Samsung NP540U3C Service manual
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Samsung NP540U3C is a versatile and powerful laptop that combines sleek design with cutting-edge technology. With its compact size and long battery life, it's perfect for professionals and students on the go. The device boasts a stunning display, a fast processor, and a variety of features to enhance productivity and creativity. Whether you're working on presentations, creating multimedia content, or simply browsing the web, the Samsung NP540U3C delivers a seamless and enjoyable experience.
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NP540U3C
Lotus-13R-TSP
SERVICE MANUAL
540U3C Contents
Refer to the service manual in the GSPN (see the rear cover) for more information.
i
Contents
Contents
Copyright© 1995-2012 SAMSUNG. All rights reserved.
1.
Precaution
1. Precaution
1.1. General After-Sales Service Precautions
1) Do not let customers repair the product themselves..
› There is a danger of injury and the product life time may be shortened.
2) Make sure to disconnect the power cord from the wall outlet before repairing the product (especially for after-sales service of electric parts).
› There is a danger of electric shock.
3) Do not let customers plug several electric home appliances into a single wall outlet at the same time.
› There is a danger of fire due to overheating.
4) Check if the power plug or wall outlet are damaged in any way.
› If a defect is found, repair or replace it immediately.
(There is a danger of electric shock or fire)
5) Make sure that it is properly grounded.
(Check the ground of the wall outlet)
› Electricity leakage may cause electric shock.
(READING S HOULD)
NOT BE ABOVE 0.5mA
DEVICE
UNDER
TES T
TES T ALL
EXP OS ED METAL
S URFACES
2-WIRE CORD
LEAKAGE
CURRENT
TES TER
*ALS O TES T WITH
P LUG REVERS ED
(US ING AC ADAP TER
P LUG AS REQUIRED)
EARTH
GROUND
Figure 1.1
Leakage Current Test Circuit
6) Do not spray water on to the product to clean it.
› There is a danger of electric shock or fire and it may shorten the lifetime of the product..
7) Check the assembly status of the product after the after-sales service..
› The assembly status of the product must be the same as before the after-sales service.
8) Unplug the power cord holding the power plug (and not the cord).
› If the cord is disconnected, it may cause electric shock or fire.
9) Repair the product using only authorized parts
10) Keep the product away from heating devices such as heaters.
› Exposure to heaters may cause deformation of the product or fire.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
1-1
1. Precaution
1.2. Safety Precautions
1) EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
2) Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since these types of devices are highly susceptible to static electricity or current leakage, an isolation break may be caused.
Therefore read and follow the instructions below.
a) When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms of resistance. In addition, wear gloves and a jacket made of cotton and not of synthetic fibers that easily generate static electricity.
b) When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the earth on the worktable.
c) You must use a soldering iron without a leakage current.
d) Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
e) When inserting an IC into a PCB, be careful with the direction of the IC. When installing an IC in the wrong direction, it might become damaged.
f) When carrying an IC, package the IC with conducting material such as aluminum foil or conducting sponge so as to keep the voltage level of each of the terminals the same.
g) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
h) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
i) When soldering an IC, solder it in as short a time as possible so that unnecessary heat is not applied to the device.
j) Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering a custom IC.
k) Take care to not damage the board when installing or separating an Option Board.
l) Take care to not break the printed circuit pattern on the PCB when separate an IC.
1-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.
1.
Precaution
1.3. Ground
The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multi tap with a ground terminal only.
If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally. Avoid using wall outlets if they are not grounded even if they have a ground terminal.
To ground the product, connect the ground to an exclusive ground terminal or metal water pipe. Connect the ground cable to the ground terminal at the rear of the main body. To ground the product, connect the ground terminal of the product to a metal water pipe, wall outlet or exclusive ground terminal with an electric wire equal to or thicker than #18.
Never ground the product to a PVC water pipe, phone line, TV, radio antenna, aluminum window or gas pipe, because this does not actually ground the product and may be dangerous.
The red box of each image is earth with overlap when inserting a plug or multiple-tab into the socket.
Please check that it should be put the outlet completely.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
1-3
1. Precaution
1.4. Static Electricity Precautions
Many parts of the system are susceptible to static electricity. Using an electrostatic discharge (ESD) device is very important for the safety of the user and the user's surroundings. Using an ESD device increases the probability of a successful repair and lowers the expenses for damaged parts.
