AMD Embedded Solutions Guide

AMD Embedded

Solutions Guide

JULY-DECEMBER 2014

Thin Client Market: Small Footprint, Low-Power Solutions

Advanced Power Management Improves Performance

Scalable, Enterprise-Class Storage and Networking

AMD Innovation Continues

Introducing the 2nd Generation AMD Embedded R-Series APU

The 2nd generation AMD Embedded R-Series APU (previously codenamed “Bald Eagle”) delivers breakthrough graphics embedded systems designed to provide ultra-immersive HD multimedia experiences and parallel processing compute

S category by allowing system designers to take advantage of

Heterogeneous System Architecture (HSA).

AMD’s 2nd generation AMD Embedded R-Series APU is a and multimedia immersion for embedded gaming, medical imaging and digital signage applications.

4652_Bald_Eagle_Print_Ad_Development_R2.indd 1

Learn more at: www.amd.com/r-series

5/30/14 10:43 AM

AMD EMBEDDED SOLUTIONS GUIDE

AMD’S EAGLES HAVE LANDED

By Scott Aylor, Corporate Vice President and General Manager, AMD Embedded Solutions

I n September 2013, AMD publically unveiled our embedded product roadmap for 2014, previewing a host of exciting new processors that promised to push performance, power and price boundaries and introduce new features that would give embedded system designers more options than ever before to meet their unique design requirements.

It was an ambitious roadmap that put AMD’s competitors on notice of our aggressive pace of innovation in the embedded processor market. This was reflected in the codenames that we assigned to these new processors, each of which was named after a type of eagle – nature’s most formidable birds of prey, capable of extraordinary speed and agility.

Today, we’re proud to tell you that AMD’s eagles have landed.

capabilities targeted at applications including industrial control and automation (IC&A) and thin clients. The new entries in this portfolio support thermal design profiles (TDP) as low as 5W while delivering up to 53% more overall performance compared to previous G-Series SoC solutions 1 .

Computex also saw the debut of “Crowned Eagle” – AMD

Embedded G-Series CPUs – optimized to provide superior single-threaded performance for storage, networking and other x86 IT systems. The new AMD G-Series CPUs deliver 1.2 to

2.0 GHz and a robust feature set including integrated PCI-E

Gen 2.0, USB3.0, SATA ports, and single-channel DDR3-1600 memory with error correction code (ECC) support.

All of these new products have a planned availability of 10 years. This unprecedented commitment gives our customers added confidence in the longevity of our embedded product families, enabling customers to “go with AMD, and stay with AMD.”

And that’s not all that the AMD Embedded Solutions Group has been up to so far in 2014.

In May at the G2E event in Macao, we introduced our

“Bald Eagle” platform – the second generation of our AMD

Embedded R-Series APUs – breaking new performance barriers for compute and graphics intensive applications spanning digital gaming, medical imaging and beyond, and enabling system designers to take full advantage of the

Heterogeneous System Architecture (HSA). Based on AMD’s

“Steamroller” CPU architecture, these new solutions deliver from 2.2 to 3.6 GHz CPU frequency with max boost, and 533 to 686 MHz GPU frequency thanks to AMD’s latest Graphics

Core Next (GCN) architecture.

We’re expanding our workforce and growing our expert team of field application engineers, and we’re increasing our embedded-focused R&D investment across both systems and software. We’re also strengthening our presence in the embedded software ecosystem, working closely with partners like Mentor Graphics and increasing our participation in initiatives like the Yocto Project to drive greater industry collaboration in the open source and Linux domains.

At Computex in June, we announced “Steppe Eagle” – the newest additions to our AMD Embedded G-Series SoC portfolio – featuring improved performance and power profiles, and enhanced security and dynamic power management

All of these initiatives – from the introduction of our new

“Eagle” codenamed processors, to our accelerating growth, innovation and ecosystem engagement – are aimed at helping our customers spread their wings and achieve their most ambitious embedded design goals. Enjoy the flight!

1. Overall performance was measured using a suite of industry benchmarks consisting of 3DMark06, 3DMark11, POVRay v3.7, Passmark v7, PCMark8 v2.0, and

BasemarkCL 1.0. The GX-412HC’s TDP is 7W and GX-210HA’s TDP is 9W. The performance delta of 53% was calculated based on GX-412HC’s geometric mean of 555.3 and GX-210HA’s geometric mean of 363.6. The performance-per-watt delta of 96% was calculated based on GX-412HC’s performance-per-watt ratio of 79.3 and GX-210HA’s performance-per-watt ratio of 40.4. The AMD Steppe Eagle GX-412HC and G-S SOC GX-210HA used an AMD Larne motherboard with

4GB DDR3-1333 memory and 320GB Toshiba HDD. The system ran Windows® 7 Ultimate. EMB-104

WWW.AMD.COM/EMBEDDED | PAGE 3


SMALL FOOTPRINT, LOW-POWER,

GRAPHIC-RICH EMBEDDED

SOLUTIONS MEET THE NEEDS

OF THIN CLIENT MARKET

AMD THIN CLIENT SOLUTIONS

AMD has an extensive history of leadership in the thin client market, offering solutions that provide reduced operating costs and power consumption, higher durability and increased longevity over personal computers. Industries such as healthcare, education and government can get high levels of performance without compromise, empower IT staff, protect client/patient data, and manage tight budgets.

AMD BASED THIN CLIENTS PROVIDE THE FOLLOWING

BENEFITS FOR OEMS AND END-USERS:

High-definition, high quality video display Hardware-assisted, high-definition video decode for H.264, VC-1, MPEG-2,

MPEG-4 Part 2, and DivX.1 Multiple video streams supported include Decode HD + SD on select APU models, SD

+ SD on all models, plus additional SD streams in the CPU.

AMD Radeon™ Dual Graphics technology can combine the processing power of 2nd Generation AMD R-Series APU with an AMD Embedded Radeon™ E8860 discrete GPU to provide up to 64% more 3D graphics performance than a standalone

2nd Generation AMD R-Series APU 1 .

Discrete-level GPU performance

Features the latest DirectX® 11 and OpenGL 4.2 graphics with 80 shader processors; easily handles graphics overlays on top of HD video, including videos found on sites such as

YouTube and Hulu.

Scalability

Models range from 3W 2 (expected average power) dual-core

(AMD G-Series SOC) to 35W quad-core APUs (AMD R-Series

APU). Because each product family is all in the same ball grid array (BGA) package, AMD offers the option for OEMs to use a one-board design for the entire range.

Industry-leading display support

Offers high-resolution on two independent displays and a variety of display formats, including DisplayPort 1.2, HDMI™,

DVI, LVDS.

Key embedded features

Small form factor designs for smaller footprints and thermals as low as 3W with a dual CPU core.

Longevity

5-year, 7-year and 10-year support offered, depending upon the AMD product. Please contact your AMD representative for more details.

Broad software support

Compatible with VMware and Citrix; supports Windows®

XPe, Windows 7, Windows Embedded Standard 7, Windows

Embedded Compact 7, Linux®, Android, and others.

1. The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle

RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB

SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and RX-427BB. The system ran Windows® 7 Ultimate. EMB-97

2. The average power for the AMD GX-210JA SOC is approximately 3 watts, determined by extrapolating the average of the results of the measured average power of the GX-210HA 9W

SOC running the following benchmarks: 3DMark® 11, AMD Sys Stress Test CPU, AMD Sys Stress

Test CPU & GPU, AMD Sys Stress Test GPU, Winbench® 99, CoreMark, Game: Meat Boy, PCMark®

7, POV-Ray, Sandra 2011, Game: Street Fighter. Testing was performed on an AMD E1-2100 (Rev

A1) that is equivalent to the AMD GX-210HA SOC. System configuration: AMD E1-2100 @ 70°C,

“Larne” development platform, 4GB RAM, Windows® 7 Ultimate. Please see AMD Publication ID

53395A for more information. EMB-48

For more information on AMD Embedded Solutions for Thin Client, please visit www.amd.com/us/products/embedded/Pages/thin-client.aspx

PAGE 4 | JULY 2014


AMD EMBEDDED G-SERIES

SYSTEM-ON-CHIP (SOC)

The embedded evolution continues with x86 CPU, integrated discrete-class GPU and I/O controller on the same die.

T he AMD Embedded G-Series SOC platform is a high-performance, low-power System-on-Chip (SOC) design, featured with enterprise-class error-correction code (ECC) memory support, dual and quad-core variants, integrated discrete-class GPU and I/O controller on the same die.

The AMD G-Series SOC achieves superior performance per watt in the low-power x86 microprocessor class of products when running multiple industry standard benchmarks 1 . This helps enable the delivery of an exceptional HD multimedia experience and provides a heterogeneous computing platform for parallel processing. The small-footprint, ECC-capable SOC sets the new foundation for a power-efficient platform for content-rich multimedia processing and workload processing that is well-suited for a broad variety of embedded applications.

