STTH810
Ultrafast recovery - high voltage diode
Main product characteristics
I
F(AV)
V
RRM
T j
V
F
(typ) t rr
(typ)
8 A
1000 V
175° C
1.30 V
47 ns
Features and benefits
■
■
■
■
■
■
Ultrafast, soft recovery
Very low conduction and switching losses
High frequency and/or high pulsed current operation
High reverse voltage capability
High junction temperature
Insulated packages:
– TO-220Ins
– Electrical insulation = 2500 V
RMS
Capacitance = 7 pF
– TO-220FPAC
Electrical insulation = 2500 V
RMS
Capacitance = 12 pF
Description
The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability.
Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications.
The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device.
A
K
TO-220AC
STTH810D
K
NC
A
A
STTH810G
Order codes
Part Number
STTH810D
STTH810G
STTH810G-TR
STTH810FP
STTH810DI
March 2006 Rev 1
K
K
TO-220FPAC
STTH810FP
A
K
TO-220Ins
STTH810DI
A
Marking
STTH810D
STTH810G
STTH810G
STTH810FP
STTH810DI
1/11
www.st.com
11
Characteristics
1 Characteristics
STTH810
Table 1.
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FRM
I
FSM
T stg
T j
Absolute ratings (limiting values at 25° C, unless otherwise specified)
Parameter
Repetitive peak reverse voltage
RMS forward current
Average forward current,
δ = 0.5
Repetitive peak forward current
Surge non repetitive forward current
Storage temperature range
Maximum operating junction temperature
TO-220AC / D
2
PAK / TO-220FPAC
TO-220AC Ins
TO-220AC / D
2
PAK T c
= 130° C
TO-220FPAC
TO-220AC Ins
T c
= 75° C
T c
= 105° C t p
= 5 µs, F = 5 kHz square t p
= 10 ms Sinusoidal
Value
1000
30
20
8
100
60
-65 to + 175
175
Table 2.
Symbol
Thermal parameters
Parameter
R th(j-c)
Junction to case
TO-220AC / D
2
PAK
TO-220FPAC
TO-220AC Ins
Value
2.5
5.8
4.1
Table 3.
Symbol
Static electrical characteristics
Parameter Test conditions
I
R
(1)
V
F
(2)
Reverse leakage current
Forward voltage drop
T j
= 25° C
T j
= 125° C
T j
= 25° C
T j
= 100° C
T j
= 150° C
V
R
= V
RRM
I
F
= 8 A
1.
Pulse test: t p
= 5 ms,
δ < 2 %
2.
Pulse test: t p
= 380 µs,
δ < 2 %
To evaluate the conduction losses use the following equation:
P = 1.3 x I
F(AV)
+ 0.05 I
F
2
(RMS)
Min.
Typ
2
1.4
1.3
Unit
V
A
A
A
A
°C
°C
Unit
°C/W
Max.
Unit
5
20
2
1.8
1.7
µA
V
2/11
STTH810 Characteristics
Table 4.
Symbol
t rr
I
RM
S t fr
V
FP
Dynamic characteristics
Parameter
Reverse recovery time
Reverse recovery current
Softness factor
Forward recovery time
Forward recovery voltage
Figure 1.
Conduction losses versus average current
18
P(W)
=0.05
=0.1
=0.2
=0.5
16
14
12
10
8
6
4
2
0
0 1 2 3 4
I
F(AV)
(A)
5 6 7
T
8 9
=1
10
Test conditions
I
F
= 1 A, dI
F
/dt = -50 A/µs,
V
R
= 30 V, T j
= 25° C
I
F
= 1 A, dI
F
/dt = -100 A/µs,
V
R
= 30 V, T j
= 25° C
I
F
= 8 A, dI
V
R
F
/dt = -200 A/µs,
= 600 V, T j
= 125° C
I
F
= 8 A, dI
V
R
F
/dt = -200 A/µs,
= 600 V, T j
= 125° C
I
F
= 8 A dI
V
FR
= 1.5 x V
F
/dt = 50 A/µs
Fmax
, T j
= 25° C
I
F
= 8 A, dI
F
/dt = 50 A/µs,
T j
= 25° C
Figure 2.
