONTROL

BACK_LIGHT

W_LED_DRV

(2V0_VRTC)

(2V0_VRTC)

(2V0_VRTC)

(2V0_VRTC)

(2V0_VRTC)

CC00IO

RSTOUT_N

RESET_N

SAFE_RES

SWITCH_ON

OSC32K

F32K

CLKOUT

A4

A3

P5

M7

B2

B1

B3

A2

N7

P6

R5

B4

2V85_VIO

T_OUT8

T_OUT4

T_OUT3

T_OUT2

T_OUT0

B7

A5

A6

B6

A7

2V8_VMEM

N5

M6

E3

E2

R3

M5

K3

P4

G1

E1

H1

D1

F3

L3

K4

J4

H3

J3

H2

G2

OE_N

ADV_N

BHE_N

WR_N

RD_N

CS3_N

CS1_N

CS0_N

A22

A21

A20

A19

A18

A17

A16

A15

A14

A13

A12

A11

C104

4.7u

A(1:22)

X100

4

GND2

1 HOT1

NX3225SA

HOT2 3

GND1

2

26MHz

DCS_PCS_OUT

GSM_OUT

DCS_PCS_RXP

DCS_PCS_RXN

GSM_RXP

GSM_RXN

RADIO_DETECT

DEFAULT_BANDSEL

TX_RAMP

SPK-

SPK+

R104

68K

R105

VMIC 100K

R106

47K

LCD_ID

BATT_TEMP

TP100

HS_MIC_P

HS_MIC_N

MIC_P

MIC_N

HS_OUT

RCV_P

RCV_N

LED_R_EN

VIBRATOR_EN

KEY_BACKLIGHT

W_LED_EN

FLIP

_EOC

_RESET

PWRON

C114

1000p

32.768KHz

HS_FM_SEL

BAND_SEL

32K_OUT

VC2

VC1

TXON_PA

_RD

FM_RADIO_EN

BHE_N

_WR

_LCD_CS

_SRAM_CS

_FLASH_CS

1 2

C121

4

X101

C122

3

MC-146_12_5PF

18p 18p

A(11:22)

D(0:15)

2V85_VSIM

2V85_VMEM

C111

0.1u

C112

0.1u

SIM_DATA

R113

4.7K

C123

22p

10

9

4

5

6

GND1

VPP

IO

J100

GND5

GND4

1

VCC

RST

CLK

GND2

3

7

8

GND3

2

U100

G2

E3

H3

F4

F5

H6

E6

G7

H2

F3

G3

H4

G6

F6

H7

F7

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

G4

G5

VCCF

VCCS

G8

E2

VSS1

VSS2

D8

E7

F8

H5

NC1

NC2

NC3

NC4

K5L6331CAM-D270

E1

A0

D1

A1

A2

A3

C1

B1

A4

A5

D2

C2

A6

A7

B2

A2

A8

A9

A6

C6

A10

D6

A11

A7

A12

B7

A13

A14

C7

D7

A15

A16

B8

E8

A17

A18

D3

C3

A19

A20

B6

C5

C8

A21

_OE

_WE

_LB

_UB

_CE

_CS1

CS2

RY__BY

_WP_ACC

_RESETR

G1

B5

C4

A4

B4

F2

A5

A3

B3

F1

_RD

_WR

A(100

BHE_N

_FLASH_CS

_SRAM_CS

_RY_BY

SIM_CONNECTOR

2V85_VSIM

C124

0.1u

C125

22p

SIM_RST

SIM_CLK

HS_FM_L

SPK+

SPK-

SPK_AMP_EN

_RD

_WR

A(0)