To prevent static electricity, follow the instructions below.
1) Perform the repair in a location without static electricity.
2) Touch your hands to a metal water pipe or some metal object connected to the ground to discharge any static
Electricity from your body before handling the parts.
3) Touch only the edges of the board, if possible.
4) Do not touch any parts unless absolutely necessary
5) Disassemble the parts on the anti-static-electricity pad.
6) When a board is not installed in the system, package the board with an anti-static-electricity packaging.
1-4 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2. Introduction
2.1. Product Features
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-1
2. Introduction
2.2. Specification
Processor* and Motherboard
CPU
Cache
Chipset
BIOS
Thermal Design (TDP)
Memory*
Maximum Capacity
Type (MHz)
Modules
Sockets
Upgradeable by users
Display and Graphics*
LCD
Ratio
Panel
Surface Type
Back Light
Interface
Vendor
Resolution (Number of Pixel)
Viewable Area
Viewing angle
Pixel Pitch
Contrast Ratio
Brightness
Colors
Response time
Graphics Controller 1
Intel® IvyBridge Processor i3 3217U 1.50Hz, 3 MB
Intel® IvyBridge Processor i5 3317U 1.70Hz, 3 MB (Up to 2.6 GHz)
Intel® IvyBridge Processor i7 3517U 1.9GHz, 4 MB (Up to 3 GHz) Max Spec
L3:3~4MB
Intel HM76
64 Mbit SPI flash, upgradeable
MAX.17W
MAX. 12GB (on BD 4GB + 8GB x1)
DDR3 (1333MHz/1600MHz)
4GB( (on BD 4GB)
6GB(on BD 4GB + 2GB x 1)
8GB(on BD 4GB + 4GB x 1, Later introduction schedule) SODIMM
1-slot SODIMM & On-board (up to 4GB) '1 Slot Per Max. 8GB Support'
Yes
※ PC3-10600(1333Mhz), PC3-12800(1600Mhz) confirmed the compatibility test.
13.3" With TSP(Touch Screen Panel : electrostatic, tempered glass)
* Not support 3 Display
16:9
TN
Non Glare
LED
LED
Samsung
HD (1366x768) Win7 Support /Win8 Support
(1366 X 768,1360 X768, 1280 X 768,1280 X720,1280 x 600, 1024 X 768, 800 X
600)
293.42(H) X 164.97(V)
Hor. +45/-45, Ver. +15/-30(typ)
0.2148(H) x 0.2148(V)
Min.300, Typ.400
typ.300 (cd/m2)
16.2M
Typ.16ms, Max. 25ms (Rising + Falling = LCD response speed)
1.Intel HD Graphics 4000 (Internal)
2-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Max. resolution for VGA
Max. resolution for HDMI
Max. Resolution for LFP LVDS
Multimedia
Sound
Controller
Conversion
Internal Interfaces
Speaker Power Rating
External Interfaces
Controls
Camera
Image sensor
Still Image Capture Resolution
Video Capture Resolution
Frame Rate
Output Video Format
Interface
UVC Support
Storage*
Hard Disk Drive
Vendor
Supports
Average Access Time
Interface
Speed
Capacity
Solid State Drive
Vendor
Supports
Average Access Time
Interface
Speed
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Max resolution of 2560x 1600 at 60Hz at 85Hz refresh rate (ext.)
Supported resolution (640x480,800x600, 1024x768, 1152x864,
1280x800,1280x960,1280x1024, 1400x1050,1440x900,1600x1024,1600x1200,
1680x1050, 1920x1200, 1920x1440, 2560x1600)
[Ext.monitor resolutions supported by EDID information]
Support v1.4a compliant / a resolution of 1920x1200 pixels with 32-bit color at 60 Hz dual link resolution of 2560 X 2048 per link / a maximum theoretical pixel rate of 224 MP/s
(640x480,800x600, 1024x768, 1152x864, 1280x800,1280x960, 1280x1024,
1400x1050, 1440x900,1600x1024,1600x1200, 1680x1050, 2560x2048)
[Ext.monitor resolutions supported by EDID information]
High Definition Audio
HD Audio Codec, ALC269Q-VC2-GR
Built-in high performance 24-bit ADC & 24-bit DAC
Embedded stereo speakers, Internal Mono MIC
2 Speakers x 2 Watt with enclosure each
Headphone/Mic Combo, Not Support S/PDIF
Keyboard volume control
1.3 Mega CMOS Color Image Sensor
1280*1024(Max.), 1280*720, 800*600, 640*480, 352*288, 320*240
1280*1024(Max.), 1280*720, 800*600, 640*480, 352*288, 320*240
30fps @ HD, 24MHz MCLK
SXGA, HD, SVGA, VGA, CI and QVGA
USB 2.0
Supported
7mmH 2.5" HDD, Removable (with Express cache 24GB=iSSD SATA3)
* 9.5mmH 2.5" HDD installation impossibility
HITACHI (BA59-03210A)
SATA host controller support 48bit LBA
12m sec.