Model Opn

Tdp

& sb)

Tjc w/GPU

GX-420CA

GX-415GA

GX-217GA

GX-210HA

GE420CIAJ44HM

GE415GIBJ44HM

GE217GIBJ23HM

GE210HICJ23HM

4

4

2

2

25W

15W

15W

9W

2MB

2MB

1MB

1MB

2.0GHz

1.5GHz

1.65GHz

1.0GHz

600MHz

(HD 8400E)

500MHz

(HD 8330E)

1.65GHz 450MHz

(HD 8280E)

300MHz

(HD 8210E)

225MHZ

DDR3-1600

DDR3-1600

DDR3-1600

DDR3-1333

0-90°C

0-90°C

0-90°C

0-90°C

GX-210JA GE210JIHJ23HM 2 6W 1MB 1.0GHZ

DDR3-1066 0-90°C

GX-424CC

GX-412HC

GX-212JC

GX-411GA

GX-210JC

GX-209HA w/o GPU

GX-416RA

GX-420MC

GX-412TC

GE424CIXJ44JB

GE412HIYJ44JB

GE212JIYJ23JB

GE411GIRJ44HM

TBD

GE209HISJ23HM

GE416RIBJ44HM

GE420MIXJ44JB

GE412TIYJ44JB

4

4

4

2

4

2

2

4

4

25W

7W

6W

15W

6W

9W

15W

17.5W

6W

2MB

2MB

2MB

2MB

2MB

1MB

2MB

1MB

1MB

2.4GHZ

1.2GHZ

1.2GHZ

1.0GHZ

1.0GHZ

1.0GHz

1.6GHz

2.0GHz

1.2GHz

497MHZ

300MHZ

300MHZ

300MHZ

TBD

225MHz

N/A

N/A

N/A

DDR3-1866

DDR3-1333

DDR3-1333

DDR3-1066

DDR3-1600

DDR3-1066

DDR3-1600

DDR3-1600

DDR3-1600

0-90°C

0-90°C

0-90°C

-40-105°C

-40-105°C

-40-105°C

0-90°C

0-90°C

0-90°C

1. The low-power x86 microprocessor class includes: GX-420CA @ 25W TDP (scored 19); GX-415GA @ 15W (25), GX-217GA @ 15W (17), GX-210HA @ 9W (20), G-T56N @ 18W (12), G-T52R @ 18W (7),

G-T40N @9W (14), G-T16R @ 4.5W (19), Intel Atom N270 @ 2.5W (20), Intel Atom D525 @ 13W (9), Intel Atom D2700 @ 10W (12) & Intel Celeron G440 @ 35W (5). Performance score based on an average of scores from the following benchmarks: Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics

Mark, and EEMBC CoreMark Multi-thread. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0. AMD G-Series APU system configurations used iBase MI958 motherboards with 4GB DDR3 and integrated graphics. All AMD G-Series SOC systems used AMD “Larne” Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D2700 was tested with Jetway NC9KDL-2700 motherboard, 4GB DDR3 and integrated graphics. Intel Celeron system configuration used MSI H61M-P23 motherboard with 4GB DDR3 and integrated graphics. Intel Atom N270 system configuration used MSI MS-9830 motherboard with maximum supported configuration of 1GB DDR2

(per http://download.intel.com/design/intarch/manuals/320436.pdf,) and Intel GM945 Intel Atom D525 used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics.

Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.



COM Express Compact

COM-KB

AMD Embedded G-Series SOC

DDR3/DDR3L-1600MHz SODIMM, Up to 16GB

SATA 6.0Gb/s x 2, USB 3.0 x 2, USB 2.0 x 8

PCI-Express [x1] x 5

24-bit single channel LVDS

High Definition Audio Interface

Communications, Industrial Controllers, Medical,

Single Board Computers, Networking, Point Of Sale

Aaeon

PHONE (714) 996-1800

(714) 996-1811

EMAIL

WEB [email protected]

www.aaeon.com

EPIC Board

EMB-KB1


DDR3 1600MHz SODIMM x 2, Up to 16GB

USB3.0 x 2 and SATA 6.0 Gb/s x 2

Realtek 8111F, Gigabit Ethernett

Dual Independent Display: VGA, DVI-D, LVDS

Rich Expansion: PCI-E[x4] x 1, Mini Card x 2

Industrial Controllers, Medical, Single Board Computers

Aaeon

PHONE (714) 996-1800

(714) 996-1811

EMAIL


www.aaeon.com

Pico-ITX

MIO-2270


DDR3/ DDR3L 1600MHz support up to 8GB

DirectX®11.1 support, dual independent display by 18-bit LVDS + VGA or 18-bit LVDS + HDMI

2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATA

Supports SUSIAcccess and Embedded Software APIs

Advantech

PHONE (949) 789-7178

(949) 789-7179

EMAIL

WEB

[email protected]

www.advantech.com/embcore

3.5” SBC

EM-6335


SODIMM, 4GB, DDR3, 1x, 1600/1333/1066

2x TypeA USB 3.0; 4x Header USB 2.0

1x Mini-PCIe w/ USB signal, full-size; 1x Mini-

PCIe w/ USB & SATA signal, half-size

1x SATA, 6.0Gbps, 3.0 compliant

Gaming, Information Appliance, Industrial Controllers,

Storage, Digital Set Top Boxes, Single Board Computers,

Digital Signage, Point Of Sale, Thin Clients

AEWIN Technologies Co., Ltd.

PHONE +886-2-8692 6677

+886-2-8692 6655

EMAIL


www.aewin.com.tw

Industrial Computer

SEM-6335


SODIMM, 4GB, DDR3, 1x 1600/1333/1066

x USB 3.0; 2x USB 2.0

1x Mini-PCIe w/USB Signal, full-size; 1x Mini-

PCIe w/USB & SATA Signal, half-size

1x SATA, 6.0Gbps, 3.0 compliant, 2.5” drive bay

Fanless operation

aGaming, Information Appliance, Industrial Controllers,



PHONE +886-2-8692 6677

+886-2-8692 6655

EMAIL


www.aewin.com.tw

PAGE 6 | JULY 2014

Custom Board

KCGX210


1x SODIMM DDR3 1333/1066/800 MHz, Max up to 4GB

2x TypeA USB 3.0 Host, 6x TypeA USB 2.0 Host,

1x Header USB 2.0 Host

1x HDMI

2x SATA 6.0Gbps

1x Mini-PCIe

Digital Signage

Albatron

PHONE 886-2-8227-3277

886-2-8227-3266

EMAIL

WEB

[email protected]

www.albatron.com.tw

Custom Board

KCGX210J


1x SODIMM DDR3 1066/800 MHz , Max up to 4GB

2x TypeA USB 3.0 Host, 6x TypeA USB 2.0 Host, 1x TypeA

1x HDMI

2x SATA 6.0Gbps, 3.0 compliant

1x Mini-PCIe

Digital Signage

Albatron

PHONE 886-2-8227-3277

886-2-8227-3266

EMAIL

WEB

[email protected]

www.albatron.com.tw


Custom Board

KCGX210J-LV


1x SODIMM DDR3 1333/1066/800 MHz , Max up to 4GB

2x TypeA USB 2.0, 2x TypeA USB 3.0

1x HDMI

2x SATA 6.0Gbps, 3.0 compliant, 1x mSATA slot

Digital Signage

Albatron

PHONE 886-2-8227-3277

886-2-8227-3266

EMAIL

WEB

[email protected]

www.albatron.com.tw

Custom Board

KCGX217-DH



2x TypeA USB 3.0, 6x TypeA USB 2.0, 1x Header USB 2.0

1x HDMI


1x Mini-PCIe

Digital Signage

Albatron

PHONE 886-2-8227-3277

886-2-8227-3266

EMAIL

WEB

[email protected]

www.albatron.com.tw

Custom Board

KCGX415-DH




2x HDMI

2x SATA 6.0Gbps

1x Mini-PCIe

Digital Signage

Albatron

PHONE 886-2-8227-3277

886-2-8227-3266

EMAIL

WEB

[email protected]

www.albatron.com.tw

Custom Board

BioDigitalPC 7 Family


2GB, 4GB or 8GB of DDR3 RAM

4 USB 2.0 Ports, 1 USB 3.0 Port,

DisplayPort, 2 PCIe x1 Gen 2

Size: 84mm x 52mm x 6mm

Epoxied for Rugged Design and Harsh

Environmental Conditions, Waterproof

Information Appliance, Medical, Digital Set

Top Boxes, Single Board Computers, Digital

Signage, Point Of Sale, Thin Clients

Arnouse Digital Devices Corp.

PHONE 1 (516) 673-4444

WEB

EMAIL [email protected]

http://arnousedigitaldevices.com/newsite/home.php

Mini-ITX Motherboard

IMB-A180-H


Supports DDR1600MHz

1 x VGA, 2 x HDMI

24 bit dual channel LVDS (optional)

6 x COM ports, 6 x USB 2.0, 2 x USB 3.0

1 x PCIex4, 1 x SATA 3.0, 1 x mSATA

Industrial Controllers, Single Board

Computers, Digital Signage

ASRock Inc.

PHONE (909) 590-8308

(909) 590-1026

EMAIL


www.asrock.com



3.5” Micro Module

ECM-KA

• AMD Embedded G-Series SOC

• One 204-pin DDR3 SODIMM Socket Supports

Up to 8GB DDR3 1600 SDRAM

• 1 x Mini PCIe (mSATA Supported)

• 2 x USB 3.0, 6 x USB 2.0

• Supports HDMI and LVDS

• Industrial Controllers, Single Board Computers

Avalue Technology Inc.

PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw

SMARC

CSB1690SM1-D10


Industry Standard SMARC, 82mm x 50mm

32KByte Instruction and Data Caches; 1MByte L2 Cache

4GByte 64-Bit Wide DDR3L-1066 Memory

Three x1 GEN II (5G/s) Ports

Dual Simultaneous Display via HDMI and eDP/LVDS

Gaming, Information Appliance,

Communications, Industrial Controllers,

Storage, Medical, Digital Set Top Boxes

Cogent Computer Systems, Inc.

