AMS TMD2620 Light Sensor Datasheet

TMD2620
Proximity Sensor Module
General Description
The device is an advanced proximity sensor. The slim module
incorporates an IR LED and factory calibrated LED driver. The
proximity detection feature provides object detection (e.g.
mobile device screen to user’s ear) by photodiode detection of
reflected IR energy (sourced by the integrated LED).
Detect/release events are interrupt driven, and occur when
proximity result crosses upper and/or lower threshold settings.
The proximity engine features offset adjustment registers to
compensate for unwanted IR energy reflection at the sensor.
Proximity results are further improved by automatic ambient
light subtraction.
Ordering Information and Content Guide appear at end of
datasheet.
Figure 1:
Added Value of Using TMD2620
Benefits
Features
• Reduced board space requirements and
enables low-profile system design
• Small footprint and low profile package
• 3.10 x 2.00 x 1.00 mm
• Reduced power consumption
• 0.18μm process technology with 1.8V I²C bus
Applications
The TMD2620 is ideal for mobile phone touch screen disable.
ams Datasheet
[v1-01] 2016-Aug-02
Page 1
Document Feedback
TMD2620 − General Description
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
Functional Blocks of TMD2620
Optically
Isolated IR
LED
PGND
Prox Data
Prox Control
Prox
Integration
Lower Upper
Prox
Thresholds
I²C Interface
Prox ADC
LEDA
SCL
SDA
Wait Control
INTR
IR
Detector
Interrupt
Control
VDD
GND
Page 2
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Pin Assignment
Pin Assignment
Figure 3:
TMD2620 Pinout (Top View)
,&
9''
,17
966
3*1'
6'$
/('$
6&/
Figure 4:
Pin Description
Pin Number
Pin Name
1
I/C
Internal connection. Connect to ground.
2
INT
Interrupt. Open drain output (active low)
3
PGND
4
LEDA
LED anode
5
SCL
I²C serial clock input
6
SDA
I²C serial data I/O terminal
7
VSS
Ground. All voltages are referenced to GND
8
VDD
Supply voltage
ams Datasheet
[v1-01] 2016-Aug-02
Description
Ground for LED current sink and I/O buffers
Page 3
Document Feedback
TMD2620 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
VDD
Supply voltage
-0.3
2.2
V
LEDA
Supply voltage
-0.3
3.6
V
Digital I/O terminal voltage
-0.3
3.6
V
Output terminal current
-1
20
mA
Storage temperature range
-40
85
ºC
VIO
(SDA, INT)
TSTRG
ISCR
Input current (latch up immunity)
JEDEC JESD78D Nov 2011
CLASS 1
ESDHBM
Electrostatic discharge HBM
S-001-2014
±2000
V
ESDCDM
Electrostatic discharge CDM
JEDEC JESD22-C101F Oct 2013
±500
V
Page 4
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Electrical Characteristics
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
Parameter
Supply voltage
VLEDA
Min
Typ
Max
Units
1.7
1.8
2.0
V
Voltage supplied to LEDA pin
3.3
Operating free-air temperature (1)
TA
V
-30
85
°C
Note(s):
1. While the device is operational across the temperature range, performance will vary with temperature. Operational characteristics are at
25°C, unless otherwise noted.
Figure 7:
Operating Characteristics, VDD = 1.8 V, TA = 25ºC (unless otherwise noted)
Symbol
fOSC
IDD
VOL
ILEAK
Parameter
Conditions
Min
Oscillator frequency
Supply current (1)
INT, SDA output low voltage
SCL, SDA input high voltage
VIL
SCL, SDA input low voltage
Max
Units
8.0
MHz
Idle state
(PON=1, PEN=0) (2)
30
μA
Sleep state (3)
0.7
6 mA sink current
Leakage current, SDA, SCL, INT pins
VIH
Typ
-5
5.0
μA
0.6
V
5
μA
1.26
V
0.54
V
Note(s):
1. Values are shown at the VDD pin and do not include current through the IR LED.
2. Idle state occurs when PON=1 and all functions are not enabled.
3. Sleep state occurs when PON = 0 and I²C bus is idle. If Sleep state has been entered as the result of operational flow, SAI = 1, PON will remain
high.