SATA2 (3.0Gbps) * SATA 1 Support, SATA 3 Not Suppot.
5400rpm
500GB(Max) mSATA SSD, Removable
SanDisk (BA59-03232C)
SATA host controller support 48bit LBA
Read : Up to 450 MB/S Write : Up to 350 MB/s
SATA3 (6.0Gbps) * SATA 1,2 Support.
6.0Gbps
2-3
Controller
Vendor
Vendor
Express Card Slots
I/O Ports
USB Port
VGA Port
Audio Jacks
Wired LAN
HDMI
Security Slot
Power
Input Devices
Keyboard
Type
2-4
2. Introduction
Capacity
Network Tools
LAN
Controller
Vendor
Features
Wireless LAN
Module
Type
Interface
Chipset
Max. Link Speed
Antenna
Wireless LAN
Module
Type
Interface
Chipset
Max. Link Speed
Antenna
I/O Interface
Memory Card Reader
- maximum support capacity
128GB(Max.256GB)
Integrated 10/100/1000 Mbps Ethernet
RTL8111E
Realtek
RJ45 Output
Jackson Peak2 2x2 Combo (BA59-03294A) * WiDi Support
802.11a/g/n 2x2 WLAN and BT4.0 (BLE , BT3.0 +HS)
Mini Card half size
WLAN(PCI-E), BT(USB2.0)
Intel Centrino Advanced-N 6235
Wi-Fi Rx/Tx Throughput 300Mbps (Link Speed is only standard value, Actually value will decided by each environmant)
2 Antenna Support : WLAN (2Tx/Rx)
Atheros WB225 (BA92-08418A)
802.11b/g/n 1x1 WLAN and BT 4.0 (BLE , BT3.0 +HS)
Mini Card half size
WLAN(PCI-E), BT(USB2.0)
AR9485(WLAN) + AR3012(Bluetooth)
Wi-Fi Rx/Tx Throughput150Mbps (Link Speed is only standard value, Actually value will decided by each environmant)
1 Antenna Support : WLAN (1TX, 1RX), BT(1TX/RX)
3-in-1( SD/ SDHC/ SDXC)
SD (SDHC +SDXC)
SDHC : 32GB
SDXC : 1TB
GL823
GENESY
N/A
1 X USB 3.0 (Chargeable→ iphone Recharge), 2 X USB2.0
mini VGA Adapter (Option) [BA39-01189A]
HeadPhone-out, MIC-in Combo (4pole) * US , L/R/G/M
RJ45
1 x HDMI
N/A
1 x DC-in jack for AC adapter (3Pie)
Chicklets
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Specification
Key numbers
Num Keypad
Touchpad
LED Indicator
Security Solutions
TPM(Option)
Interface
Controller
Vendor
Application
Power and Power Management
System power management
Power management features
Standard battery
Model code
Type
Details of cell
Battery capacity
Battery rating
Voltage
Color
Dimension
Weight
Recharging Time
Vendor
AC Adapter
Model Name
Output Power
Dimension
Weight (AC Adapter)
Worldwide Compatibility
Line Frequency
Adapter Rating - Input
Adapter Rating - Output
System Dimensions
Pyxical Information
Dimensions (W X D X H)
Weight
- Condition
Package dimensions (W x D x H)
Travel length : 1.5 mm, height : 3.9 mm, Pitch : 19.05mm
80 - key (US,KOR,RUS,SEK) 81- Key (UK,FRA, GER, SPA, ITA )
N/A
Standard Touchpad with 2 buttons (with gesture function), 99.0 x 53.0
Power, AC-in / battery, HDD, WLAN
Trusted Platform Module 1.2
LPC
SLB 9635 TT 1.2
Infineon
Omnipass / TPM Host SW
ACPI V2.0 compliant S0 ~ S5, C1~ C6 Mode
AA-PLWN4AB
Li-Polymer
4 cells
6890mAh
52Wh
7.56V
Black
265.8*104.11*6mm (W x D x H) approximate 315g approximate 3 hours
SDI, Dynapack
AD-4019P (BA44-00279A)
40W
92.5 x 38.5 x 27.5mm (W x H x D)
175g (Max)
Auto-sensing 100 - 240VAC
50 / 60Hz
100 VAC ~ 240 VAC, 1.0 A
19.0VDC / 2.1A
315.1 x 218.9 x 19.9mm
1.64Kg (W/ SSD) 1.69Kg(W/ HDD)
Full System with 4 cell Battery (With Bag: ±0.06Kg, WithOut Bag: ±0.04)
All Nation Common (With bag) 386 x 136 x 345 mm (Without bag) 395 x 330 x82 mm
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-5
2. Introduction
Design
LCD Back
LCD Front
System Top
System Bottom
OS
Operating system
Aluminum
Glass
Aluminum
PA/GF 50%
Win8
2-6 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Label Location
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-7
