SAMSUNG Lotus-13R TSP notebook SERVICE MANUAL

Below you will find brief information for notebook Lotus-13R TSP. This notebook has a 13.3-inch display with a Touch Screen Panel, an Intel IvyBridge processor, and a variety of other features. It has a battery capacity of 6890mAh and a battery rating of 52Wh. It also includes a 3-in-1 memory card reader, a built-in speaker, and a high-definition audio codec. This notebook is designed for users who need a portable and versatile device. It is perfect for students, professionals, and anyone who needs to work on the go

PDF

Document

NP540U3C

Lotus-13R-TSP

SERVICE MANUAL

540U3C Contents

1. Precaution

2. Introduction

3. Desassembly and Reassembly

4. Trouble shooting

5. System Wire Diagram

Refer to the service manual in the GSPN (see the rear cover) for more information.

Contents

Precaution........................................................................................................................................ 1 − 1

1.1.

General After-Sales Service Precautions....................................................................................... 1 − 1

1.2.

Safety Precautions ................................................................................................................... 1 − 2

1.3.

Ground .................................................................................................................................. 1 − 3

1.4.

Static Electricity Precautions...................................................................................................... 1 − 4

Introduction ..................................................................................................................................... 2 − 1

2.1.

Product Features ...................................................................................................................... 2 − 1

2.2.

Specification ........................................................................................................................... 2 − 2

2.3.

Comparing product specifications ............................................................................................... 2 − 8

2.4.

Function of Product.................................................................................................................. 2 − 9

2.5.

New Technology / ability .......................................................................................................... 2 − 13

2.6.

Hardware ............................................................................................................................... 2 − 31

2.7.

Software ................................................................................................................................ 2 − 38

2.8.

System Setup (Bios Setup)......................................................................................................... 2 − 41

2.9.

HW & Option Materials ............................................................................................................ 2 − 48

Desassembly and Reassembly.............................................................................................................. 3 − 1

3.1.

MainSystem............................................................................................................................ 3 − 1

3.2.

LCD...................................................................................................................................... 3 − 4

Trouble shooting ............................................................................................................................... 4 − 1

4.1.

General spec ........................................................................................................................... 4 − 1

4.2.

Debugging Flow Chart.............................................................................................................. 4 − 2

4.3.

Hardware Troubleshooting ........................................................................................................ 4 − 5

4.3.1.

LCD ......................................................................................................................... 4 − 5

4.3.2.

Main System .............................................................................................................. 4 − 6

4.4.

Diagnosis application ............................................................................................................... 4 − 11

4.5.

Bios & Micom Update .............................................................................................................. 4 − 13

4.6.

RTC Reset .............................................................................................................................. 4 − 14

4.7.

Battery Use time...................................................................................................................... 4 − 15

4.8.

CPU FAN Control.................................................................................................................... 4 − 16

4.9.

System Diagnosis .................................................................................................................... 4 − 18

4.10. Hardware Upgrade ................................................................................................................... 4 − 19

System Wire Diagram ........................................................................................................................ 5 − 1

5.1.

System Layout ........................................................................................................................ 5 − 1

5.2.

Board Component .................................................................................................................... 5 − 4

Precaution

1. Precaution

1.1. General After-Sales Service Precautions

1) Do not let customers repair the product themselves..

› There is a danger of injury and the product life time may be shortened.

2) Make sure to disconnect the power cord from the wall outlet before repairing the product (especially for after-sales service of electric parts).

› There is a danger of electric shock.

3) Do not let customers plug several electric home appliances into a single wall outlet at the same time.

› There is a danger of fire due to overheating.

4) Check if the power plug or wall outlet are damaged in any way.

› If a defect is found, repair or replace it immediately.

(There is a danger of electric shock or fire)

5) Make sure that it is properly grounded.

(Check the ground of the wall outlet)

› Electricity leakage may cause electric shock.

(READING S HOULD)

NOT BE ABOVE 0.5mA

DEVICE

UNDER

TES T

TES T ALL

EXP OS ED METAL

S URFACES

2-WIRE CORD

LEAKAGE

CURRENT

TES TER

*ALS O TES T WITH

P LUG REVERS ED

(US ING AC ADAP TER

P LUG AS REQUIRED)

EARTH

GROUND

Figure 1.1

Leakage Current Test Circuit

6) Do not spray water on to the product to clean it.

› There is a danger of electric shock or fire and it may shorten the lifetime of the product..

7) Check the assembly status of the product after the after-sales service..

› The assembly status of the product must be the same as before the after-sales service.

8) Unplug the power cord holding the power plug (and not the cord).

› If the cord is disconnected, it may cause electric shock or fire.

