CPL-WB-00C2
Wide band directional coupler with ISO port
Features
■
■
■
■
■
■
■
■
50 Ω nominal input / output impedance
Wide operating frequency range
(824 MHz to 2170 MHz)
Low Insertion Loss (< 0.2 dB)
34 dB typical coupling factor
High directivity (typical 25 dB)
High ESD robustness
(IEC 61000-4-2 Level 4)
Flip-Chip package
Small footprint: 1700 x 1200 µm
Benefits
■
■
■
■
Very low profile (< 690 µm thickness)
Lead-free package
High RF performance
RF module size reduction
Applications
■
■
■
Quad band power amplifier module
Quad band front end module
GSM / WCDMA mobile phone
Figure 1.
Pin configuration (top view)
3
RFOUT
2
GND
1
RFIN
ATN.
ATN.
ISO GND CPLD
A
B
Description
The CPL-WB-00C2 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS,
WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to
2170 MHz).
The CPL-WB-00C2 has been designed using
STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.
January 2010 Doc ID 15088 Rev 3 1/8 www.st.com
8
Characteristics
1 Characteristics
CPL-WB-00C2
Table 1.
A bsolute maximum rating (limiting values)
Symbol Parameter
Min.
P
IN
V
ESD (IEC)
Input Power RF
IN
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330
Ω
, 10 shots with both polarities and each condition, cumulative method)
RF
IN
, RF
OUT
, air discharge
RF
IN
, RF
OUT
, contact discharge
V
ESD (HBM)
Human body model, JESD22-A114-B, All I/O
V
ESD (MM)
Machine model, JESD22-A115-A, All I/O
V
ESD (CDM)
Charge device model, JESD22-C101-C, All I/O
T
OP
Operating temperature
Table 2.
Electrical characteristics (T amb
= 25 °C) - impedances
±15
±8
2
100
500
-30
Value
Typ.
Symbol
Z
OUT
Z
IN
Z
CPLD
Z
OUT
Table 3.
Parameter
Min.
Nominal output impedance
Nominal input impedance
Nominal coupling impedance
Nominal ISO impedance
Electrical characteristics (T amb
= 25 °C) - RF performance
Symbol
T
I
OP
R f
L
L
CPLD
Ripple
DIR
Parameter Test condition
Operating temperature
Frequency range
(bandwidth)
Insertion loss in bandwidth From 824 MHz to 2170 MHz
Return loss in bandwidth From 824 MHz to 2170 MHz
Coupling factor (including attenuator)
From 824 MHz to 915 MHz
From 1710 MHz to 1980 MHz
Coupling ripple in individual band
(824 to 849 MHz) (880 to 915 MHz)
(1710 to 1785 MHz) (1850 to
1910 MHz)(1920 to 1980 MHz)
Coupler directivity From 824 MHz to 1980 MHz
Min.
-30
824
15
35
28
20
Value
Typ.
50
50
50
50
Value
Typ.
0.1
25
Max.
35
+85
Max.
39
33
0.5
Max.
+85
2170
0.2
Unit dBm
Unit
Unit dB dB
Ω
Ω
Ω
Ω kV kV kV
V
V
ºC
°C
MHz dB dB dB dB
2/8 Doc ID 15088 Rev 3
CPL-WB-00C2
1.1
Characteristics
RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω , de-embedding at
CPL-WB-00C2 bumps.
Figure 2.
Insertion loss dB
-0.0
-0.05
-0.1
-0.15
-0.2
-0.25
-0.3
824
F (MHz)
959 1093 1228 1362 1497 1632 1766 1901 2035 2170
Figure 3.
Coupling and isolation dB
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
824
F (MHz)
959 1093 1228 1362 1497 1632 1766 1901 2035 2170
Figure 4.
Directivity
40
38
36
34
32
30
28
26
24
22
20
824
F (MHz)
959 1093 1228 1362 1497 1632 1766 1901 2035 2170
Doc ID 15088 Rev 3 3/8
Reference evaluation board
2 Reference evaluation board
CPL-WB-00C2
Figure 5.
CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on bottom layer
●
●
●
●
●
Material: 2 layers FR4 with solder mask on top and bottom layer
Substrate thickness: 0.8 mm
Line lengths: 10.2 mm
Extension values on short line measurement: 102 ps
Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz
4/8 Doc ID 15088 Rev 3
CPL-WB-00C2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 6.
Package dimensions
670 µm
650 µm
Figure 7.
Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
1.200 mm ± 50 µm
Figure 8.
Marking
Dot, ST logo xx = marking z = manufacturing location yww = datecode
(y = year ww = week)
E x y x z w w
Doc ID 15088 Rev 3 5/8
Package information
Figure 9.
Flip Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
CPL-WB-00C2
ST
E xxx yww
ST
E xxx yww
ST
E xxx yww
Note:
0.73 ± 0.05
4 ± 0.1
User direction of unreeling
All dimensions in mm
More information is available in the application note:
AN1235: “Flip Chip: package description and recommendations for use”
6/8 Doc ID 15088 Rev 3
CPL-WB-00C2 Ordering information
Table 4.
Ordering information
Order code Marking
CPL-WB-00C2 RE
Base qty
5000
Delivery mode
Tape and reel
Table 5.
Date
02-Oct-2008
12-Oct-2009
06-Jan-2010
Document revision history
Revision
1
2
3
Changes
Initial release.
Updated description on page 1 and test condition on Table 3 value I
L
.
Updated description on page 1 .
Doc ID 15088 Rev 3 7/8
CPL-WB-00C2
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