DIP1524-01D3
GPS/GLONASS and 2.4 GHz diplexer
Datasheet
production data
Features
■
■
■
■
■
■
■
■
■
Low insertion loss
High attenuation levels
Input power for GPS: 25 dBm max
Input power for WLAN: 28 dBm max
High power capacity
Lead-free, Flip-Chip package
Small footprint
Very low profile (< 630 µm thickness)
High RF performance
Applications
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■
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Multi-band power amplifier module
Multi-band front end module
Multi-band GSM/WCDMA mobile phone
PC (netbooks, tablet) and smartphones
Description
The DIP1524-01D3 is a diplexer designed to separate the RF received signals of the
GPS-GLONASS from the RF received signals in the 2.4 to 2.7 GHz band.
The DIP1524-01D3 has been designed using
STMicroelectronics IPD (Integrated Passive
Device) technology on non conductive glass substrate to optimize RF performance.
Flip-Chip package 4 bumps
Figure 1.
Schematic diagram (top view)
1 2
WLAN, BTE
LTE Band VII
P1
P1
B GND P3
GPS/GLONASS
Rx
P2
P2
A
P3
C
Rx Antenna
January 2013
This is information on a product in full production.
Doc ID 022548 Rev 2 1/9 www.st.com
9
Characteristics
1 Characteristics
DIP1524-01D3
Table 1.
A bsolute maximum rating (limiting values)
Symbol Parameter
Min.
P
IN
Input power P
1
Input power P
2
(GPS)
V
ESD
(HBM) Human body model, JESD22-A114-B, all I/O
V
ESD
(MM) Machine model, JESD22-A115-A, all I/O
V
ESD
(CDM) Charge device model, JESD22-C101-C, all I/O
T
OP
Operating temperature range
Table 2.
-30
Electrical characteristics and RF performance (T amb
= 25° C)
Value
Typ.
Symbol Parameter Test condition
Value
Typ f1
Min
2400 f2
IL
Pass band range
P1-P3
P2-P3
Attenuation
P1-P3
P2-P3
P1
Return loss P2
P3
WLAN, BT, LTE BAND VII
GPS: 1573.42 – 1577.42 MHz
GLONASS: 1597.55 – 1605.89 MHz
In f1: WLAN, BT, LTE BAND VII
In f2: GPS
In f2: GLONASS
In f2
In f1
In f1
In f2
In f1 and f2
1573.42
20
18
0.85
0.60
0.65
Max.
28
25
300
100
500
+85
Max
2700
0.90
0.65
0.75
-10
-20
-9.5
Unit dBm
V
V
V
ºC
Unit
MHz
1605.89
MHz dB
2/9 Doc ID 022548 Rev 2
DIP1524-01D3 Characteristics
Measurements performed at component level
Figure 2.
P1-P3 and P2-P3 - S13 and S23 forward transmission
0
-5
-10
-15
S13, S23 (dB)
-20
-25
-30
-35
0 1 2 3 4
S13
S23
F (GHz)
5 6
Figure 3.
P1-P3 - S13 insertion loss in f1 band
-0.70
S13 (dB) m1
F = 2.400 GHz
S13 = -0.861 dB m2
F = 2.700 GHz
S13 = -0.812 dB
-0.75
-0.80
-0.85
m1
-0.90
2.40
2.45
2.50
2.55
2.60
F (GHz)
2.65
m2
2.70
Figure 4.
P2-P3 - S23 insertion loss in f2 band (GPS)
-0.50
S23 (dB)
-0.55
m3
F = 1.575 GHz
S23 = -0.580 dB m3
-0.60
Figure 5.
P2-P3 - S23 insertion loss in f2 band (GLONASS)
-0.50
S23 (dB) m4
F = 1.595 GHz
S23 = -0.603 dB m5
F = 1.605 GHz
S23 = -0.624 dB
-0.55
-0.60
m4 m5
-0.65
-0.70
1.570
1.572
1.574
1.576
F (GHz)
1.578
1.580
-0.65
-0.70
1.595
1.600
1.605
F (GHz)
1.610
Figure 6.
P1-P3 - S13 attenuation in f2 band Figure 7.
P2-P3 - S23 attenuation in f1 band
-15
S13 (dB)
-20 m6
F = 1.575 GHz
S13 = -23.141 dB m7
F = 1.605 GHz
S13 = -27.723 dB
-15
S23 (dB) m8 m8
F = 2.400 GHz
S23 = -19.084 dB m9
F = 2.700 GHz
S23 = -24.617 dB
-20 m6 m9
-25 -25 m7
-30 -30
F (GHz)
-35
1.570 1.575 1.580 1.585
1.590 1.595 1.600 1.605 1.610
-35
2.40
2.45
2.50
2.55
2.60
F (GHz)
2.65
2.70
Doc ID 022548 Rev 2 3/9
Characteristics DIP1524-01D3
Figure 8.