2. Introduction
2.3. Comparing product specifications
2-8 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.4. Function of Product
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-9
2. Introduction
2-10 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Keyboard
2.
Introduction
Keyboard arrangement and size can differ to by each country.
○ : KBD Water Check sheet Location
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-11
2. Introduction
2-12 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.5. New Technology / ability
Inner Battery
2.
Introduction
TPM (Option)
※ Please Refer to the Training manual chapter1.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-13
2. Introduction
2-14 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-15
2. Introduction
2-16 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-17
2. Introduction
USB3.0
2-18 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
iSSD
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-19
2. Introduction
Wireless Display
※ Please Refer to the Training manual chapter1.
2-20 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
※ Please Refer to the Training manual chapter1.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-21
2. Introduction
Windows 8
2-22 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-23
2. Introduction
2-24 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-25
2. Introduction
2-26 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Touch Screen (Option)
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-27
2. Introduction
2-28 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-29
2. Introduction
2-30 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.6. Hardware
New H/W - ISSD
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-31
2. Introduction
(1) Intel’s 2012 Mobile Platform : Cheif River
2-32 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-33
2. Introduction
2-34 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-35
2. Introduction
2-36 Copyright© 1995-2012 SAMSUNG. All rights reserved.
BT 4.0
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-37
2. Introduction
2.7. Software
Driver
Application
ItmName
Heci(Chief River,SWDESC)_Package 8.1.0.1248 for Win8(8.1.0.1248 )
Touchpad- Elan - (11.7.2.1_WHQL)
Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC (SC-13HDL11431N)(-)
Namuga 1.3M(HD) Camera 6.5x56x3.1T FPC LED VE (SC-13HDL12131N)(-)
QCA Bluetooth Driver Win8- (8.0.0.206)
QCA WLAN Driver Win8- (10.0.0.75 WHQL)
Intel Bluetooth Driver (Win8)(2.5_PV2)
Intel WLAN Driver (e64)(15.5.0.42 PV HF1 BTHS MWT)
ExpressCache (for x64)(1.0.92.0)
Win 8 64bit Professional(v.9200)
Win 8 64bit Standard(v.9200)
Intel IvyBridge Windows8 GFX driver - 64bit(9.17.10.2817 (WHQL_Generic))
Realtek ALC26X Win8/Win7 Snd Drv(6.0.1.6699Logo)
Intel Rapid Start Technology Driver for Windows 8(2.1.0.1002)
Win8-Realtek LAN Driver[Gigabit](8.2.612.2012) iRST Win8 for NP(11.5.0.1207PV-W8Inst)
Lotus_Jones_TSP_SS Enable(1.0.0.2)
Infineon TPM Utility (Win8)(4.3.0.3137)
Airplane Mode Control Driver(Win8, 64bit)(6.2.8400.4218)
Intel Wireless Display (3.5.34.0 PV)
Kindle for Metro (Samsung)
Shark Dash for Metro
Photo Editor
MusicHub
FamilyStory
ChatOn
Birzzle for Metro
StumbleUpon for Metro
Netflix
Tuba.FM for Metro
Onet.news for Metro
MS_Mahjong
BugsMusic
WildTangent Games for Metro
CineTrailer for Metro ilMeteo for Metro
2-38 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Application