9) Repair the product using only authorized parts

10) Keep the product away from heating devices such as heaters.

› Exposure to heaters may cause deformation of the product or fire.

1-1

1. Precaution

1.2. Safety Precautions

1) EMI

This device has been registered regarding EMI for residential use. It can be used in all areas.

2) Circuit Test (Logic Test) Precautions

The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since these types of devices are highly susceptible to static electricity or current leakage, an isolation break may be caused.

Therefore read and follow the instructions below.

a) When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms of resistance. In addition, wear gloves and a jacket made of cotton and not of synthetic fibers that easily generate static electricity.

b) When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the earth on the worktable.

c) You must use a soldering iron without a leakage current.

d) Do not touch the pin of an IC and carefully insert the IC into the black plastic package.

e) When inserting an IC into a PCB, be careful with the direction of the IC. When installing an IC in the wrong direction, it might become damaged.

f) When carrying an IC, package the IC with conducting material such as aluminum foil or conducting sponge so as to keep the voltage level of each of the terminals the same.

g) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.

h) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.

i) When soldering an IC, solder it in as short a time as possible so that unnecessary heat is not applied to the device.

j) Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering a custom IC.

k) Take care to not damage the board when installing or separating an Option Board.

l) Take care to not break the printed circuit pattern on the PCB when separate an IC.

Precaution

1.3. Ground

The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multi tap with a ground terminal only.

If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid using wall outlets if they are not grounded even if they have a ground terminal.

To ground the product, connect the ground to an exclusive ground terminal or metal water pipe. Connect the ground cable to the ground terminal at the rear of the main body. To ground the product, connect the ground terminal of the product to a metal water pipe, wall outlet or exclusive ground terminal with an electric wire equal to or thicker than #18.

Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or gas pipe, because this does not actually ground the product and may be dangerous.

The red box of each image is earth with overlap when inserting a plug or multiple-tab into the socket.

Please check that it should be put the outlet completely.

1-3

1. Precaution

1.4. Static Electricity Precautions

Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD) device is very important for the safety of the user and the user's surroundings. Using an ESD device increases the probability of a successful repair and lowers the expenses for damaged parts.

To prevent static electricity, follow the instructions below.

1) Perform the repair in a location without static electricity.

2) Touch your hands to a metal water pipe or some metal object connected to the ground to discharge any static

Electricity from your body before handling the parts.

3) Touch only the edges of the board, if possible.

4) Do not touch any parts unless absolutely necessary

5) Disassemble the parts on the anti-static-electricity pad.

6) When a board is not installed in the system, package the board with an anti-static-electricity packaging.

2. Introduction

2.1. Product Features

Introduction

2-1

2. Introduction

2.2. Specification

Processor* and Motherboard

CPU

Cache

Chipset

BIOS

Thermal Design (TDP)

Memory*

Maximum Capacity

Type (MHz)

Modules

Sockets

Upgradeable by users

Display and Graphics*

LCD

Ratio

Panel

Surface Type

Back Light

Interface

Vendor

Resolution (Number of Pixel)

Viewable Area

Viewing angle

Pixel Pitch

Contrast Ratio

Brightness

Colors

Response time

Graphics Controller 1

Intel® IvyBridge Processor i3 3217U 1.50Hz, 3 MB

Intel® IvyBridge Processor i5 3317U 1.70Hz, 3 MB (Up to 2.6 GHz)

Intel® IvyBridge Processor i7 3517U 1.9GHz, 4 MB (Up to 3 GHz) Max Spec

L3:3~4MB

Intel HM76

64 Mbit SPI flash, upgradeable

MAX.17W

MAX. 12GB (on BD 4GB + 8GB x1)

DDR3 (1333MHz/1600MHz)

4GB( (on BD 4GB)

6GB(on BD 4GB + 2GB x 1)

8GB(on BD 4GB + 4GB x 1, Later introduction schedule) SODIMM

1-slot SODIMM & On-board (up to 4GB) '1 Slot Per Max. 8GB Support'

Yes

※ PC3-10600(1333Mhz), PC3-12800(1600Mhz) confirmed the compatibility test.