PHONE 1-401-349-3999 http://www.cogcomp.com/


COM Express Module

CSB1890T10-Q15


Excellent choice for size restricted, low power, ruggedized embedded applications

4GByte 64-Bit Wide DDR3-1600 Memory with 8-Bit ECC

PCIe: One x4 and Two x1 GEN II (5G/s) Ports

Dual Simultaneous Display via HDMI,

DisplayPort 1.2, eDP or LVDS

Gaming, Information Appliance, Communications,

Industrial Controllers, Storage, Medical,

Digital Set Top Boxes, Networking, Digital


Cogent Computer Systems, Inc.

PHONE 1-401-349-3999 http://www.cogcomp.com/


COM Express Compact/Type 6 conga-TCG

• AMD Embedded G-Series SOC

• Max. 8 GByte DDR3L 1600 MHz

• 4 x PCIe 2.0

• 2 x USB 3.0; 8 x USB 2.0

• 1 x HDMI; VGA; LVDS; 1 x DisplayPort

• Gaming, Information Appliance, Communications,

Industrial Controllers, Medical, Digital Set Top Boxes,

Networking, Digital Signage, Point Of Sale, Thin Clients congatec Inc.

PHONE (858) 457-2600

(858) 457-2602

EMAIL


www.congatec.us

Network Appliance

Netboard A10


SODIMM, max. 8GB, DDR3 non-ECC, 1x 1600/1333/1066

1 x PCIe x4 Edge Connector

5x USB 2.0

2x SATA 3 + mini power header (JST)

1x Display Port ++, 1x VGA

Communications, Networking

Deciso B.V.

PHONE +31187744020 www.deciso.com

PAGE 8 | JULY 2014


Proprietary Network Board

Netboard A10


185mm x 125mm

SODIMM, max. 8GB, DDR3 non-ECC, 1x 1600/1333/1066

1 x PCIe x4 Edge Connector

5x USB 2.0

2x SATA 3 + mini power header (JST)

1x Display Port ++, 1x VGA

Communications, Storage, Single Board Computers,

Networking, Digital Signage, Point Of Sale, Thin Clients

Deciso B.V.

PHONE +31187744020 www.deciso.com


Mini-ITX

KB160/161 Series


2 DDR3L SODIMM up to 8GB

1 PCIe x4, 1 Mini PCIem 1 DFI Proprietary

Extension Bus (optional), 1 DFI ECX interface

1 USB 3.0, 3 USB 2.0

1 VGA, 1 LVDS

Information Appliance, Communications,

Industrial Controllers, Medical, Single

Board Computers, Networking

DFI

PHONE (916) 568-1234

(916) 568-1233

EMAIL


www.dfi.com



KB968 Series


1 DDR3 SODIMM up to 8GB

1 PCIe x4, 4 PCIe x1

8 USB: 2 USB 3.0/2.0, 6 USB 2.0

1 VGA, 1 LVDS, 1 DDI

2 SATA 3.0

Gaming, Communications, Industrial

Controllers, Medical, Printers, Single Board

Computers, Networking, Digital Signage

DFI

PHONE (916) 568-1234

(916) 568-1233

EMAIL


www.dfi.com

Mini-ITX

D3313-S


DDR3 1866/1600 SDRAM Memory

USB 2.0 and USB3.0 onboard

PCIe x4 connector and Mini-PCI Express onboard

DVI-I, DP V1.2 and Dual Channel LVDS support

Designed for fanless operation

Gaming, Server, Information Appliance,

Communications, Industrial Controllers, Medical,

Digital Set Top Boxes, Single Board Computers,


Fujitsu

PHONE

WEB

+49 821 804 3387 www.ts.fujitsu.com


Mini-ITX

FUTRO S520



2x Front USB 3.0, 2x Rear USB 2.0

2x DVI-I 1920 x 1200

Thin Clients

Fujitsu

PHONE

WEB



Mini-ITX

FUTRO S720/ S920



2x Front USB 3.0, 4x Rear USB 2.0

1x DisplayPort 2560 x 1600, 1x DVI-I 1920 x 1200

Thin Clients

Fujitsu

PHONE

WEB



QSeven

H6069


Soldered DDRIII RAM 2GB (Module prepared for 4GB)

1 x SATA ports

2 x USB 3.0, 4 x USB 2.0

4 ports for PCIe x1

Dual 24-bit LVDS and Displayport or DVI or HDMI

Gaming, Information Appliance, Communications,

Industrial Controllers, Medical, Single Board

Computers, Digital Signage, Point Of Sale

Hectronic AB

PHONE +46-733-660704 www.hectronic.se




Desktop Thin Client t520 Flexible Thin Client

AMD GX-212JC Dual-Core SOC APU

AMD Radeon HD Graphics (1.2 GHz)

DDR3L-1600 SDRAM, Max up to 8 GB

2x DisplayPort 1.2, 1x VGA

2x USB 3.0, 2x USB 2.0

Thin Clients

Hewlett-Packard

PHONE 800-334-5144 http://www.hp.com


Digital Signage Player

SI-22


Operating Temp: 0 ~ 45 C

SODIMM, 8GB, DDR3, 1x 1600/1333/1066

2x, Mini-PCIe, X1, Including mSATA

2x, HDMI, 1920 x 1080

2x TypeA, USB 3.0, Host; 1x TypeA, USB 2.0, Host

iSMART for EuP/ErP power saving, auto-scheduler and power resume

Single Board Computers, Digital Signage, Thin Clients

IBASE

PHONE +886-2-2655-7588

+886-2-2655-7388

EMAIL


www.IBASE-usa.com

3.5” Single Board Computer

IB903


1x DDR3 SO-DIMM , Max. 8GB

Supports DVI-I and 24-bit dual channel LVDS

2x Realtek RTL8111G PCI-E Gigabit LAN

Watchdog timer, Digital I/O, mSATA, iSAMRT

6x USB, 4x COM, 2x SATA III

2x Mini PCI-E (half-sized)

Gaming, Single Board Computers,

Digital Signage, Thin Clients

IBASE

PHONE +886-2-2655-7588

+886-2-2655-7388

EMAIL


www.IBASE-usa.com


MSC C6C-GX


Up to 16GB DDR3 SDRAM, dual-channel

2 SATA 3Gb/s mass storage interfaces

2x USB 3.0 and 6x USB 2.0 interfaces

1x Digital Display Interface (DP 1.2, DVI, HDMI 1.4a)

1x Embedded DisplayPort 1.3 (shared with LVDS 24 bit, dual channel )



Medical, Digital Signage, Point Of Sale

MSC Vertriebs GmbH

PHONE 49-8165-906-240

49-72-49-79-93

EMAIL


www.msc-ge.com

Digital Gaming System

QXi-300


2x DDR3-1600 (PC3-12800) SODIMM sockets

4x USB 2.0 ports

Advanced PCI Express gaming logic and NVRAM

Meets the requirements of GLI-11 and all major global gaming jurisdictions

Fanless operation

Cost-effective “all-in-one” two-screen gaming platform

Quixant UK Ltd

PHONE +44 (0) 1223 89296

+44 (0) 1223 892401

EMAIL


www.quixant.com

PAGE 10 | JULY 2014


IPC-FT3GS


AMD Radeon 8000 series graphic

Dual Memory DIMMS Non-ECC

Dual simultaneous displays

4 SATA ports, 8 USB ports

2x DDR3 DIMMs up to 1600

1x PCI-E (x16 at x4 BW); 1x Mini PCI-E

Gaming, Single Board Computers, Digital


Sapphire Technology Limited

PHONE 886226270685 www.sapphiretech.com


4”x4”

BP-FT3GS


AMD Radeon 8000 series graphics

Dual memory SO-DIMMS non-ECC

Dual simultaneous displays

4”x 4”, Audio Jacks

GDigital Set Top Boxes, Single Board

Computers, Digital Signage, Point Of Sale, Thin

ClientsSignage, Point Of Sale, Thin Clients





Pico-ITX

SECOpITX-GX


Reduced space, with low power consumption and high performance

Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V

18 bit single channel LVDS or embedded

Display Port internal connector

VGA interface (requires external optional Video Adapter)

2 x standard USB 3.0 Type A connectors;

4 x internal USB 2.0 ports

Gaming, Medical, Digital Set Top Boxes, Single Board

Computers, Digital Signage, Point Of Sale, Thin Clients

Seco

PHONE +39 0575 26979

+39 0575 350210

EMAIL


www.seco.com

QSeven

Q7-GX


Soldered Down, 8GB, DDR3, 1600/1333/1066

1x DisplayPort, 2560 x 1600, 1x HDMI, 1920 x 1200

1x USB 3.0, Host, 6x USB 2.0, Hos


Industrial Controllers, Point Of Sale, Thin Clients

Seco

PHONE +39 0575 26979

+39 0575 350210

EMAIL


www.seco.com

Panel PC

Thinlabs TL2300/2400

22” POE AiO Touch Computer


2x DDR3, 1600/1333/1066, Max up to 16GB

1x LVDS 2 Channel 1920 x 1080

1x DVI/HDMI 1920 x 1080

2x USB 3.0, 4x USB 2.0, Host



Thinlabs

PHONE 44 (0) 20 33 22 60 50 thinlabs.com


Panel PC

Thinlabs TL8500/8600

19” POE AiO Touch Computer


2x DDR3, 1600/1333/1066, Max up to 16GB

1x LVDS 2 Channel 1366 x 768, 19”

1x DVI/HDMI 1920 x 1080, 19”

2x USB 3.0, 4x USB 2.0, Host



Thinlabs

PHONE 44 (0) 20 33 22 60 50 thinlabs.com


Fanless System

PL-60830


HDMI & VGA Dual Display

DDR3 1600 up to 4GB

Support 1 x 2.5” SATA HDD and 1 x Half-size mSATA

3 x COM, USB3.0, Audio

2 x Mini-PCIe sockets, DC 8V~32V input

Gaming, Industrial Controllers, Digital Set Top

Boxes, Networking, Digital Signage, Point Of Sale

Win Enterprises

PHONE (978) 688-2000

(978) 688-4884

EMAIL


www.win-ent.com



ADVANCED POWER MANAGEMENT

HELPS BRING IMPROVED

PERFORMANCE TO HIGHLY

INTEGRATED X86 PROCESSORS

Complex heterogeneous processors have the potential to leave a large amount of performance headroom untapped when workloads don’t utilize all cores. Advanced power management techniques for x86 processors are designed to reduce the power of underutilized cores while also allowing for dynamic allocation of the thermal budget between cores for improved performance.