BHE_N

_FLASH_CS

_SRAM_CS

SPEAKER AMPLIFIER

R117

100K

2V85_VMEM

R101

100K

C126

0.47u

R102

100K

2V85_VMEM

R103

10K

C113

1000p

C115 330p

C116 220n R107 20K

R108

82K

C117 220n

R109

C118 220n R110

20K

U101

A3

INP

20K

C119

A1

INM

C3

_SD

R114

C1

BYPASS

NCP2890AFCT2G

OUTB

C2

OUTA

A2

B2

VM

VP

B3

330p 82K

FOLDER SENSE

2V85_VIO

INDICATOR LED

Q100

UMX1NTN

VBAT

C127

2.2u

2V5_VRF1 2V5_VRF2

FLIP

C135 C136

27p 27p

1

VDD

U104

VSS

4

C137

2

OUT NC

3

EM-1681-FT

0.1u

LED_B_EN

IND_LED_R

R118

10K

R130

100K

R131

100K

R119

10K

SPK_P

SPK_N

IND_LED_B

LED_R_EN

SPK_N

SPK_RCV_N

SPK_RCV_SEL

RCV_N

R115

10

TEST PAD FOR MP

VBAT VBAT

SPK & RCV Switch

VBAT

KEY BACKLIGHT

VBAT

RPWRON

DSR

RXD

TXD

C133

1u

R120 R121 R122 R123 R124 R125 R126 R127 R128 R129


C134

1u

A

B

C

D

1

U102

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

4

IN1

5

NC1

COM2

9

IN2

8

NC2

7

GND

6

C131

100p

R112

10

C132

100p

SPK_P

SPK_RCV_P

E

RCV_P

F

C

D D

C144

4700p

KEY_BACKLIGHT

R132 10K

R133

100K

KTC4075E

Q101

ON BOARD JTAG

2V85_VIO

TRSTn

TDI

TMS

TCK

TDO

TRIG_IN

TRIG_OUT

10

11

12

13

14

15

8

9

6

7

1

2

3

4

5

G1

CN100

G2

22

21

20

19

25

24

23

18

17

16

30

29

28

27

26

G3 G4

UART PORT

VBAT VCHG

UA100

3G 2.5G

GND

RX

TX

VCHAR

GND

RX

TX

NC1

3

4

1

2

5

6

ON_SW ON_SW

VBAT

PWR

URXD

UTXD

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

7

8

9

10

11

12

RXD

TXD

RPWRON

DSR

BACK UP CAPACITOR

2V0_VRTC

R136

6.8K

BAT100

RPWRON

KEY_UNLOCK

REMOTE POWER ON

2V0_VRTC

R134

Q102

NA

R135

NA

PWRON

C145

1000p

R137

100K

R138

390K

R139

100K

E

LG(42)-A-5505-10:01

1 2 3 4 5 6 7 8 9

LG Electronics Inc.



- 79 -



A

D(0:7)

A(7)

_WR

_LCD_CS

LCD_RESET

1

CONNECTOR

2 3 4 5 6 7


6 8


5 9

4


3

2

1

10


11


12


13

FL200

ICVE31186E150R101FR

INOUT_A6

6

INOUT_A5

5

INOUT_A4

4

INOUT_A3

3

INOUT_A2

2

1

INOUT_A1

FL201

INOUT_B6

INOUT_B5

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

ICVE31186E150R101FR

8

9

10

11

12

13

C221

1000p

30

29

28

27

26

25

24

23

22

21

20

19

18

17

16

CN200

9

10

11

12

13

14

15

6

7

4

5

8

1

2

3

MICROPHONE

MIC_P

MIC_N

VMIC

R217

1K

L205

1K

C230

18p

L206

1K

C227

39p

C228

10u

R219

2.2K

39p

C226

C229 0.1u

C232 0.1u

C231

39p

R221

2.2K

C235

39p

1

2

MIC200

OB4-15L42-C33L

2V85_VIO VBAT

LCD_ID

MLED2

MLED1

MLED

MOTOR_P

IND_LED_B

IND_LED_R

MLED

W_LED_EN

SPK_RCV_P

SPK_RCV_N

CHARGE PUMP

VBAT

C202 0.1u

R210

100K

C217

2.2u

5

U200

IN

AAT3157ITP-T1

C1+

10

8

11

4

CP

EN_SET

GND

C1-

C2+

9

7

C2-

6

D1

D2

D3

NC

1

2

3

12

C203

1u

C205

1u

HS_MIC_N

HS_MIC_P

MLED1

MLED2

HS_MMI_L

HS_MMI_R

TXD

RXD

HS_DETECT

RPWRON

DSR

TXD

RXD

C200 0.1u

C204 0.1u

C206

39p

CHARGING

CHG_DT

_EOC

2V85_VIO VCHG

R220

1.8K

R218

10K

R222

R223

C233

100K

NA

1 uF

U201

1

VIN

2

_PPR

3

_CHG

4

9

_EN

PGND

ISL6294

BAT

8

IREF

7

IMIN

6

GND

5

VBAT

R224 R225

C234

240K 30K 0.1u

8

VMIC

C213

C215

R200

1.5K

R201

2.2K

22u

22u

L200 100nH

R294 47

C212

39p

L201

L202

R299

R298

0

0

100nH

100nH

9

2V85_VIO

R205

R206

R207

R208

R209

4.7

4.7

47

47

47

R211 1K

R212

R213

R214

47

NA

NA

FM_ANT

10

A

HSEJ-18S04-25R

9

10

7

8

11

4

5

6

2

3

21

19

1

12

13

14

15

16

17

18

20

22

CN201

B

C

D

KEY_IN(0:4)

