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1. Storage Notes
1.1. The Moisture Sensitivity Level
The moisture sensitivity level of SIM800H&L is 3. The module should be mounted within 168 hours after unpacking in the environmental conditions of temperature <30 ℃ and relative humidity of <60% (RH). It is necessary to bake the module if the above conditions are not met.
Table1: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
1
Floor Life (out of bag) at factory ambient≤30°C/60% RH
or as stated
Unlimited at ≦30℃/85% RH
2
2a
3
4
1 year
4 weeks
168 hours
72 hours
5
5a
48 hours
24 hours
6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.
NOTES:
For product handling, storage and processing, IPC/JEDEC J-STD-033 must be followed.
1.2. Baking Requirements
SIM800H&L modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage under the following conditions: the environment temperature is lower than 40
℃, and the air humidity is less than 90%.
If the condition meets one of the following ones shown below, the modules should be baked sufficiently before re-flow soldering, and the baking condition is shown in below table; otherwise the module will be at the risk of permanent damage during re-flow soldering. z If the vacuum package is broken or leakage; z If the vacuum package is opened after 6 months since it’s been packed; z If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient
≦30℃/60%RH or as stated.
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Table 2: Baking requirements
Baking temperature
40
℃
±5
℃
120
℃
±5
℃
Moisture
<5%
<5%
Time
192 hours
6 hours
NOTES
：
Care should be taken if that plastic tray is not heat-resistant, the modules should be taken out for preheating, otherwise the tray may be damaged by high-temperature heating.