ams Datasheet
[v1-01] 2016-Aug-02
Page 5
Document Feedback
TMD2620 − Electrical Characteristics
Figure 8:
Proximity Optical Characteristics of TMD2620
Parameter
Conditions
Min
Typ
Max
Unit
Part to part variation (1)
Conditions:
PGAIN = 2 (4x)
PLDRIVE = 8 (54mA)
PPULSE = 15 (16 pulses)
PPULSE_LEN = 1 (16μs)
d=23mm round target
30mm target distance
75
100
125
%
Response, absolute
Basic proximity measurement (2)
Conditions:
PGAIN = 2 (4x),
PLDRIVE = 7(48mA)
PPULSE = 15 (16 pulses)
PPULSE_LEN = 2 (16μs)
Target material:
90% reflective surface of Kodak
gray card
Target Size: 100mm x 100mm
Target Distance: 60mm
82
103
123
Response, no target using offset
values from 0xE6 and 0xE7
PGAIN = 2 (4x)
ILEDDRIVE = 16 (102mA)
PPULSE = 16 (17 Pulses)
Pulse Length = 2 (16μS)
0
Noise/Signal (3)
PGAIN = 2 (4x)
IRLEDDRIVE = 8 (54mA)
PPULSE = 15 (16 pulses)
PPULSE_LEN = 1 (8μs)
d=23mm round target
30mm target distance
Counts
10
1
%
Note(s):
1. Production tested result is the average of 5 readings expressed relative to a calibrated response.
2. Representative result by characterization.
3. Production tested result is the average of 20 readings divided by the average response.
Page 6
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Electrical Characteristics
Figure 9:
Proximity Operation
$%!!&'!!()*'+,-'!.*
!"#
/(0,
/(0,
/(0,
/(0,
Figure 10:
Proximity Angular Spectral Response
Proximity Angular Spectral Responsivity
500
450
The response at 0° and 5°
is nearly identical.
IR - 0°
IR - 5°
400
Responsivity - Counts/uW/cm²
IR - 10°
350
IR - 20°
IR - 30°
300
250
200
150
100
50
0
300
350
400
450
500
550
600
650
700
750
800
850
900
950
1000
1050
1100
λ Wavelength - nm
ams Datasheet
[v1-01] 2016-Aug-02
Page 7
Document Feedback
TMD2620 − Register Description
Device address is 0x29.
Register Description
Figure 11:
Register Overview
Address
Register Name
R/W
Register Function
Reset Value
0x80
ENABLE
R/W
Enables states and interrupts
0x00
0x82
PRATE
R/W
Proximity sample rate
0x1F
0x83
WTIME
R/W
Wait time
0x00
0x88
PILT
R/W
Proximity interrupt low threshold
0x00
0x8A
PIHT
R/W
Proximity interrupt high threshold
0x00
0x8C
PERS
R/W
Proximity interrupt persistence filters
0x00
0x8D
CFG0
R/W
WTIME configuration
0x80
0x8E
PCFG0
R/W
Proximity pulse width and count
0x4F
0x8F
PCFG1
R/W
Proximity gain and LED current
0x80
0x91
REVID
R
Revision ID
0x92
ID
R
Device ID
0xD4
0x93
STATUS
R, SC
Device status register one
0x00
0x9C
PDATA
R
Proximity ADC data register MSBs
0x00
0x9E
REVID2
R
Reserved
0x00
0x9F
CFG2
R/W
Configuration register two
0x00
0xAB
CFG3
R/W
Configuration register three
0x0C
0xC0
POFFSET_L
R/W
Proximity offset value
0x00-0xFF
0xC1
POFFSET_H
R/W
Proximity offset sign
0x00-0xFF
0xD7
CALIB
R/W
Calibration control
0x00
0xD9
CALIBCFG
R/W
Calibration configuration
0x00
0xDC
CALIBSTAT
R/W
Calibration status bit
0x00
0xDD
INTENAB
R/W
Interrupt enables
0x00
Register Access:
• R = Read Only
• W = Write Only
• R/W = Read or Write
• SC = Self Clearing after access
Page 8
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
ENABLE Register (0x80)
Figure 12:
ENABLE Register
0x80: ENABLE
Field
Name
Reset
Type
Description
7:4
Reserved
0
RW
Reserved
3
wen
0
RW
Wait Enable. This bit activates the wait feature. Writing a one
actives the wait timer. Writing a zero disables the wait timer.
2
pen
0
RW
Proximity Detect Enable. This field activates the proximity
detection.
1
Reserved
0
RW
Reserved
0
pon
0
RW
Power On. This field activates the internal oscillator to permit the
timers and ADC channels to operate. Writing a one activates the
oscillator. Writing a zero disables the oscillator.