E

KEY_OUT(0:4)

KEY_MATRIX

R227

680

R228

680

R229

680

R230

680

R231 680

R232 680

R233 680

R235 680

R236 680

R237 680

200

203

206

STAR

2

201

204

207

209

202

205

208

SHARP

OK

LEFT

UP

RIGHT

DOWN

MENU

SEL

SEND

CLEAR

PWRON

R234

1K

C242

100p

END

2V0_VRTC

MOTOR_P

VIBRATOR_EN

VIBRATOR

VBAT

C241

0.1u

R226

20

3

Q2_C

2

Q1_B

Q1_E

1

Q200

Q2_E

4

Q2_B

5

Q1_C

6

C236

27p

3 4 5 1

LGIC(42)-A-5505-10:01


- 80 -

BATTERY CONNECTOR

VBAT

BATT_TEMP

C237

27p

C238 C239

4.7u

27p

C240

0.1u

3

2

1

CN202

LG Electronics Inc.



D


F

A

B

C

D

E

1 2 3 4 5 6 7 8

PRESENT RADIO

FM_ANT

2V8_VRADIO

FM_SCL

FM_SDA

32K_OUT

C301 100p

_FM_RST

1

2

3

4

5

NC1

FMIP

RFGND

GND1

_RST

U300

GND3

LOUT

ROUT

GND2

VD

15

14

13

11

2

2V8_VRADIO

C300

1u

2V8_VRADIO

C304

1u

2V8_VRADIO

R306

4.7K

R307

4.7K

0.1u

C308

C307

1u

2V8_VRADIO

C302 220n

C303 220n

R301

R302

20K

20K

HS_AMP_EN

R305 C306

100K 1u

C305

0.1u

R300 39K

U301

7

VDD

LM4809LD

VOUT1

8

1

VIN1

VOUT2

6

5

VIN2

2

4

BYPASS

_SHDN

GND

BGND

3

9

R303 39K

FM_RADIO_EN

2V85_VIO

R308

NA

VBAT 2V8_VRADIO

C309

0.1u

U302 BH28FB1WHFV

3

2

1

VIN

GND

STBY

VOUT

BGND

NC

4

6

5

C310

1u

HS_FM_R

HS_MMI_R

HS_OUT

HS_FM_SEL

2V85_VIO

C311 R309

0.1u

100K

1

U303

NLAS5223BMNR2G

10

VCC NO2

2

NO1 COM2

9

8 3

COM1

4

IN1

5

NC1

IN2

7

NC2

GND

6

HS_FM_L

HS_FM_R

HS_FM_L

HS_MMI_L

HS_OUT

ABSENT RADIO

HS_OUT

R311

R312

0

0

HS_MMI_R

HS_MMI_L

9

C

10 11 12 13 14 15 16

R310

27K

RADIO_DETECT

(CURRENT MODE:30uA)

RADIO

NO RADIO

RADIO_DETECT

27K

2.7K

A

B

C

D

E

F

C

D

E

D

E

F

LG(42)-A-5505-10:01

1 2 3



4 5 6 7 8 9

- 81 -




A

B

C

D

1 2 3 4 5 6 7 8 9 10

ANT400

R400

NA

ANT401 ANT402

C410

100p

C413

1p

L403

1.2nH

R401

NA

L400

15nH

ANT403

R402

NA

RF-800

SW400

VC1

VC2

C420

22p

C423

27p

C424

27p

FL401

5

8

10

9

3

7

IN GSM1800_1900TX

GSM1800_1900RX

VC_GSM850_900TX

VC_GSM1800_1900TX

1

6

GND1

GND2

GND3

GSM850_900TX

GSM850_900RX

2

4


MODE

850/900 TX

1800/1900 TX

850/900/1800/1900 RX

VC1

H

L

L

VC2

L

H

L

C400

10u

(2012 size)

