EMIF08-VID1F3
8-line low capacitance EMI filter and ESD protection
Datasheet - production data
Description
This is a highly integrated 8-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 20 kV.
Figure 1: Pin configuration (top view)
Features
High efficiency in EMI filtering in wide filter bandwidth: better than -25 dB from 700 MHz to 3.0 GHz
Very thin package: 0.6 mm max.
High efficiency in ESD suppression on all input and output pins (exceeds IEC61000-4-
2 level 4: ±20 kV contact discharge)
High reliability offered by monolithic integration
High reduction of parasitic elements through integration and wafer level packaging
Applications
LCD and camera for mobile phones
Computers and printers
Communication systems
MCU Boards
Figure 2: Basic cell configuration
R input output
R = 100 Ω
C line
= 30 pF typ. at 2.5V
DC
May 2017 DocID030456 Rev 1
This is information on a product in full production.
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Characteristics
1 Characteristics
Symbol
V pp
T j
T stg
T op
Table 1: Absolute maximum ratings (T amb
= 25 °C)
Parameter
Peak pulse voltage
Operating junction temperature
Storage temperature range
Operating temperature range
IESD IEC 61000-4-2
Contact discharge
Air discharge
Figure 3: Electrical characteristics (definitions)
EMIF08-VID1F3
Value
±20
±30
±125
-40 to +85
-65 to +150
Unit kV
°C
°C
°C
2/8
Symbol
V
BR
V
F
I
RM
R
C line
F
C
S
21
Table 2: Electrical characteristics (T amb
= 25 °C)
Test conditions Min. Typ. Max. Unit
I
R
= 1 mA
I
F
= 1 mA
V
RM
= 3.5 V per line
Serial resistance
V
BIAS
= 2.5 V
DC
reverse Bias, F = 1 MHz, V
OSC
= 30 mV
Cut-off frequency
Attenuation from 700 MHz to 3 GHz
F = 1.7 GHz
5.8 9
0.4 1.5
100
80 100 120
30
98
-25 -30
-45
V nA
Ω pF
MHz dB
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EMIF08-VID1F3
1.1 Characteristics (curves)
Figure 4: Attenuation versus frequency
Characteristics
Figure 5: Analog crosstalk versus frequency
Figure 6: ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 7: ESD response to IEC 61000-4-2
(-8 kV contact discharge)
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Package information
2
2.1
Package information
EMIF08-VID1F3
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com.
ECOPACK ® is an ST trademark.
WLCSP 20 bumps package information
Figure 8: WLCSP 20 bumps package outline
400 µm ± 40
255 µm ± 25
600 µm ± 40
170 µm
3140 µm ± 40
Figure 9: Footprint recommendations, dimensions in mm (inches)
Figure 10: Marking layout
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EMIF08-VID1F3
Figure 11: Tape dimension definitions
Package information
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Ordering information
3 Ordering information
Figure 12: Ordering information scheme
EMIF08-VID1F3
EMIF 08 - VID 1 F3
EMI Filter
08 : 8 lines
Application
Version
Package
Flip-chip
3 = lead-free, pitch 400 µm, bump = 255 µm
Order code
EMIF08-VID1F3
Marking
LN
Table 3: Ordering information
Package Weight Base qty. Delivery mode
WLCSP 20 bumps 7.2 mg 5000 Tape and reel
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4 Revision history
Date
19-May-2017
Table 4: Document revision history
Revision
1 Initial release.
Changes
Revision history
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EMIF08-VID1F3
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© 2017 STMicroelectronics
– All rights reserved
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