T

HE IMPORTANCE OF POWER MANAGEMENT

Those with experience implementing microprocessors know the importance of proper power management.

Whether for simple applications processors or high-end server processors, the ability to down-clock, clock-gate, power-off, or in some manner disable unused or underused hardware blocks is crucial in limiting power consumption.

Better power management benefits range from energy savings within the data center to improved battery life in mobile devices. But don’t underestimate the value of reducing power and increasing efficiency. In fact, power reduction and increased efficiencyis even more important today, as processors integrate more and varied functional blocks.

THE X86 EXAMPLE

Typical x86 processors widely used in both consumer and embedded applications are a perfect example: Integration of network and security engines, memory controllers, graphicsprocessing units (GPUs), and videoencode/decode engines has effectively turned them into heterogeneous compute units that excel at a wide variety of workloads.

The notable thing about traditional reduction-based power management is that a particular functional block is only turned off when unused, or down clocked when higher performance is not needed by the application. What about applications that desire more performance? Shouldn’t saving power in one area allow you to utilize it in another?

Specifying power usage is complex, particularly with highly integrated processors. If the worst-case power for each individual hardware block in a heterogeneous processor were added together, the resulting total could be several times the

PAGE 12 | JULY 2014 achievable worst-case power for the device. The fact that it is nearly impossible to write software that will simultaneously utilize all functional blocks to their fullest extent is one reason.

Simply feeding the various compute engines and I/O ports with enough data to keep them all 100% utilized would likely exceed the available bandwidth of internal buses. Central processing unit (CPU) cores manage data movement, and time spent there is less time spent executing higher power instructions.

Another issue is that different instruction sequences can incur vastly different power usage, which can further complicate specifying processor power. For instance, complex floating-point instructions burn much more power than a simple

I/O data read due to the significant difference in transistor logic they activate during execution. The combination of varying instruction types and utilized hardware blocks makes the actual power usage of the processor highly workload-dependent, and explains why it is rare to see a “typical” power specification for this device type. Still, implementers expect a maximum power specification on which to base their design.

ESTABLISH A REALISTIC WORST-CASE FOR POWER

The pragmatic approach for silicon providers is to survey real-world application software to establish a more realistic worst-case power and add some guard-band for safety. Both

AMD and Intel use this type of methodology and specify it as thermal design power (TDP). TDP is essentially the maximum sustained power a processor can draw with “real world” software while operating under defined temperature and voltage limits.

POWER LIMITS CAN TRANSLATE TO PERFORMANCE LIMITS

Most embedded x86-based systems are power-constrained


"PILEDRIVER"

DUAL-CORE

X86 MODULE

"PILEDRIVER"

DUAL-CORE

X86 MODULE

GRAPHICS CORES

& MULTIMEDIA

2MB L2

NORTHBRIDGE

2MB L2 in some way. Designers will look for the best performance they can get in a given power envelope, at a price they can afford. The worstcase power limit can translate directly into a performance limit for a given processor product by effectively defining the maximum operating frequency. Using TDP as a worst-case power specification instead of the cumulative per-block

Integration of large GPU cores, as done in AMD R-Series APUs, increases the potential for unused power budget.

maximum power helps to increase that operating frequency, but it’s also based on an assumption of the software workload.

Applications using fewer hardware blocks, or using them to a lesser extent, use less power and effectively leave performance headroom on the table.

AMD’s recent move to integrate discrete-class GPUs with x86 processor cores in accelerated processing units (APUs) underscores this power management challenge. Some APUs contain a GPU that accounts for more than half of the silicon die and a proportional amount of the power budget. A much larger potential for under-utilization of the APU’s power envelope exists in this scenario if the software workload is highly CPU centric or GPU-centric. The trend toward integration of these complex, heterogeneous cores is likely to continue and necessitates a means of harnessing the excess thermal headroom.

AMD TACKLES THE UNDERUSED TDP HEADROOM ISSUE

AMD Turbo CORE technology 1 was launched several years ago to address underutilized TDP headroom. AMD Turbo CORE began with a simple core-counting mechanism that allowed some CPU cores to use higher-frequency “boost” states while other CPU cores were idle. This approach only affected the CPU cores, and was primarily targeted at accelerating single-threaded applications that didn’t leverage a multi-core architecture.

Generational improvements have increased the granularity and effectiveness of the technology by adding more boost states for CPU and GPU cores, real-time power and temperature monitors, and enabling dynamic power budget allocation between cores.

Increasing performance by boosting to higher frequencies is relatively simple, since the use of multiple performance states

(voltage and frequency operating points) has been around for a while. However, the complexity lies in determining when and which cores to boost. For AMD Embedded R-Series APUs, the process starts by dividing the processor into separate thermal entities: one for each CPU core-pair and one for the GPU. I/O power is small by comparison, so it is defined as a fixed value based on characterization to reduce complexity.

CPU

CORE

PWR

CPU

CORE

PWR

I/O

PWR

MAX DIE TEMP LIMIT

TDP BUDGET

CPU

CORE

PWR

CPU

CORE

PWR

I/O

PWR

Unused

Power

Budget

An integrated microcontroller manages AMD

Turbo CORE calculations, allowing a more complex and therefore more effective algorithm.

In deciding whether boosting a given core is possible, the power usage of each thermal entity must be determined. Ondie analog power

APP 1 high C

AC

Applications with a low CAC can leave unused

TDP and temperature headroom. New power management techniques can exploit both for improved performance.

APP 2 low C

AC measurement at many amps is not practical in a 32nm silicon on insulator

(SOI) process, and external measurement is not possible because the various cores share power rails. Alternatively, proprietary activity monitors that are integrated throughout the processor architecture model current logic activity as an AC capacitance (CAC). The CAC monitors effectively profile the running application to determine if it is one of those “worstcase” workloads that defines TDP or something less laborious.

Static power of the core is determined by transistor leakage at a given voltage and temperature which can be characterized for the device and hard-coded into the algorithm as a function of temperature. A calculated temperature value from a previous iteration is used for reasons that will be explained later.

Total instantaneous power of the thermal entity can then be calculated by P=CAC*V2*f + Pstatic, and total power for the

APU equals the summation of the power for each thermal entity and the I/O power offset. The instantaneous power calculation result is compared to an allocated power budget for the thermal entity, as well as the device’s thermal design current specification to ensure that current demand does not exceed what the voltage regulator can provide. If either value is too close to the limit, firmware can impose throttling by reducing the core’s performance state. The ability to boost the performance state is maintained when headroom exists on both parameters.

GOING ABOVE TDP

Even if an application with a high CAC drives the APU to consume the full TDP, operation at this level may occur in bursts


AMD EMBEDDED SOLUTIONS GUIDE or be preceded by idle time such that the die temperature at the start of the high CAC period is far below the maximum specification. The latest version of AMD Turbo CORE also takes the opportunity to boost in this scenario by allowing brief excursions above TDP when there is adequate temperature headroom. After all, the purpose of a TDP limit is only to ensure die temperature stays in check.

Real-time temperature values from around the thermal entity provide a scaling factor to the power calculation so they influence the boost decision without controlling it directly. Derivation of a calculated temperature comes from application of the calculated power to a reference thermal solution model.

Reducing the influence of actual die temperature on the boost algorithm is an intentional tradeoff to increase deterministic performance of the device. The calculated temperature is then combined with temperature data from other thermal entities to determine if thermal headroom exists.

Other thermal entities can act as heat sources or sinks, depending on their temperature state, and therefore must be considered. Temperature offsets are also included to account for sensor tolerance and help make sure that the maximum junction temperature is never exceeded. The calculated temperature is compared to predefined thresholds to determine the amount of boost that is possible.

INTELLIGENT BOOST

The final stage of AMD Turbo CORE technology is called

Intelligent Boost; it uses a proprietary algorithm that helps improve efficiency by only allowing a core to boost if it can translate that higher frequency to increased performance.

If each thermal entity control loop operated independently under a demanding workload, all cores would attempt to boost until they reach their maximum performance state or until the device thermal limit is reached. It is very unlikely that the application will be perfectly balanced, but rather limited by one core type (CPU or GPU) being saturated.

Intelligent Boost examines the workload at a very high frequency to give more thermal budget to the core that needs it the most by preventing the other cores from boosting more than necessary, maximizing efficiency without affecting overall processer performance.

With an understanding of how boost technologies work, designers should consider where it could affect their application or design practices. A common concern is that designers may have become accustomed to the idea that the power draw of their software application doesn’t come close to driving a processor near its TDP, leading them to design to a lower specification. Historically, this may have been safe, but boost technologies will tend to drive the processor closer to TDP than before by allowing the active cores to consume more power.

