BALF-2690-02D3
50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter
Datasheet
−
production data
Flip-Chip package 4 bumps
Description
STMicroelectronics BALF-2690-02D3 is a balun design to transform single ended signal to differential signals in Bluetooth applications. This
BALF-2690-02D3 has been customized for
STLC2690 Bluetooth transceiver with less than
1.2 dB insertion losses in the bandwidth
(2400 MHz-2500 MHz).
The BALF-2690-02D3 has been designed using
STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate which optimize RF performance.
Features
•
50
Ω nominal input / matched output differential impedance
•
Integrated harmonic filter
•
Low insertion loss
•
Low amplitude imbalance
•
Low phase imbalance
•
Small footprint < 1.54 mm²
Benefits
• Very low profile (< 560 µm after reflow)
• High RF performance
• RF BOM and area reduction
Figure 1. Device configuration (top view)
1
SE
DIFF
2
GND
DIFF
A
B
C
Applications
•
Bluetooth STLC2690 application
•
Mobile phone application
Antenna
Figure 2. Application schematic
STLC2690
BALF-2690-02D3
Z IN
RF_P
RF_N
GND
September 2015
This is information on a product in full production.
DocID025234 Rev 4 1/9 www.st.com
9
Characteristics
1 Characteristics
BALF-2690-02D3
Symbol
P
IN
V
ESD
T
OP
Table 1. Absolute maximum ratings (limiting values)
Parameter
Value
Unit
Min.
Typ.
Max.
10 13 dBm Input power RFIN
ESD rating, human body model (JESD22-A114-C) all I/O one at a time while others connected to GND
ESD rating, machine model, all I/O
Operating temperature range
2000
200
-40 +85
V
°C
Symbol
Z
DIFF
Z
SE
Table 2. Impedances (T amb
= 25 °C)
Parameter
Nominal differential impedance
Nominal single-ended impedance
Min.
Value
Typ.
matched to STLC2690
50
Max.
Unit
Ω f
I
L
R
L_SE
φ
imb
A imb
CMRR
Att
2fo
Att
3f0
Symbol
Table 3. RF performance (T amb
= 25 °C)
Parameter
Frequency range (bandwidth)
Insertion loss in bandwidth
Return loss in bandwidth
Output phase imbalance (single ended)
Output amplitude imbalance
Common mode rejection (S
SC12
)
2nd harmonic S21 attenuation
3rd harmonic S21 attenuation
Test condition
4800-5000 MHz
7200-7500 MHz
Value
15
-10
-1
20
31
36
Min.
Typ.
Max.
2400 2500
+1.2
21
0.5
+10
1
Unit
MHz dB dB
° dB dB dB
2/9 DocID025234 Rev 4
BALF-2690-02D3 Characteristics
1.1 Measurements
Figure 3. Return loss (T amb
= 25 °C)
-15.0
(dB)
-17.5
-20.0
-22.5
-25.0
-27.5
F (GHz)
-30.0
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49
2.50
Figure 4. Insertion loss (T amb
= 25 °C)
-0.5
(dB)
-0.6
-0.7
-0.8
-0.9
-1.0
-1.1
-1.2
-1.3
-1.4
F (GHz)
-1.5
2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49
2.50
Figure 5. Phase imbalance (T amb
= 25 °C)
15
(deg)
10
5
0
-5
-10
F (GHz)
-15
2.40 2.41 2.42 2.43 2.44
2.45 2.46 2.47 2.48 2.49
2.50
Figure 6. Amplitude imbalance (T amb
= 25 °C)
1.0
(dB)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.40
F (GHz)
2.41 2.42 2.43 2.44
2.45 2.46 2.47 2.48 2.49
2.50
Figure 7. Transmission: 2nd harmonic (dB)
(T amb
= 25 °C)
-25.0
(dB)
-27.5
-30.0
-32.5
-35.0
-37.5
F (GHz)
-40.0
4.80
4.82 4.84 4.86 4.88 4.90 4.92 4.94 4.96 4.98
5.0
Figure 8. Transmission: 3rd harmonic (dB)
(T amb
= 25 °C)
-25.0
(dB)
-27.5
-30.0
-32.5
-35.0
-37.5
-40.0
7.20
7.25
7.30
7.35
7.40
F (GHz)
7.45
7.50
DocID025234 Rev 4 3/9
Characteristics
0
(dB)
-10
-20
-30
-40
-50
-60
-70
0 1
Figure 9. Transmission (dB)
2 3 4 5 6 7 8
F (GHz)
9 10
BALF-2690-02D3
4/9 DocID025234 Rev 4
BALF-2690-02D3 Package information
2.1
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Flip-Chip package information
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Figure 10. Flip-Chip package outline
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Parameter b
D
D1
D2
A
A1
A2
E
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Table 4. Flip-Chip package mechanical data
Description
Bump height + substrate thickness
Bump height
Substrate thickness
Bump diameter
Y dimension of the die
Y pitch
Y pitch2
X dimension of the die
X pitch
Distance from bump to edge of die on Y axis
Distance from bump to edge of die on X axis
Min.
0.570
0.155
0.215
1.590
0.890
Typ.
0.225
0.215
0.630
0.205
0.400
0.255
1.640
0.660
0.540
0.940
0.500
ccc
$ 0.025
$
Max.
0.690
0.255
0.295
1.690
0.990
0.05
Unit mm mm mm mm mm mm mm mm mm mm mm mm mm
DocID025234 Rev 4 5/9
Package information BALF-2690-02D3
Figure 11. Footprint
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Figure 12. Footprint - 3 mils stencil -non solder mask defined
Figure 13. Footprint - 3 mils stencil - solder mask defined
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6/9 DocID025234 Rev 4
BALF-2690-02D3
Figure 16. Marking
Dot, ST logo
ECOPACK grade xx = marking z = manufacturing location yww = datecode x y x z w w
Package information
Figure 17. Recommended land pattern
800 µm
Width 120 µm
Pads diameter 220 µm
(Solder mask opening 300 µm)
GND clearance 130µm
Figure 18. Flip Chip tape and reel specifications
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More information is available in the STMicroelectronics application notes:
AN2348 Flip-Chip: “Package description and recommendations for use”
DocID025234 Rev 4 7/9
Ordering information BALF-2690-02D3
Order code
BALF-2690-02D3
Table 5. Ordering information
Marking Weight Base Qty
SP 1.81 mg 5000
Delivery mode
Tape and Reel
Date
27-Sep-2013
19-Dec-2013
19-Nov-2014
02-Sep-2015
Revision
Table 6. Document revision history
Changes
1
2
3
4
Initial release
Added product weight in
Table 5
and updated Table 1
.
Added tape and reel dimensions.
Updated
Figure 10 . Added
Figure 12 , Figure 13
,
Figure 14
,
Figure 15 and
Table 4 .
8/9 DocID025234 Rev 4
BALF-2690-02D3
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DocID025234 Rev 4 9/9