C401

12p

C402

0.01u

C403

33p

C404

18p

C405

27p

C406

0.01u

TX_RAMP

C411

NA

L401

1.5nH

C412

1.8p

R403

1K

C408

39p

15

DCS_PCS_OUT

11

19

21

EGSM_OUT

RSVD_GND

P_GND

U400

SKY77318

DCS_PCS_IN

3

EGSM_IN

4

ENABLE

18

BS

1

C414

27p

C415

27p

TXON_PA

BAND_SEL

C417

NA

L402

2.7nH

C418

2.2p

3

4

1

2

7

8

5

6

9

SC400

Shield CAN

R404

NA

C409

100p

R405

NA

R406

NA

C416

100p

R407

NA

14

15

16

17

10

11

12

13

18

19

DCS_PCS_OUT

GSM_OUT

1

FL400

I1

B9310

O1_1

9

4

I2

O1_2

O2_1

8

7

O2_2

6


2 3 5 10

R408

NA

DEFAULT_BANDSEL

C419

3p

C421

3p

C422

3p

C425

3p

L404

5.1nH

L405

18nH

DCS_PCS_RXP

DCS_PCS_RXN

GSM_RXP

GSM_RXN

A

A

C

D

E

1

LGIC(42)-A-5505-10:01


2 3 4 5 6 7

- 82 -




8. BGA IC Pin Check


<U103> PMB7880

15

10

09

08

07

06

14

13

12

11

05

04

03

02

01

A B C D E F G H J K L M N P R

: Us ed

: Not used





<U100> K5L6331CAM-D270

1 2 3 4 5 6 7 8

D

E

F

A

B

C

G

H

: Us ed

: Not used



9. PCB LAYOUT

<Folder on/off SW>

-Folder on/off operation



- 85 -


9. PCB LAYOUT

<RF SW>

<Antenna SW>

-Rx, Tx switching selection

<Rx SAW filter>

-Rx operation

<PAM> -Tx amplifier operation

<Baseband plus RF IC>

-Check the battery voltage and

Outputs of LDOs -Rx operation

<Xtal> -Check the frequency

(26Mhz)

<Memory IC> -Check SW download

<Indicator LED>

-Charging LED operation

<Charging IC>

-Check the TA and battery

<Key backlight SW>

-Check all LEDs operation


- 86 -

<LCD Backlight driver>

-LCD Backlight problem

<FPCB connector>

-LCD assembly status (FPCB)

-Connetor combination

<Audio amp>

-Speaker spring contact

-Audio amp soldering

<Receiver speaker SW>

-Receiver and Speaker operation

<Xtal>

-Check the frequency (32Khz)

<FM tuner>

-FM radio operation

<SIM connector>

-Socket soldering

-Proper SIM is used

<Vibrator driver>

-Check the vibrator operation

<Back-up battery>

-RTC operation



10. Calibration

4.000V 0.0000A

10. Calibration

10.1 Calibration Steps

10.1.1 Turn on the Phone.

10.1.2 Execute “HK_24.exe”




10. Calibration

10.1.3 Click “SETTING” Menu

10.1.4 Setup “Ezlooks” menu such as the following figure



10.1.5 Setup “Line System” menu such as the following figure

10. Calibration

Adjust the number of times.

10.1.6 Setup Logic operation such as the following figure.

Operation Mode

1. By-Pass: not control by GPIB

2. Normal : control by GPIB

Setup UART Port

PWR : Power Supply

CELL :Call-Test Equipment




10. Calibration

10.1.7 Select “MODEL”.

10.1.8 Click “START” for RF calibration

10.1.9 RF Calibration finishes.



10.1.10 Calibration data will be saved to the following folder.

10. Calibration

Saving format: year/month/day_PASS

Notices:

1. The state of Phone is “ test mode “ during the CALIBRATION.

2. Calibration program automatically changes either “normal mode” or “ptest mode”.

3. RF Calibration steps as follow:

TX Channel compensation: GSM850->PCS

RX Channel compensation: GSM850->PCS

4. Phone Operation Mode




11. Stand-alone Test


11.1 Test Program Setting

1

Set COM Port.

2

Check PC Baud rate.

3 Confirm EEPROM & Delta file prefix name

1

3

2

4 Click “Update Info” for communicating Phone and Test-Program.

Not Connected

4




Connected

5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the

“Reset” bar.

6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.

6

5

Change "ptest mood"





11.2 Tx Test

1

Click “Non signaling mode” bar and then confirm “OK” text in the command line.

1

2 Put the number of TX Channel in the ARFCN.

3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.

4

Finally, Click “Write All” bar and try the efficiency test of Phone.

2

3

4



11.3 Rx Test

1

Put the number of RX Channel in the ARFCN.

2

Select “Rx” in the RF mode menu.

3 Finally, Click “Write All” bar and try the efficiency test of Phone.

3

1

2


4 The Phone must be changed “normal mode” after finishing Test.

5

Change the Phone to “normal mode” and then Click the “Reset” bar.