The Mode/Parameter fields should be written before pen is
asserted. The function pen require pon to be asserted for the
respective function to operate correctly.
PRATE Register (0x82)
Figure 13:
PRATE Register
0x82: PRATE
Field
Name
Reset
Type
7:0
prate
0x1F
RW
ams Datasheet
[v1-01] 2016-Aug-02
Description
When averaging is turned on, this register defines the time
between proximity measurements.
The time will be 88μs times this register's value.
Page 9
Document Feedback
TMD2620 − Register Description
WTIME Register (0x83)
Figure 14:
WTIME Register
0x83: WTIME
Field
Name
Reset
Type
Description
Wait Time. Eight bit value that specifies the time
7:0
wtime
0x00
Value
Wait Cycles
Wait Time
0x00
1
2.81ms/ 33.8ms
0x01
2
5.6ms/ 67.6ms
...
...
...
0x3f
63
180ms/ 2.16s
...
...
...
0xff
255
721ms/ 8.65s
RW
The wait timer is implemented with a down counter with 0x00
as the terminal count. Loading 0x00 will generate a 2.81ms wait
time, loading 0x01 will generate a 5.6ms wait time, and so forth;
by asserting wlong, in register 0x8D the wait time is given in
multiples of 33.8ms (12x).
Page 10
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
PILT Register (0x88)
Figure 15:
PILT Register
0x88: PILT
Field
Name
Reset
Type
7:0
pilt
0
RW
Description
Proximity ADC Channel Low Threshold
This register provides the low interrupt threshold.
If the value generated by the proximity channel is below the
low threshold specified and the PPERS value is reached, the pint
bit is asserted which will assert the INT pin if pien is set.
PIHT Register (0x8A)
Figure 16:
PIHT Register
0x8A: PIHT
Field
Name
Reset
Type
7:0
piht
0
RW
Description
Proximity ADC Channel High Threshold
This register provides the high interrupt threshold.
If the value generated by the proximity channel is above the
high threshold specified and the PPERS value is reached, the
pint bit is asserted which will assert the INT pin if pien is set.
ams Datasheet
[v1-01] 2016-Aug-02
Page 11
Document Feedback
TMD2620 − Register Description
PERS Register (0x8C)
This register controls the interrupt filtering capabilities of the
device. Configurable filtering is provided to allow interrupts to
be generated after a proximity cycle or if the integration cycle
has produced a result that is outside of the values specified by
threshold register for some specified number of times.
Figure 17:
PERS Register
0x8C: PERS
Field
Name
Reset
Type
Description
Proximity Persistence Filtering
Value
7:4
3:0
ppers
Reserved
0
Interrupt generated when...
0
Every proximity cycle
1
Any proximity value outside of threshold range
2
2 consecutive proximity values out of range
3
3 consecutive proximity values out of range
...
...
15
15 consecutive proximity values out of range
RW
0
RW
Reserved
CFG0 Register (0x8D)
Figure 18:
CFG0 Register
0x8D: CFG0
Field
Name
Reset
Type
7:3
Reserved
10000
RW
Reserved. Must be set to 10000.
2
wlong
0
RW
Wait Long. When asserted, the wait cycle is increased
by a factor 12x from that programmed in the WTIME
register.
1:0
Reserved
00
RW
Reserved. Must be set to 00.
Page 12
Document Feedback
Description
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
PCFG0 Register (0x8E)
Figure 19:
PCFG0 Register
0x8E: PCFG0
Field
Name
Reset
Type
Description
Proximity Pulse Length
7:6
ppulse_len
1
Value
Pulse Length
0
4μs
1
8μs
2
16μs
3
32μs
RW
Maximum Number of Pulses in Proximity
5:0
ppulse
ams Datasheet
[v1-01] 2016-Aug-02
15
RW
Value
Number of Pulses
0
1
1
2
2
3
...
...
63
64
Page 13
Document Feedback
TMD2620 − Register Description
PCFG1 Register (0x8F)
Figure 20:
PCFG1 Register
0x8F: PCFG1
Field
Name
Reset
Type
Description
Proximity Gain Control. Sets the gain of the proximity receiver.
7:6
5
pgain
Reserved
2
0
Value
Gain Value
0
1x
1
2x
2
4x
3
8x
RW
RW
Reserved
Proximity LED Drive Strength. This is configured linearly in steps
of 6mA, this is the nominal value. The actual value depends on
the trim procedure.
4:0
pldrive
0
RW
Value
LED Current
0
6mA
1
12mA
...