13.3" With TSP(Touch Screen Panel : electrostatic, tempered glass)

* Not support 3 Display

16:9

Non Glare

LED

Samsung

HD (1366x768) Win7 Support /Win8 Support

(1366 X 768,1360 X768, 1280 X 768,1280 X720,1280 x 600, 1024 X 768, 800 X

600)

293.42(H) X 164.97(V)

Hor. +45/-45, Ver. +15/-30(typ)

0.2148(H) x 0.2148(V)

Min.300, Typ.400

typ.300 (cd/m2)

16.2M

Typ.16ms, Max. 25ms (Rising + Falling = LCD response speed)

1.Intel HD Graphics 4000 (Internal)

Max. resolution for VGA

Max. resolution for HDMI

Max. Resolution for LFP LVDS

Multimedia

Sound

Controller

Conversion

Internal Interfaces

Speaker Power Rating

External Interfaces

Controls

Camera

Image sensor

Still Image Capture Resolution

Video Capture Resolution

Frame Rate

Output Video Format

Interface

UVC Support

Storage*

Hard Disk Drive

Vendor

Supports

Average Access Time

Interface

Speed

Capacity

Solid State Drive

Vendor

Supports

Average Access Time

Interface

Speed

Introduction

Max resolution of 2560x 1600 at 60Hz at 85Hz refresh rate (ext.)

Supported resolution (640x480,800x600, 1024x768, 1152x864,

1280x800,1280x960,1280x1024, 1400x1050,1440x900,1600x1024,1600x1200,

1680x1050, 1920x1200, 1920x1440, 2560x1600)

[Ext.monitor resolutions supported by EDID information]

Support v1.4a compliant / a resolution of 1920x1200 pixels with 32-bit color at 60 Hz dual link resolution of 2560 X 2048 per link / a maximum theoretical pixel rate of 224 MP/s

(640x480,800x600, 1024x768, 1152x864, 1280x800,1280x960, 1280x1024,

1400x1050, 1440x900,1600x1024,1600x1200, 1680x1050, 2560x2048)

[Ext.monitor resolutions supported by EDID information]

High Definition Audio

HD Audio Codec, ALC269Q-VC2-GR

Built-in high performance 24-bit ADC & 24-bit DAC

Embedded stereo speakers, Internal Mono MIC

2 Speakers x 2 Watt with enclosure each

Headphone/Mic Combo, Not Support S/PDIF

Keyboard volume control

1.3 Mega CMOS Color Image Sensor

1280*1024(Max.), 1280*720, 800*600, 640*480, 352*288, 320*240

30fps @ HD, 24MHz MCLK

SXGA, HD, SVGA, VGA, CI and QVGA

USB 2.0

Supported

7mmH 2.5" HDD, Removable (with Express cache 24GB=iSSD SATA3)

* 9.5mmH 2.5" HDD installation impossibility

HITACHI (BA59-03210A)

SATA host controller support 48bit LBA

12m sec.

SATA2 (3.0Gbps) * SATA 1 Support, SATA 3 Not Suppot.

5400rpm

500GB(Max) mSATA SSD, Removable

SanDisk (BA59-03232C)

SATA host controller support 48bit LBA

Read : Up to 450 MB/S Write : Up to 350 MB/s

SATA3 (6.0Gbps) * SATA 1,2 Support.

6.0Gbps

2-3

Controller

Vendor

Express Card Slots

I/O Ports

USB Port

VGA Port

Audio Jacks

Wired LAN

HDMI

Security Slot

Power

Input Devices

Keyboard

Type

2-4

2. Introduction

Capacity

Network Tools

LAN

Controller

Vendor

Features

Wireless LAN

Module

Type

Interface

Chipset

Max. Link Speed

Antenna

Wireless LAN

Module

Type

Interface

Chipset

Max. Link Speed

Antenna

I/O Interface

Memory Card Reader

- maximum support capacity

128GB(Max.256GB)

Integrated 10/100/1000 Mbps Ethernet

RTL8111E

Realtek

RJ45 Output

Jackson Peak2 2x2 Combo (BA59-03294A) * WiDi Support

802.11a/g/n 2x2 WLAN and BT4.0 (BLE , BT3.0 +HS)

Mini Card half size

WLAN(PCI-E), BT(USB2.0)

Intel Centrino Advanced-N 6235

Wi-Fi Rx/Tx Throughput 300Mbps (Link Speed is only standard value, Actually value will decided by each environmant)

2 Antenna Support : WLAN (2Tx/Rx)

Atheros WB225 (BA92-08418A)

802.11b/g/n 1x1 WLAN and BT 4.0 (BLE , BT3.0 +HS)

Mini Card half size

WLAN(PCI-E), BT(USB2.0)

AR9485(WLAN) + AR3012(Bluetooth)

Wi-Fi Rx/Tx Throughput150Mbps (Link Speed is only standard value, Actually value will decided by each environmant)

1 Antenna Support : WLAN (1TX, 1RX), BT(1TX/RX)

3-in-1( SD/ SDHC/ SDXC)

SD (SDHC +SDXC)

SDHC : 32GB

SDXC : 1TB

GL823

GENESY

N/A

1 X USB 3.0 (Chargeable→ iphone Recharge), 2 X USB2.0

mini VGA Adapter (Option) [BA39-01189A]