P1, P2, P3 - Sxx reflection coefficient
0
S11, S22, S33 (dB)
-5
-10
-15
-20
-25
-30
-35
0 1 2 3 4
S11
S22
S33
F (GHz)
5 6
Figure 9.
P1 - S11 return loss in f1 band
-5
S11 (dB)
-10 m10
-15
-20
-25
-30
-35
2.40
m10
F = 2.400 GHz
S11 = -13.229 dB m11
F = 2.700 GHz
S11 = -11.059 dB
2.45
2.50
2.55
F (GHz) m11
2.60
2.65
2.70
Figure 10.
P2 - S22 return loss in f2 band
-5
S22 (dB)
-10
-15 m12
F = 1.575 GHz
S22 = -31.730 dB m13
F = 1.605 GHz
S22 = -27.778 dB
-20
-25 m13
-30 m12
F (GHz)
-35
1.570 1.575 1.580 1.585
1.590 1.595 1.600 1.605 1.610
Figure 11.
P3 - S33 return loss in f1 band
-5
S33 (dB)
-10 m14
-15
-20
-25
-30
-35
2.40
m15 m14
F = 2.400 GHz
S33 = -11.442 dB m15
F = 2.700 GHz
S33 = -10.102 dB
F (GHz)
2.45
2.50
2.55
2.60
2.65
2.70
Figure 12.
P3 - S33 return loss in f2 band
-5
S33 (dB)
-10 m16
F = 1.575 GHz
S33 = -24.600 dB m17
F = 1.605 GHz
S33 = -22.469 dB
-15
-20 m16
-25 m17
-30
F (GHz)
-35
1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610
Figure 13.
P1-P2 - S12 isolation
0
S12 (dB)
-5
-10
-15
-20
-25
-30
-35
0 1 2 3 4
F (GHz)
5 6
4/9 Doc ID 022548 Rev 2
DIP1524-01D3 Ordering information scheme
Figure 14.
P1-P2 - S12 isolation in f1 band
-15
S12 (dB)
-20 m20 m20
F = 2.400 GHz
S23 = -19.224 dB m21
F = 2.700 GHz
S23 = -24.375 dB m21
-25
Figure 15.
P1-P2 - S12 isolation in f2 band
-15
S12 (dB)
-20
-25 m18 m18
F = 1.575 GHz
S12 = -22.399 dB m19
F = 1.605 GHz
S12 = -24.812 dB m19
-30
-35
2.40
2.45
2.50
2.55
2.60
F (GHz)
2.65
2.70
-30
F (GHz)
-35
1.570 1.575 1.580 1.585
1.590 1.595 1.600 1.605 1.610
2 Ordering information scheme
Figure 16.
Ordering information scheme
DIP 15 24 01 D3
IPD family
Diplexer f1 band f2 band
Design version
1st version
Package
D3 = glass substrate
Doc ID 022548 Rev 2 5/9
Package information DIP1524-01D3
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 17.
Package dimensions
400 µm
∅ 255 µm
Top view
P1
GND
P3
P2
840 µm
Figure 18.
Footprint
Copper pad diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 19.
Marking
Dot, ST logo
ECOPACK grade xx = marking z = manufacturing location yww = datecode
(y = year ww = week) x y x z w w
6/9 Doc ID 022548 Rev 2
DIP1524-01D3
Figure 20.
Tape and reel specifications
Dot identifying Pin A1 location
0.20
2.0
4.0
Package information
Ø 1.50
ST xxz yww
ST xxz yww
ST xxz yww
Note:
0.75
All dimensions are typical values in mm
0.94
4.0
User direction of unreeling
More information is available in the application note:
AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
Doc ID 022548 Rev 2 7/9
Ordering information DIP1524-01D3
Table 3.
Ordering information
Order code Marking Package
DIP1524-01D3 RT Flip Chip
Weight
1.35 mg
Base qty
5000
Delivery mode
Tape and reel (7”)
Table 4.
Date
Document revision history
14-Feb-2012
17-Jan-2013
Revision
1
2
Changes
Initial release
Updated package graphics for clarity.
8/9 Doc ID 022548 Rev 2
DIP1524-01D3
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Doc ID 022548 Rev 2 9/9