Operating closer to TDP may sound like a bad thing, but keep in mind that performance can be gained with the increase in power. An example could be a machine vision application achieving higher frame rates for faster recognition. Total processor power might increase in that scenario, but doesn’t materially increase with applications such as media playback in a digital signage player. Fixed, periodic workloads may complete faster at a higher power level, but when the burst of activity is over, cores then spend more time in lower-power idle states, so the average power is approximately the same. Applications like this can still benefit from boosted performance through better responsiveness.

CONFIGURABLE TDP

Beyond performance benefits, the ability of AMD Turbo

CORE algorithms to control average power consumption of the processor also enables a new and interesting feature on the latest generation of AMD APUs, called configurable TDP.

It essentially provides the system designer a knob to modify the processor TDP to better fit the needs of the application.

A useful example might be a system design with a thermal budget for a 20W processor but vendor offerings that only include 15W and 25W options. Configurable TDP enables flexibility so the designer isn’t forced to choose a lower-performing 15W option in order to remain within the 20W power budget. Instead, the 25W processor might be used but configured for 20W.

SUMMARY

AMD Turbo CORE technology will help to dynamically provide the processor’s best available performance while keeping thermal dissipation under the specified amount. Support for configurable TDP and the level of configurability varies by processor model, but it can be a very useful feature for those that support it. System designers should keep these new concepts in mind when choosing and implementing embedded x86 processors. Power management isn’t just about saving power anymore.

1. AMD Turbo CORE technology is available only with select AMD APUs and GPUs.

PAGE 14 | JULY 2014


AMD EMBEDDED G-SERIES

APU PLATFORM

AMD’s original combination of low-power CPU and advanced GPU integrated into a single embedded device.

T he AMD Embedded G-Series processor is the world’s first integrated circuit to combine a low-power CPU and a discrete-level GPU into a single embedded Accelerated

Processing Unit (APU). This unprecedented level of graphics integration builds a new foundation for high-performance multimedia content delivery in a small form factor and power-efficient platform for a broad range of embedded designs. Based on a new power-optimized core, the AMD

Embedded G-Series platform delivers levels of performance in a compact BGA package that is ideal for low-power designs in embedded applications such as Digital Signage, x86

Set-Top-Box (xSTB), IP-TV, Thin Client, Information Kiosk,

Point-of-Sale, Casino Gaming, Media Servers, and Industrial

Control Systems.

T52R

T48E

T44R

T40N

T48n

T40E

T40R

T16R

T48L

T30L

T24L

Model x86 Core Clock

Speed Base/

Boost L2 Cache

AMD Embedded G-Series APU – FT1 413-pin

T56N 1.65GHz

2

GPU

AMD Radeon™ HD 6320

T56E 1.65GHz

2 AMD Radeon™ HD 6250



1.5GHz

1.4GHz

1.2GHz

1.0GHz

2

1.4GHz

1.0GHz

2

1.0GHz

2

615mHz

1.4GHz

1.4GHz

1.0GHz

2

512KB







N/A

N/A

N/A

DDR3-1066

Unbuffered

DDR3-1066

Unbuffered

DDR3-1066

3

Unbuffered

DDR3-1066 3

Unbuffered

LVDDR3-1066

DDR3-1066

Unbuffered

DDR3-1066 3

Unbuffered

DDR3 Speed x86 Cores

DDR3-1333

Unbuffered

1

2

2

2

1

1

2

1

1

2

1

2

2

UVD 1 3 Display Ouptuts 4 Max TDP

18W

Yes

N/A

Dual independent display controllers

2 active outputs from:

1xVGA

2x single link DVI

1X single link LVDS

2x DisplayPort 1.1a

1x HDMI

1X DVO

N/A

18W

18W

18W

9W

9W

18W

6.4W

5.5W

4.5W

18W

18W

5W

1. Unified Video Decoder (UVD 3) for hardware decode of high-definition video.

2. Models enabled by AMD Turbo CORE technology, up to 10% clock speed increase is planned. For CPU boost, only one processor core of a dual-core has boost enabled.

3. Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder.

4. Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.

Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.



Gaming System

ACE-S7400

AMD Embedded G-T56N APU

with AMD Radeon™ HD 6320 Graphics

Digital inputs and digital outputs with Micro fit 3.0 connector

2 x ccTalk

2MB Battery back up SRAM

Timer & Meter pulse generator, counters

Intrusion Logger

Storage:2 x CF connectors aCrosser Technology Limited

PHONE (866) 401-9463

(714) 903 5629

EMAIL


www.acrosser.com

Mini-ITX

AA55E-IF

AMD Embedded G-Series APU

AMD A55E Controller Hub

1x DDR3 1066 SODIMM, Max up to 4GB

1x PCI-E x 4 Gen.2, 1x Mini PCI-E , 1x CFas

5 SATA 3.0 (6Gb/s)

8x USB 2.0 (4 Rear, 4 Internal)

Storage, Single Board Computers, Digital

Signage, Point Of Sale, Thin Clients, Gaming

Advansus

PHONE 886-2-8177-7089

886-2-2794-7306

EMAIL


www.advansus.com.tw

PICMG 1.0

PCA-6763



1x DDR3 1066/800, Max up to 1GB

1 x Mini-PCIe

4 SATA 6.0 Gbps, 3.0 compliant

6x Header USB 2.0, 1x TypeA USB 2.0

1x DVI 1920 x 1200, LVDS 1920 x 1200

Industrial Controllers, Single Board Computers

Advantech

PHONE (949) 789-7178

(949) 789-7179

EMAIL

WEB

[email protected]


Industrial Tablet WA-10



Memory: SODIMM, 2GB, DDR3

Amtek System Company

PHONE +886-2-26492212#133

+886-2-26492363

EMAIL


www.amtek.com

PAGE 16 | JULY 2014

Desktop Network Security

Appliance CAF-1000


AMD A50M Controller Hub

SODIMM, 8GB, DDR3, 1x, 1066/800

2x USB 2.0


200(W) x 112(D) x 52(H) mm

American Portwell Technology, Inc.

PHONE (510) 403-3399

(510) 403-3184

EMAIL


www.portwell.com

Fanless Box PC

ARES-1500-A10



Fanless with Aluminum Chassis Design

Suitable for Harsh Environment

Support Optional WiFi or 3G Connection

Slim, Compact & Cable-free Design

4 x USB, 4 x COM, 2 GbE LAN, DVI-I)

Industrial Controllers, Medical, Networking,

Point Of Sale, Thin Clients

Arbor Technology Corp.

PHONE (866) 270-2617

(408) 452-8909

EMAIL


www.arbor.com.tw

Thin Client

A9S/A9SD



SODIMM, 2GB (4GB for A9SD), DDR3, 1x 1066/800

Dual Video (DVI + DP) Support

6x USB 2.0

Supports DirectX 11 and 3D Visual Effect

Low power consumption

Astec Technology Co., Ltd.

PHONE +886-2-86983077 Ext. 108 www.astec-tech.com



3.5” Single Board Computer

ECM-A50M



(Optional G-T56N APU)


One 204-pin DDR3 SODIMM Socket Supports

Up to 4GB DDR3 1066 SDRAM

Dual View, 2-CH LVDS, CRT, HDMI

7.1-CH Audio, Dual GbE

1 CF, 2 SATA, 2 COM, 7 USB, 16-bit GPIO


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw


5.25” Single Board

Computer EBM-A50M

AMD Embedded G-T40E APU


Fan-less (Optional G-T56N APU/ with fan)

With AMD Radeon™ HD 6250 Graphics or

Optional AMD Radeon™ HD 6320 Graphics


Onboard 2GB DDR3 1333 SDRAM, One 204-pin

DDR3 SODIMM Up to 4GB DDR3 1333 SDRAM

Dual View, 2-CH LVDS, HDMI

7.1-CH Audio, Dual GbE, 2W Amplifier

Two Mini PCIe Slots, Optional Supports mSATA

PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw


ERS-A50M




One 204-pin DDR3 SODIMM Up to

4GB DDR3 1066 SDRAM

1 mSATA, 1 CF, 1 SSD

Dual GbE, 7.1-CH Audio

1 VGA, 1 HDMI, 2 COM, 6 USB

Service Windows, Easy to Install HDD/ SSD and Memory

Operating Temperature -10 ~ 50°C, Ambient w/ Air Flow


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw

Mini-ITX

EMX-A55E



1x SODIMM DDR3 1066/800, Max up to 4GB

1 x Mini-PCIe, 1 x PCIe, X4

5 SATA 3.0 Gbps

8x USB 2.0

Accelerated Parallel Processing, Gaming, Medical,



PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw

Panel PC

APC-18W4



18” Projected Capacitive Multitouch Screen

1 GbE, 2W Amplifier

1 CF, 2 USB, 1 COM, 1 Mini PCIe

Wide Voltage 12V~28V Input, ErP Power

Over Current & Surge Protection

Backlight controlled by PWM, Timer-Power-on

Programmable Function Key


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw



Panel PC

FPC-08WA4



1x SODIMM DDR3, Max up to 4GB

1x HDMI

1x RS-232, 1x RS-232 or Optional RS-422/485

3x USB 2.0

Communications, Point Of Sale, Thin Clients


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw



ESM-A50



Also supports AMD G-T40E APU with



Two 204-pin DDR3 SODIMM Up to

8GB DDR3 1066/1333 SDRAM

Dual View, Dual-Channel 18/24-bit LVDS

GbE

4 SATA, 8 USB, 8-bit GPIO

Pin-out Type 6

PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw

Custom Board

GA690-2r





5x TypeA USB 2.0

Thin Clients

Centerm Information Co., Ltd.