HeadPhone-out, MIC-in Combo (4pole) * US , L/R/G/M

RJ45

1 x HDMI

N/A

1 x DC-in jack for AC adapter (3Pie)

Chicklets

Introduction

Specification

Key numbers

Num Keypad

Touchpad

LED Indicator

Security Solutions

TPM(Option)

Interface

Controller

Vendor

Application

Power and Power Management

System power management

Power management features

Standard battery

Model code

Type

Details of cell

Battery capacity

Battery rating

Voltage

Color

Dimension

Weight

Recharging Time

Vendor

AC Adapter

Model Name

Output Power

Dimension

Weight (AC Adapter)

Worldwide Compatibility

Line Frequency

Adapter Rating - Input

Adapter Rating - Output

System Dimensions

Pyxical Information

Dimensions (W X D X H)

Weight

- Condition

Package dimensions (W x D x H)

Travel length : 1.5 mm, height : 3.9 mm, Pitch : 19.05mm

80 - key (US,KOR,RUS,SEK) 81- Key (UK,FRA, GER, SPA, ITA )

N/A

Standard Touchpad with 2 buttons (with gesture function), 99.0 x 53.0

Power, AC-in / battery, HDD, WLAN

Trusted Platform Module 1.2

LPC

SLB 9635 TT 1.2

Infineon

Omnipass / TPM Host SW

ACPI V2.0 compliant S0 ~ S5, C1~ C6 Mode

AA-PLWN4AB

Li-Polymer

4 cells

6890mAh

52Wh

7.56V

Black

265.8*104.11*6mm (W x D x H) approximate 315g approximate 3 hours

SDI, Dynapack

AD-4019P (BA44-00279A)

40W

92.5 x 38.5 x 27.5mm (W x H x D)

175g (Max)

Auto-sensing 100 - 240VAC

50 / 60Hz

100 VAC ~ 240 VAC, 1.0 A

19.0VDC / 2.1A

315.1 x 218.9 x 19.9mm

1.64Kg (W/ SSD) 1.69Kg(W/ HDD)

Full System with 4 cell Battery (With Bag: ±0.06Kg, WithOut Bag: ±0.04)

All Nation Common (With bag) 386 x 136 x 345 mm (Without bag) 395 x 330 x82 mm

2-5

2. Introduction

Design

LCD Back

LCD Front

System Top

System Bottom

Operating system

Aluminum

Glass

Aluminum

PA/GF 50%

Win8

Label Location

Introduction

2-7

2. Introduction

2.3. Comparing product specifications

2.4. Function of Product

Introduction

2-9

2. Introduction

Keyboard

Introduction

Keyboard arrangement and size can differ to by each country.

○ : KBD Water Check sheet Location

2-11

2. Introduction

2.5. New Technology / ability

Inner Battery

Introduction

TPM (Option)

※ Please Refer to the Training manual chapter1.

2-13

2. Introduction

Introduction

2-15

2. Introduction

Introduction

2-17

2. Introduction

USB3.0

Introduction

iSSD

2-19

2. Introduction

Wireless Display

※ Please Refer to the Training manual chapter1.

Introduction

※ Please Refer to the Training manual chapter1.

2-21

2. Introduction

Windows 8

Introduction

2-23

2. Introduction

Introduction

2-25

2. Introduction

Touch Screen (Option)

Introduction

2-27

2. Introduction

Introduction

2-29

2. Introduction

2.6. Hardware

New H/W - ISSD

Introduction

2-31

2. Introduction

(1) Intel’s 2012 Mobile Platform : Cheif River

Introduction

2-33

2. Introduction

Introduction

2-35

2. Introduction

BT 4.0

Introduction

2-37

2. Introduction

2.7. Software

Driver

Application

ItmName

Heci(Chief River,SWDESC)_Package 8.1.0.1248 for Win8(8.1.0.1248 )

Touchpad- Elan - (11.7.2.1_WHQL)

Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC (SC-13HDL11431N)(-)

Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC LED VE (SC-13HDL12131N)(-)

QCA Bluetooth Driver Win8- (8.0.0.206)

QCA WLAN Driver Win8- (10.0.0.75 WHQL)

Intel Bluetooth Driver (Win8)(2.5_PV2)

Intel WLAN Driver (e64)(15.5.0.42 PV HF1 BTHS MWT)

ExpressCache (for x64)(1.0.92.0)

Win 8 64bit Professional(v.9200)

Win 8 64bit Standard(v.9200)

Intel IvyBridge Windows8 GFX driver - 64bit(9.17.10.2817 (WHQL_Generic))

Realtek ALC26X Win8/Win7 Snd Drv(6.0.1.6699Logo)