5

4

Change "normal mode "






12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW



- 97 -


ASS'Y EXPLODED VIEW

A

H I J

B C D

K L M

E F

N F

G

I

H

G

F

E

D

C

B

A

M

L

K

J

P

O

N

O P


- 98 -




12.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

4

4

4

4

5

5

5

5

5

5

5

5

5

5

5

5

5

5

4

5

5

5

5

5

5

Level

3

2

3

1

2

4

4

Location

No.

Description

GSM(FOLDER)

AAAY00 ADDITION

MCJA00 COVER,BATTERY

APEY00 PHONE

ACGG00 COVER ASSY,FOLDER

ACGH00

COVER

ASSY,FOLDER(LOWER)

MCJH00 COVER,FOLDER(LOWER)

MMAA00 MAGNET,SWITCH

MPBG00 PAD,LCD

MPBJ00 PAD,MOTOR

MPBN00 PAD,SPEAKER

MTAD00 TAPE,WINDOW

ACGJ00

COVER

ASSY,FOLDER(UPPER)

MCJJ00 COVER,FOLDER(UPPER)

MDAE00 DECO,FOLDER(UPPER)

MIAA00 INDICATOR,LED

MPBG00 PAD,LCD

MPBJ00 PAD,MOTOR

MPBN00 PAD,SPEAKER

MTAA00 TAPE,DECO

MTAB00 TAPE,PROTECTION

ACGK00 COVER ASSY,FRONT

MCJK00 COVER,FRONT

MDAG00 DECO,FRONT

MFBD00 FILTER,MIKE

MSGB00 STOPPER,HINGE

MSGC00 STOPPER,FOLDER

MTAA00 TAPE,DECO

GMEY00

MCCH00

MHFD00

MIDZ00

SCREW MACHINE,BIND

CAP,SCREW

HINGE,FOLDER

INSULATOR

Part Number Spec

TGFF0097701

AAAY0247801

MCJA0044401 MOLD, PC LUPOY SC-1004A, , , , ,

APEY0423302

ACGG0083301

ACGH0049301

MCJH0039301 MOLD, PC LUPOY SC-1004A, , , , ,

MMAA0001601 7100 magnetic

MPBG0062201 COMPLEX, (empty), , , , ,

MPBJ0048201 CUTTING, NS, , , , ,

MPBN0043101 COMPLEX, (empty), , , , ,

MTAD0069401 COMPLEX, (empty), , , , ,

ACGJ0064301

MCJJ0048701 MOLD, PC LUPOY SC-1004A, , , , ,

MDAE0040001 MOLD, PC LUPOY SC-1004A, , , , ,

MIAA0021501 COMPLEX, (empty), , , , ,

MPBG0062301 COMPLEX, (empty), , , , ,

MPBJ0044701 COMPLEX, (empty), , , , ,

MPBN0041701 COMPLEX, (empty), , , , ,

MTAA0137201 COMPLEX, (empty), , , , ,

MTAB0179501 COMPLEX, (empty), , , , ,

ACGK0089901

MCJK0072301 MOLD, PC LUPOY SC-1004A, , , , ,

MDAG0028001 MOLD, PC LUPOY SC-1004A, , , , ,

MFBD0023701 COMPLEX, (empty), , , , ,

MSGB0019801 MOLD, Urethane Rubber S190A, , , , ,

MSGC0000601 MOLD, Urethane Rubber S190A, , , , ,

MTAA0139101 COMPLEX, (empty), , , , ,

GMEY0002001

1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7

MCCH0107301 COMPLEX, (empty), , , , ,

MHFD0013702 COMPLEX, (empty), , , , ,

MIDZ0136901 COMPLEX, (empty), , , , ,

Black

Without Color

Without Color

18,G

I,24

Color

Black

Black

Black

Black

Black

Black

Remark

P, 37

D

14 Black

Silver

Without Color

Without Color

Without Color

Without Color

Black

13

15

A

Silver

Black

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Black

Black

Silver

Without Color

Silver

Black

Without Color

19,23

3

38

H

22

21

5

9

6

4

1

2





7

7

7

7

7

7

7

7

4

4

4

4

3

4

4

4

4

4

3

3

5

7

4

4

4

4

5

4

4

Level

6

7

6

Location

No.