PHONE 0591-28053888-8757

0591-83057710

EMAIL


www.centerm.com.cn

PAGE 18 | JULY 2014

Ultra Slim Industrial Computer

ASM-A50M-40E



AMD A50M Controller Hub Chipset

Onboard 2GB DDR3 1066 SDRAM and One 204-pin

SODIMM Up to 6GB

Dual Display Output, VGA, HDMI

7.1-CH Audio, Dual GbE

1 CF, 1 SATA, 2 COM, 4 USB

ErP/EuP 2.0 compliant


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw

Industrial Panel PC

LPC-10/12/15/17



8”/10”/12”/15”/17” 5-wire Resistive Touch Screen

VGA/HDMI, Audio, GbE, optional WiFi

1 CF, 2 COM, 4 USB

Fanless operation, VESA Compliance

IP-65 Compliant Front Panel

High Brightness, Anti-scratch Panel (option)

Compatible installation/mounting Accessories


PHONE +886-2-8226-2345

+886-8226-2777

EMAIL


www.avalue.com.tw


Modular Thin Platform DT135D

AMD Embedded G-Series APU Platform

High performance with low power consumption

Support for Linux, Microsoft® Windows® XP

Embedded or Windows® Embedded Standard 7

2 video-out ports: 1 DVI-I connector and 1 VGA Port

Fanless design; no moving parts

Integrates major thin-client/server computing protocols

(Citrix ICA, Microsoft RDP) and web browsers

Comprehensive remote device administration through server-based WebDT Device Manager software

DT Research, Inc.

PHONE (408) 934-6220

(408) 934 6222

EMAIL


www.dtresearch.com

Mini-ITX Single Board

Computer D3003-S


HD Audio on board

Dual GbE LAN on board

Serial ATA III RAID on board

mSATA socket support (for Embedded OS) onboard

USB 2.0 onboard

8 Bit GPIO onboard

Infineon TPM V1.2 onboard

Designed for fanless operation

Mainboard ready for EuP

Fujitsu

PHONE

WEB




Custom Board

FUTRO X913



2x Left side USB 2.0, 2x Rear USB

2.0, 2x Internal USB 2.0

1x DVI-I 1920 x 1200

Thin Clients

Fujitsu

PHONE

WEB



Custom Board

FUTRO X913-T



2x Left side USB 2.0, 2x Rear USB

2.0, 2x Internal USB 2.0

1x DVI-I 1920 x 1200

Thin Clients

Fujitsu

PHONE

WEB




JBC361F35



Support DirectX 11 3D Graphics Acceleration

Support 2 * Gigabit LAN

Equipped with 802.11 b/g/n WiFi card &

Internal Antenna (JBC361F35W-B only)

Support 2.5” SATA HDD

Small size and provide VESA mount bracket

Gaming, Digital Set Top Boxes, Digital


JETWAY Information Co., Ltd

PHONE +886 2 89132711

+886 2 89132722

EMAIL


www jetway.com.tw

Mini-ITX Single Board

Computer

NF81-T56N

AMD Embedded G-T56N APU with AMD

Radeon™ HD 6320 Graphics

Silent fan, silent drivers

6x SATA, 6.0Gbps, 3.0 compliant, 1 port is m-SATA connector

Designed for Digital Signage and

Gaming machine applications


PHONE +886 2 89132711

+886 2 89132722

EMAIL


www jetway.com.tw


QXi-200



2x DDR3-1333 (PC3-10600) SODIMM sockets

1x DVI-I (analogue or digital), 1x DVI-D (digital)

2x PCI Express® Gigabit LAN controllers

4x USB 2.0 ports

Cost effective, compact “all-in-one” gaming platform

Quixant UK Ltd

PHONE +44 (0) 1223 89296

+44 (0) 1223 892401

EMAIL


www.quixant.com



SILVERCOR AND AMD ACHIEVE

SCALABLE, ENTERPRISE-CLASS

STORAGE AND NETWORKING

WITH ULTRA-MODULAR ‘SAN

IN A DISK DRIVE’ TECHNOLOGY

Big Data analytics and cloud storage have emerged as core applications in the enterprise

IT domain, enabling users to harness huge data sets across a distributed network of servers and storage arrays for a wide range of business purposes. With this decentralization of hardware infrastructure, new approaches to storage networking and the underlying processing platforms are needed.

C onventional storage arrays and servers are typically architected around centralized controllers or boards that process the aggregate storage IO via general purpose

CPUs. In these systems, the processor is the main bottleneck of data flows to and from the system, so system vendors design in the highest performing CPUs they can, adding significant expense and power consumption in the process.

Silvercor’s approach is to decentralize storage hardware infrastructure, giving IT administrators the flexibility to deploy storage resources incrementally in ‘building block’ fashion wherever these resources are needed in the distributed network. By equipping each individual Silvercor disk drive with a high-performance, power efficient multicore AMD

Embedded APU, the aggregate number of processor cores in the storage network can exceed the amount of cores within legacy storage systems, allowing users to process more data at the same rate or faster - at less cost, and with lower power consumption.

Utilizing AMD Embedded G-Series Accelerated Processing

Units (APUs), Silvercor has pioneered a new category of enterprise storage with the introduction of a new class of hard disk drives (HDDs) and solid state drives (SSDs) that harness the full capabilities of a Storage Area Network (SAN) in a

PAGE 20 | JULY 2014 single 3.5’’ drive. With integrated Ethernet connectivity, native virtualization support, outstanding energy efficiency and a high performance AMD-enabled multicore processing platform, Silvercor’s family of Refugio, Vulcan and Magnum disk drives enables users to implement a full-featured, ultra-scalable SAN with minimal upfront investment.

A SAN IN THE PALM OF YOUR HAND

From expensive, monolithic storage arrays to commodity servers with direct attach storage (DAS) architectures, legacy enterprise storage systems can add considerable cost, management complexity and power consumption to Big Data and cloud storage-optimized IT infrastructure.

With AMD Embedded G-Series APUs (Accelerated Processing Units) at the heart of its disk drive portfolio, Silvercor is helping storage administrators achieve enterprise-class storage performance and versatility via a highly scalable and extremely cost effective platform. Among the many benefits offered with this solution:

Extreme Flexibility and Affordability – Start implementing a SAN with a single disk drive and add additional drives as storage performance and capacity requirements evolve — with little or no downtime or disruption — helping to provide a low total cost of ownership.


Low Power Consumption – Utilizing Power over Ethernet

(PoE), Silvercor disk drives use less power than comparable solutions without sacrificing processing performance.

Built-in Virtualization Support – The ability to run virtual machines (VMs) natively on a Silvercor disk drive helps enable granular provisioning at the disk drive level for diverse workloads and/or multi-tenant usage.

Simplified Management and Interoperability – Offering iSCSI VM compliant and out-of-the-box Windows Server® and Linux® support, Silvercor disk drives require no specialized training to get started. Users can configure and provision storage, and manage and monitor logical volumes and

LUNs, using standard cloud management tools to deploy

VMs on a large scale.

Optimized Support for Big Data and Cloud Storage Applications – With a multicore AMD G-Series processor embedded locally in each individual Silvercor drive, optimal performance is virtually assured for distributed, scale-out computing architectures. Hadoop and OpenStack Swift run natively on the disk drive, minimizing performance degradation of the cluster when adding or replacing nodes. Additionally, Silvercor’s innovative caching solution helps enable operators to achieve challenging performance and service level objectives

AMD APUS FOR NEXT-GENERATION STORAGE

SYSTEM ARCHITECTURES

AMD Embedded G-Series APUs enabled Silvercor’s design team to achieve aggressive design and functionality goals, at a lower cost than other processing platforms that perform comparably. Offering seamless interoperability with the rich ecosystem of industry-standard x86 software, drivers and tools, and supported by AMD’s expert technical support team, AMD Embedded G-Series APUs provide Silvercor with a host of benefits:

High Performance Processing – The combination of a general purpose CPU and discrete-class GPU on a single silicon die assists in high-speed parallel processing that dramatically improves the performance of each individual Silvercor disk drive ‘node.’

Ultra Compact Form Factor – The AMD G-Series APU’s twochip architecture – the APU and the companion controller hub – simplifies design complexity through a reduction in board layers, allowing Silvercor’s designers to architect extremely dense 3.5’’ disk drive systems that can be configured 12 across in a standard 19’’ rack.

Low Power Consumption – Supporting thermal design power (TDP) profiles from 5.5 W to 18 W, AMD G-Series

APUs are an optimal fit for Silvercor’s advanced POE power distribution approach, and help to lower system-level heat generation considerably.

AMD EMBEDDED SOLUTIONS FOR

ENTERPRISE STORAGE

AMD Embedded APUs are well-suited for enterprise storage systems and components requiring an optimal balance of processing performance, scalability, and low power consumption in a small footprint. For SAN, NAS, DAS and next generation networked storage architectures in physical, virtual and cloud-based computing environments, AMD

APUs provide a powerful, reliable processing platform that maximizes storage IO with minimal design complexity. www.silvercor.com | www.amd.com/embedded

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF

AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY

APPEAR IN THIS INFORMATION.

