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3. TECHNICAL BRIEF
3.14 Power Block Interface
VBAT
FB100
C109
0.1u
C105
2.2u
C106
1u
C107
1u
C108
1u
C8
KP0
C100
1u
C101
1u
C102
1u
C103
1u
R100
C110
22K
220n
C104
4.7u
REXT
D12
XOX
A9
A8
Figure 3-14-1 Power Block interface
The E-Gold voice integrated power management unit (PMU) supports direct connection to battery
(DCB). That means all supply voltages needed are generated on-chip with integrated linear voltage regulators. The input of these linear voltage regulators is the battery voltage. The external memory and
SIM card supply is provided by the on-chip voltage regulators. Table 144 is an overview of the internal generated supply voltages.
The integrated power management also provides the control state machine for system start up, including start up with discharged batteries, trickle charging and system reset control. After system start up several methods are implemented for active and idle power saving.
LGE Internal Use Only - 40 Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Name
LRTC
LD1
LIO
LRFXO
LMEM
LANA
LSIM
LBUF
LRFRX
LRFTRX
Output Voltage(V) Output Current (mA) Comment
2.0
4 Used for the real time and digital PMU supply
1.2/1.5
1.8/2.85
2.5
1.8/2.85
150
30
10
100
Used for the core supplies (MCU and DSP via switch)
Used for the I/O pad supply and, for example, the display
Used for the crystal oscillator supply
Used for the external memory supply, voltage can be configured during startup
2.5
100
1.8/2.85
2.6/2.8/3.0/3.2
2.5
1.5
30
300
100
120
Used for analog (audio and baseband processing) and headset driver
Used of the SIM card supply
Used for the loudspeaker and earpiece driver
Used for the RF RX part
Used for the RF TX/TX part
Figure 3-14-2 EGlod Voice PMU
LDO output voltage selection
• LD1, LIO, LSIM, LBUF output voltage programmable by software.
• LMEM output voltage is selectable by pin configuration upon startup.
Active and idle power saving options:
• The flexible clock switching options allow minimizing the power consumption during the operation phases of the E-GOLD voice.
• Current consumption during the standby mode is minimized by reducing the clock to 32 kHz and switching it off for most of the device. In addition, the power supply for the TEAKLite ROM is switched off and the controller RAM is switched to a power saving mode.
Start-up and Reset Control State Machine Features
• Power up upon battery insertion, push button, alarm, charger connection.
• Detection of battery exchange or re-insertion.
• Complete start-up sequence management.
• System turn-on, system turn-off operation management including emergency (under-voltage) and programmed shutdown functions.
• Internal reset of the baseband, including silent reset.
• Tri-state function of the baseband module.
• Standby mode controlled by VCXO_EN provided by SCCU module.
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 41 LGE Internal Use Only
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Table of contents
- 6 1. INTRODUCTION
- 6 1.1 Purpose
- 6 1.2 Regulatory Information
- 8 1.3 ABBREVIATION
- 10 2. PERFORMANCE
- 10 2.1 Product Name
- 10 2.2 Supporting Standard
- 10 2.3 Main Parts: GSM Solution
- 11 2.4 H/W Features
- 15 3. TECHNICAL BRIEF
- 15 3.1 Digital Main Processor(PMB7880)
- 23 3.2 Power Amplifier Module (SKY77318)
- 25 3.3 26 MHz Clock (DCXO)
- 26 3.4 RTC(32.768KHz Crystal)
- 27 3.5 LCD Interface(3-wire SPI interface)
- 29 3.6 SIM Card Interface
- 30 3.7 KEYPAD Interface
- 31 3.8 Battery Charging Block Interface
- 32 3.9 RF Interface
- 34 3.10 Audio Interface
- 38 3.11 Key LED Interface
- 39 3.12 Vibrator Interface
- 40 3.13 Memory Interface
- 41 3.14 Power Block Interface
- 43 Function difference
- 44 3.16 BOM difference
- 45 4. TROUBLE SHOOTING
- 45 4.1 Trouble Test Set-up
- 46 4.2 Power On Trouble
- 48 4.3 Charging Trouble
- 50 4.4 Vibrator Trouble
- 52 4.5 SIM Card Trouble
- 54 4.6 KEY backlight Trouble
- 55 4.7 RTC Trouble
- 56 4.8 LCD Trouble
- 58 4.9 Speaker Trouble
- 60 4.10 Receiver Trouble
- 61 4.11 Headphone Trouble
- 63 4.12 Microphone Trouble
- 64 4.13 RF Components
- 65 4.14 RX Receiver Part
- 68 4.15 TX Transmitter Part
- 72 5. DOWNLOAD
- 72 5.1 Download Setup
- 73 5.2 Download Process
- 78 6. BLOCK DIAGRAM
- 80 7. CIRCUIT DIAGRAM
- 84 8. BGA IC Pin Check
- 86 9. PCB LAYOUT
- 88 10. Calibration
- 88 10.1 Calibration Steps
- 93 11. Stand-alone Test
- 93 11.1 Test Program Setting
- 95 11.2 Tx Test
- 96 11.3 Rx Test
- 98 REPLACEMENT PART LIST
- 98 12.1 Exploded View
- 100 12.2 Replacement Parts
- 112 12.3 Accessory