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32/40-Bit IEEE Floating-Point
DSP Microprocessor
ADSP-21020
FUNCTIONAL BLOCK DIAGRAM FEATURES
Superscalar IEEE Floating-Point Processor
Off-Chip Harvard Architecture Maximizes Signal
Processing Performance
30 ns, 33.3 MIPS Instruction Rate, Single-Cycle
Execution
100 MFLOPS Peak, 66 MFLOPS Sustained Performance
1024-Point Complex FFT Benchmark: 0.58 ms
Divide (y/x): 180 ns
Inverse Square Root (1/
√ x): 270 ns
32-Bit Single-Precision and 40-Bit Extended-Precision
IEEE Floating-Point Data Formats
32-Bit Fixed-Point Formats, Integer and Fractional, with 80-Bit Accumulators
IEEE Exception Handling with Interrupt on Exception
Three Independent Computation Units: Multiplier,
ALU, and Barrel Shifter
Dual Data Address Generators with Indirect, Immediate, Modulo, and Bit Reverse Addressing Modes
Two Off-Chip Memory Transfers in Parallel with
Instruction Fetch and Single-Cycle Multiply & ALU
Operations
Multiply with Add & Subtract for FFT Butterfly
Computation
Efficient Program Sequencing with Zero-Overhead
Looping: Single-Cycle Loop Setup
Single-Cycle Register File Context Switch
15 (or 25) ns External RAM Access Time for Zero-Wait-
State, 30 (or 40) ns Instruction Execution
IEEE JTAG Standard 1149.1 Test Access Port and
On-Chip Emulation Circuitry
223-Pin PGA Package (Ceramic)
GENERAL DESCRIPTION
The ADSP-21020 is the first member of Analog Devices’ family of single-chip IEEE floating-point processors optimized for digital signal processing applications. Its architecture is similar to that of Analog Devices’ ADSP-2100 family of fixed-point
DSP processors.
Fabricated in a high-speed, low-power CMOS process, the
ADSP-21020 has a 30 ns instruction cycle time. With a highperformance on-chip instruction cache, the ADSP-21020 can execute every instruction in a single cycle.
The ADSP-21020 features:
• Independent Parallel Computation Units
The arithmetic/logic unit (ALU), multiplier and shifter perform single-cycle instructions. The units are architecturally arranged in parallel, maximizing computational throughput. A single multifunction instruction executes parallel ALU and
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
DATA ADDRESS
GENERATORS
DAG 1 DAG 2
REGISTER FILE
INSTRUCTION
CACHE
PROGRAM
SEQUENCER
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
PROGRAM MEMORY DATA
DATA MEMORY DATA
ALU
ARITHMETIC UNITS
MULTIPLIER SHIFTER
JTAG TEST
& EMULATION
TIMER
EXTERNAL
ADDRESS
BUSES
EXTERNAL
DATA
BUSES multiplier operations. These computation units support IEEE
32-bit single-precision floating-point, extended precision
40-bit floating-point, and 32-bit fixed-point data formats.
• Data Register File
A general-purpose data register file is used for transferring data between the computation units and the data buses, and for storing intermediate results. This 10-port (16-register) register file, combined with the ADSP-21020’s Harvard architecture, allows unconstrained data flow between computation units and off-chip memory.
• Single-Cycle Fetch of Instruction and Two Operands
The ADSP-21020 uses a modified Harvard architecture in which data memory stores data and program memory stores both instructions and data. Because of its separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch an operand from data memory, an operand from program memory, and an instruction from the cache, all in a single cycle.
• Memory Interface
Addressing of external memory devices by the ADSP-21020 is facilitated by on-chip decoding of high-order address lines to generate memory bank select signals. Separate control lines are also generated for simplified addressing of page-mode
DRAM.
The ADSP-21020 provides programmable memory wait states, and external memory acknowledge controls allow interfacing to peripheral devices with variable access times.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 Fax: 617/326-8703
ADSP-21020
• Instruction Cache
The ADSP-21020 includes a high performance instruction cache that enables three-bus operation for fetching an instruction and two data values. The cache is selective—only the instructions whose fetches conflict with program memory data accesses are cached. This allows full-speed execution of core, looped operations such as digital filter multiplyaccumulates and FFT butterfly processing.
• Hardware Circular Buffers
The ADSP-21020 provides hardware to implement circular buffers in memory, which are common in digital filters and
Fourier transform implementations. It handles address pointer wraparound, reducing overhead (thereby increasing performance) and simplifying implementation. Circular buffers can start and end at any location.
• Flexible Instruction Set
The ADSP-21020’s 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP-21020 can conditionally execute a multiply, an add, a subtract and a branch in a single instruction.
DEVELOPMENT SYSTEM
The ADSP-21020 is supported with a complete set of software and hardware development tools. The ADSP-21000 Family
Development System includes development software, an evaluation board and an in-circuit emulator.
• Assembler
Creates relocatable, COFF (Common Object File Format) object files from ADSP-21xxx assembly source code. It accepts standard C preprocessor directives for conditional assembly and macro processing. The algebraic syntax of the
ADSP-21xxx assembly language facilitates coding and debugging of DSP algorithms.
• Linker/Librarian
The Linker processes separately assembled object files and library files to create a single executable program. It assigns memory locations to code and to data in accordance with a user-defined architecture file that describes the memory and
I/O configuration of the target system. The Librarian allows you to group frequently used object files into a single library file that can be linked with your main program.
• Simulator
The Simulator performs interactive, instruction-level simulation of ADSP-21xxx code within the hardware configuration described by a system architecture file. It flags illegal operations and supports full symbolic disassembly. It provides an easy-to-use, window oriented, graphical user interface that is identical to the one used by the ADSP-21020
EZ-ICE Emulator. Commands are accessed from pull-down menus with a mouse.
• PROM Splitter
Formats an executable file into files that can be used with an industry-standard PROM programmer.
• C Compiler and Runtime Library
The C Compiler complies with ANSI specifications. It takes advantage of the ADSP-21020’s high-level language architectural features and incorporates optimizing algorithms to speed up the execution of code. It includes an extensive runtime library with over 100 standard and DSP-specific functions.
–2–
• C Source Level Debugger
A full-featured C source level debugger that works with the simulator or EZ-ICE emulator to allow debugging of assembler source, C source, or mixed assembler and C.
• Numerical C Compiler
Supports ANSI Standard (X3J11.1) Numerical C as defined by the Numeric C Extensions Group. The compiler accepts C source input containing Numerical C extensions for array selection, vector math operations, complex data types, circular pointers, and variably dimensioned arrays, and outputs ADSP-21xxx assembly language source code.
• ADSP-21020 EZ-LAB® Evaluation Board
The EZ-LAB Evaluation Board is a general-purpose, standalone ADSP-21020 system that includes 32K words of program memory and 32K words of data memory as well as analog I/O. A PC RS-232 download path enables the user to download and run programs directly on the EZ-LAB. In addition, it may be used in conjunction with the EZ-ICE
Emulator to provide a powerful software debug environment.
• ADSP-21020 EZ-ICE® Emulator
This in-circuit emulator provides the system designer with a
PC-based development environment that allows nonintrusive access to the ADSP-21020’s internal registers through the processor’s 5-pin JTAG Test Access Port. This use of on-chip emulation circuitry enables reliable, full-speed performance in any target. The emulator uses the same graphical user interface as the ADSP-21020 Simulator, allowing an easy transition from software to hardware debug. (See “Target System
Requirements for Use of EZ-ICE Emulator” on page 27.)
ADDITIONAL INFORMATION
This data sheet provides a general overview of ADSP-21020 functionality. For additional information on the architecture and instruction set of the processor, refer to the ADSP-21020 User’s
Manual. For development system and programming reference information, refer to the ADSP-21000 Family Development
Software Manuals and the ADSP-21020 Programmer’s Quick
Reference. Applications code listings and benchmarks for key
DSP algorithms are available on the DSP Applications BBS; call
(617) 461-4258, 8 data bits, no parity, 1 stop bit, 300/1200/
2400/9600 baud.
ARCHITECTURE OVERVIEW
Figure 1 shows a block diagram of the ADSP-21020. The processor features:
• Three Computation Units (ALU, Multiplier, and Shifter) with a Shared Data Register File
• Two Data Address Generators (DAG 1, DAG 2)
• Program Sequencer with Instruction Cache
• 32-Bit Timer
• Memory Buses and Interface
• JTAG Test Access Port and On-Chip Emulation Support
Computation Units
The ADSP-21020 contains three independent computation units: an ALU, a multiplier with fixed-point accumulator, and a shifter. In order to meet a wide variety of processing needs, the computation units process data in three formats: 32-bit fixed-point, 32-bit floating-point and 40-bit floating-point. The floating-point operations are single-precision IEEE-compatible
(IEEE Standard 754/854). The 32-bit floating-point format is
EZ-LAB and EZ-ICE are registered trademarks of Analog Devices, Inc.
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DAG 1
8 x 4 x 32
CACHE
MEMORY
32 x 48
DAG 2
8 x 4 x 24
PMD BUS 48
PMA BUS
24
DMA BUS 32
BUS CONNECT
DMD BUS 40
PROGRAM
SEQUENCER
JTAG TEST &
EMULATION
FLAGS
TIMER
ADSP-21020
PMA
DMA
PMD
DMD
FLOATING & FIXED-POINT
MULTIPLIER, FIXED-POINT
ACCUMULATOR
REGISTER
FILE
16 x 40
32-BIT
BARREL
SHIFTER
FLOATING-POINT
& FIXED-POINT
ALU
Figure 1. ADSP-21020 Block Diagram the standard IEEE format, whereas the 40-bit IEEE extendedprecision format has eight additional LSBs of mantissa for greater accuracy.
The multiplier performs floating-point and fixed-point multiplication as well as fixed-point multiply/add and multiply/ subtract operations. Integer products are 64 bits wide, and the accumulator is 80 bits wide. The ALU performs 45 standard arithmetic and logic operations, supporting both fixed-point and floating-point formats. The shifter performs 19 different operations on 32-bit operands. These operations include logical and arithmetic shifts, bit manipulation, field deposit, and extract and derive exponent operations.
The computation units perform single-cycle operations; there is
no computation pipeline. The three units are connected in parallel rather than serially, via multiple-bus connections with the 10-port data register file. The output of any computation unit may be used as the input of any unit on the next cycle. In a
multifunction computation, the ALU and multiplier perform independent, simultaneous operations.
Data Register File
The ADSP-21020’s general-purpose data register file is used for transferring data between the computation units and the data buses, and for storing intermediate results. The register file has two sets (primary and alternate) of sixteen 40-bit registers each, for fast context switching.
With a large number of buses connecting the registers to the computation units, data flow between computation units and from/to off-chip memory is unconstrained and free from bottlenecks. The 10-port register file and Harvard architecture of the ADSP-21020 allow the following nine data transfers to be performed every cycle:
• Off-chip read/write of two operands to or from the register file
• Two operands supplied to the ALU
• Two operands supplied to the multiplier
• Two results received from the ALU and multiplier (three, if the ALU operation is a combined addition/subtraction)
The processor’s 48-bit orthogonal instruction word supports fully parallel data transfer and arithmetic operations in the same instruction.