Intel Rapid Start Technology Driver for Windows 8(2.1.0.1002)

Win8-Realtek LAN Driver[Gigabit](8.2.612.2012) iRST Win8 for NP(11.5.0.1207PV-W8Inst)

Lotus_Jones_TSP_SS Enable(1.0.0.2)

Infineon TPM Utility (Win8)(4.3.0.3137)

Airplane Mode Control Driver(Win8, 64bit)(6.2.8400.4218)

Intel Wireless Display (3.5.34.0 PV)

Kindle for Metro (Samsung)

Shark Dash for Metro

Photo Editor

MusicHub

FamilyStory

ChatOn

Birzzle for Metro

StumbleUpon for Metro

Netflix

Tuba.FM for Metro

Onet.news for Metro

MS_Mahjong

BugsMusic

WildTangent Games for Metro

CineTrailer for Metro ilMeteo for Metro

Application

ItmName

RepubblicaTV for Metro

PagineGialle for Metro

Rai.TV for Metro

Merriam-Webster Dictionary

MusixMatch

TVN Player

Le Monde

Tele7

Allo Cine

Kiosque Relay

Financial Times

Parcel Genie

MS_Adera

MS_Taptiles

National Rail

Fresh Paint

Metro_Layout_for_NotePC_Intel_MS_Featured_Only

MS_Pinball_FX2

Dailymotion

ChatON(Canada)

Music Maker Jam

Windows Reader Metro Pinning

SkyNews

Norton Studio

News Republic

Jamie Oliver's Recipe for Metro

Skype(Metro) for Win8

Match'A' Shape for Metro

S Player for Win8 Metro

S Camera for Win8 Metro

S Gallery for Win8 Metro

Evernote Metro for Win8

Accessory Store

IE Default HomePage(MSN)_64bit (Jumpstart'12)

SkyNews

Adobe Reader for Win 8

Sogou 6.2 for Win8

Introduction

2-39

2. Introduction

Software — Previous/New

※ For more information, product descriptions and installation training manuals refer to Chap.1

Development Stage Information

※ Consultation of development stage (Known Issue&spec)

Please refer that [Consulting Script]->[Consultation].

2.8. System Setup (Bios Setup)

Introduction

2-41

2. Introduction

Introduction

2-43

2. Introduction

Introduction

2-45

2. Introduction

Introduction

2-47

2. Introduction

2.9. HW & Option Materials

Basic Item

Optional

Introduction

2-49

2. Introduction

3. Desassembly and Reassembly

3.1. MainSystem

CAUTION disassembling the system.

1.memory door disassembling

- After removing 1 screw up to the remove the memory door.

mini SSD card (mSATA)

At first disassemble screw( red circle ) change mini SSD card module

< Picture of system which remove memory door. >

Cover disassembling

- Remove 8 screws for removing Bottom.

- 3 Red Circle : Careful! The hook can be broken.

< Picture of system which removed Bottom >

HDD disassembling

Remove 4 (Red circle) Screw, and take out FPC cable from the connector.

3-1

3. Desassembly and Reassembly

Battery disassembling

-Remove 5 (Red circle) Screw, and take out Battery

Jack from the connector.

DC jack cable disassembling

- DC jack cable(Red Square) Pull and remove it.

WLAN disassembling

-After removing 1 screw (Red circle) up to the remove the Wlan.

10. Memory disassembling

- Loosen both sides of the hook to remove the memory.

KBD Membrain TP SUB FFC disassembling

- KBD Membrain TP SUB FFC is separated by pulling to the top.

11. Fan disassembling

After removing 2 screws, remove the 3 screws in Sink outlet.

LCD Cable and TSP cable disassembling

- LCD/TSP Cable(Red Square) Pull and remove it.

12. Main Board disassembling

– After removing 2 screw up to the remove the Main board

- cf) Yellow circle for Lotus-R not Lotus-TSP

13.

< After full decomposition appearance. >

3. Desassembly and Reassembly

3-3

3. Desassembly and Reassembly

3.2. LCD

CAUTION

12.LCD Assy can’t disassemble

- TSP do not function when LCD Assydisassembled.

4. Trouble shooting

4.1. General spec

Tools used for repairing the product

• System Diagnostics Disk

• MS-DOS Booting Disk

• System Diagnostics Card

• Screwdrivers (+, —)

• Tweezers

• Multi-meter

• Oscilloscope / Logic Analyzer

Replace Units (FRU: Field Replaceable Unit)

• DDR3 RAM Module (1 slot)

• 7mmH SATA 2.0 HDD

• Broadcom Wireless LAN + BT Combo Module / Intel Wireless LAN + BT Combo Module

• Adapter

• System Fan / Heatsink

• Touch Pad

• Battery

• Speaker

• Main Board / PWR Sub Board / 3-in-1 Sub Board / USB 2.0 Sub Board

• Harness Cable

• Harness Cable- DC in Cable, SATA HDD FPC, Main-to-PWR SubB’dFFC , USB2.0 FFC, 3-in-1 FFC, LCD Cable,

Touchpad FFC

4-1

4. Trouble shooting

4.2. Debugging Flow Chart

Debugging Flow of our company computer product does same as between product universally.