Forward voltage drop versus forward current
80
I
FM
(A)
Min.
Typ Max.
Unit
64
47
12
2
5.5
85
65
16
300 ns
A ns
V
70
60
50
40
30
20
T j
=150°C
(Maximum values)
T j
=150°C
(Typical values)
T j
=25°C
(Maximum values)
10
V
FM
(V)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 3.
Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th(j-c)
/R th(j-c)
0.9
0.8
Single pulse
DO-220AB
D²PAK
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
Figure 4.
Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th(j-c)
/R th(j-c)
0.9
Single pulse
TO-220FPAB
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
3/11
Characteristics STTH810
Figure 5.
Peak reverse recovery current versus dI
F
/dt (typical values)
25
I
RM
(A)
V
R
=600V
T j
=125°C
20
I
F
= 2 x I
F(AV)
I
F
= I
F(AV)
15
I
F
=0.5 x I
F(AV)
10
5
0
0 50 100 150 200 250 300 350 400 450 500
Figure 7.
Reverse recovery charges versus dI
F
/dt (typical values)
2.5
V
R
=600V
T j
=125°C
I
F
= 2 x I
F(AV)
2.0
1.5
I
F
= I
F(AV)
1.0
0.5
I
F
=0.5 x I
F(AV)
0.0
0 50 100 150 200 250 300 350 400 450 500
Figure 6.
Reverse recovery time versus dI
F
/dt
(typical values)
500
450
400
350
300
250
200
150
100
50
0
0
I
F
= 2 x I
F(AV)
I
F
= I
F(AV)
I
F
=0.5 x I
F(AV)
V
R
T j
=600V
=125°C
50 100 150 200 250 300 350 400 450 500
Figure 8.
Softness factor versus dI
F
(typical values)
/dt
3.0
S factor
I
F
= 2 x I
F(AV)
V
R
=600V
T j
=125°C
2.5
2.0
1.5
1.0
0 50 100 150 200 250 300 350 400 450 500
Figure 9.
Relative variations of dynamic parameters versus junction temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
25
I
RM
S factor
Q
RR
50
t
RR
75
I
F
= I
F(AV)
V
R
=600V
Reference: T j
=125°C
100 125
Figure 10.
Transient peak forward voltage versus dI
F
/dt (typical values)
15
10
5
0
0
35
30
25
20
45
V
FP
(V)
40
I
F
T j
= I
F(AV)
=125°C
100 200 300 400 500
4/11
STTH810 Characteristics
Figure 11.
Forward recovery time versus dI
F
/dt
(typical values)
Figure 12.
Junction capacitance versus reverse voltage applied (typical values)
600
100
C(pF)
550
V
FR
I
F
= 1.5 x V
F
T j
= I
F(AV)
=125°C max.
F=1MHz
V osc
=30mV
RMS
T j
=25°C
500
450
400
10
350
300
250
200
0 100 200 300 400 500
1
1 10 100 1000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, e cu
= 35 µm)
80
R th(j-a)
(°C/W)
D²PAK
70
60
50
40
30
20
10
0
0 5 10 15
S
CU
(cm²)
20 25 30 35 40
5/11
Package information STTH810
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 Nm (TO-220AC, TC-220Ins, TO-220FPAC)
Maximum torque value: 0.7 Nm (TO-220AC, TO-220Ins, TO-220FPAC)
Table 5.
T0-220AC dimensions
L2
F1
F
H2
Ø I
G
L5
L9
L6
L4
C
A
D
M
E
L7
DIMENSIONS
REF.
Millimeters Inches
Min.
Max.
Min.
Max.