Address Generators and Program Sequencer
Two dedicated address generators and a program sequencer supply addresses for memory accesses. Because of this, the computation units need never be used to calculate addresses.
Because of its instruction cache, the ADSP-21020 can simultaneously fetch an instruction and data values from both off-chip program memory and off-chip data memory in a single cycle.
The data address generators (DAGs) provide memory addresses when external memory data is transferred over the parallel memory ports to or from internal registers. Dual data address generators enable the processor to output two simultaneous addresses for dual operand reads and writes. DAG 1 supplies
32-bit addresses to data memory. DAG 2 supplies 24-bit addresses to program memory for program memory data accesses.
Each DAG keeps track of up to eight address pointers, eight modifiers, eight buffer length values and eight base values. A pointer used for indirect addressing can be modified by a value
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ADSP-21020 in a specified register, either before (premodify) or after
(postmodify) the access. To implement automatic modulo addressing for circular buffers, the ADSP-21020 provides buffer length registers that can be associated with each pointer. Base values for pointers allow circular buffers to be placed at arbitrary locations. Each DAG register has an alternate register that can be activated for fast context switching.
The program sequencer supplies instruction addresses to program memory. It controls loop iterations and evaluates conditional instructions. To execute looped code with zero overhead, the ADSP-21020 maintains an internal loop counter and loop stack. No explicit jump or decrement instructions are required to maintain the loop.
The ADSP-21020 derives its high clock rate from pipelined
fetch, decode and execute cycles. Approximately 70% of the machine cycle is available for memory accesses; consequently,
ADSP-21020 systems can be built using slower and therefore less expensive memory chips.
Instruction Cache
The program sequencer includes a high performance, selective instruction cache that enables three-bus operation for fetching an instruction and two data values. This two-way, set-associative cache holds 32 instructions. The cache is selective—only the instructions whose fetches conflict with program memory data accesses are cached, so the ADSP-21020 can perform a program memory data access and can execute the corresponding instruction in the same cycle. The program sequencer fetches the instruction from the cache instead of from program memory, enabling the
ADSP-21020 to simultaneously access data in both program memory and data memory.
Context Switching
Many of the ADSP-21020’s registers have alternate register sets that can be activated during interrupt servicing to facilitate a fast context switch. The data registers in the register file, DAG registers and the multiplier result register all have alternate sets.
Registers active at reset are called primary registers; the others are called alternate registers. Bits in the MODE1 control register determine which registers are active at any particular time.
The primary/alternate select bits for each half of the register file
(top eight or bottom eight registers) are independent. Likewise, the top four and bottom four register sets in each DAG have independent primary/ alternate select bits. This scheme allows passing of data between contexts.
Interrupts
The ADSP-21020 has four external hardware interrupts, nine internally generated interrupts, and eight software interrupts.
For the external interrupts and the internal timer interrupt, the
ADSP-21020 automatically stacks the arithmetic status and mode (MODE1) registers when servicing the interrupt, allowing five nesting levels of fast service for these interrupts.
An interrupt can occur at any time while the ADSP-21020 is executing a program. Internal events that generate interrupts include arithmetic exceptions, which allow for fast trap handling and recovery.
Timer
The programmable interval timer provides periodic interrupt generation. When enabled, the timer decrements a 32-bit count register every cycle. When this count register reaches zero, the
ADSP-21020 generates an interrupt and asserts its TIMEXP
–4– output. The count register is automatically reloaded from a
32-bit period register and the count resumes immediately.
System Interface
Figure 2 shows an ADSP-21020 basic system configuration.
The external memory interface supports memory-mapped peripherals and slower memory with a user-defined combination of programmable wait states and hardware acknowledge signals.
Both the program memory and data memory interfaces support addressing of page-mode DRAMs.
The ADSP-21020’s internal functions are supported by four internal buses: the program memory address (PMA) and data memory address (DMA) buses are used for addresses associated with program and data memory. The program memory data
(PMD) and data memory data (DMD) buses are used for data associated with the two memory spaces. These buses are extended off chip. Four data memory select (DMS) signals select one of four user-configurable banks of data memory.
Similarly, two program memory select (PMS) signals select between two user-configurable banks of program memory. All banks are independently programmable for 0-7 wait states.
The PX registers permit passing data between program memory and data memory spaces. They provide a bridge between the
48-bit PMD bus and the 40-bit DMD bus or between the 40-bit register file and the PMD bus.
The PMA bus is 24 bits wide allowing direct access of up to
16M words of mixed instruction code and data. The PMD is 48 bits wide to accommodate the 48-bit instruction width. For access of 40-bit data the lower 8 bits are unused. For access of
32-bit data the lower 16 bits are ignored.
The DMA bus is 32 bits wide allowing direct access of up to 4
Gigawords of data. The DMD bus is 40 bits wide. For 32-bit data, the lower 8 bits are unused. The DMD bus provides a path for the contents of any register in the processor to be transferred to any other register or to any external data memory location in a single cycle. The data memory address comes from one of two sources: an absolute value specified in the instruction code (direct addressing) or the output of a data address generator (indirect addressing).
External devices can gain control of the processor’s memory buses from the ADSP-21020 by means of the bus request/grant signals (BR and BG). To grant its buses in response to a bus request, the ADSP-21020 halts internal operations and places its program and data memory interfaces in a high impedance state. In addition, three-state controls (DMTS and PMTS) allow an external device to place either the program or data memory interface in a high impedance state without affecting the other interface and without halting the ADSP-21020 unless it requires a memory access from the affected interface. The three-state controls make it easy for an external cache controller to hold the ADSP-21020 off the bus while it updates an external cache memory.
JTAG Test and Emulation Support
The ADSP-21020 implements the boundary scan testing provisions specified by IEEE Standard 1149.1 of the Joint
Testing Action Group (JTAG). The ADSP-21020’s test access port and on-chip JTAG circuitry is fully compliant with the IEEE 1149.1 specification. The test access port enables boundary scan testing of circuitry connected to the
ADSP-21020’s I/O pins.
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ADSP-21020
PROGRAM
MEMORY
SELECTS
OE
WE
ADDR
DATA
1
×
CLOCK
4
2
24
48
CLKIN RESET IRQ3-0
PMS1-0
PMRD
PMWR
PMA
PMD
DMS3-0
DMRD
DMWR
DMA
DMD
ADSP-21010
4
32
PMTS
PMPAGE
PMACK
DMTS
DMPAGE
DMACK
32
SELECTS
OE
WE
ADDR
DATA
MEMORY
DATA
SELECTS
OE
PERIPHERALS
WE
ACK
ADDR
DATA
4 5
PIN DESCRIPTIONS
This section describes the pins of the ADSP-21020. When groups of pins are identified with subscripts, e.g. PMD
47–0
, the highest numbered pin is the MSB (in this case, PMD
47
). Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS, TDI, and TRST). Those that are asynchronous (A) can be asserted asynchronously to CLKIN.
O = Output; I = Input; S = Synchronous; A = Asynchronous;
P = Power Supply; G = Ground.
Pin
Name Type Function
PMA
PMD
PMS
23–0
47–0
1–0
PMRD
PMWR
O
I/O
O
O
O
PMACK I/S
Program Memory Address. The ADSP-21020 outputs an address in program memory on these pins.
Program Memory Data. The ADSP-21020 inputs and outputs data and instructions on these pins. 32-bit fixed-point data and 32-bit single-precision floating-point data is transferred over bits 47-16 of the PMD bus.
Program Memory Select lines. These pins are asserted as chip selects for the corresponding banks of program memory. Memory banks must be defined in the memory control registers. These pins are decoded program memory address lines and provide an early indication of a possible bus cycle.
Program Memory Read strobe. This pin is asserted when the ADSP-21020 reads from program memory.
Program Memory Write strobe. This pin is asserted when the ADSP-21020 writes to program memory.
Program Memory Acknowledge. An external device deasserts this input to add wait states to a memory access.
Figure 2. Basic System Configuration
The ADSP-21020 also implements on-chip emulation through the JTAG test access port. The processor’s eight sets of breakpoint range registers enable program execution at full speed until reaching a desired break-point address range. The processor can then halt and allow reading/writing of all the processor’s internal registers and external memories through the
JTAG port.
Pin
Name Type
PMPAGE O
PMTS
DMACK
I/S
I/S
Function
Program Memory Page Boundary. The
ADSP-21020 asserts this pin to signal that a program memory page boundary has been crossed. Memory pages must be defined in the memory control registers.
Program Memory Three-State Control.
PMTS places the program memory address, data, selects, and strobes in a highimpedance state. If PMTS is asserted while a PM access is occurring, the processor will halt and the memory access will not be completed. PMACK must be asserted for at least one cycle when PMTS is deasserted to allow any pending memory access to complete properly. PMTS should only be asserted (low) during an active memory access cycle.
DMA
DMD
DMS
31–0
39–0
3–0
DMRD
O Data Memory Address. The ADSP-21020 outputs an address in data memory on these pins.
I/O Data Memory Data. The ADSP-21020 inputs and outputs data on these pins.
32-bit fixed point data and 32-bit single-precision floating point data is transferred over bits 39-8 of the DMD bus.
O
O
Data Memory Select lines. These pins are asserted as chip selects for the corresponding banks of data memory. Memory banks must be defined in the memory control registers. These pins are decoded data memory address lines and provide an early indication of a possible bus cycle.
Data Memory Read strobe. This pin is asserted when the ADSP-21020 reads from data memory.
DMWR O Data Memory Write strobe. This pin is asserted when the ADSP-21020 writes to data memory.
Data Memory Acknowledge. An external device deasserts this input to add wait states to a memory access.
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ADSP-21020
Pin
Name Type Function
Pin
Name Type Function
DMPAGE
DMTS
CLKIIN
RESET
IRQ
3–0
FLAG
3–0
O
I
I/S
Data Memory Page Boundary. The ADSP-
21020 asserts this pin to signal that a data memory page boundary has been crossed.
Memory pages must be defined in the memory control registers.
Data Memory Three-State Control. DMTS places the data memory address, data, selects, and strobes in a high-impedance state. If DMTS is asserted while a DM access is occurring, the processor will halt and the memory access will not be completed. DMACK must be asserted for at least one cycle when DMTS is deasserted to allow any pending memory access to complete properly. DMTS should only be asserted (low) during an active memory access cycle.
External clock input to the ADSP-21020.
The instruction cycle rate is equal to
CLKIN. CLKIN may not be halted, changed, or operated below the specified frequency.
I/A Sets the ADSP-21020 to a known state and begins execution at the program memory location specified by the hardware reset vector (address). This input must be asserted (low) at power-up.
I/A Interrupt request lines; may be either edge triggered or level-sensitive.