...
31
192mA
REVID Register (0x91)
Figure 21:
REVID Register
0x91: REVID
Field
Name
Reset
Type
7:3
Reserved
0
RO
Reserved
2:0
rev_id
RO
Revision Number Identification
Page 14
Document Feedback
Description
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
ID Register (0x92)
Figure 22:
ID Register
0x92: ID
Field
Name
Reset
Type
Description
Part Number Identification
7:2
1:0
ID
Reserved
ams Datasheet
[v1-01] 2016-Aug-02
0x35
00
RO
RO
Value
Meaning
110101
TMD2620
Reserved
Page 15
Document Feedback
TMD2620 − Register Description
STATUS Register (0x93)
Figure 23:
STATUS Register
0x93: STATUS
Field
Name
Reset
Type
7
Reserved
0
R, SC
Reserved
R, SC
Proximity Saturation. Indicates that an ambient- or
reflective-saturation event occurred during a previous
proximity cycle.
Writing a 1 will clear this status flag; to enable clear-by-read
function, the register CFG3.int_read_clear must be set 1
6
psat
0
Description
5
pint
0
R, SC
Proximity Interrupt. Indicates that the device is asserting a
proximity interrupt. Writing a 1 will clear this status flag; to
enable clear-by-read function, the register CFG3.int_read_
clear must be set 1
4
Reserved
0
R, SC
Reserved
3
cint
0
R, SC
Calibration Interrupt. Writing a 1 will clear this status flag; to
enable clear-by-read function, the register CFG3.int_read_
clear must be set 1
2
zint
0
R, SC
Zero Detection Interrupt. Writing a 1 will clear this status
flag. Enable clear-byread with CFG3
1
psat_
reflective
R, SC
psat interrupt is from reflective light saturation writing a 1
to psat or psat_reflective will clear this status flag; to enable
clear-by-read function, the register CFG3.int_read_clear
must be set 1
0
psat_
ambient
R, SC
psat interrupt is from ambient light or idac threshold
saturation writing a 1 to psat or psat_ambient will clear this
status flag; to enable clear-by-read function, the register
CFG3.int_read_clear must be set 1
0
0
STATUS flags are reset with reading from STATUS address, or
with writing 1 to dedicated bits of STATUS address. PDATA Register (0x9C)
Figure 24:
PDATA Register
0x9C: PDATA
Field
Name
Reset
Type
7:0
pdata
0
RO
Page 16
Document Feedback
Description
This register contains the 8-bit proximity data.
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
REVID2 Register (0x9E)
Figure 25:
REVID2 Register
0x9E: REVID2
Field
Name
Reset
Type
Description
7:4
Reserved
0
RO
Reserved
3:0
aux_id
0
RO
TBD
CFG3 Register (0xAB)
Figure 26:
CFG3 Register
0xAB: CFG3
Field
Name
Reset
Type
Description
7
int_read_clear
0
RW
If set to 1, interrupt flags in STATUS register (0x93) are
reset after I²C reads to the STATUS register; otherwise the
interrupt flags will not be reset.
6:5
Reserved
0
R, SC
Reserved. Set to 0.
Sleep After Interrupt: Power down the device at the end
of the proximity cycle if an interrupt has been
generated.(1)
4
sai
0
RW
PON
SAI
INT
(low active)
Oscillator
0
x
x
OFF
1
0
x
ON
1
1
1
ON
1
1
0
OFF
(SAI induced sleep)
The way to “wake up” the device from SAI-sleep is by
clearing the interrupt register 0x93.
3:0
Reserved
1100
RW
Reserved. Set to 0.
Note(s):
1. SAI does not modify any register bits directly, it rather uses the interrupt signal to turn OFF the oscillator.
ams Datasheet
[v1-01] 2016-Aug-02
Page 17
Document Feedback
TMD2620 − Register Description
POFFSET_L Register (0xC0)
Figure 27:
POFFSET_L Register
0xC0: POFFSET_L
Field
Name
Reset
Type
7:0
poffset_l
0x00-0xFF
R, SC
Description
Offset compensation for proximity channel (magnitude)
POFFSET_H Register (0xC1)
Figure 28:
POFFSET_H Register
0xC1: POFFSET_H
Field
Name
Reset
Type
0
poffset_h
0x00-0xFF
R, SC
Description
Offset compensation for proximity channel (sign)
CALIB Register (0xD7)
Figure 29:
CALIB Register
0xD7: CALIB
Field
Name
Reset
Type
7:6
Reserved
0
RO
Description
Reserved. Set to 0.