Description

MRDY00 REINFORCE

MSGB00 STOPPER,HINGE

MTAB00 TAPE,PROTECTION

MTAJ00 TAPE,FLEXIBLE PCB

MWAC00 WINDOW,LCD

SACY00 PCB ASSY,FLEXIBLE

SACE00 PCB ASSY,FLEXIBLE,SMT

SACC00

PCB ASSY,FLEXIBLE,SMT

BOTTOM

CN1

CONNECTOR,BOARD TO

BOARD

SACD00

PCB ASSY,FLEXIBLE,SMT

TOP


MRDY0000601 COMPLEX, (empty), , , , ,

MSGB0019901 MOLD, PC LUPOY SC-1004A, , , , ,

MTAB0174501 COMPLEX, (empty), , , , ,

MTAJ0002001 COMPLEX, (empty), , , , ,

MWAC0080201 CUTTING, PMMA MR 200, , , , ,

SACY0061201

SACE0055601

SACC0034901

ENBY0040601

SACD0045501

30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT

,MALE ,SMD ,R/TP , ,

4

3

CN2

LD1

LD2

R1

R2

VA1

VA2

SUMY00

SUSY00

SVLM00

ACGM00

ENZY00

MCCC00

MCJN00

MLAB00

MPBF00

MPBH00

SNGF00

GMEY00

MBJA00

MLAK00

MLAZ00

MCBA00

CONNECTOR,FFC/FPC

DIODE,LED,CHIP

DIODE,LED,CHIP

RES,CHIP

RES,CHIP,MAKER

SPFY00 PCB,FLEXIBLE

VARISTOR

VARISTOR

VIBRATOR,MOTOR

SPEAKER

LCD MODULE

COVER ASSY,REAR

CONNECTOR,ETC

CAP,EARPHONE JACK

COVER,REAR

LABEL,A/S

PAD,FLEXIBLE PCB

PAD,MIKE

ANTENNA,GSM,FIXED

SCREW MACHINE,BIND

BUTTON,DIAL

LABEL,MODEL

LABEL

CAN,SHIELD

ENQY0013901

35 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC

,STRAIGHT ,BOTH ,SMD ,R/TP ,[empty] ,

EDLH0007901 RED ,1608 ,R/TP ,Indicator,0.4T Red LED

EDLH0004501 BLUE ,1608 ,R/TP ,

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000458 300 ohm,1/16W ,J ,1005 ,R/TP

SPCY0104301 POLYI , mm,MULTI-3 , ,; , , , , , , , , ,

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SJMY0007202 3 V,.08 A,12*3.4 ,17mm

SUSY0026501 ASSY ,8 ohm,91 dB,17 mm, ,; , , , , , , ,WIRE

SVLM0024701

MAIN ,1.52"(128*128) ,35.78*39.7*2.8 ,65k ,CSTN ,TM

,NT7573 ,Single

ACGM0091201

ENZY0015701 3 PIN,3 mm,ETC , ,H=6.5

MCCC0045401 MOLD, Urethane Rubber S190A, , , , ,

MCJN0068501 MOLD, PC LUPOY SC-1004A, , , , ,

MLAB0001102 C2000 USASV DIA 4.0

MPBF0021701 COMPLEX, (empty), , , , ,

MPBH0030701 COMPLEX, (empty), , , , ,

SNGF0026201 3.0 ,-2.0 dBd, ,Internal ,; ,DUAL ,-2.0 ,50 ,3.0

GMEY0002001

1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7

MBJA0024501 MOLD, Silicone Rubber KE971-U, , , , ,

MLAK0006901

MLAZ0038301 PID Label 4 Array

MCBA0019001 PRESS, STS, 0.2, , , ,

Color

White

Silver

Without Color

Without Color

Black

Remark

J

17

39

16,E

B

Black

Silver

Silver

White

Without Color

Without Color

Black

Without Color

Without Color

C

N

34

35

40

33

F, 41

K




Level

7

Location

No.

Description

MCBA01 CAN,SHIELD

Part Number

MCBA0021901 PRESS, STS, 0.2, , , ,

Spec Color

Without Color

Remark





<Main component>


6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

3

4

5

5

4

5

Location

No.

Description

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

ADCA00 DOME ASSY,METAL

SUMY00 MICROPHONE

SAFF00 PCB ASSY,MAIN,SMT

SAFC00

PCB ASSY,MAIN,SMT

BOTTOM

BAT100 BATTERY,CELL,LITHIUM

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C111

C112

C113

C114

C115

C116

C117

C118

C119

C120

C121

C122

C123

C105

C106

C107

C108

C109

C110

C100

C101

C102

C103

C104

Part Number

SAFY0210802

SAFB0075501

ADCA0067001

SUMY0003802 FPCB ,-42 dB,4*1.5 ,

SAFF0133902

Spec

SAFC0092702

SBCL0001701

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP




ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP





ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP



ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP


ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP




ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP


ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP



Color

Without Color

Remark

M

L




Level

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

C213

C215

C217

C218

C219

C220

C221

C207

C208

C209

C210

C211

C212

C142

C143

C144

C145

C200

C202

C203

C204

C205

C206

C131

C132

C138

C139

C140

C141

Location

No.