I/O/A External Flags. Each is configured via control bits as either an input or output. As an input, it can be tested as a condition. As an output, it can be used to signal external peripherals.
BR
BG
TIMEXP
I/A Bus Request. Used by an external device to request control of the memory interface.
When BR is asserted, the processor halts execution after completion of the current cycle, places all memory data, addresses, selects, and strobes in a high-impedance state, and asserts BG. The processor continues normal operation when BR is released.
O
O
Bus Grant. Acknowledges a bus request
(BR), indicating that the external device may take control of the memory interface.
BG is asserted (held low) until BR is released.
Timer Expired. Asserted for four cycles when the value of TCOUNT is decremented to zero.
RCOMP
EVDD
EGND
P
G
Compensation Resistor input. Controls compensated output buffers. Connect
RCOMP through a 1.8 k
Ω ±
15% resistor to EVDD. Use of a capacitor (approximately 100 pF), placed in parallel with the
1.8 k
Ω
resistor is recommended.
Power supply (for output drivers), nominally +5 V dc (10 pins).
Power supply return (for output drivers);
(16 pins).
IVDD P
IGND G
TCK I
TMS I/S
TDI
NC
VS
TDO O
TRST I/A
Power supply (for internal circuitry), nominally +5 V dc (4 pins).
Power supply return (for internal circuitry); (7 pins).
Test Clock. Provides an asynchronous clock for JTAG boundary scan.
Test Mode Select. Used to control the test state machine. TMS has a 20 k
Ω
internal pullup resistor.
Test Data Input. Provides serial data for the boundary scan logic. TDI has a 20 k
Ω
internal pullup resistor.
Test Data Output. Serial scan output of the boundary scan path.
Test Reset. Resets the test state machine.
TRST must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-21020. TRST has a 20 k
Ω
internal pullup resistor.
No Connect. No Connects are reserved pins that must be left open and unconnected.
INSTRUCTION SET SUMMARY
The ADSP-21020 instruction set provides a wide variety of programming capabilities. Every instruction assembles into a single word and can execute in a single processor cycle.
Multifunction instructions enable simultaneous multiplier and
ALU operations, as well as computations executed in parallel with data transfers. The addressing power of the ADSP-21020 gives you flexibility in moving data both internally and externally. The ADSP-21020 assembly language uses an algebraic syntax for ease of coding and readability.
The instruction types are grouped into four categories:
Compute and Move or Modify
Program Flow Control
Immediate Move
Miscellaneous
The instruction types are numbered; there are 22 types. Some instructions have more than one syntactical form; for example,
Instruction 4 has four distinct forms. The instruction number itself has no bearing on programming, but corresponds to the opcode recognized by the ADSP-21020 device.
Because of the width and orthogonality of the instruction word, there are many possible instructions. For example, the ALU supports 21 fixed-point operations and 24 floating-point operations; each of these operations can be the compute portion of an instruction.
The following pages provide an overview and summary of the
ADSP-21020 instruction set. For complete information, see the
ADSP-21020 User’s Manual. For additional reference information, see the ADSP-21020 Programmer’s Quick Reference.
–6–
This section also contains several reference tables for using the instruction set.
• Table I describes the notation and abbreviations used.
• Table II lists all condition and termination code mnemonics.
• Table III lists all register mnemonics.
• Tables IV through VII list the syntax for all compute
(ALU, multiplier, shifter or multifunction) operations.
• Table VIII lists interrupts and their vector addresses.
REV. C
COMPUTE AND MOVE OR MODIFY INSTRUCTIONS
1.
compute, | DM(Ia, Mb) = dreg1 | ,
| dreg1 = DM(Ia, Mb)
|
2.
IF condition compute;
3a.
IF condition
3b.
IF condition
3c.
IF condition
3d.
IF condition
4a.
IF condition
4b.
IF condition
4c.
IF condition
4d.
IF condition
compute,
compute,
compute,
compute,
compute,
compute,
compute,
compute,
| DM(Ia, Mb) | = ureg ;
|
PM(Ic, Md)
|
| DM(Mb, Ia) | = ureg ;
|
PM(Md, Ic)
| ureg = | DM(Ia, Mb) | ;
|
PM(Ic, Md)
| ureg = | DM(Mb, Ia) | ;
|
PM(Md, Ic)
|
| DM(Ia, <data6>) | = dreg ;
|
PM(Ic, <data6>)
|
| DM(<data6>, Ia) | = dreg ;
|
PM(<data6>, Ic)
| dreg = | DM(Ia, <data6>) | ;
|
PM(Ic, <data6>)
| dreg = | DM(<data6>, Ia) | ;
|
PM(<data6>, Ic)
|
5.
IF condition
6a.
IF condition
6b.
IF condition
7.
IF condition
7.
IF condition
compute, shiftimm, shiftimm,
compute,
compute, ureg1 = ureg2 ;
| DM(Ia, Mb) | = dreg ;
|
PM(Ic, Md)
|
dreg = | DM(Ia, Mb) | ;
|
PM(Ic, Md)
|
MODIFY | (Ia, Mb) | ;
MODIFY | (Ic, Md)
|
|
|
PM(Ic, Md) = dreg2 dreg2 = PM(Ic, Md)
PROGRAM FLOW CONTROL INSTRUCTIONS
8.
IF condition |
|
|
JUMP
CALL
CALL
|
|
|
|
|
|
<addr24>
(PC, <reladdr6>)
(PC, <reladdr6>)
| ( | DB | ) ;
|
|
(
(
|
|
LA
,
DB, LA
|
|
9.
IF condition | JUMP | | (Md, Ic) | ( | DB | ) , compute ;
|
CALL
| |
(PC, <reladdr6>)
|
(
|
LA
,
|
|
CALL
| |
(PC, <reladdr6>)
|
(
|
DB, LA
|
|
|
;
11.
IF condition
12.
LCNTR =
12.
LCNTR =
13.
LCNTR =
| RTS | ( | DB , | ) , compute ;
|
RTI | (
|
LA ,
|
|
RTI | (
|
DB, LA
|
| <data16> | , DO | <addr24>
| ureg
|
, DO
| UNTIL LCE ;
|
(<PC, <reladdr24>)
(
|
UNTIL LCE ;
| <data16> | , DO | <addr24>
| ureg
|
, DO
|
(
|
(PC, <reladdr24>)
| UNTIL termination ;
|
12.
LCNTR =
(DB) Delayed branch
(LA) Loop abort (pop loop PC stacks on branch)
ADSP-21020
REV. C –7–
ADSP-21020
IMMEDIATE MOVE INSTRUCTIONS
14a. DM(<addr32>) = ureg ;
PM(<addr24>)
14b. ureg = DM(<addr32>)
PM(<addr24>)
;
15a. DM(<data32>, Ia) = ureg;
PM(< data24>, Ic)
15b. ureg = DM(<data32>, Ia)
PM(<data24>, Ic)
;
16.
DM(Ia, Mb) = <data32>;
PM(Ic, Md)
17.
ureg = <data32>;
MISCELLANEOUS INSTRUCTIONS
18. BIT
19a. MODIFY
19b. BITREV
SET
CLR
TGL
TST
XOR sreg <data32>;
(Ia, <data32>) | ;
(Ic, <data32>) |
(Ia, <data32>) ;
20.
|
|
PUSH
POP
21. NOP ;
22. IDLE ;
LOOP , PUSH
POP
STS ;
Table I. Syntax Notation Conventions
Notation Meaning
UPPERCASE Explicit syntax—assembler keyword (notation only; assembler is not case-sensitive and lowercase is the preferred programming
,
; convention)
Instruction terminator
Separates parallel operations in an italics instruction
Optional part of instruction
| between lines | List of options (choose one)
<datan> n-bit immediate data value
<addrn>
<reladdrn> compute
n-bit immediate address value
n-bit immediate PC-relative address value
ALU, multiplier, shifter or multifunction shiftimm condition termination ureg sreg dreg
Ia
Mb
Ic
Md operation (from Tables IV-VII)
Shifter immediate operation
(from Table VI)
Status condition (from Table II)
Termination condition (from Table II)
Universal register (from Table III)
System register (from Table III)
R15-R0, F15-F0; register file location
I7-I0; DAG1 index register
M7-M0; DAG1 modify register
I15-I8; DAG2 index register
M15-M8; DAG2 modify register
Table II. Condition and Termination Codes
Name Description eq ne ge lt le gt ac not ac av not av mv not mv ms not ms sv not sv sz not sz flag0_in not flag0_in flag1_in not flag1_in flag2_in not flag2_in flag3_in not flag3_in tf not tf lce not lce forever true
ALU equal to zero
ALU not equal to zero
ALU greater than or equal to zero
ALU less than zero
ALU less than or equal to zero
ALU greater than zero
ALU carry
Not ALU carry
ALU overflow
Not ALU overflow
Multiplier overflow
Not multiplier overflow
Multiplier sign
Not multiplier sign
Shifter overflow
Not shifter overflow
Shifter zero
Not shifter zero
Flag 0
Not Flag 0
Flag 1
Not Flag l
Flag 2
Not Flag 2
Flag 3
Not Flag 3
Bit test flag
Not bit test flag
Loop counter expired (DO UNTIL)
Loop counter not expired (IF)
Always False (DO UNTIL)
Always True (IF)
In a conditional instruction, the execution of the entire instruction is based on the specified condition.
–8– REV. C
ADSP-21020
Table III. Universal Registers Table IV. ALU Compute Operations
Name Function
Register File
R15–R0 Register file locations
Program Sequencer
PC*
PCSTK
PCSTKP
FADDR*
Program counter; address of instruction currently executing
Top of PC stack
PC stack pointer
Fetch address
DADDR*
LADDR
Decode address
Loop termination address, code; top of loop address stack
CURLCNTR Current loop counter; top of loop count stack
LCNTR Loop count for next nested counter-controlled loop
Data Address Generators
I7–I0
M7–M0
L7–L0
DAG1 index registers
DAG1 modify registers
DAG1 length registers
B7–B0
I15–I8
M15–M8
L15–L8
B15–B8
Bus Exchange
PX1
PX2
PX
Timer
DAG1 base registers
DAG2 index registers
DAG2 modify registers
DAG2 length registers
DAG2 base registers
PMD-DMD bus exchange 1 (16 bits)
PMD-DMD bus exchange 2 (32 bits)
48-bit PX1 and PX2 combination
TPERIOD
TCOUNT
Timer period
Timer counter
Memory Interface
DMWAIT Wait state and page size control for data memory
DMBANK1 Data memory bank 1 upper boundary
DMBANK2 Data memory bank 2 upper boundary
DMBANK3 Data memory bank 3 upper boundary
DMADR* Copy of last data memory address
PMWAIT Wait state and page size control for program
PMBANK1
PMADR*
System Registers
MODE1 memory
Program memory bank 1 upper boundary
Copy of last program memory address
MODE2
Mode control bits for bit-reverse, alternate registers, interrupt nesting and enable, ALU saturation, floating-point rounding mode and boundary
Mode control bits for interrupt sensitivity, cache disable and freeze, timer enable, and I/O
IRPTL
IMASK
IMASKP
ASTAT
STKY
USTAT1
USTAT2 flag configuration
Interrupt latch
Interrupt mask
Interrupt mask pointer (for nesting)
Arithmetic status flags, bit test, I/O flag values, and compare accumulator
Sticky arithmetic status flags, circular buffer overflow flags, stack status flags (not sticky)
User status register l
User status register 2
*read-only
Refer to User’s Manual for bit-level definitions of each register.
