SIM800H&L_ Secondary Reflow SMT
_Guidelines_V1.00
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Document Title:
Version:
SIM800H&L_ Secondary Reflow SMT_Guidelines
1.00
Date:
2013-08-30
Status:
Document Control ID:
Release
SIM800H&L_ Secondary Reflow SMT_Guidelines_V1.00
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by SIMCom. The information provided is based upon requirements specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change.
Copyright
This document contains proprietary technical information which is the property of SIMCom
Limited., copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2013
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Contents
1.
Storage Notes ....................................................................................4
1.1.
The Moisture Sensitivity Level........................................................................4
1.2.
Baking Requirements.......................................................................................4
2.
PCB Design Notes ............................................................................6
2.1.
Layout Requirements .......................................................................................6
3.
Assembly Instructions .....................................................................7
3.1.
Stencil Design ..................................................................................................7
3.2.
Reflow Profile..................................................................................................8
3.3.
Reflow Times ...................................................................................................9
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Version History
Author
songjialin
Date Version Description of change
2013-09-05 1.00
Scope
This document can apply to SIM800H and SIM800L modules.
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1. Storage Notes
1.1. The Moisture Sensitivity Level
The moisture sensitivity level of SIM800H&L is 3. The module should be mounted within 168 hours after unpacking in the environmental conditions of temperature <30 ℃ and relative humidity of <60% (RH). It is necessary to bake the module if the above conditions are not met.
Table1: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
1
Floor Life (out of bag) at factory ambient≤30°C/60% RH
or as stated
Unlimited at ≦30℃/85% RH
2
2a
3
4
1 year
4 weeks
168 hours
72 hours
5
5a
48 hours
24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.
NOTES:
For product handling, storage and processing, IPC/JEDEC J-STD-033 must be followed.
1.2. Baking Requirements
SIM800H&L modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under the following conditions: the environment temperature is lower than 40
℃, and the air humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of permanent damage during re-flow soldering. z If the vacuum package is broken or leakage; z If the vacuum package is opened after 6 months since it’s been packed; z If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient
≦30℃/60%RH or as stated.
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Table 2: Baking requirements
Baking temperature
40
℃
±5
℃
120
℃
±5
℃
Moisture
<5%
<5%
Time
192 hours
6 hours
NOTES
：
Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, otherwise the tray may be damaged by high-temperature heating.
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2. PCB Design Notes
2.1. Layout Requirements
z For SIM800H&L modules, layout of other components within 1mm area is prohibited. The minimum distance on the PCB edge from SIM800H&L modules is 1.5mm. z If the PCB layout is double-sided, it is suggested that SIM800H&L side is the last for reflow.
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3. Assembly Instructions
3.1. Stencil Design
Recommended thickness of the SIM800H&L stencil is 0.12mm; For stencil design, please refer to
Figure1 and Figure2.
Figure 1: Recommended SMT stencil outline A (Unit: mm)
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Figure 2: Recommended SMT stencil outline B (Unit: mm)
3.2. Reflow Profile
Recommend the solder paste type: M705-GRN360-K2-V.
Please refer to the recommended ramp-soak-spike reflow profile as following shows.
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Figure 3: Standard temperature curve and the parameter range of lead-free processes
NOTES
：
Recommended temperature curve of different solder paste is not completely consistent,
The temperature curve of solder paste please contact suppliers.
3.3. Reflow Times
For SIM800H&L modules, the reflow time should be not more than one time after the modules delivered to customer.
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H
Contact us:
Shanghai SIMCom Wireless Solutions Co.,Ltd.
Address: Building A, SIM Technology Building, No. 633, Jinzhong Road, Shanghai,
P. R. China 200335
Tel: +86 21 3252 3300
Fax: +86 21 3252 3020
URL:
www.sim.com/wm