Refer to attachment Debugging Flowchart more content.

※Training manual how to use the side of the fault diagnosis please refer.

4. Trouble shooting

4-3

4. Trouble shooting

4.3. Hardware Troubleshooting

4.3.1. LCD

#1. The screen is dark or the colors of the screen are distorted.

Check the connection status

- LCD Module LCD Cable

- LCD Cable and Main board LCD Connector

→Connect Cable and Connector perfectly

2 Replace the LCD Ass’y

Check if there is a part of the LCD that is bent or broken due to impact

→Replace the LCD Ass’y

Defectiveness confirmation

#2. No picture appears on the screen.

Check the connection status

- LCD Module LCD Cable

- LCD Cable and Main board LCD Connector

→Connect Cable and Connector perfectly

→LCD Ass’y replace

Check if the System LED of the main board is blinking

3 Check if the memory module is out of order

4 Check if the Power button can be normally pressed.

#3. The LCD blinks while the system is in operation.

Check if there is a magnetic body near the touch pad button or the system or check if there is an exterior defect to the LCD

Re-fixation or Replacement other Memory Card

Check operating or not

2 Replace the LCD Ass’y Defectiveness confirmation

4-5

4. Trouble shooting

4.3.2. Main System

#1. The system is not turned on.

Check if the AC adapter LED is lit and if the adapter is properly connected to the system.

If the AC adapter is not connected, check the charge status of the battery. Even if the battery is charged, if the remaining battery charge is too low, the system may not be turned on.

Check the adapter LED.

Inner Cell Battery type

Can’t check external meter

Check if there are any alien substances in the Power switch.

if have, change the LED

4 Replace Main Board Check operating or not.

#2. the system does not boot or immediately turns off after being turned on

Since this may be a short circuit in the system.

Disconnect the power immediately, disassemble the system and check if there are any conducting alien objects such as a screw inside.

Check the connection status between the CPU and the

RHE.

3 Replace the memory module.

4 RTC Reset.

5 Replace Main Board.

*Check if it is out of order.

#3. There is no sound from the speaker.

(Insert the figure of the audio jacks so that the reader can check via the figure.)

Check if the sound is muted after booting up Windows.

→Fn + F6 (Mute cancellation)

→Fn Lock enable + F6

Control panel confirmation.

→Speaker Setting.

Check the connection status of the speaker cable and check if the speaker is out of order.

Check if there is a magnetic object near the speaker.

5 Replace Main Board.

#4. I cannot hear sound through the headphones.

Check if the sound is muted after booting up Windows.

→Fn + F6 (Mute cancellation)

→Fn Lock enable + F6

*Check if it is out of order.

Control panel confirmation .

→Speaker Setting.

Turn the volume up.

→Fn key volume adjustment.

Check the Headphone jack.

5 Replace Main Board.

*Check if it is out of order

4. Trouble shooting

4-7

4. Trouble shooting

#5. external/Internal microphone does not work normally.

Check the audio driver settings and change them if necessary.

Check the connection status of the MIC connector and check if the speaker is out of order.

Check the Mic jack.

4 Replace Main Board.

*Check if it is out of order.

#6. HDMI port does not work normally.

System manager confirmation .

(Video / Sound / Controller confirmation)

→HDMI driver Re-install.

Check the Display Manager work normally.

→Display Manager program Re-install.

Check the Control panel .

→Check HDMI section enable.

4 Replace Main Board.

#7. The HDD is not recognized.

Check the connection status of the HDD connector. Fix

HDD, check whether the system can be found. if not, change the connector on the motherboard and check again.

*Check if it is out of order.

If the 'Operating system not found' message appears during the booting process even though the HDD is recognized by CMOS, the operating system of the HDD may be corrupted or the SSD is out of order.

Format the HDD and reinstall the operating System.

Replace the HDD with a new one.

#8. Touch Pad does not work normally.

1 Check the connection status of Touch Pad FFC.

2 Check the connection status of Touch Pad I/F B'D.

3 Check the connection status of Touch Pad Module.

Replace Touch-Pad Module.

#9. Battery problems.

Check if the AC adapter

→Replace suitable Adapter (40W/60W)

2 Confirms a battery defective yes or no.

3 Replace Main board

#10. Camera does not work normally.