REV. C –9–
Fixed-Point Floating-Point
Rn = Rx + Ry
Rn = Rx – Ry
Rn = Rx + Ry, Rm = Rx – Ry
Rn = Rx + Ry + CI
Rn = Rx – Ry + CI – l
Rn = (Rx + Ry)/2
COMP(Rx, Ry)
Rn = –Rx
Rn = ABS Rx
Rn = PASS Rx
Rn = MIN(Rx, Ry)
Rn = MAX(Rx, Ry)
Rn = CLIP Rx BY Ry
Rn = Rx + CI
Rn = Rx + CI – 1
Rn = Rx + l
Rn = Rx – l
Rn = Rx AND Ry
Rn = Rx OR Ry
Rn = Rx XOR Ry
Rn = NOT Rx
Fn = Fx + Fy
Fn = Fx – Fy
Fn = Fx + Fy, Fm = Fx – Fy
Fn = ABS (Fx + Fy)
Fn = ABS (Fx – Fy)
Fn = (Fx + Fy)/2
COMP(Fx, Fy)
Fn = –Fx
Fn = ABS Fx
Fn = PASS Fx
Fn = MIN(Fx, Fy)
Fn = MAX(Fx, Fy)
Fn = CLIP Fx BY Fy
Fn = RND Fx
Fn = SCALB Fx BY Ry
Rn = MANT Fx
Rn = LOGB Fx
Rn = FIX Fx BY Ry
Rn = FIX Fx
Fn = FLOAT Rx BY Ry
Fn = FLOAT Rx
Fn = RECIPS Fx
Fn = RSQRTS Fx
Fn = Fx COPYSIGN Fy
Rn, Rx, Ry R15–R0; register file location, fixed-point
Fn, Fx, Fy F15–F0; register file location, floating point
ADSP-21020
Table V. Multiplier Compute Operations
Rn = Rx * Ry ( S S F )
MRF = Rx * Ry ( U U I
MRB = Rx * Ry ( U U FR
Rn
Rn
= MRF + Rx * Ry ( S S F )
= MRB + Rx * Ry ( U U I
MRF = MRF + Rx * Ry ( U U FR
MRB = MRB
Rn = SAT MRF (SI)
Rn = SAT MRB (UI)
MRF = SAT MRF (SF)
MRB = SAT MRB (UF)
MRF = 0
MRB
MRxF = Rn
MRxB
Fn
Rn
Rn
Rn
= Fx * Fy
= MRF
= MRB
MRF = MRF
MRB = MRB
Rn = MRxF
Rn = MRxB
S
U
I
F
FR
Rn, Rx, Ry
Fn, Fx, Fy
MRxF
MRxB
R15–R0; register file location, fixed-point
F15–F0; register file location, floating-point
MR2F, MR1F; MR0F; multiplier result accumulators, foreground
MR2B, MR1B, MR0B; multiplier result accumulators, background
( x-input y-input data format, )
( x-input y-input rounding
Signed input
Unsigned input
Integer input(s)
Fractional input(s)
Fractional inputs, Rounded output
(SF) Default format for 1-input operations
(SSF) Default format for 2-input operations
– Rx * Ry ( S
= Rx * Ry
= Rx * Ry
= RND MRF
(
( U U I
(SF)
Rn = RND MRB (UF)
MRF = RND MRF
MRB = RND MRB
S F
U U I
FR
)
Table VI. Shifter and Shifter Immediate Compute Operations
Shifter Shifter Immediate
Rn = LSHIFT Rx BY Ry
Rn = Rn OR LSHIFT Rx BY Ry
Rn = ASHIFT Rx BY Ry
Rn = Rn OR ASHIFT Rx BY Ry
Rn = ROT Rx BY RY
Rn = BCLR Rx BY Ry
Rn = BSET Rx BY Ry
Rn = BTGL Rx BY Ry
BTST Rx BY Ry
Rn = FDEP Rx BY Ry
Rn = Rn OR FDEP Rx BY Ry
Rn = FDEP Rx BY Ry (SE)
BTST Rx BY<data8>
Rn = FDEP Rx BY <bit6>: <len6>
Rn = Rn OR FDEP Rx BY <bit6>:<1en6>
Rn = FDEP Rx BY <bit6>:<1en6> (SE)
Rn = Rn OR FDEP Rx BY Ry (SE) Rn = Rn OR FDEP Rx BY <bit6>:<1en6> (SE)
Rn = FEXT Rx BY Ry Rn = FEXT Rx BY <bit6>:<1en6>
Rn = FEXT Rx BY Ry (SE)
Rn = EXP Rx
Rn = FEXT Rx BY <bit6>:<1en6> (SE)
Rn = EXP Rx (EX)
Rn = LEFTZ Rx
Rn = LEFTO Rx
Rn = LSHIFT Rx BY<data8>
Rn = Rn OR LSHIFT Rx BY<data8>
Rn = ASHIFT Rx BY<data8>
Rn = Rn OR ASHIFT Rx BY<data8>
Rn = ROT Rx BY<data8>
Rn = BCLR Rx BY<data8>
Rn = BSET Rx BY<data8>
Rn = BTGL Rx BY<data8>
Rn, Rx, Ry R15-R0; register file location, fixed-point
<bit6>:<len6> 6-bit immediate bit position and length values (for shifter immediate operations)
–10– REV. C
Table Vll. Multifunction Compute Operations
Fixed-Point
Rm=R3-0 * R7-4 (SSFR), Ra=R11-8 + R15-12
Rm=R3-0 * R7-4 (SSFR), Ra=R11-8 – R15-12
Rm=R3-0 * R7-4 (SSFR), Ra=(R11-8 + R15-12)/2
MRF=MRF + R3-0 * R7-4 (SSF), Ra=R11-8 + R15-12
MRF=MRF + R3-0 * R7-4 (SSF), Ra=R11-8 – R15-12
MRF=MRF + R3-0 * R7-4 (SSF), Ra=(R11-8 + R15-12)/2
Rm=MRF + R3-0 * R7-4 (SSFR), Ra=R11-8 + R15-12
Rm=MRF + R3-0 * R7-4 (SSFR), Ra=R11-8 – R15-12
Rm=MRF + R3-0 * R7-4 (SSFR), Ra=(R11-8 + R15-12)/2
MRF=MRF – R3-0 * R7-4 (SSF), Ra=R11-8 + R15-12
MRF=MRF – R3-0 * R7-4 (SSF), Ra=R11-8 – R15-12
MRF=MRF – R3-0 * R7-4 (SSF), Ra=(R11-8 + R15-12)/2
Rm=MRF – R3-0 * R7-4 (SSFR), Ra=R11-8 + R15-12
Rm=MRF – R3-0 * R7-4 (SSFR), Ra=R11-8 – R15-12
Rm=MRF – R3-0 * R7-4 (SSFR), Ra=(R11-8 + R15-12)/2
Rm=R3-0 * R7-4 (SSFR), Ra=R11-8 + R15-12,
Rs=R11-8 – R15-12
Floating-Point
Fm=F3-0 * F7-4, Fa=F11-8 + F15-12
Fm=F3-0 * F7-4, Fa=F11-8 – F15-12
Fm=F3-0 * F7-4, Fa=FLOAT R11-8 by R15-12
Fm=F3-0 * F7-4, Fa=FIX R11-8 by R15-12
Fm=F3-0 * F7-4, Fa=(F11-8 + F15-12)/2
Fm=F3-0 * F7-4, Fa=ABS F11-8
Fm=F3-0 * F7-4, Fa=MAX (F11-8, F15-12)
Fm=F3-0 * F7-4, Fa=MIN (F11-8, F15-12)
Fm=F3-0 * F7-4, Fa=F11-8 + F15-12,
Fs=F11-8 – F15-12
Ra, Rm Any register file location (fixed-point)
R3-0
R7-4
R3, R2, R1, R0
R7, R6, R5, R4
R11-8 R11, R10, R9, R8
R15-12 R15, R14, R13, R12
Fa, Fm Any register file location (floating-point)
F3-0 F3, F2, F1, F0
F7-4 F7, F6, F5, F4
F11-8 F11, F10, F9, F8
F15-12 F15, F14, F13, F12
(SSF) X-input signed, Y-input signed, fractional inputs
(SSFR) X-input signed, Y-input signed, fractional inputs, rounded output
ADSP-21020
Table VIII. Interrupt Vector Addresses and Priorities
No.
Vector
Address
(Hex) Function
0
1*
2
3
8
9
10
11
12
13
4
5
6
7
0x00
0x08
0xl0
0xl8
0x20
0x28
0x30
0x38
0x40
0x48
0x50
0x58
0x60
0x68
Reserved
Reset
Reserved
Status stack or loop stack overflow or
PC stack full
Timer=0 (high priority option)
IRQ3
IRQ2
IRQ1
IRQ0
asserted
asserted
asserted
asserted
Reserved
Reserved
DAG 1 circular buffer 7 overflow
DAG 2 circular buffer 15 overflow
Reserved
14
15
16
0x70
0x78
0x80
Timer=0 (low priority option)
Fixed-point overflow
Floating-point overflow
17
18
0x88
0x90
19–23 0x98-0xB8
Floating-point underflow
Floating-point invalid operation
Reserved
24–31 0xC0–OxF8 User software interrupts
*Nonmaskable
REV. C –11–
ADSP-21020–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Parameter
K Grade
Min Max
V
DD
T
AMB
Supply Voltage
Ambient Operating Temperature
4.50
0
Refer to Environmental Conditions for information on thermal specifications.