5
electrical_calibration
0
RW_SM
If set, do electrical offset calibration (diodes
disabled) instead of optical. Otherwise, do
optical calibration. In either case, the result is
stored in the POFFSET_L/H registers. This flag is
cleared after calibration is completed.
This flag is redundant, software could just:
set gdiode_disab=0xf set concap_intinn=1 start
calibration. However, since electrical calibration
is done automatically at the first time PON gets
asserted, the function is there anyway, so it's
made available to the user here.
4:1
Reserved
0
WS_SC
Reserved. Set to 0.
RW_SM
Start Offset Calibration. The result is stored in the
POFFSET registers. The calib_finished flag is
asserted afterwards. Calibration can be stopped
by writing a 0 to this bit.
0
start_offset_calib
Page 18
Document Feedback
0
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
CALIBCFG Register (0xD9)
Figure 30:
CALIBCFG Register
0xD9: CALIBCFG
Field
Name
Reset
Type
Description
ADC target during binary search
7:5
binsrch_target
0x2
Value
Target
0
0
1
1
2
3
3
7
4
15
5
31
6
63
7
127
RW
Note: This target is relative to 8-bit ADC values. In
the circuit, a 10-bit target is used (x4) of which the
lowest 2 bits are always ignored when checking for
zero during binary search and zero detection.
In hardware, this defines a mask of which bits to
ignore when comparing to zero. e.g. binsrch_
target=4 (target=15) means that values from the
ADC are AND'ed with 0xffc0 before comparing to
zero. Only values 16 or larger are taken as positive
ADC values.
4
3
Reserved
prox_auto_offset_
adjust
ams Datasheet
[v1-01] 2016-Aug-02
0
0
RW
Reserved. Set to 0.
SC
This bit enables an automatic adjustment of the
offset used in proximity measurements. If this bit is
set, when a measurement returns zero, the value of
0xC0 will be decremented and offset_adjusted flag
will be set, bit 2 in 0xDC.
Page 19
Document Feedback
TMD2620 − Register Description
0xD9: CALIBCFG
Field
Name
Reset
Type
Description
Prox data calculation is done by averaging
consecutive windows of constant size. At the end of
the window, PDATA is updated. Typical use case is
HRM measurement
2:0
prx_data_avg
0
R_PUSH
Value
Window Size
0
disable
1
2
2
4
3
8
4
16
5
32
6
64
7
128
CALIBSTAT Register (0xDC)
Figure 31:
CALIBSTAT Register
0xDC: CALIBSTAT
Field
Name
Reset
7:3
Reserved
0
2
offset_adjusted
0
1
Reserved
0
0
calib_finished
0
Page 20
Document Feedback
Type
Description
Reserved
SC
This bit is a flag that the automatic proximity offset
adjustment has changed the offset in register 0xDC.
See 0xD9 for “prox_auto_offset_adjust”.
Reserved
R/W
Offset calibration has finished. Clear bit by writing '1' to
it. Bit generates interrupt if cien is asserted.
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Register Description
INTENAB Register (0xDD)
Figure 32:
INTENAB Register
0xDD: INTENAB
Field
Name
Reset
Type
6
psien
0
RW
Writing '1' to this bit enables psat.
5
pien
0
RW
Writing '1' to this bit enables prox interrupt.
3
cien
0
RW
Writing '1' to this bit enables calibration interrupt.
2
zien
0
RW
Writing '1' to this bit enables zero_detection/offset_adjustment.
ams Datasheet
[v1-01] 2016-Aug-02
Description
Page 21
Document Feedback
TMD2620 − Application Information
Application Information
Figure 33:
Typical Application Hardware Circuit
VBUS
RINT = 10KΩ
RPU
TMD2620
SCL
SCL
VDD
SDA
SDA
GND
INT
INT
LEDA
I/C
PGND
R = 22Ω
1.8V
Bulk System
Capacitance
4.7μF
3.0V
10μF
Note(s):
1. Place the 4.7μF and 10μF capacitors within 5mm of the module.
2. The value of the I²C pull up resistors RPU should be based on the 1.8V bus voltage, system bus speed and trace capacitance.
3. The bulk capacitor can affect the stability of a regulated supply output and should be chosen with the regulator characteristics in
mind.