© 2014 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD arrow logo, and combinations thereof are a trademark of Advanced Micro Devices, Inc. Windows Server is a registered trademark of Microsoft. Linux is a registered trademark of Linus Torvalds. All other names used in this publication are for informational purposes only and may be trademarks of their respective owners.



Mini PC Solution

SP-FT1M1



SODIMM, 8GB, DDR3, 1x 1333/1066/800

320 GB SATA 2.5” Hard Drive (Optional)

1x HDMI, 1x VGA

0.5L: 19.3 x 14.8 x 2.2cm (L / W / H)





Nano-ITX Single Board

Computer

K-A8HD


Able to drive two independent monitors using VGA/HDMI/LVDS

Support 3G and onboard SIM interface

Support 1*Mini PCIE+1*DDRIII-SODIMM

Small size and full function


Medical, Digital Signage, Thin Clients

Shenzhen Comstar Technology Co,.LTD

PHONE (86) (0) 13590253820 www.cst-tek.com


Custom Board

IM-AMD-Ontario



SODIMM, 4GB, DDR3, 1x 1033/1066/800

2x TypeA, USB 2.0, Host, Front

3x TypeA, USB 2.0, Host, Back

6x Header, USB 2.0, Host, Internal


Information Appliance, Industrial Controllers,

Medical, Digital Set Top Boxes, Digital

Signage, Point-of-Sale, Thin Clients

Shenzhen i-long Business Machine Co., Ltd.

PHONE 86-755-82877033

86-755-82874781 WEB i-long.en.gongchang.com

Giada Mini PC A51



1x SO DIMM DDR3 1066/800, Max up to 2GB

4x TypeA USB 2.0, 1 x TypeA USB 3.0

1x HDMI 1366 x 76

Server, Information Appliance, Storage, Medical,

Digital Signage, Point Of Sale, Thin Clients, Other

SHENZHEN JIEHE TECHNOLOGY DEVELOPMENT

PHONE (408) 235-8582 www.giadatech.com


Mini-ITX

ITX-AF2X21B



1x DIMM DDR3 1066/800, Max up to 8GB

4x TypeA USB 2.0 Host, 2x Header USB 2.0 Host

5x SATA 3.0 Gbps

2x Mini-PCIe X1, 1x PCIe X1

1x DVI 1280 x 720

Accelerated Parallel Processing, Gaming, Medical,


SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD

PHONE 86 0755 83663196 www.micputer.com


PAGE 22 | JULY 2014

Mini-ITX

ITX-AF2X62A



2x SO DIMM DDR3 1333/1066/800, Max up to 8GB


6x SATA 3.0 Gbps, 2.0 compliant

2x Mini-PCIe X1

1x HDMI 2560 x 1600

Gaming, Storage, Medical, Digital Set Top

Boxes, Single Board Computers, Digital






ITX-A35E21A



1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB

2x SATA 3Gb

2x MINI PCI-E slot (1pcs for wifi, 1 pcs for SSD)

8x USB 2.0

1x VGA port, 1x DVI port

Gaming, Digital Set Top Boxes, Single Board Computers,







ITX-AF2E21C




2x SATA 3Gb

2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)

8x USB 2.0





Nano-ITX

Nano AF2S1E



1x SO DIMM DDR3 1333/1066/800, Max up to 2GB

4x TypeB USB 2.0 Host, 2x Header USB 2.0 Host


1x Mini-PCIe X1

LVDS 1024 x 768, HDMI 24-bit

Industrial Controllers, Digital Set Top Boxes, Single Board

Computers, Digital Signage, Point Of Sale, Thin Clients




Nano-ITX Motherboard

NANO-AF2S1F



1x SO DIMM DDR3 800/1066MHz of memory up to 4GB

1x Notebook SATA 3Gb/s with power interface

2x MINI PCI-E slot (support wifi and SSD)

6x USB 2.0

1x VGA port, 1x HDMI port





ITX-AF2E21A



1x SO DIMM DDR3 1066 MT/S, Max up to 8GB

2x SATA 3Gb/s


8x USB 2.0


Gaming, Storage, Single Board Computers, Thin Clients





ITX-AF2X62B



2x desk pc DDR3 1066MHz, Max up to 8GB

5x SATA 3Gb/s

2x MINI PCI-E slot, 1x PCI-E 1x

8x USB 2.0


Industrial Controllers, Storage, Digital Set

Top Boxes, Digital Signage, Thin Clients







ITX-AF2X21D




2x SATA 3Gb


8x USB 2.0


Industrial Controllers, Digital Set Top

Boxes, Digital Signage, Thin Clients




Nano-ITX

Nano AF2S1A



1x SO DIMM DDR3 1066/800, Max up to 4GB



1x Mini-PCIe X1

1x HDMI 1920 x 1080, 1x HDMI 1280 x 1024

Digital Set Top Boxes, Single Board Computers,





Nano-ITX Single Board

Computer NANO-AF2S1A


OS Supported: Linux™, Windows™ 7

Power Consumption: <25W

Memory: SODIMM, up to 4GB, DDR3, 1x 1333/1066/800

Industrial Controllers, Digital Set Top Boxes,

Digital Signage, Point-of-Sale, Thin Clients




3.5”

Refugio/Vulcan/Magnum Series


Ethernet Flash drive with ISCSI protocol built in.

POE powered from standard Network switch.

Single 1Gi, dual 1 Gig and dual 10 Gig.

Flash capacities up to 1TByte.

Management software

SAN, NAS, Object Storage and Hadoop

Silvercor

PHONE (408) 426-4428 www.silvercor.com


EmbeddedITX Single Board

Computer UMB-AFEI01


AMD A55E C

OS Supported: Windows® Vista, Linux®, Windows®

XP, Windows® 7, Linux® Terminal, Redhat® Linux

Power Consumption: <36W


Memory: SODIMM, 4GB, DDR3, 1x, 1066/800

Suzhou UET Electronics Co. Ltd.

PHONE

EMAIL

0512 87185616 13962146197 [email protected] WEB www.uetcn.com

PAGE 24 | JULY 2014

NANO PC HD ITX

TS 1000/TS 1100





7x TypeA USB 2.0

1x HDMI 1920 x 1080

1x Mini-PCIe

Accelerated Parallel Processing, Information

Appliance, Industrial Controllers, Storage, Digital Set

Top Boxes, Single Board Computers, Networking,


TECSYS

PHONE 55 12 3797-8800

55 12 3797-8824

EMAIL


www.tecsysbrasil.com.br


INTRODUCING THE 2ND

GENERATION AMD EMBEDDED

R-SERIES APU

T he 2nd Generation AMD Embedded R-Series APU (previously codenamed “Bald Eagle”) delivers breakthrough graphics performance and power efficiency for a new generation of embedded systems designed to provide ultra-immersive HD multimedia experiences and parallel processing compute performance. The AMD R-Series APU offers next-generation performance-per-watt compute efficiency in the x86 product category by allowing system designers to take advantage of Heterogeneous System

Architecture (HSA)

2nd Generation AMD Embedded R-Series APUs enable stunningly crisp 3D, 4K, and HD video content and offer support for up to four independent displays (4096 x 2160 resolution per display output). The AMD Dual Graphics 1 configuration allows you to combine the power of the 2nd

Generation AMD R-Series APU with an AMD Embedded

Radeon™ E8860 discrete GPU to provide up to 64% more

3D graphics performance than a standalone 2nd Generation

AMD R-Series APU 2 .

AMD’s 2nd Generation AMD Embedded R-Series APU is a revolutionary leap in processing performance, power efficiency and multimedia immersion, well-suited for embedded gaming, medical imaging, digital signage and other embedded applications.

Model# OPN

RX-427BB RE427BDGH44JA 4

RX-425BB RE425BDGH44JA 4

RX-225FB RE225FECH23JA 2

RX-427NB RE427NDGH44JA 4

RX-219NB RE219NECH23JA 2

3

0

8

6

0

35W

35W

17W

35W

17W

1

4

4

4

1

3.6/2.7

3.4/2.5

3.0/2.2

3.6/2.7

3.0/2.2

686/600

Memory

DDR3 2133 30W-35W

654/576

533/464

-

-

DDR3

DDR3

DDR3

DDR3

1866 30W-35W

1600 15W-17W

2133 30W-35W

1600 15W-17W

1. AMD Dual Graphics technology combines the 3D graphics rendering resources of the APU’s discrete-class graphics processor with the discrete graphics processor to accelerate the Microsoft® Direct3D function for software applications using Microsoft DirectX® 10 or DirectX 11 technology.

2. The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle RX-427BB used an

AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and

RX-427BB. The system ran Windows® 7 Ultimate. EMB-97

Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.



micro-ATX Motherboard

GMB-A75

AMD Embedded R-Series APU

AMD Radeon™ HD 7000G Series Graphics integrated

AMD A75 Controller Hub

Built-in SMI 750 GPU to support extension 2 display

Extended up to 2 PCIex16 slot

System memory up to 16 GB (DDR3)

Comprehensive I/O: 2 x RJ45, 10 x USB (2.0/3.0),

8 x COM, 4 x VGA, 2 x DVI-D, CF card, and audio


Digital Signage, Point Of Sale

Advantech

PHONE 886-2-2792-7818 #1431 www.advantech.com


Digital Gaming SBC

DPX-S430




Quad and Dual Core APUs

Comprehensive Gaming features

High performance integrated or PCI-Express graphics

Up to 4 independent displays from the chipset

Low power consumption

Small format

Advantech-Innocore

PHONE (949) 789-7178

(949) 789-7179

EMAIL




GA-5010



PCIe x16 slot + mini-PCIe/mSATA slot

USB 3.0 x 4 + USB 2.0 x 8

Two SATA + One CF or optional onboard NANDrive

Up to 4 digital displays: HDMI + 3 x DVI-D

Optional ODM module memory & I/O expansion for specific applications

Gaming, Industrial Controllers, Single Board Computers


PHONE +886-2-8692 6677

+886-2-8692 6655

EMAIL


www.aewin.com.tw

Digital Engine

DE6140



USB 2.0 Port : x 2

DDRIII SO-DIMM x 2

HDMI Port : x 4

eSATA port: x 2

Purpose-built for powering video walls and displaying dynamic content on multiple displays

Aopen Inc.