ItmName
RepubblicaTV for Metro
PagineGialle for Metro
Rai.TV for Metro
Merriam-Webster Dictionary
MusixMatch
TVN Player
Le Monde
Tele7
Allo Cine
Kiosque Relay
Financial Times
Parcel Genie
MS_Adera
MS_Taptiles
National Rail
Fresh Paint
Metro_Layout_for_NotePC_Intel_MS_Featured_Only
MS_Pinball_FX2
Dailymotion
ChatON(Canada)
Music Maker Jam
Windows Reader Metro Pinning
SkyNews
Norton Studio
News Republic
Jamie Oliver's Recipe for Metro
Skype(Metro) for Win8
Match'A' Shape for Metro
S Player for Win8 Metro
S Camera for Win8 Metro
S Gallery for Win8 Metro
Evernote Metro for Win8
Accessory Store
IE Default HomePage(MSN)_64bit (Jumpstart'12)
SkyNews
Adobe Reader for Win 8
Sogou 6.2 for Win8
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
2-39
2. Introduction
Software — Previous/New
※ For more information, product descriptions and installation training manuals refer to Chap.1
Development Stage Information
※ Consultation of development stage (Known Issue&spec)
Please refer that [Consulting Script]->[Consultation].
2-40 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.8. System Setup (Bios Setup)
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-41
2. Introduction
2-42 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-43
2. Introduction
2-44 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-45
2. Introduction
2-46 Copyright© 1995-2012 SAMSUNG. All rights reserved.
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-47
2. Introduction
2.9. HW & Option Materials
Basic Item
2-48 Copyright© 1995-2012 SAMSUNG. All rights reserved.
Optional
2.
Introduction
Copyright© 1995-2012 SAMSUNG. All rights reserved.
2-49
2. Introduction
2-50 Copyright© 1995-2012 SAMSUNG. All rights reserved.
3. Desassembly and Reassembly
3. Desassembly and Reassembly
3.1. MainSystem
CAUTION disassembling the system.
1.
1.memory door disassembling
- After removing 1 screw up to the remove the memory door.
3.
mini SSD card (mSATA)
At first disassemble screw( red circle ) change mini SSD card module
< Picture of system which remove memory door. >
4.
Cover disassembling
- Remove 8 screws for removing Bottom.
- 3 Red Circle : Careful! The hook can be broken.
< Picture of system which removed Bottom >
2.
HDD disassembling
Remove 4 (Red circle) Screw, and take out FPC cable from the connector.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
3-1
3. Desassembly and Reassembly
5.
Battery disassembling
-Remove 5 (Red circle) Screw, and take out Battery
Jack from the connector.
9.
DC jack cable disassembling
- DC jack cable(Red Square) Pull and remove it.
6.
WLAN disassembling
-After removing 1 screw (Red circle) up to the remove the Wlan.
10. Memory disassembling
- Loosen both sides of the hook to remove the memory.
7.
KBD Membrain TP SUB FFC disassembling
- KBD Membrain TP SUB FFC is separated by pulling to the top.
11. Fan disassembling
After removing 2 screws, remove the 3 screws in Sink outlet.
8.
LCD Cable and TSP cable disassembling
- LCD/TSP Cable(Red Square) Pull and remove it.
12. Main Board disassembling
– After removing 2 screw up to the remove the Main board
- cf) Yellow circle for Lotus-R not Lotus-TSP
3-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.
13.
< After full decomposition appearance. >
3. Desassembly and Reassembly
Copyright© 1995-2012 SAMSUNG. All rights reserved.
3-3
3. Desassembly and Reassembly
3.2. LCD
CAUTION
12.LCD Assy can’t disassemble
- TSP do not function when LCD Assydisassembled.