4. GND and PGND should be connected to the same solid ground plane as close to the device as possible.
Page 22
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − PCB Pad Layout
PCB Pad Layout
Figure 34:
Recommended PCB Pad Layout
; &/
;
;
&/
Note(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerances are 0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
ams Datasheet
[v1-01] 2016-Aug-02
Page 23
Document Feedback
TMD2620 − Packaging Mechanical Data
Packaging Mechanical Data
Figure 35:
Package Drawing
/('
&/
3,1,1',&$725
RoHS
&/
Green
& $ %
3$57 &/ 7223(1,1* &/ 3$57 &/ 72352; &/ 352; &/ 72/(' &/ $
%
“
“
“
6'$
966
9''
,175
6<1&
I/C
;
0 & $ %
3*1'
;
0 & $ %
&/
6&/
&
;
&/
/('$
; '(9,&(3,1287
%277209,(:
Note(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerances are 0.05mm unless otherwise noted.
3. Contact finish is Au.
4. This package contains no lead (Pb).
5. This drawing is subject to change without notice.
Page 24
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Tape & Reel Information
Tape & Reel Information
Figure 36:
Tape & Reel Information
'R
3
“,
<
3R
,,
(
),,,
'
0,1
:
5
7<3,&$/
<
3
$R
%R
7
“
.R
6(&7,21<<
Ao
Bo
Ko
F
P1
W
2.25
3.35
1.25
3.50
4.00
8.00
+/- 0.05
+/- 0.05
+/- 0.05
+/- 0.05
+/- 0.10
+0.3/-0.1
Note(s):
1. Measured from centreline of sprocket hole to centreline of pocket.
2. Cumulative tolerance of 10 sprocket holes is ± 0.20.
3. Measured from centreline of sprocket hole to centreline of pocket.
4. Other material available.
ams Datasheet
[v1-01] 2016-Aug-02
Page 25
Document Feedback
TMD2620 − Soldering & Storage Information
Soldering & Storage
Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 37:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Soak time
Device
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 s
Time above 230°C (T2)
t2
Max 50 s
Time above Tpeak – 10 °C (T3)
t3
Max 10 s
Tpeak
260°C
Peak temperature in reflow
Temperature gradient in cooling
Max −5°C/s
Figure 38:
Solder Reflow Profile Graph
NottoScale
Tpeak
T3
T2
Temperaturein°C
T1
Timeinseconds
Page 26
Document Feedback
t3
t2
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Soldering & Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: <40°C
• Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: <30°C
• Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet
[v1-01] 2016-Aug-02
Page 27
Document Feedback
TMD2620 − Ordering & Contact Information
Ordering & Contact Information
Figure 39:
Ordering Information
Ordering Code
Package
I²C Addr
Delivery Form
Delivery Quantity
TMD26203
Module
29h
3.30mm reel
5000 pcs/reel
TMD26203M
Module
29h
3.30mm reel
1000 pcs/reel
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 28
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-01] 2016-Aug-02
Page 29
Document Feedback
TMD2620 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 30
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-01] 2016-Aug-02
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 31
Document Feedback
TMD2620 − Revision Information
Revision Information
Changes from 1-00 (2016-Jun-28) to current revision 1-01 (2016-Aug-02)
Page
Added note under Figure 35
24
Updated Figure 39
28
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 32
Document Feedback
ams Datasheet
[v1-01] 2016-Aug-02
TMD2620 − Content Guide
Content Guide
ams Datasheet
[v1-01] 2016-Aug-02
1
1
2
General Description
Applications
Block Diagram
3
4
5
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
8
9
10
10
11
11
12
13
14
15
15
16
17
17
18
18
19
19
19
20
21
22
Register Description
ENABLE Register (0x80)
PRATE Register (0x82)
WTIME Register (0x83)
PILT Register (0x88)
PIHT Register (0x8A)
PERS Register (0x8C)
CFG0 Register (0x8D)
PCFG0 Register (0x8E)
PCFG1 Register (0x8F)
REVID Register (0x91)
ID Register (0x92)
STATUS Register (0x93)
PDATA Register (0x9C)
REVID2 Register (0x9E)
CFG3 Register (0xAB)
POFFSET_L Register (0xC0)
POFFSET_H Register (0xC1)
CALIB Register (0xD7)
CALIBCFG Register (0xD9)
CALIBSTAT Register (0xDC)
INTENAB Register (0xDD)
23
24
25
26
Application Information
PCB Pad Layout
Packaging Mechanical Data
Tape & Reel Information
27
28
28
28
28
28
Soldering & Storage Information
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
29
30
31
32
33
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
Page 33
Document Feedback
">