A
C
D
E
F
F1
G
4.40
1.23
2.40
0.49
0.61
1.14
4.95
4.60
1.32
2.72
0.70
0.88
1.70
5.15
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
0.194
0.202
H2
L2
L4
L5
L6
L7
10.00
16.40 typ.
13.00
14.00
0.511
0.551
2.65
15.25
15.75
0.600
0.620
6.20
10.40
2.95
6.60
L9 3.50
3.93
M 2.6 typ.
Diam. I 3.75
3.85
0.393
0.645 typ.
0.104
0.116
0.244
0.259
0.137
0.409
0.154
0.102 typ.
0.147
0.151
6/11
STTH810
Table 6.
T0-220Ins dimensions
Package information
DIMENSIONS
Millimeters Inches REF
Min.
Max.
Min.
Max.
A 15.20
a1 3.75
a2 13.00
B 10.00
b1 0.61
c2 e
F b2 1.23
C c1
4.40
0.49
2.40
4.80
6.20
15.90 0.598
14.00 0.511
10.40 0.393
0.88
1.32
0.024
0.048
4.60
0.173
0.70
0.019
2.72
0.094
5.40
0.189
6.60
0.244
0.147
0.625
ØI l2
M
3.75
2.60
3.85
0.147
0.102
0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65
2.95
0.104
0.116
1.14
1.70
0.044
0.066
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.212
0.259
7/11
Package information
Table 7.
T0-220FPAC dimensions
STTH810
H
L6
Dia
L3
L2
L4
G1
G
F
F1
L5
D
B
A
E
L7
DIMENSIONS
Millimeters Inches REF
Min.
Max.
F1
G
G1
H
L2
L3
D
E
F
A
B
L4
L5
L6
9.8
2.9
15.9
L7 9.00
Dia.
3.00
4.4
2.5
2.5
0.45
0.75
1.15
4.95
2.4
1.70
5.20
2.7
10 10.4
16 Typ.
28.6
30.6
4.6
2.7
2.75
0.70
1
10.6
3.6
16.4
9.30
3.20
Min.
Max.
0.173
0.181
0.098
0.106
0.098
0.108
0.018
0.027
0.030
0.039
0.045
0.067
0.195
0.205
0.094
0.106
0.393
0.409
0.63 Typ.
1.126
1.205
0.386
0.417
0.114
0.142
0.626
0.646
0.354
0.366
0.118
0.126
8/11
STTH810 Package information
Table 8.
D
2
PAK dimensions
REF.
L
L2
L3
E
G
B2
B
A1
C2
2mm min.
FLAT ZONE
C
A2
A
R
V2
D
C
C2
D
E
G
L
A
A1
A2
B
B2
L2
L3
M
R
V2
Figure 14.
D
2
PAK footprint (all dimensions in mm)
Min.
Max
0.45
1.23
8.95
10.00
4.88
15.00
4.40
2.49
0.03
0.70
1.14
1.27
1.40
2.40
1.40
1.75
3.20
0°
0.40 typ.
8°
0.60
1.36
9.35
10.40
5.28
15.85
4.60
2.69
0.23
0.93
1.70
DIMENSIONS
Millimeters Inches
Min.
Max.
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.055
0.094
0.055
0.069
0.126
0.016 typ.
0° 8°
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
16.90
10.30
5.08
1.30
3.70
8.90
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/11
Ordering information STTH810
Part Number
STTH810D
STTH810DI
STTH810FP
STTH810G
STTH810G-TR
Marking
STTH810D
STTH810DI
STTH810FP
STTH810G
STTH810G
Package
TO-220AC
TO-220Ins
TO-220FPAC
D
2
PAK
D
2
PAK
Weight
1.86 g
1.86 g
2.2 g
1.48 g
1.48 g
Base qty Delivery mode
50
50
50
50
1000
Tube
Tube
Tube
Tube
Tape & reel
Date
02-Mar-2006
Revision
1 First issue.
Description of Changes
10/11
STTH810
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