3-4 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
4. Trouble shooting
4.1. General spec
Tools used for repairing the product
• System Diagnostics Disk
• MS-DOS Booting Disk
• System Diagnostics Card
• Screwdrivers (+, —)
• Tweezers
• Multi-meter
• Oscilloscope / Logic Analyzer
Replace Units (FRU: Field Replaceable Unit)
• DDR3 RAM Module (1 slot)
• 7mmH SATA 2.0 HDD
• Broadcom Wireless LAN + BT Combo Module / Intel Wireless LAN + BT Combo Module
• Adapter
• System Fan / Heatsink
• Touch Pad
• Battery
• Speaker
• Main Board / PWR Sub Board / 3-in-1 Sub Board / USB 2.0 Sub Board
• Harness Cable
• Harness Cable- DC in Cable, SATA HDD FPC, Main-to-PWR SubB’dFFC , USB2.0 FFC, 3-in-1 FFC, LCD Cable,
Touchpad FFC
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-1
4. Trouble shooting
4.2. Debugging Flow Chart
Debugging Flow of our company computer product does same as between product universally.
Refer to attachment Debugging Flowchart more content.
※Training manual how to use the side of the fault diagnosis please refer.
4-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-3
4. Trouble shooting
4-4 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
4.3. Hardware Troubleshooting
4.3.1. LCD
#1. The screen is dark or the colors of the screen are distorted.
1
Check the connection status
- LCD Module LCD Cable
- LCD Cable and Main board LCD Connector
→Connect Cable and Connector perfectly
2 Replace the LCD Ass’y
3
Check if there is a part of the LCD that is bent or broken due to impact
→Replace the LCD Ass’y
Defectiveness confirmation
#2. No picture appears on the screen.
1
Check the connection status
- LCD Module LCD Cable
- LCD Cable and Main board LCD Connector
→Connect Cable and Connector perfectly
→LCD Ass’y replace
Check if the System LED of the main board is blinking
2
3 Check if the memory module is out of order
4 Check if the Power button can be normally pressed.
#3. The LCD blinks while the system is in operation.
Check if there is a magnetic body near the touch pad button or the system or check if there is an exterior defect to the LCD
1
Re-fixation or Replacement other Memory Card
Check operating or not
2 Replace the LCD Ass’y Defectiveness confirmation
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-5
4. Trouble shooting
4.3.2. Main System
#1. The system is not turned on.
Check if the AC adapter LED is lit and if the adapter is properly connected to the system.
1
2
If the AC adapter is not connected, check the charge status of the battery. Even if the battery is charged, if the remaining battery charge is too low, the system may not be turned on.
Check the adapter LED.
Inner Cell Battery type
Can’t check external meter
3
Check if there are any alien substances in the Power switch.
if have, change the LED
4 Replace Main Board Check operating or not.
#2. the system does not boot or immediately turns off after being turned on
1
Since this may be a short circuit in the system.
Disconnect the power immediately, disassemble the system and check if there are any conducting alien objects such as a screw inside.
Check the connection status between the CPU and the
RHE.
2
3 Replace the memory module.
4 RTC Reset.
5 Replace Main Board.
*Check if it is out of order.
*Check if it is out of order.
*Check if it is out of order.
4-6 Copyright© 1995-2012 SAMSUNG. All rights reserved.
#3. There is no sound from the speaker.
(Insert the figure of the audio jacks so that the reader can check via the figure.)
1
Check if the sound is muted after booting up Windows.
→Fn + F6 (Mute cancellation)
→Fn Lock enable + F6
2
Control panel confirmation.
→Speaker Setting.
3
Check the connection status of the speaker cable and check if the speaker is out of order.
Check if there is a magnetic object near the speaker.
4
5 Replace Main Board.
#4. I cannot hear sound through the headphones.
1
Check if the sound is muted after booting up Windows.
→Fn + F6 (Mute cancellation)
→Fn Lock enable + F6
*Check if it is out of order.
2
Control panel confirmation .
→Speaker Setting.
Turn the volume up.
→Fn key volume adjustment.
3
4
Check the Headphone jack.
5 Replace Main Board.
*Check if it is out of order
4. Trouble shooting
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-7
4. Trouble shooting
#5. external/Internal microphone does not work normally.
Check the audio driver settings and change them if necessary.
1
2
Check the connection status of the MIC connector and check if the speaker is out of order.
Check the Mic jack.
3
4 Replace Main Board.
*Check if it is out of order.
*Check if it is out of order.
#6. HDMI port does not work normally.
1
System manager confirmation .
(Video / Sound / Controller confirmation)
→HDMI driver Re-install.
