BAL-CC1101-01D3
50 ohm nominal input / conjugate match balun
to CC1101 / CC1150 (868-928 MHz), with integrated harmonic filter
Datasheet production data
Description
STMicroelectronics BAL-CC1101-01D3 is an ultra
miniature balun which integrates a matching
network in a monolithic glass substrate. This has
been customized for the CC1101 / CC1150
TI transceiver.
It’s a design using STMicroelectronics IPD
(integrated passive device) technology on nonconductive glass substrate to optimize RF
performance.
Flip-Chip package
4 bumps
Figure 1. Application schematic
Features
50 Ω nominal input / conjugate match to
CC1101 / CC1150
BAL-CC1101-01D3
Low insertion loss
CC1101
CC1150
Low amplitude imbalance
Low phase imbalance
Z
Harmonic
filter
Coated Flip-Chip on glass
Small footprint: < 2.1 mm²
Benefits
Extremely low profile (< 550 µm after reflow)
High RF performance
RF BOM and area reduction
May 2016
This is information on a product in full production.
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www.st.com
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Characteristics
1
BAL-CC1101-01D3
Characteristics
Table 1. Absolute maximum rating (limiting values)
Symbol
PIN
VESD
TOP
Parameter
Input power RFIN
Value
Unit
20
dBm
ESD ratings human body model (JESD22-A114C), all I/O one at a time while
others connected to GND
2000
ESD ratings machine model, all I/O
500
ESD ratings charged device model (JESD22-C101D)
500
Operating temperature
V
-40 to +125
ºC
Table 2. Electrical characteristics - RF performance (Tamb = 25 °C)
Value
Symbol
Parameter
Unit
Min.
ZOUT
ZIN
Typ.
Max.
Conjugate match to
CC1101 / CC1150
Nominal differential output impedance
Nominal input impedance
Ω
50
F
Frequency range (bandwidth)
IL
Insertion loss in bandwidth
1.7
Single ended return loss in bandwidth
15
dB
15
dB
RL_SE
779
RL_DIFF Differential ended return loss in bandwidth
928
MHz
1.9
dB
imb
Phase imbalance
-10
10
°
Aimb
Amplitude imbalance
-1
1
dB
Att
2/10
Harmonic levels (TX filter)
Attenuation at 2fo
Attenuation at 3fo
-25
-50
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dB
BAL-CC1101-01D3
1.1
Characteristics
Measurements
Figure 2. Transmission (S21)
0.0
Figure 3. Insertion loss in band
S21 (dB)
0.0
IL (dB)
-0.5
-20
-1.0
-1.5
-40
-2.0
-60
-2.5
F (MHz)
F (GHz)
-80
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-3.0
780
Figure 4. Return loss single-ended
0
800
820
840
860
880
900
920 930
Figure 5. Return loss differential
RL-SE (dB)
0
RL-DIFF (dB)
-5
-10
-10
-20
-15
-20
-30
-25
F (MHz)
F (MHz)
-40
780
800
820
840
860
880
900
920 930
-30
780
800
Figure 6. Phase imbalance
10
820
840
860
880
900
920 930
Figure 7. Amplitude imbalance
Φimb (dB)
1.0
Aimb (dB)
0.8
0.6
8
0.4
6
0.2
4
-0.2
2
-0.6
0.0
-0.4
F (MHz)
0
780
800
820
840
860
880
900
920 930
-0.8
-1.0
780
F (MHz)
800
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820
840
860
880
900
920 930
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Characteristics
BAL-CC1101-01D3
Figure 8. H2 attenuation
Figure 9. H3 attenuation
2f0 (dB)
0.0
0.0
-20
-20
-40
-40
-60
-60
F (GHz)
-80
1.558
4/10
1.608
1.658
1.708
1.758
1.808
1.858
3f0 (dB)
F (GHz)
-80
2.337
2.387
DocID025629 Rev 3
2.437
2.487
2.537
2.587
2.637
2.687
2.737
2.784
BAL-CC1101-01D3
2
Package information
Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip package information
Figure 10. Flip-Chip package outline
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Table 3. Flip-Chip package mechanical data
Description
Parameter
Min.
Typ.
Max.
Unit
A
Bump height + substrate thickness
0.570
0.630
0.690
mm
b
Bump diameter
0.215
0.255
0.295
mm
D
Y dimension of the die
1.970
2.020
2.070
mm
D1
Y pitch
1.200
E
X dimension of the die
E1
X pitch
fE
Distance from bump to edge of die on X axis
1.000
1.050
mm
1.100
0.500
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mm
mm
0.225
mm
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Package information
BAL-CC1101-01D3
Figure 11. Footprint - 3 mils stencil -non solder
mask defined
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Figure 13. Footprint - 5 mils stencil -non solder
mask defined
Figure 14. Footprint - 5 mils stencil - solder
mask defined
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6/10
Figure 12. Footprint - 3 mils stencil - solder
mask defined
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DocID025629 Rev 3
BAL-CC1101-01D3
Package information
Figure 15. PCB view CC1101 with BAL-CC1101-01D3
Top 220 µm diameter
SMT 320 µm diameter
1400 µm
Figure 16. Marking
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
(y = year, ww = week)
x x z
y ww
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Package information
BAL-CC1101-01D3
Figure 17. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
8.0
3.5
2.19
1.75
0.20
1.14
4.0
0.71
All dimensions are typical values in mm
Note:
User direction of unreeling
More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
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BAL-CC1101-01D3
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Ordering information
Ordering information
Table 4. Ordering information
4
Order code
Marking
Package
Weight
Base qty
Delivery mode
BAL-CC1101-01D3
SS
Flip-Chip
2.21 mg
5000
Tape and reel (7”)
Revision history
Table 5. Document revision history
Date
Revision
Changes
23-Jan-2014
1
Initial release
18-Sep-2015
2
Updated Figure 10. Added Figure 11, Figure 12, Figure 13,
Figure 14 and Table 3.
02-May-2016
3
Updated Figure 10 and Table 3.
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BAL-CC1101-01D3
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