C124

Description

CAP,CERAMIC,CHIP

C125 CAP,CERAMIC,CHIP

C126

C127

C128

C129

C130

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

Part Number

Spec



ECZH0001213 0.47 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP


ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP






ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

ECCH0000153 6.8 nF,25V,K,X7R,HD,1005,R/TP

ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP



ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP














ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP





Color Remark





Level

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

C310

C311

C400

C401

C402

C403

C404

C304

C305

C306

C307

C308

C309

C237

C238

C239

C240

C241

C242

C300

C301

C302

C303

C231

C232

C233

C234

C235

C236

Location

No.

C222

Description

CAP,CERAMIC,CHIP


C226

C227

C228

C229

C230

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

Part Number

Spec










ECCH0000391 1 uF,50V ,Z ,Y5V ,HD ,2012 ,R/TP





ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

















ECCH0003002 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP





Color Remark




6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

C414

C415

C416

C418

C419

C420

Location

No.

C405

Description

CAP,CHIP,MAKER


C408

C409

C410

C412

C413

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C421

C422

C423

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C424

C425

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CN200

CONNECTOR,BOARD TO

BOARD

CN201 CONNECTOR,I/O

FB100 FILTER,BEAD,CHIP



6 FL200 VARISTOR

Part Number

Spec






ECCH0000183 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP




ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP







ENBY0040701

30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE

,SMD ,R/TP ,1.0 ,

ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

SFBH0007102 10 ohm,1005 ,Ferrite Bead



SEVY0007001 18 V,- ,SMD ,6ch, 100ohm, EMI Filter Array chip varistor

FL201 VARISTOR

FL400

FL401

J100

L200

L201

L202

L204

FILTER,SAW,DUAL

FILTER,SEPERATOR

CONN,SOCKET

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

SEVY0007001 18 V,- ,SMD ,6ch, 100ohm, EMI Filter Array chip varistor

SFSB0001301

881.5 MHz,25 MHz,1.8 dB,30 dB,1960 MHz,60 MHz,2.3

dB,12 dB,2.0*1.6*0.68 ,SMD

,869M~894M,1930M~1990M,10p,B,150_82,150_18,GSM

850+PCS Rx ,; ,881.5, 1960 ,2.0*1.6*0.68 ,SMD ,R/TP

SFAY0010101

850.1900 ,900.1800 ,2.0 dB,2.0 dB,2.0 dB,2.0 dB,ETC

,Dual Band ASM, 2.5x2.5x1.2

ENSY0014601 6 PIN,ETC , ,2.54 mm,H=2.3

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0010302 100 nH,J ,1608 ,R/TP ,chip coil

Color Remark





6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

6

6

6

6

6

6

6

6

6

Location

No.

L205

Description

RES,CHIP,MAKER

L206 RES,CHIP,MAKER

L400

L401

L402

L403

L404

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

L405

Q100

Q101

INDUCTOR,CHIP

TR,BJT,ARRAY

TR,BJT,NPN

6 Q102 TR,BJT,PNP

Q200 TR,BJT,ARRAY

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R115

R116

R117

R118

R119

R130

R131

R132

R109

R110

R111

R112

R113

R114

R100

R101

R102

R103

R104

R105

R106

R107

R108


ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ELCH0004711 22 nH,J ,1005 ,R/TP ,

ELCH0004707 1.5 nH,S ,1005 ,R/TP ,

ELCH0004708 2.7 nH,S ,1005 ,R/TP ,

ELCH0004726 1.5 nH,J ,1005 ,R/TP ,

ELCH0009110 5.1 nH,J ,1005 ,R/TP ,chip coil

ELCH0004714 18 nH,J ,1005 ,R/TP ,

EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use

EQBN0007601 SOT-23 ,0.15 W,R/TP ,EMT3

EQBP0006402

VSM ,100 mW,R/TP ,EPITAXIAL PLANAR PNP

TRANSISTOR

EQBA0004902

TES6 ,200 mW,R/TP ,NPN/PNP dual, Vo1=50V,

Io1=100mA, Vo2=-50V,Io2=-100mA

ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000278 82K ohm,1/16W,J,1005,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000278 82K ohm,1/16W,J,1005,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

Color

Remark




Level

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

R234

R294

R295

R296

R297

R298

R299

R220

R221

R222

R224

R225

R226

R208

R209

R210

R211

R212

R215

R216

R217

R218

R219

R202

R203

R204

R205

R206

R207

Location

No.