5.50
+70
B Grade
Min Max
4.50
–40
5.50
+85
T Grade
Min Max
4.50
–55
5.50
+125
Unit
V
°
C
ELECTRICAL CHARACTERISTICS
Parameter Test Conditions Min Max Unit
V
IH
V
IHCR
V
IL
V
ILC
V
OH
V
OL
I
IH
I
IL
I
ILT
I
OZH
I
OZL
I
DDIN
I
DDIDLE
C
IN
Hi-Level Input Voltage
Hi-Level Input Voltage
Lo-Level Input Voltage
Lo-Level Input Voltage
1
2, 12
1, 12
2
Hi-Level Output Voltage
Lo-Level Output Voltage
Hi-Level Input Current
Lo-Level Input Current
Lo-Level Input Current
Supply Current (Idle)
Input Capacitance 9, 10
8
3, 11
3, 11
4, 5
4
5
Tristate Leakage Current
6
Tristate Leakage Current 6
Supply Current (Internal)
7
V
DD
= max
V
DD
= max
V
DD
= min
V
DD
= max
V
DD
= min, I
OH
= –1.0 mA
V
DD
= min, I
OL
= 4.0 mA
V
DD
= max, V
IN
= V
DD
max
V
DD
= max, V
IN
= 0 V
V
DD
= max, V
IN
= 0 V
V
DD
= max, V
IN
= V
DD
max
V
DD
= max, V
IN
= 0 V t
CK
= 30–33 ns, V
DD
= max, V
IHCR
= 3.0 V,
V
IH
= 2.4 V, V
IL
= V
ILC
= 0.4 V
V
DD f
IN
= max, V
IN
= 1 MHz, T
= 0 V or V
CASE
DD
max
= 25
°
C, V
IN
= 2.5 V
2.0
3.0
2.4
0.8
0.6
0.4
10
10
350
10
10
490
150
10
V
V
V
V
V
V
µ
A
µ
A
µ
A
µ
A
µ
A mA mA pF
NOTES l
Applies to: PMD47–0, PMACK, PMTS, DMD39–0, DMACK, DMTS, IRQ3–0. FLAG3–0, BR, TMS, TDI.
2
Applies to: CLKIN, TCK.
3
Applies to: PMA23–0, PMD47–0, PMS1–0, PMRD, PMWR, PMPAGE, DMA31–0, DMD39–0, DMS3–0, DMRD, DMWR, DMPAGE, FLAG3–0,
TIMEXP, BG.
4
Applies to: PMACK, PMTS, DMACK, DMTS, IRQ3–0, BR, CLKIN, RESET, TCK.
5
Applies to: TMS, TDI, TRST.
6
Applies to: PMA23–0, PMD47–0, PMS1–0, PMRD, PMWR, PMPAGE, DMA31–0, DMD39–0, DMS3–0, DMRD, DMWR, DMPAGE, FLAG3–0, TDO.
7
Applies to IVDD pins. At t
CK
= 30–33 ns, I
DDIN
(typical) = 230 mA; at t
CK
= 40 ns, I
DDIN
(max) = 420 mA and I
DDIN
(typical) = 200 mA; at t
CK
= 50 ns,
I
DDIN
(max) = 370 mA and I
DDIN
(typical) = 115 mA. See “Power Dissipation” for calculation of external (EVDD) supply current for total supply current.
8
Applies to IVDD pins. Idle refers to ADSP-21020 state of operation during execution of the IDLE instruction.
9
Guaranteed but not tested.
10
Applies to all signal pins.
11
Although specified for TTL outputs, all ADSP-21020 outputs are CMOS-compatible and will drive to V
12
Applies to RESET, TRST.
DD
and GND assuming no dc loads.
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Output Voltage Swing . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Operating Temperature Range (Ambient) . . –55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature (10 seconds) CPGA . . . . . . . . . . . +300
°
C
*Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD SENSITIVITY
The ADSP-21020 features proprietary input protection circuitry to dissipate high energy discharges
(Human Body Model). Per method 3015 of MIL-STD-883, the ADSP-21020 has been classified as a Class 3 device, with the ability to withstand up to 4000 V ESD.
Proper ESD precautions are strongly recommended to avoid functional damage or performance degradation. Charges readily accumulate on the human body and test equipment and discharge without detection. Unused devices must be stored in conductive foam or shunts, and the foam should be discharged to the destination socket before devices are removed. For further information on ESD precautions, refer to Analog Devices’ ESD Prevention Manual.
WARNING!
ESD SENSITIVE DEVICE
–12– REV. C
ADSP-21020
TIMING PARAMETERS
General Notes
See Figure 15 on page 24 for voltage reference levels. Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, you cannot meaningfully add parameters to derive other specifications.
Clock Signal
K/B/T Grade
20 MHz
Min Max
K/B/T Grade
25 MHz
Min Max
B/T Grade
Min
30 MHz
Max
K Grade
33.3 MHz
Min Max Unit Parameter t
Timing Requirement:
CK t
CKH t
CKL
CLKIN Period
CLKIN Width High
CLKIN Width Low
50
10
10
150 40
10
10
150 33
10
10
150 30
10
10
150 ns ns ns t
CK
CLKIN t
CKH t
CKL
Figure 3. Clock
Reset
K/B/T Grade K/B/T Grade B/T Grade K Grade
Parameter
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit
Timing Requirement: t
WRST
1 t
SRST
2
RESET Width Low 200
RESET Setup before CLKIN High 29 50
160
24 40
132
21 33
120
19 30
4t
CK
29 + DT/2 30 ns ns
NOTES
DT = t
CK
–50 ns
1
Applies after the power-up sequence is complete. At power up, the Internal Phase Locked Loop requires no more than 1000 CLKIN cycles while RESET is low, assuming stable V
DD
and CLKIN (not including clock oscillator start-up time).
2
Specification only applies in cases where multiple ADSP-21020 processors are required to execute in program counter lock-step (all processors start execution at location 8 in the same cycle). See the Hardware Configuration chapter of the ADSP-21020 User’s Manual for reset sequence information.
CLKIN
RESET t
WRST t
SRST
Figure 4. Reset
REV. C –13–
ADSP-21020
Interrupts
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit Parameter
Timing Requirement: t
SIR t
HIR t
IPW
IRQ
IRQ
IRQ
3-0 Setup before CLKIN High 38
3-0 Hold after CLKIN High
3-0 Pulse Width
0
55
31
0
45
25
0
38
23
0
35
38 + 3DT/4 ns ns t
CK
+ 5 ns
NOTE
*DT = t
CK
– 50 ns
Meeting setup and hold guarantees interrupts will be latched in that cycle. Meeting the pulse width is not necessary if the setup and hold is met. Likewise, meeting the setup and hold is not necessary if the pulse width is met. See the Hardware Configuration chapter of the ADSP-21020 User’s Manual for interrupt servicing information.
CLKIN t
HIR t
SIR
IRQ3-0 t
IPW
Figure 5. Interrupts
Timer
Parameter t
Switching Characteristic:
DTEX
CLKIN High to TIMEXP
NOTE
*DT = t
CK
– 50 ns
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit
24 24 24 24 ns
CLKIN t
DTEX t
DTEX
TIMEXP
Figure 6. TIMEXP
–14– REV. C
ADSP-21020
Flags
K/B/T Grade K/B/T Grade B/T Grade K Grade
Parameter
20 MHz
Min
Timing Requirement:
1 t
SFI t
HFI t
DWRFI t
HFIWR
FLAG3-0
IN
FLAG3-0
FLAG3-0
IN
FLAG3-0
IN
IN
Deasserted
Setup before CLKIN High 19
Hold after CLKIN High
Delay from xRD, xWR Low
Hold after xRD, xWR
0
0
Max
12
25 MHz
Min
16
0
0
8
14
0
0
30 MHz 33.3 MHz Frequency Dependency*
Max Min Max
5
Min Max
13
0
0
3
Min Max
19 + 5DT/16
Unit ns ns
12 + 7DT/16 ns ns
Switching Characteristic: t
DFO t
HFO t
DFOE t
DFOD
FLAG3-0
FLAG3-0
OUT
OUT
Delay from CLKIN High
Hold after CLKIN High
CLKIN High to FLAG3-0
CLKIN High to FLAG3-0
OUT
OUT
Enable
Disable
5
1
24
24
5
1
24
24
5
1
24
24
5
1
24
24
NOTES
*DT = t
CK
– 50 ns
1 Flag inputs meeting these setup and hold times will affect conditional operations in the next instruction cycle. See the Hardware Configuration chapter of the
ADSP-21020 User’s Manual for additional flag servicing information.
x = PM or DM.
ns ns ns ns
CLKIN
FLAG3-0
OUT t
DFOE t
DFO t
HFO t
DFO t
DFOD
FLAG OUTPUT
CLKIN t
HFI t
SFI
FLAG3-0
IN t
DWRFI t
HFIWR xRD, xWR
FLAG INPUT
Figure 7. Flags
REV. C –15–
ADSP-21020
Bus Request/Bus Grant
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit Parameter t
Timing Requirement:
HBR t
SBR
BR Hold after CLKIN High
BR Setup before CLKIN High
0
18 t
Switching Characteristic: t
DMDBGL t
DME
Memory Interface Disable to BG Low –2
CLKIN High to Memory Interface
DBGL t
DBGH
Enable
CLKIN High to BG Low
CLKIN High to BG High
25
22
22
0
15
–2
20
22
22
0
13
–2
16
22
22
0
12
–2
15
22
22
18 + 5DT/16
25 + DT/2
NOTES
*DT = t
CK
– 50 ns.
Memory Interface = PMA23-0, PMD47-0, PMS1-0, PMRD, PMWR, PMPAGE, DMA31-0, DMD39-0, DMS3-0, DMRD, DMWR, DMPAGE.
Buses are not granted until completion of current memory access.
See the Memory Interface chapter of the ADSP-21020 User’s Manual for BG, BR cycle relationships.
ns ns ns ns ns ns
CLKIN t
HBR t
SBR t
HBR t
SBR
BR t
DME
MEMORY
INTERFACE t
DBGL t
DMDBGL t
DBGH
BG
Figure 8. Bus Request/Bus Grant
–16– REV. C
ADSP-21020
External Memory Three-State Control
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit Parameter t
Timing Requirement:
STS t
DADTS t
DSTS xTS , Setup before CLKIN High xTS xTS
Delay after Address, Select
Delay after XRD, XWR Low
14 t t
Switching Characteristic:
DTSD
Memory Interface Disable before
DTSAE
CLKIN High 0 xTS High to Address, Select Enable 0
50
28
16
12
–2
0
40
19
11
10
–4
0
33
13
7
9
–5
0
30 14 + DT/4 t
10
6
DT/4
CK
28 + 7DT/8 ns
16 + DT/2
NOTES
*DT = t
CK
– 50 ns.
xTS should only be asserted (low) during an active memory access cycle.
Memory Interface = PMA23-0, PMD47-0, PMS1-0, PMRD, PMWR, PMPAGE, DMA31-0, DMD39-0, DMS3-0, DMRD, DMWR, DMPAGE.
Address = PMA23-0, DMA31-0. Select = PMS1-0, DMS3-0.
x = PM or DM.
ns ns ns ns
CLKIN t
STS t
STS
PMTS, DMTS t
DADTS t
DSTS t
DTSD xRD, xWR t
DTSAE
ADDRESS,
SELECTS
DATA
Figure 9. External Memory Three-State Control
REV. C –17–
ADSP-21020
Memory Read
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependence*
Min Max Min Max Min Max Min Max Min Max Unit Parameter t
Timing Requirement:
DAD t
DRLD t
HDA
Address, Select to Data Valid xRD Low to Data Valid
Data Hold from Address, Select t
HDRH t
DAAK t
DRAK t
SAK t
HAK
Data Hold from xRD High xACK Delay from Address xACK Delay from xRD Low xACK Setup before CLKIN High xACK Hold after CLKIN High
Switching Characteristic: t
DARL t
DAP t
DCKRL t
RW t
RWR
Address, Select to xRD Low xPAGE Delay from Address, Select
CLKIN High to xRD Low xRD xRD
Pulse Width
High to xRD, xWD Low
0
–1
14
0
8
16
26
17
37
24
27
15
1
26
0
–1
12
0
4
13
20
13
27
18
18
10
1
24
0
–1
10
0
2
20
13
12
6
NOTES
*DT = t
CK
– 50 ns x = PM or DM; Address = PMA23-0, DMA31-0; Data = PMD47-0, DMD39-0; Select = PMS1-0, DMS3-0.