2
Check the Display Manager work normally.
→Display Manager program Re-install.
3
Check the Control panel .
→Check HDMI section enable.
4 Replace Main Board.
#7. The HDD is not recognized.
1
Check the connection status of the HDD connector. Fix
HDD, check whether the system can be found. if not, change the connector on the motherboard and check again.
*Check if it is out of order.
2
If the 'Operating system not found' message appears during the booting process even though the HDD is recognized by CMOS, the operating system of the HDD may be corrupted or the SSD is out of order.
Format the HDD and reinstall the operating System.
Replace the HDD with a new one.
4-8 Copyright© 1995-2012 SAMSUNG. All rights reserved.
#8. Touch Pad does not work normally.
1 Check the connection status of Touch Pad FFC.
2 Check the connection status of Touch Pad I/F B'D.
3 Check the connection status of Touch Pad Module.
Replace Touch-Pad Module.
4
#9. Battery problems.
Check if the AC adapter
→Replace suitable Adapter (40W/60W)
1
2 Confirms a battery defective yes or no.
3 Replace Main board
#10. Camera does not work normally.
1
Check the driver status of Camera
( Check the system manager )
2
Check the connection status of camera cable between
Camera module
*Battery Check reference.
*Check if it is out of order.
3
Replace Camera module
4 Replace Main Board
#11. WLAN does not work normally.
Check the damage status of WLAN Cable
→Replace WLAN Cable
1
*Check if it is out of order.
2
Check the driver status of WLAN
→Re-Install WLAN driver.
3
Check the damage status of WLAN Jack
→Replace WLAN module.
4 Replace Main Board.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
*Check if it is out of order.
4. Trouble shooting
4-9
4. Trouble shooting
#12. The Fan does not work normally.
1
Check the system by using SAFC(Samsung Advanced
Fan Control)program.
Check the connection status of Heat sink
è Screw fixation 7EA
2
*Tool Program referance
3 Check the connection status of FAN
4 Replace FAN
5 Replace Main Board.
#13. TSP function is abnormal , or does not work.
1 Try Calibrate TSP again in control panel
Make sure TSP cable is connected
*Check if it is out of order.
*Check if it is out of order.
2
3 Change LCD Assy
4-10 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
4.4. Diagnosis application
WinDiag4
※Training manual how to use the side of the fault diagnosis please refer.
1) WinDiag4 is a Diagnostic tool that tests overall computer’s H/Ws and functions for Windows 7.
2) Precondition : UAC(User Account Control) should be disabled.
3) Installation : When you double-click SvcDiag.bat file, this program will be installed in C:\WinDiag4.
After installation, WinDiag4 will automatically start testing the system.
4) Uninstallation : After terminating the program, Just delete C:\WinDiag4 folder.
: Group Info
It displays Group Item Name and Test Count. If there is any FAIL or FAULT in the Group Item, the color of title will be changed to Red.
: Test Item
It displays Test items included in this Group. If there is any FAIL or FAULT in this test item, the color of the test item will be changed to Red.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-11
4. Trouble shooting
Pyxis
1) Pyxis is a software that diagnose computer’s H/W components in DOS environment.
2) How to use Pyxis
- First, make Dos bootable USB memory or CD.
- Copy all released files to the Dos bootable device.
- After you boot using the Dos bootable device, Select the menu that you want to execute.
4-12 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
4.5. Bios & Micom Update
Set-up Method
1) DOS Mode Update a) Make a Dos booting disk -> Copy Packing file to Disk -> boot from DOS disk -> b) BIOS update: C:\>phlash16 xxx.wph/c /bbl c) MICOM update : C:\>up111m XXXX.bin
d) Packing fie : C:\>XXXX.exe /s /c
(XXXX.exe is the packing file merging BIOS and MICOM -> ABXX.exe)
Inform to customer that it is not recommend to update BIOS and Micom in DOS mode.
If not, it can cause fatal error.
2) update in the Windows
Windows boot -> Run Samsung update plus -> check update profile -> Click ‘BIOS update’
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-13
4. Trouble shooting
4.6. RTC Reset
4-14 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
4.7. Battery Use time
1) Generally, the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery usage time may differ from the advertisement even if there is no problem with the system.
2) Conditions for the company's maximum battery use time
• Minimum LCD brightness, base system, the wireless LAN R/F is turned off, BatteryManager-Maximum
Battery Mode.