Check the driver status of Camera

( Check the system manager )

Check the connection status of camera cable between

Camera module

*Battery Check reference.

*Check if it is out of order.

Replace Camera module

4 Replace Main Board

#11. WLAN does not work normally.

Check the damage status of WLAN Cable

→Replace WLAN Cable

*Check if it is out of order.

Check the driver status of WLAN

→Re-Install WLAN driver.

Check the damage status of WLAN Jack

→Replace WLAN module.

4 Replace Main Board.

*Check if it is out of order.

4. Trouble shooting

4-9

4. Trouble shooting

#12. The Fan does not work normally.

Check the system by using SAFC(Samsung Advanced

Fan Control)program.

Check the connection status of Heat sink

è Screw fixation 7EA

*Tool Program referance

3 Check the connection status of FAN

4 Replace FAN

5 Replace Main Board.

#13. TSP function is abnormal , or does not work.

1 Try Calibrate TSP again in control panel

Make sure TSP cable is connected

*Check if it is out of order.

3 Change LCD Assy

4. Trouble shooting

4.4. Diagnosis application

WinDiag4

※Training manual how to use the side of the fault diagnosis please refer.

1) WinDiag4 is a Diagnostic tool that tests overall computer’s H/Ws and functions for Windows 7.

2) Precondition : UAC(User Account Control) should be disabled.

3) Installation : When you double-click SvcDiag.bat file, this program will be installed in C:\WinDiag4.

After installation, WinDiag4 will automatically start testing the system.

4) Uninstallation : After terminating the program, Just delete C:\WinDiag4 folder.

: Group Info

It displays Group Item Name and Test Count. If there is any FAIL or FAULT in the Group Item, the color of title will be changed to Red.

: Test Item

It displays Test items included in this Group. If there is any FAIL or FAULT in this test item, the color of the test item will be changed to Red.

4-11

4. Trouble shooting

Pyxis

1) Pyxis is a software that diagnose computer’s H/W components in DOS environment.

2) How to use Pyxis

- First, make Dos bootable USB memory or CD.

- Copy all released files to the Dos bootable device.

- After you boot using the Dos bootable device, Select the menu that you want to execute.

4. Trouble shooting

4.5. Bios & Micom Update

Set-up Method

1) DOS Mode Update a) Make a Dos booting disk -> Copy Packing file to Disk -> boot from DOS disk -> b) BIOS update: C:\>phlash16 xxx.wph/c /bbl c) MICOM update : C:\>up111m XXXX.bin

d) Packing fie : C:\>XXXX.exe /s /c

(XXXX.exe is the packing file merging BIOS and MICOM -> ABXX.exe)

Inform to customer that it is not recommend to update BIOS and Micom in DOS mode.

If not, it can cause fatal error.

2) update in the Windows

Windows boot -> Run Samsung update plus -> check update profile -> Click ‘BIOS update’

4-13

4. Trouble shooting

4.6. RTC Reset

4. Trouble shooting

4.7. Battery Use time

1) Generally, the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery usage time may differ from the advertisement even if there is no problem with the system.

2) Conditions for the company's maximum battery use time

• Minimum LCD brightness, base system, the wireless LAN R/F is turned off, BatteryManager-Maximum

Battery Mode.

• Measuring Tool: BatteryMark v.4.0.1

3) If a customer complains about the battery usage time, let them know that the battery usage time may differ depending on the model specifications and the usage environment and recommend the following usage environment for longer battery time.

• Use the company's power-saving program, BatteryManager, and set BatteryManager to Maximum Battery Mode.

• LCD brightness: Set to the minimum level as long as the user does not experience inconvenience.

• Disable unnecessary devices : Turn the wireless LAN R/F switch off and disable USB devices (DMB, fingerprint recognition and Bluetooth)

※ Please Refer to the Training manual chapter4. Trouble Shooting.

4-15

4. Trouble shooting

4.8. CPU FAN Control

Checking CPU FAN

1) Check thermal Fan locked well

2) Check FAN cable plugged well

3) change FAN.

CPU Fan Control

- One can turn the fan on & off and check the fan's operational conditions without system disassembly

4. Trouble shooting

Pic (1) Fan off status

- SAFC's default setting is "Fan off" or "Minimum Fan Speed".

- Press "ON" in "ON/OFF Control" Fan is turned on to maximum fan speed.

- Press "OFF" in "ON/OFF Control" Fan returns to default setting.

>Fan Voltage Measurement

- Read Fan RPM indicated in SAFC.

>Fan Voltage Pass/Fail determination

- If Fan RPM satisfies "rpm spec +/-10%", then Fan test is

"PASS" .