0
–1
9
0
0
17
11
9
5
14 + DT/4
8 + 3DT/8
37 + DT ns
24 + 5DT/8 ns ns ns
27 + 7DT/8 ns
15 + DT/2 ns ns
1 1
12 22 11 21 16 + DT/4 26 + DT/4
15 13 26 + 5DT/8
11 9 17 + 3DT/8 ns ns ns ns ns ns
–18– REV. C
CLKIN
ADDRESS,
SELECT
DMPAGE,
PMPAGE
DMRD,
PMRD
DATA
DMACK,
PMACK
DMWR,
PMWR t
DAP t
DCKRL t
DARL t
DAAK t
DRAK t
DRLD t
DAD t
RW t
SAK t
HAK t
HDA t
HDRH t
RWR
Figure 10. Memory Read
ADSP-21020
REV. C –19–
ADSP-21020
Memory Write
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit Parameter t
Timing Requirement:
DAAK t
DWAK t
SAK xACK Delay from Address, Select xACK Delay from xWR Low xACK Setup before CLKIN High t
HAK xACK Hold after CLKIN High
14
0 t t t t t
Switching Characteristic:
DAWH
DAWL t
WW t
DDWH t
DWHA
Address, Select to xWR Deasserted 37
Address, Select to xWR Low 11 xWR Pulse Width
Data Setup before xWR High
26
23
HDWH
DAP t
DCKWL t
WWR t
DDWR
WDE
Address, Select Hold after xWR
Deasserted
Data Hold after xWR Deasserted
1 xPAGE Delay from Address, Select
CLKIN High to xWR Low xWR
Data Disable before xWR or xRD
Low xWR
High to xWR or xRD Low
Low to Data Enabled
1
0
16
17
13
0
27
15
1
26
12
0
28
7
20
18
0
–1
13
13
9
–1
18
10
1
24
10
0
21
5
16
14
0
–1
12 22
10
7
–1
12
6
1
9
0
18
3
15
13
0
–1
5
–1
9
5
NOTES
*DT = t
C
– 50 ns
See “System Hold Time Calculation” in “Test Conditions” section for calculating hold times given capacitive and DC loads.
x = PM or DM; Address = PMA23-0, DMA31-0; Data = PMD47-0, DMD39-0; Select = PMS1-0, DMS3-0.
14 + DT/4
11 + 3DT/8
26 + 9DT/16
23 + DT/2
1 + DT/16
DT/16
13 + 3DT/8
DT/16
27 + 7DT/8 ns
15 + DT/2 ns ns
37+ 15DT/16 ns
1
11 21 16 + DT/4 26 + DT/4 ns
8 17 + 7DT/16 ns ns ns ns ns ns ns ns ns ns
–20– REV. C
ADSP-21020
CLKIN
ADDRESS,
SELECT
DMPAGE,
PMPAGE
DMWR,
PMWR
DATA
DMACK,
PMACK
DMRD,
PMRD t
DAP t
DAWL t
DCKWL t
WDE t
DAAK t
DWAK t
DAWH t
WW t
SAK t
DDWH t
HAK t
DWHA t
WWR t
HDWH t
DDWR
Figure 11. Memory Write
REV. C –21–
ADSP-21020
IEEE 1149.1 Test Access Port
K/B/T Grade K/B/T Grade B/T Grade K Grade
20 MHz 25 MHz 30 MHz 33.3 MHz Frequency Dependency*
Min Max Min Max Min Max Min Max Min Max Unit Parameter t t
Timing Requirement:
TCK
STAP t
HTAP t
SSYS t
HSYS t
TRSTW
TCK Period 50
TDI, TMS Setup before TCK High 5
TDI, TMS Hold after TCK High
System Inputs Setup before TCK High 7
System Inputs Hold after TCK High
TRST Pulse Width
6
9
200 t
Switching Characteristic:
DTDO
TDO Delay from TCK Low t
DSYS
System Outputs Delay from TCK Low
15
26
40
5
6
7
9
160
15
26
33
5
6
7
9
132
15
26
30
5
6
7
9
120
15
26 t
CK ns ns
NOTES
*DT = t
C
– 50 ns
System Inputs = PMD47-0, PMACK, PMTS, DMD39-0, DMACK, DMTS, CLKIN, IRQ3 0, RESET, FLAG3-0, BR.
System Outputs = PMA23-0, PMS1-0, PMRD, PMWR, PMD47-0, PMPAGE, DMA31-0, DMS1-0, DMRD, DMWR, DMD39-0, DMPAGE, FLAG3-0, BG,
TIMEXP.
See the IEEE 1149.1 Test Access Port chapter of the ADSP-21020 User’s Manual for further detail.
ns ns ns ns ns ns
–22– REV. C
TCK
TMS,TDI
TDO
SYSTEM
INPUTS
SYSTEM
OUTPUTS t
TCK t
STAP t
HTAP t
DTDO t
SSYS t
HSYS t
DSYS
Figure 12. IEEE 1149.1 Test Access Port
ADSP-21020
REV. C –23–
ADSP-21020
TEST CONDITIONS
Output Disable Time
Output pins are considered to be disabled when they stop driving, go into a high-impedance state, and start to decay from their output high or low voltage. The time for the voltage on the bus to decay by
∆
V is dependent on the capacitive load, C
L
, and the load current, I
L
. It can be approximated by the following equation: t
DECAY
=
C
L
I
L
∆
V t
The output disable time (t
DIS
) is the difference between
MEASURED
and t
DECAY
as shown in Figure 13. The time t
MEASURED
) is the interval from when the reference signal switches to when the output voltage decays
∆
V from the measured output high or output low voltage. t
DECAY
is calculated with
∆
V equal to 0.5 V, and test loads C
L
and I
L
.
Output Enable Time
Output pins are considered to be enabled when they have made a transition from a high-impedance state to when they start driving. The output enable time (t
ENA
) is the interval from when a reference signal reaches a high or low voltage level to when the output has reached a specified high or low trip point, as shown in the Output Enable/Disable diagram. If multiple pins (such as the data bus) are enabled, the measurement value is that of the first pin to start driving.
Example System Hold Time Calculation
To determine the data output hold time in a particular system, first calculate t
DECAY
using the above equation. Choose
∆
V to be the difference between the ADSP-21020’s output voltage and the input threshold for the device requiring the hold time. A typical
∆
V will be 0.4 V. C
L
is the total bus capacitance (per data line), and I
L
is the total leakage or three-state current (per data line). The hold time will be t
DECAY
plus the minimum disable time (i.e. t
HDWD
for the write cycle).
I
OL
TO
OUTPUT
PIN
50pF
*
+1.5V
I
OH
*AC TIMING SPECIFICATIONS ARE CALCULATED FOR 100pF
DERATING ON THE FOLLOWING PINS: PMA23–0, PMS1–0, PMRD,
PMWR, PMPAGE, DMA31–0, DMS3–0, DMRD, DMWR, DMPAGE
Figure 14. Equivalent Device Loading For AC
Measurements (Includes All Fixtures)
INPUT OR
OUTPUT
1.5V
1.5V
Figure 15. Voltage Reference Levels For AC
Measurements (Except Output Enable/Disable)
REFERENCE
SIGNAL t
MEASURED t
DIS t
ENA
V
OH (MEASURED)
V
OH (MEASURED) –
∆
V
2.0V
OUTPUT
V
OL (MEASURED) + ∆ V
1.0V
V
OL (MEASURED) t
DECAY
OUTPUT STOPS DRIVING
HIGH-IMPEDANCE STATE. TEST CONDITIONS
CAUSE THIS VOLTAGE LEVEL TO BE
APPROXIMATELY 1.5 V.
Figure 13. Output Enable/Disable
V
OH (MEASURED)
V
OL (MEASURED)
OUTPUT STARTS DRIVING
–24– REV. C
Capacitive Loading
Output delays are based on standard capacitive loads: 100 pF on address, select, page and strobe pins, and 50 pF on all others
(see Figure 14). For different loads, these timing parameters should be derated. See the Hardware Configuration chapter of the ADSP-21020 User’s Manual for further information on derating of timing specifications.
Figures 16 and 17 show how the output rise time varies with capacitance. Figures 18 and 19 show how output delays vary with capacitance. Note that the graphs may not be linear outside the ranges shown.
10
9
8
1
7
6
5
4
3
2
1.46
1
1.31
0
25 50
2
75 100 125 150
LOAD CAPACITANCE – pF
NOTES:
(1) OUTPUT PINS BG, TIMEXP
(2) OUTPUT PINS PMD47–0, DMD39–0, FLAG3–0
175
9.18
3.95
200
Figure 16. Typical Output Rise Time vs. Load
Capacitance (at Maximum Case Temperature)
4
3.59
1
3
3.00
2
1.33
1
0.85
0
25
2
50 75 100 125 150
LOAD CAPACITANCE – pF
175 200
NOTES:
(1) OUTPUT PINS PMA23–0, PMS1–0, PMPAGE, DMA31–0, DMS3–0, DMPAGE, TDO
(2) OUTPUT PINS PMRD, PMWR, DMRD, DMWR
π
Figure 17. Typical Output Rise Time vs. Load
Capacitance (at Maximum Case Temperature)
ADSP-21020
12
10
11.19
8
1
6
5.34
4
2
2
NOMINAL
– 0.89
–2
25
–1.86
50 75 100 125 150
LOAD CAPACITANCE – pF
NOTES:
(1) OUTPUT PINS BG, TIMEXP
(2) OUTPUT PINS PMD47–0, DMD39–0, FLAG3–0
175
Figure 18. Typical Output Delay or Hold vs. Load
Capacitance (at Maximum Case Temperature)
200
1
NOMINAL
3
2
1
2
2.99
2.27
–1
– 1.70
–2
– 2.24
–3
25 50 75 100 125 150 175 200
LOAD CAPACITANCE – pF
NOTES:
(1) OUTPUT PINS PMA23–0, PMS1–0, PMPAGE, DMA31–0, DMS3–0, DMPAGE, TDO
(2) OUTPUT PINS PMRD, PMWR, DMRD, DMWR
Figure 19. Typical Output Delay or Hold vs. Load
Capacitance (at Maximum Case Temperature)
REV. C –25–
ADSP-21020
ENVIRONMENTAL CONDITIONS
The ADSP-21020 is available in a Ceramic Pin Grid Array
(CPGA). The package uses a cavity-down configuration which gives it favorable thermal characteristics. The top surface of the package contains a raised copper slug from which much of the die heat is dissipated. The slug provides a surface for mounting a heat sink (if required).