R133

Description

RES,CHIP,MAKER

R136 RES,CHIP,MAKER

R137

R138

R139

R200

R201

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER


ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000506 6800 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000477 390 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003401 1800 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000450 240 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000460 30 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP



ELCH0005009 100 nH,J ,1005 ,R/TP ,




Color Remark





6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

R300

Description

RES,CHIP,MAKER

R301 RES,CHIP,MAKER

R302

R303

R304

R305

R306

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R307

R309

R310

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R403 RES,CHIP,MAKER

SC400 CAN ASSY,SHIELD

SW400 CONN,RF SWITCH

6 U100 IC

U101

U102

U103

U200

IC

IC

IC

IC

U201

U300

U301

U302

U303

IC

IC

IC

IC

IC

U400 PAM

VA200 VARISTOR

VA201 VARISTOR

VA202 VARISTOR

VA203 VARISTOR

VA204 VARISTOR

VA205 VARISTOR

VA206 VARISTOR

VA207 VARISTOR

VA208 VARISTOR

Part Number Spec Color

ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000476 39 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000454 27 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ACKA0002801

ENWY0004401 ,SMD , dB,H=2.2

EUSY0304302

64Mb NOR63 3V+utRAM32Mb ,56 PIN,R/TP ,W7 L9

H1.2

EUSY0176402 Flip-Chip CSP ,9 PIN,R/TP ,Audio Power Amplifier

EUSY0300101

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

EUSY0317401 BGA ,189 PIN,R/TP ,E-Gold voice

EUSY0238702

TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge

Pump(AAT2154 Low cost version)

EUSY0292601

DFN ,8 PIN,R/TP ,Li-ion charger IC, 8 Ld 2 x 3 DFN, Pbfree

EUSY0320801 QFN ,20 PIN,R/TP ,FM Tuner Chip, 3*3*0.57, Pb Free

EUSY0142501 LLP ,8 PIN,R/TP ,Dual 105mW Headphone Amplifier

EUSY0223002

HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH

OUTPUT CONTROL / 2.8V

EUSY0300101

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

Without Color

Remark




6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

5

6

6

6

6

6

6

6

6

6

6

6

Level

6

6

6

6

Location

No.

X100

X101

Description

VA209 VARISTOR

VA210 VARISTOR

X-TAL

X-TAL

R126

R127

R128

R129

R227

R228

R229

R230

SAFD00 PCB ASSY,MAIN,SMT TOP

C133 CAP,CHIP,MAKER

C134

C135

C136

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER


LD100 DIODE,LED,CHIP






R121

R122

R123

R124

R125





R120 RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER


SEVY0004101 5.6 V, ,SMD ,360pF, 1005

SEVY0004101 5.6 V, ,SMD ,360pF, 1005

EXXY0018404

26 MHz,10 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.6 ,12ppm at -30'C ~ +85'C, C0 1.0pF, C1 3.6fF ,; ,26 ,10PPM ,8 , ,

,SMD ,R/TP

EXXY0004602

.032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD

,6.9*1.4*1.3 ,

SAFD0091902

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP




EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

EDLH0004501 BLUE ,1608 ,R/TP ,

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

Color Remark





Level

6

6

6

6

6

6

6

6

Location

No.

R231

Description

RES,CHIP,MAKER

R232 RES,CHIP,MAKER

R233

R235

R236

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R237 RES,CHIP,MAKER

SPFY00 PCB,MAIN

U104 IC

Part Number

Spec

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP

SPFY0153601 FR-4 ,0.8 mm,BUILD-UP 6 , ,; , , , , , , , , ,

EUSY0250001 Leaded ,4 PIN,R/TP ,Hall IC

Color Remark




12.3 Accessory


Level

3

3 SGEY00

EAR PHONE/EAR MIKE

SET

3

Location

No.

SBPL00 BATTERY PACK,LI-ION

SSAD00

Description

ADAPTOR,AC-DC


SBPL0089504

SGEY0003213

3.7 V,750 mAh,1 CELL,PRISMATIC ,WLT, BATT, Latin

America Label, Pb-Free ,; ,3.7 ,750 ,0.2C ,PRISMATIC

,43x34x46 , ,BLACK ,Innerpack ,Latin America Label

; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty]

,BLACK,EARPHONE HOUSING:SILVER ,18P MMI

CONNECTOR ,LOW COST STEREO,18P(5P) ,

SSAD0024601

100-240V ,5060 Hz,5.1 V,.7 A,NOM ,AC-DC ADAPTOR ,;

,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,

,WALL 2P ,I/O CONNECTOR ,

Color

Black

Remark

36, O




Note

Note

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