Pic (2) Fan on status

4-17

4. Trouble shooting

4.9. System Diagnosis

System Diagnostics Card

The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the Top part. The card is used to evaluate the reason for the malfunction without disassembling the system when the system malfunctions and to test if the system operates normally after replacing a defective FRU.

Debugging Code

In general, if a defect of the circuit or part is detected during the system test, the system stops at a particular code. The error codes for each part of the system are listed in the following table

※ Please Refer to the Training manual chapter4. Trouble Shooting.

4.10. Hardware Upgrade

HDD Upgrade

Four screws ( red circle ) after removing ,Disconnect the cable from the connector FPC.

mini SSD card Upgrade (mSATA SSD)

- At first disassemble screw ( red circle ) change mini SSD card module.

4. Trouble shooting

4-19

4. Trouble shooting

Memory Upgrade

4. Trouble shooting

4-21

5. System Wire Diagram

5.1. System Layout

System Layout

Height Simulation

LCD Layout

5. System Wire Diagram

Cabling

5-2

5. System Wire Diagram

Keyboard

○ : KBD Water Check sheet Location

5.2. Board Component

MainBoard

Front

Back

5. System Wire Diagram

5-4

5. System Wire Diagram

Subboard

GSPN (GLOBAL SERVICE PARTNER NETWORK)

Area Web Site

Europe, MENA,

CIS, Africa

E.Asia, W.Asia,

China, Japan https://gspn1.samsungcsportal.com

https://gspn2.samsungcsportal.com

N.America, S.America

https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics

Co.,Ltd.

Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

Printed in Korea

Code No.:

I've reviewed the Samsung Lotus-13R TSP Service Manual. This service manual provides detailed technical information, including specifications, disassembly/reassembly instructions, and troubleshooting steps for the 540U3C model. I'm ready to help you with technical questions and repair procedures.

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Key features

Laptop Clamshell Silver
Intel® Core™ i7 i7-3517U 1.9 GHz
Touchscreen 33.8 cm (13.3") 1366 x 768 pixels LED backlight 16:9
6 GB DDR3-SDRAM 1600 MHz 1 x 2 GB
500 GB Hybrid-HDD
Intel® HD Graphics 4000
Ethernet LAN 10,100,1000 Mbit/s Bluetooth 4.0
Lithium Polymer (LiPo) 52 Wh 40 W
Windows 8 64-bit

Frequently asked questions

The NP540U3C laptop has a 13.3" touchscreen display.

The maximum RAM capacity for NP540U3C is 12GB (on BD 4GB + 8GB x1).

The NP540U3C supports Windows 8 operating system.

The NP540U3C has wireless LAN and Bluetooth 4.0 for connectivity.

The NP540U3C uses Intel Ivy Bridge Processor.

SERVICE MANUAL

540U3C Contents

Contents

1. Precaution

1.1. General After-Sales Service Precautions

1.2. Safety Precautions

1.3. Ground

1.4. Static Electricity Precautions

2. Introduction

2.1. Product Features

2.2. Specification

2.3. Comparing product specifications

2.4. Function of Product

Keyboard

2.5. New Technology / ability

Inner Battery

TPM (Option)

USB3.0

iSSD

Wireless Display

Windows 8

Touch Screen (Option)

2.6. Hardware

New H/W - ISSD

(1) Intel’s 2012 Mobile Platform : Cheif River

BT 4.0

2.7. Software

Software — Previous/New

Development Stage Information

2.8. System Setup (Bios Setup)

2.9. HW & Option Materials

Basic Item

Optional

3. Desassembly and Reassembly

3.1. MainSystem

3.2. LCD

4. Trouble shooting

4.1. General spec

Tools used for repairing the product

Replace Units (FRU: Field Replaceable Unit)

4.2. Debugging Flow Chart

4.3. Hardware Troubleshooting

4.4. Diagnosis application

WinDiag4

Pyxis

4.5. Bios & Micom Update

Set-up Method

4.6. RTC Reset

4.7. Battery Use time

4.8. CPU FAN Control

Checking CPU FAN

4.9. System Diagnosis

System Diagnostics Card

Debugging Code

4.10. Hardware Upgrade

HDD Upgrade

mini SSD card Upgrade (mSATA SSD)

Memory Upgrade

5. System Wire Diagram

5.1. System Layout

System Layout

Height Simulation

LCD Layout

Cabling

Keyboard

5.2. Board Component

MainBoard

Front

Back

Subboard

GSPN (GLOBAL SERVICE PARTNER NETWORK)

What is the screen size of the NP540U3C laptop?

What is the maximum RAM capacity of this device?

What operating system does the NP540U3C support?

What kind of wireless connections does the NP540U3C have?

What is the processor type for the NP540U3C?

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