The commercial grade (K grade) ADSP-21020 is specified for operation at T
AMB
of 0
°
C to +70
°
C. Maximum T
CASE
(case temperature) can be calculated from the following equation:
T
CASE
=
T
AMB
+
(
PD
× θ
CA
) where PD is power dissipation and
θ
CA
is the case-to-ambient thermal resistance. The value of PD depends on your application; the method for calculating PD is shown under
“Power Dissipation” below.
θ
CA
varies with airflow and with the presence or absence of a heat sink. Table IX shows a range of
θ
CA
values.
Table IX. Maximum
θ
CA
for Various Airflow Values
Airflow (Linear ft./min.) 0 100 200 300
CPGA with No Heat Sink 12.8
°
C/W 9.2
°
C/W 6.6
°
C/W 5.5
°
C/W
NOTES
θ
JC
is approximately 1
°
C/W.
Maximum recommended T
J
is 130
°
C.
As per method 1012 MIL-STD-883. Ambient temperature: 25
°
C. Power:
3.5 W.
Power Dissipation
Total power dissipation has two components: one due to internal circuitry and one due to the switching of external output drivers. Internal power dissipation is dependent on the instruction execution sequence and the data values involved.
Internal power dissipation is calculated in the following way:
P
INT
= I
DDIN
3 V
DD
The external component of total power dissipation is caused by the switching of output pins. Its magnitude depends on:
1) the number of output pins that switch during each cycle (O),
2) the maximum frequency at which they can switch (f),
3) their load capacitance (C), and
4) their voltage swing (V
DD
).
It is calculated by:
P
EXT
= O 3 C 3 V
DD
2 3 f
The load capacitance should include the processor’s package capacitance (C
IN
). The switching frequency includes driving the load high and then back low. Address and data pins can drive high and low at a maximum rate of 1/(2t
CK
). The write strobes can switch every cycle at a frequency of 1/t
CK
. Select pins switch at 1/(2t
CK
), but 2 DM and 2 PM selects can switch on each cycle. If only one bank is accessed, no select line will switch.
Example:
Estimate P
EXT
with the following assumptions:
• A system with one RAM bank each of PM (48 bits) and DM
(32 bits).
• 32K 3 8 RAM chips are used, each with a load of 10 pF.
• Single-precision mode is enabled so that only 32 data pins can switch at once.
• PM and DM writes occur every other cycle, with 50% of the pins switching.
• The instruction cycle rate is 20 MHz (t
CK
= 50 ns) and
V
DD
= 5.0 V.
The P
EXT
equation is calculated for each class of pins that can drive:
Pin
Type
# %
Pins Switch
3 C 3 f 3 V
DD
2
P
EXT
PMA
PMS
15 50
2 0
PMWR 1
PMD 32
—
50
DMA
DMS
15 50
2 0
DMWR 1
DMD 32
—
50
68 pF 5 MHz 25 V
68 pF 5 MHz 25 V
68 pF 10 MHz 25 V
18 pF 5 MHz 25 V
48 pF 5 MHz 25 V
48 pF 5 MHz 25 V
48 pF 10 MHz 25 V
18 pF 5 MHz 25 V
0.064 W
0.000 W
0.017 W
0.036 W
0.045 W
0.000 W
0.012 W
0.036 W
P
EXT
=0.210 W
A typical power consumption can now be calculated for this situation by adding a typical internal power dissipation:
P
TOTAL
= P
EXT
+ (5 V
3 I
DDIN
(typ)) = 0.210 + 1.15
= 1.36 W
Note that the conditions causing a worst case P
EXT
are different from those causing a worst case P
INT
. Maximum P
INT
cannot occur while 100% of the output pins are switching from all ones to all zeros. Also note that it is not common for a program to have 100% or even 50% of the outputs switching simultaneously.
Power and Ground Guidelines
To achieve its fast cycle time, including instruction fetch, data access, and execution, the ADSP-21020 is designed with high speed drivers on all output pins. Large peak currents may pass through a circuit board’s ground and power lines, especially when many output drivers are simultaneously charging or discharging their load capacitances. These transient currents can cause disturbances on the power and ground lines. To minimize these effects, the ADSP-21020 provides separate supply pins for its internal logic (IGND and IVDD) and for its external drivers
(EGND and EVDD).
To reduce system noise at low temperatures when transistors switch fastest, the ADSP-21020 employs compensated output drivers. These drivers equalize slew rate over temperature extremes and process variations. A 1.8 k
Ω
resistor placed between the RCOMP pin and EVDD (+5 V) provides a reference for the compensated drivers. Use of a capacitor
(approximately 100 pF), placed in parallel with the 1.8 k
Ω resistor, is recommended.
–26– REV. C
All GND pins should have a low impedance path to ground. A ground plane is required in ADSP-21020 systems to reduce this impedance, minimizing noise.
The EVDD and IVDD pins should be bypassed to the ground plane using approximately 14 high-frequency capacitors (0.1
µ
F ceramic). Keep each capacitor’s lead and trace length to the pins as short as possible. This low inductive path provides the
ADSP-21020 with the peak currents required when its output drivers switch. The capacitors’ ground leads should also be short and connect directly to the ground plane. This provides a low impedance return path for the load capacitance of the
ADSP-21020’s output drivers.
If a V
DD
plane is not used, the following recommendations apply. Traces from the +5 V supply to the 10 EVDD pins should be designed to satisfy the minimum V while carrying average dc currents of [I
DDEX
DD
specification
/10
3 (number of
EVDD pins per trace)]. I
DDEX
is the calculated external supply current. A similar calculation should be made for the four
IVDD pins using the I
DDIN
specification. The traces connecting
+5 V to the IVDD pins should be separate from those connecting to the EVDD pins.
A low frequency bypass capacitor (20
µ
F tantalum) located near the junction of the IVDD and EVDD traces is also recommended.
Target System Requirements For Use Of EZ-ICE Emulator
The ADSP-21020 EZ-ICE uses the IEEE 1149.1 JTAG test access port of the ADSP-21020 to monitor and control the target board processor during emulation. The EZ-ICE probe requires that CLKIN, TMS, TCK, TRST, TDI, TDO, and
GND be made accessible on the target system via a 12-pin connector (pin strip header) such as that shown in Figure 20.
The EZ-ICE probe plugs directly onto this connector for chip-on-board emulation; you must add this connector to your target board design if you intend to use the ADSP-21020
EZ-ICE. Figure 21 shows the dimensions of the EZ-ICE probe; be sure to allow enough space in your system to fit the probe onto the 12-pin connector.
KEY (NO PIN 1) X CLKIN
BTMS
BTCK
BTRST
TMS
TCK
TRST
BTDI TDI
GND TDO
TOP VIEW
Figure 20. Target Board Connector for EZ-ICE Emulator
(Jumpers In Place)
RIBBON CABLE LENGTH = 60.0 INCHES
2.435 (61.9)
ADSP-21020
0.590
(15.0)
0.2 (5.1)
0.128 (3.25)
0.408 (10.4)
BOTTOM
VIEW
0.92
(23.4)
0.6
(15.2)
2.435
(61.9)
RIBBON
CABLE
ALL DIMENSIONS IN INCHES AND (mm)
Figure 21. EZ-ICE Probe
The 12-pin, 2-row pin strip header is keyed at the Pin 1 location
–you must clip Pin 1 off of the header. The pins must be 0.025
inch square and at least 0.20 inch in length. Pin spacing is
0.1
3 0.1 inches.
The tip of the pins must be at least 0.10 inch higher than the tallest component under the probe to allow clearance for the bottom of the probe. Pin strip headers are available from vendors such as 3M, McKenzie, and Samtec.
The length of the traces between the EZ-ICE probe connector and the ADSP-21020 test access port pins should be less than 1 inch. Note that the EZ-ICE probe adds two TTL loads to the
CKIN pin of the ADSP-21020.
The BMTS, BTCK, BTRST, and BTDI signals are provided so that the test access port can also be used for board-level testing.
When the connector is not being used for emulation, place jumpers between the BXXX pins and the XXX pins as shown in
Figure 20. If you are not going to use the test access port for board test, tie BTRST to GND and tie or pull up BTCK to
VDD. The TRST pin must be asserted (pulsed low) after power up (through BTRST on the connector) or held low for proper operation of the ADSP-21020.