• Measuring Tool: BatteryMark v.4.0.1
3) If a customer complains about the battery usage time, let them know that the battery usage time may differ depending on the model specifications and the usage environment and recommend the following usage environment for longer battery time.
• Use the company's power-saving program, BatteryManager, and set BatteryManager to Maximum Battery Mode.
• LCD brightness: Set to the minimum level as long as the user does not experience inconvenience.
• Disable unnecessary devices : Turn the wireless LAN R/F switch off and disable USB devices (DMB, fingerprint recognition and Bluetooth)
※ Please Refer to the Training manual chapter4. Trouble Shooting.
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-15
4. Trouble shooting
4.8. CPU FAN Control
Checking CPU FAN
1) Check thermal Fan locked well
2) Check FAN cable plugged well
3) change FAN.
4-16 Copyright© 1995-2012 SAMSUNG. All rights reserved.
CPU Fan Control
- One can turn the fan on & off and check the fan's operational conditions without system disassembly
4. Trouble shooting
Pic (1) Fan off status
- SAFC's default setting is "Fan off" or "Minimum Fan Speed".
- Press "ON" in "ON/OFF Control" Fan is turned on to maximum fan speed.
- Press "OFF" in "ON/OFF Control" Fan returns to default setting.
>Fan Voltage Measurement
- Read Fan RPM indicated in SAFC.
>Fan Voltage Pass/Fail determination
- If Fan RPM satisfies "rpm spec +/-10%", then Fan test is
"PASS" .
Pic (2) Fan on status
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-17
4. Trouble shooting
4.9. System Diagnosis
System Diagnostics Card
The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the Top part. The card is used to evaluate the reason for the malfunction without disassembling the system when the system malfunctions and to test if the system operates normally after replacing a defective FRU.
Debugging Code
In general, if a defect of the circuit or part is detected during the system test, the system stops at a particular code. The error codes for each part of the system are listed in the following table
※ Please Refer to the Training manual chapter4. Trouble Shooting.
4-18 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4.10. Hardware Upgrade
HDD Upgrade
Four screws ( red circle ) after removing ,Disconnect the cable from the connector FPC.
mini SSD card Upgrade (mSATA SSD)
- At first disassemble screw ( red circle ) change mini SSD card module.
4. Trouble shooting
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-19
4. Trouble shooting
Memory Upgrade
4-20 Copyright© 1995-2012 SAMSUNG. All rights reserved.
4. Trouble shooting
Copyright© 1995-2012 SAMSUNG. All rights reserved.
4-21
5. System Wire Diagram
5. System Wire Diagram
5.1. System Layout
System Layout
Height Simulation
5-1 Copyright© 1995-2012 SAMSUNG. All rights reserved.
LCD Layout
5. System Wire Diagram
Cabling
Copyright© 1995-2012 SAMSUNG. All rights reserved.
5-2
5. System Wire Diagram
Keyboard
○ : KBD Water Check sheet Location
5-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.
5.2. Board Component
MainBoard
Front
Back
5. System Wire Diagram
Copyright© 1995-2012 SAMSUNG. All rights reserved.
5-4
5. System Wire Diagram
Subboard
5-5 Copyright© 1995-2012 SAMSUNG. All rights reserved.
GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site
Europe, MENA,
CIS, Africa
E.Asia, W.Asia,
China, Japan https://gspn1.samsungcsportal.com
https://gspn2.samsungcsportal.com
N.America, S.America
https://gspn3.samsungcsportal.com
This Service Manual is a property of Samsung Electronics
Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable International and/or domestic law.
© 2012 Samsung Electronics Co.,Ltd.
All rights reserved.
Printed in Korea
Code No.:
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Key Features
- Laptop Clamshell Silver
- Intel® Core™ i7 i7-3517U 1.9 GHz
- Touchscreen 33.8 cm (13.3") 1366 x 768 pixels LED backlight 16:9
- 6 GB DDR3-SDRAM 1600 MHz 1 x 2 GB
- 500 GB Hybrid-HDD
- Intel® HD Graphics 4000
- Ethernet LAN 10,100,1000 Mbit/s Bluetooth 4.0
- Lithium Polymer (LiPo) 52 Wh 40 W
- Windows 8 64-bit
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