EMIF06-MSD04F3
6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection
Features
■
■
■
■
EMI low-pass filter
Integrated pull up resistors to prevent bus floating when no card is connected
208 MHz clock frequency compatible with
SDR104 mode (SD3.0)
Lead-free package
■
■
■
Benefits
■
■
Low power consumption
Easy layout thanks to smart pin-out configuration
Very low PCB space consumption
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP integration
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
Micro (T-Flash) secure digital memory card in:
■
■
Mobile phones
Communication systems
Description
The EMIF06-MSD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies.
Flip Chip
(16 bumps)
Figure 1.
Pin configuration (bump side)
4 3 2 1
A
B
C
D
TM: IPAD is a trademark of STMicroelectronics
July 2011 Doc ID 018849 Rev 1 1/9 www.st.com
9
Characteristics
1 Characteristics
Table 1.
Symbol
Absolute ratings (limiting values)
Parameter
V
PP
T j
T op
T stg
ESD discharge IEC 61000-4-2, level 4
Air discharge, card side
Contact discharge, card side
Air discharge, IC side
Contact discharge, IC side
Maximum junction temperature
Operating temperature range
Storage temperature range
Figure 2.
EMIF06-MSD04F3 configuration
Host side
Clk
CMD
Dat0
Dat1
Dat2
Dat3/CD
R1
R2
R3
R4
R5
R6
EMIF06-MSD04F3
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Table 2.
Pin
B1
B2
B3
B4
A1
A2
A3
A4
Pin configuration
Signal
Dat0
Dat1
SDDat1
SDDda0
Clk
V cc
V ss
SDClk
Vss
Pin
D1
D2
D3
D4
C1
C2
C3
C4
Signal
CMD
V ss
V ss
SDCMD
Dat3/CD
Dat2
SDDat2
SDDat3/CD
Doc ID 018849 Rev 1
Value Unit
15
8
2
2
125
- 40 to + 85
- 55 to + 150 kV
°C
°C
°C
Vcc
SDClk
SDCMD
SDDat0
SDDat1
SDDat2
SDDat3/CD
Card side
EMIF06-MSD04F3 Characteristics
Table 3.
Symbol
Electrical characteristic
Parameter
V
BR
I
RM
R1, R2, R3,
R4, R5, R6
Breakdown voltage
Leakage current at V
RM
Serial resistance
R7, R8, R9,
R10, R11
Pull-up resistance
-5
-10
-15
-20
-25
-30
C line
F
0 t
R
,t
F
Data line capacitance
Cut-off frequency
Rise and fall time
100k
Clk
Dat1
Dat3
1M 10M 100M
Dat0
Dat2
Cmd
F (Hz)
1G
I
R
= 1 mA
V
RM
= 3 V
Test conditions
Tolerance ±10 %, matching ±2 %
Tolerance ±20 %, matching ±2 %
V = 1.8 V, F = 10 MHz, V
OSC
= 30 mV
V = 2.9 V, F = 10 MHz, V
OSC
= 30 mV
S21 = -3 dB
C load
= 10 pF, low-ref = 0.58 V, high-ref = 1.27 V
20
Figure 3.
S21 attenuation measurements
0
S21 (dB)
Min.
Typ.
Max.
Unit
14 16
0.1
V
µA
36 40 44 Ω
25
7.5
550
0.98
30
10
9 k Ω pF
MHz ns
Figure 4.
Analog crosstalk measurements
0 dB
-10
-60
-70
-80
-90
-100
-110
-20
-30
-40
-50
100k
Clk-Dat0
1M 10M 100M
Dat3-SDDat0
F (Hz)
1G
Doc ID 018849 Rev 1 3/9
Characteristics EMIF06-MSD04F3
Figure 5.
Line capacitance versus applied voltage (typical values)
12
11
10
9
8
7
6
5
Cline (pF)
F=10 MHz
V
OSC
=30 mV
RMS
T
AMB
=25 °C
4
3
2
1 V
BIAS
(V)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Figure 6.
Line capacitance versus frequency
(typical values)
3
2
1
5
4
7
6
8
Cline (pF)
0
1
V
T
OSC
=30 mV
AMB
=25 °C
RMS
10
V
BIAS
=1.8 V
V
BIAS
=2.9 V
100
F (MHz)
500
Figure 7.
Digital crosstalk measurements
4/9 Doc ID 018849 Rev 1
EMIF06-MSD04F3 Characteristics
Figure 8.
Host side response to IEC 61000-4-2 (+8 kV contact discharge) on card side
Figure 9.
Host side response to IEC 61000-4-2 (-8 kV contact discharge) on card side
Doc ID 018849 Rev 1 5/9
Layout recommendations EMIF06-MSD04F3
3
Figure 10.
Layout recommendations
Vcc
Dat1
Dat0
Clk
CMD
Dat3/CD
Dat2
Dat1
Dat0
Vss
Clk
Vcc
NC
NC
Vss
CMD
Dat3/CD
Dat2
Input
Top level
Second level
Output
Top View
Ordering information scheme
Figure 11.
Ordering information scheme
EMI filter
Number of lines
Application
MSD = micro SD card
Version
04 = 7.5 pF line capacitance
Package
F = Flip Chip
3= lead-free, pitch = 400 µm, bump = 255 µm
EMIF 06 MSD 04 F3
6/9 Doc ID 018849 Rev 1
EMIF06-MSD04F3 Package information
●
●
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 12. Package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
Figure 13.
Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
1.54 mm ± 40 µm
170 µm ± 10
Figure 14.
Marking
Dot, ST logo
ECOPACK status xx = marking z = manufacturing location yww = datecode y = year, ww = week x y x z w w
Doc ID 018849 Rev 1 7/9
Ordering information
Figure 15.
Tape and reel specification
Dot identifying Pin A1 location
2.0
0.20
4.0
Ø 1.55
EMIF06-MSD04F3
0.69
All dimensionsare typical values in mm
1.65
4.0
User direction of unreeling
Note:
Table 4.
Ordering information
Order code Marking Package
EMIF06-MSD04F3 JW Flip Chip
Weight
3.2 mg
Base qty
5000
More information is available in the application notes:
AN2348: “Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
Delivery mode
Tape and reel 7”
Table 5.
Date
Document revision history
Revision
12-July-2011 1 First issue.
Changes
8/9 Doc ID 018849 Rev 1
EMIF06-MSD04F3
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