REV. C –27–
ADSP-21020
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
U PMA17 PMA20 TMS EGND TCK EVDD RCOMP EGND PMACK EVDD PMWR EGND PMD44 EGND PMD40 PMD39 PMD35 PMD31 U
T EGND PMA19 PMA23 PMS1 TRST DMWR DMACK CLKIN NC NC PMTS PMD45 PMD42 NC PMD37 PMD32 PMD30 PMD27 T
S PMA11 PMA14 PMA18 PMA22 PMPAGE TDI DMTS DMRD NC PMRD PMD47 PMD43 PMD41 PMD36 PMD34 PMD28 PMD26 PMD21 S
R EGND PMA10 PMA15 PMA16 PMA21 PMS0 TDO IGND RESET IVDD PMD46 IGND PMD38 PMD33 PMD29 PMD25 PMD23 EGND R
P PMA8 PMA9 PMA13 PMA12 PMD24 PMD22 PMD19 PMD18 P
N EVDD PMA5 PMA6 PMA7 PMD20 PMD17 PMD16 EVDD N
M PMA1 PMA4 PMA3 PMA2
L EGND PMA0 TIMEXP IGND
PMD15 PMD14 PMD13 PMD12 M
IGND PMD10 PMD11 EGND L
K EVDD NC IRQ2 IRQ3
J EVDD IRQ0 IRQ1 IVDD
ADSP-21020
TOP VIEW
(PINS DOWN)
PMD6
IVDD
PMD7 PMD8
PMD2 PMD5
PMD9 K
EVDD J
H EGND FLAG2 FLAG0 FLAG1
G FLAG3 DMA1 DMA0 IGND
DMD1 DMD0 PMD3 PMD4 H
IGND DMD3 NC EGND G
DMD9 DMD6 PMD0 PMD1 F F DMA2 DMA3 DMA4 DMA5
E
DMA6 DMA7 DMA8 DMA10
DMD13 DMD10 DMD2 EGND E
D DMA9 DMA11 DMA12 DMA15 DMA19 DMA23 DMA27 IGND DMS0 IVDD DMD36 DMD31 DMD27 DMD22 DMD17 DMD11 DMD5 DMD4 D
C DMA13 DMA14 DMA18 DMA20 DMA24 DMA28 DMA31 DMS1 NC DMD38 DMD35 DMD30 DMD28 DMD24 DMD20 DMD15 DMD8 DMD7 C
B DMA16 DMA17 DMA21 DMA25 DMA26 DMA30 DMPAGE DMS3 DMD39 DMD37 DMD33 DMD32 DMD26 DMD25 DMD21 DMD18 DMD14 DMD12 B
A BR
18
BG DMA22 EGND DMA29 EVDD DMS2 EGND DMD34 EVDD DMD29 EGND DMD23 EVDD DMD19 EGND DMD16
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
–28– REV. C
ADSP-21020
1 2 3 4 5 6 7 8 9 10 11 12 13
U PMD31 PMD35 PMD39 PMD40 EGND PMD44 EGND PMWR EVDD PMACK EGND RCOMP EVDD
14
TCK
15
EGND
16 17 18
TMS PMA20 PMA17
U
T PMD27 PMD30 PMD32 PMD37 NC PMD42 PMD45 PMTS NC NC CLKIN DMACK DMWR TRST PMS1 PMA23 PMA19 EGND
T
S PMD21 PMD26 PMD28 PMD34 PMD36 PMD41 PMD43 PMD47 PMRD NC DMRD DMTS TDI PMPAGE PMA22 PMA18 PMA14 PMA11 S
R EGND PMD23 PMD25 PMD29 PMD33 PMD38 IGND PMD46 IVDD RESET IGND TDO PMS0 PMA21 PMA16 PMA15 PMA10 EGND R
P PMD18 PMD19 PMD22 PMD24 PMA12 PMA13 PMA9 PMA8 P
N EVDD PMD16 PMD17 PMD20
M PMD12 PMD13 PMD14 PMD15
L EGND PMD11 PMD10 IGND
K PMD9 PMD8 PMD7 PMD6
J EVDD PMD5 PMD2 IVDD
H PMD4 PMD3 DMD0 DMD1
ADSP-21020
BOTTOM VIEW
(PINS UP)
PMA7
PMA2
PMA6 PMA5
IRQ3 IRQ2
IVDD IRQ1
EVDD N
PMA3 PMA4 PMA1 M
IGND TIMEXP PMA0 EGND L
NC EVDD K
IRQ0 EVDD J
FLAG1 FLAG0 FLAG2 EGND H
G
F
E
EGND
PMD1
EGND
NC
PMD0
DMD2
DMD3
DMD6
IGND
DMD9
DMD10 DMD13
IGND DMA0 DMA1 FLAG3 G
DMA5 DMA4 DMA3 DMA2 F
DMA10 DMA8 DMA7 DMA6 E
D DMD4 DMD5 DMD11 DMD17 DMD22 DMD27 DMD31 DMD36 IVDD DMS0 IGND DMA27 DMA23 DMA19 DMA15 DMA12 DMA11 DMA9 D
C DMD7 DMD8 DMD15 DMD20 DMD24 DMD28 DMD30 DMD35 DMD38 NC DMS1 DMA31 DMA28 DMA24 DMA20 DMA18 DMA14 DMA13
C
B
DMD12 DMD14 DMD18 DMD21 DMD25 DMD26 DMD32 DMD33 DMD37 DMD39 DMS3 DMPAGE DMA30 DMA26 DMA25 DMA21 DMA17 DMA16
B
A
1
DMD16 EGND DMD19 EVDD DMD23 EGND DMD29 EVDD DMD34 EGND DMS2 EVDD DMA29 EGND DMA22 BG
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
BR
18
A
REV. C –29–
ADSP-21020
B3
A4
C4
B4
B2
C3
A2
D4
D5
A6
C5
E3
D3
B1
E4
F3
C1
C2
F4
E2
G3
D1
D2
B13
C12
H3
H4
A16
D13
C14
B15
B14
D12
C13
A14
C17
D15
B18
B17
C16
D14
C15
B16
E18
E17
E16
D18
E15
D17
D16
C18
PGA
LOCATION
G16
G17
F18
F17
F16
F15
DMD14
DMD15
DMD16
DMD17
DMD18
DMDl9
DMD20
DMD21
DMD22
DMD23
DMD24
DMA30
DMA31
DMD0
DMD1
DMD2
DMD3
DMD4
DMD5
DMD6
DMD7
DMD8
DMD9
DMD10
DMD11
DMD12
DMD13
DMA14
DMA15
DMA16
DMA17
DMA18
DMA19
DMA20
DMA21
DMA22
DMA23
DMA24
DMA25
DMA26
DMA27
DMA28
DMA29
PIN
NAME
DMA0
DMA1
DMA2
DMA3
DMA4
DMA5
DMA6
DMA7
DMA8
DMA9
DMA10
DMA11
DMA12
DMA13
PMA22
PMA23
PMD0
PMD1
PMD2
PMD3
PMD4
PMD5
PMD6
PMD7
PMD8
PMA14
PMA15
PMA16
PMA17
PMA18
PMA19
PMA20
PMA21
PMA6
PMA7
PMA8
PMA9
PMA10
PMA11
PMA12
PMA13
DMD39
DMS0
DMS1
DMS2
DMS3
DMWR
DMRD
DMPAGE
DMTS
DMACK
PMA0
PMA1
PMA2
PMA3
PMA4
PMA5
PIN
NAME
DMD25
DMD26
DMD27
DMD28
DMD29
DMD30
DMD31
DMD32
DMD33
DMD34
DMD35
DMD36
DMD37
DMD38
J3
H2
H1
J2
S15
T16
F2
F1
K4
K3
K2
S17
R16
R15
U18
S16
T17
U17
R14
N16
N15
P18
P17
R17
S18
P15
P16
S12
T12
L17
M18
M15
M16
M17
N17
B10
D10
C11
A12
B11
T13
S11
B12
C8
D8
B9
C9
D7
B7
B8
A10
D6
C6
A8
C7
PGA
LOCATION
B5
B6
–30–
BG
BR
FLAG0
FLAG1
FLAG2
FLAG3
IRQ0
IRQ1
IRQ2
IRQ3
RESET
PMD39
PMD40
PMD41
PMD42
PMD43
PMD44
PMD45
PMD46
PMD47
PMS0
PMS1
PMWR
PMRD
PMPAGE
PMTS
PMACK
PMD31
PMD32
PMD33
PMD34
PMD35
PMD36
PMD37
PMD38
PMD23
PMD24
PMD25
PMD26
PMD27
PMD28
PMD29
PMD30
PMD15
PMD16
PMD17
PMD18
PMD19
PMD20
PMD21
PMD22
PIN
NAME
PMD9
PMD10
PMD11
PMD12
PMD13
PMD14
A17
A18
H16
H15
H17
G18
J17
J16
K16
K15
R10
S8
R13
T15
U8
S9
S14
T8
U10
S7
U6
T7
R8
U3
U4
S6
T6
U2
S5
T4
R6
U1
T3
R5
S4
T1
S3
R4
T2
R2
P4
R3
S2
P2
N4
S1
P3
M4
N2
N3
P1
L2
M1
M2
M3
PGA
LOCATION
K1
L3
NC
NC
NC
NC
NC
NC
EVDD
EVDD
EVDD
IVDD
IVDD
IVDD
IVDD
NC
IGND
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EVDD
EGND
EGND
IGND
IGND
IGND
IGND
IGND
IGND
EGND
EGND
EGND
EGND
EGND
EGND
EGND
EGND
TMS
TCK
EGND
EGND
EGND
EGND
EGND
EGND
PIN
NAME
TIMEXP
RCOMP
CLKIN
TRST
TD0
TDI
U9
U13
K18
D9
J4
J15
R9
C10
R11
A5
A9
A13
J1
J18
N1
N18
S10
T10
T9
K17
T5
G2
U11
U15
D11
G4
G15
L4
L15
R7
G1
L1
L18
R1
R18
T18
U5
U7
U16
U14
H18
A3
A7
A11
A15
E1
PGA
LOCATION
L16
U12
T11
T14
R12
S13
REV. C
REV. C
D j
2
L
3
A
φ b
D j
1
ADSP-21020
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
223-Pin Ceramic Pin Grid Array h
A
1 e
1 e
1
TOP VIEW
A B C D E F G H J K L M N P R S T U
18
17
16
15
14
13
12
11
8
7
10
9
6
5
4
3
2
1 e
φ b
1
SYMBOL MIN
INCHES
MAX
A 0.084
MILLIMETERS
MIN
0.102
2.11
MAX
2.59
A
1
φ b
φ b
1
D e
1 e
L
3 h
0.40
1.844
0.60
0.018 TYP
0.050 TYP
1.876
1.700 TYP
0.100 TYP
0.172
0.188
1.02
46.84
4.37
1.52
0.46 TYP
1.27 TYP
47.64
43.18 TYP
2.54 TYP
4.77
0.020 TYP 0.500 TYP j
1
1.125
1.147
28.56
29.14
j
2
1.065
1.186
27.05
27.61
NOTE
When socketing the CPGA package, use of a low insertion force socket is recommended.
–31–
ADSP-21020
Part Number*
ADSP-21020KG-80
ADSP-21020KG-100
ADSP-21020KG-133
ADSP-21020BG-80
ADSP-21020BG-100
ADSP-21020BG-120
ADSP-21020TG-80
ADSP-21020TG-100
ADSP-21020TG-120
ADSP-21020TG-80/883B
ADSP-21020TG-100/883B
ADSP-21020TG-120/883B
*G = Ceramic Pin Grid Array.
ORDERING GUIDE
Ambient Temperature
Range
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
–55
°
C to +125
°
C
Instruction
Rate (MHz)
20
25
33.3
20
25
30
20
25
30
20
25
30
Cycle Time
(ns)
50
40
33.3
50
40
33.3
50
40
30
50
40
33.3
Package
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
223-Lead Ceramic Pin Grid Array
–32– REV. C
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Table of contents
- 12 Specifications
- 31 Package drawings
- 32 Ordering Guide
- 1 Features
- 1 Product Description
- 12 Absolute Maximum Ratings
- 1 Functional Block Diagram
- 2 DEVELOPMENT SYSTEM
- 2 ADDITIONAL INFORMATION
- 2 ARCHITECTURE OVERVIEW
- 5 PIN DESCRIPTIONS
- 6 INSTRUCTION SET SUMMARY
- 7 COMPUTE AND MOVE OR MODIFY INSTRUCTIONS
- 7 PROGRAM FLOW CONTROL INSTRUCTIONS
- 8 IMMEDIATE MOVE INSTRUCTIONS
- 8 MISCELLANEOUS INSTRUCTIONS
- 12 RECOMMENDED OPERATING CONDITIONS
- 12 ESD SENSITIVITY
- 13 TIMING PARAMETERS
- 24 TEST CONDITIONS
- 26 ENVIRONMENTAL CONDITIONS
- 1 DIAGRAMS
- 3 Block Diagram
- 5 Basic System Configuration
- 13 Clock
- 13 Reset
- 14 Interrupts
- 14 TIMEXP
- 15 Flags
- 16 Bus Request/Bus Grant
- 17 External Memory Three-State Control
- 19 Memory Read
- 21 Memory Write
- 23 IEEE 1149.1 Test Access Port
- 24 Voltage Reference Levels For AC Measurements
- 24 Output Enable/Disable
- 27 EZ-ICE Probe
- 27 Target Board Connector for EZ-ICE Emulator