PHONE 886-2-77101161

WEB

EMAIL www.aopen.com/global/home [email protected]

Axiomtek

PHONE (626) 581-3232

(626) 581-3552

PAGE 26 | JULY 2014

MiniITX Single Board Computer

MANO111




DDR3 Dual channel SO-DIMM

1333/1600 max. up to 16 GB

4 SATA-600 support RAID 0,1,5,10

4 USB 3.0 supported

3 independent displays

DisplayPort 2 supports multi-stream

Gaming, Communications, Industrial Controllers,


EMAIL


www.axiomtek.com/US

COM Express / Type

6 conga-TFS




SODIMM, 16GB, DDR3, 2x 1066/800

7 x PCI Express™

4 x SATA

4 x USB 3.0, 4 x USB 2.0

High performance DirectX®11 GPU supports

OpenCL™ 1.1 and OpenGL 4.2

Gaming, Server, Information Appliance, Communications,

Industrial Controllers, Medical, Digital Signagedfi congatec Inc.

PHONE (858) 457-2600

(858) 457-2602

EMAIL


www.congatec.us


R2.0, Type 6 CM901-B

MD Embedded R-Series APU




VGA, LVDS, DDI (DisplayPort, LVDS, VGA)

1 PCIe x16, 7 PCIe x1 (first 4 PCIe support PCIe x4)

4 SATA 3.0

8 USB 2.0 (first 4 USB ports support up to USB 3.0)

Gaming, Information Appliance, Industrial Controllers,


DFI

PHONE (916) 568-1234

(916) 568-1233

EMAIL


www.dfi.com



CM100-C





1 HDMI, 2 DVI (1 supports DVI-D signal), 1 LVDS

1 PCIe x16, 2 PCIe x1 gold fingers, 1 Mini PCIe

4x SATA 3.0

4x USB 3.0, 6x USB 2.0

Gaming, Industrial Controllers, Medical,

Digital Signage, Point Of Sale

DFI

PHONE (916) 568-1234

(916) 568-1233

EMAIL


www.dfi.com


MI959




2 x DDR3-1600 Memory, up-to 16GB Dual Channel

1 x DVI-, DVI-D, Display Port & LVDS

2 x Mini PCI-E(x1), PCI-E(x16)

4 x USB 3.0 + 8 USB 2.0

Server, Communications, Industrial Controllers,

Medical, Networking, Digital Signage, Point of Sale

IBASE

PHONE +886-2-2655-7588

+886-2-2655-7388

EMAIL


www.IBASE-usa.com

Digital Signage Player

SI-38

AMD R-Series Quad-Core / Dual-Core APU, up to 35W

Integrated AMD Radeon™ 384/240 Cores

DirectX® 11 GPU in Processor

Winner of Computex 2012 Design & Innovation Award

Dual independent 1080p Hybrid DVI-I display outputs

Supports DDR3 memory up to 16GB

iSMART - for EuP/ErP power saving, auto-scheduler and power resume

Dual Mini PCI-E(x1) slots for WiFi and TV tuner options

2x USB 3.0 and serial port (RS232)

IBASE

PHONE +886-2-2655-7588

+886-2-2655-7388

EMAIL


www.IBASE-usa.com


NF82



2 x SODIMM Sockets for un-buffered Dual

Channel DDR3 1600 SDRAM up to 16 GB

6 x Serial ATA3 6Gb/s connectors support RAID 0, 1 & 10 functions

1 x PCI x 16 slot, 1 x Mini PCI-E

Embedded 4 x USB 3.0 & 8 x USB 2.0/1.1

Gaming, Digital Signage, Point Of Sale


PHONE +886 2 89132711

+886 2 89132722

EMAIL


www jetway.com.tw

COM Express Compact Module

MSC C6C-A7



Up to 16GB DDR3-1333 SDRAM, dual channel

4X SATA-300 mass storage interfaces

1x, LVDS 2 Channel

1x, DVI/HDMI/DisplayPort, 4096 x 2560

4X USB 3.O, 4X USB 2.0

Gaming, Information Appliance, Industrial

Controllers, Medical, Digital Signage, Point Of Sale

MSC Vertriebs GmbH

PHONE 49-8165-906-240

49-72-49-79-93

EMAIL


www.msc-ge.com



Multi-Display Embedded

Computer

NDiS B862



Slim and compact design

6 x HDMI

2 x USB3.0 support

WLAN and TV tuner support

Removable Fan Module

Designed for Digital Signage

Nexcom

PHONE (510) 656-2248

(510) 656-2158

EMAIL


www.nexcom.com

Multi-Display Embedded

Computer

NDiS B842



Slim and compact design

4 x HDMI

2 x USB3.0 support

WLAN and TV tuner support

Removable Fan Module

Designed for Digital Signage

Nexcom

PHONE (510) 656-2248

(510) 656-2158

EMAIL


www.nexcom.com


QX-40


AMD Radeon™ HD 6760 Graphics integrated


SODIMM, 8GB, DDR3, 2x 1600/1333/1066

OpenGL 4.1, DirectX® 11, OpenCL™ 1.1 compatible

Advanced PCI Express® gaming logic & SRAM / MRAM

Support for up to 10 independent monitors

7x DisplayPort, 2560 x 1600

4x DVI, 2560 x 1600

Quixant UK Ltd

PHONE +44 (0) 1223 89296

+44 (0) 1223 892401

EMAIL


www.quixant.com


QX-50

2nd Generation AMD Embedded R-Series APU

2x DDR3-2133 (PC3-17000), Max up to 16GB

2x USB 3.0, 11x USB 2.0 (4 internal, 7 on BP board)

1x DisplayPort, 1x DVI, 1x HDMI

2x SATA, 6.0Gbps, 1x eSATA, 6.0Gbps

4x PCIe

Gaming

Quixant UK Ltd

PHONE +44 (0) 1223 89296

+44 (0) 1223 892401

EMAIL


www.quixant.com


QXi-4000




Fanless all-in-one PC-based gaming controller for slot machines

Supports up to four independent HD monitors

Advanced PCI Express® gaming logic & SRAM/MRAM

4x, DisplayPort, 2560 x 1600

5x TypeA USB 2.0, Host

4x SATA, 6.0Gbps, 3.0 compliant, 2 x CFAST sockets

Quixant UK Ltd

PHONE +44 (0) 1223 89296

+44 (0) 1223 892401

EMAIL


www.quixant.com

PAGE 28 | JULY 2014

Embedded System

SP-FP2M3



SODIMM, 4-16GB, DDR3, 2x 1333/1066/800

1x HDMI, 1x DP, 1920 x 1080

500Gb SATA 2.5” Hard Drive (Optional)

7.8” x 7.2” x 1.2” 197.5 x 182.5 x 31.6mm (L / W / H)





Mini-ITX

IPC-FS1r2A75



2x DDR3 SO-DIMM, Max. 16GB (Non-ECC)


1x PCI-E(x4), 2x Mini PCI-E(x1), (one with mSATA)

4x HDMI, 6x DisplayPort

Accelerated Parallel Processing, Gaming,

Information Appliance, Digital Signage, Other





COM Express Basic

SECOMExp-Rseries



Up to 8GB of 1600MHz DDR3 on two SO-DIMMs

Able to drive up to 4 independent monitors using the LVDS / CRT / Digital Display interfaces

Offering a PCI Express Graphics x8 interface

4 x S-ATA Channels 6Gb/s

8 x USB 2.0 ports; 4 x USB 3.0 ports

Gaming, Digital Signage

Seco

PHONE +39 0575 26979

+39 0575 350210

EMAIL


www.seco.com

Mini-ITX

WTM-A4



2x DIMM DDR3 1600/1333/1066, Max up to 8GB

8x USB 2.0, 3x USB 3.0

1x Mini-PCIe

4x DVI


Shenzhen IPCWTM Technology Co., Ltd.

PHONE +8613927447156 www.ipcwtm.com



ITX-AT2X21B and ITX-AT2X21B-1




2x SATA 3Gb/s with power


8x USB 2.0

1x HDMI port, 3x DVI port

Industrial Controllers, Digital Set Top Boxes,


Shenzhen Xinzhixin Enterprise Development Co.,Ltd




ITX-AT2X21E, ITX-AT2X21F





2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD); 2x SIM slot

Supports USB 3.0 and USB 2.0

Supports HDMI and DVI

Gaming, Storage, Digital Set Top Boxes,

Single Board Computers, Point Of Sale





ITX-AT2X21D





2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD), 1x SIM slot

2x USB 3.0, 6x USB 2.0


Gaming, Industrial Controllers, Digital Set Top

Boxes, Printers, Point Of Sale, Thin Clients







ITX-AT2X21A






8x USB 2.0


Gaming, Industrial Controllers, Single Board

Computers, Digital Signage, Thin Clients




Embedded Gaming Board

MB-63010



2x SODIMM DDR3 1600/1333/1066, Max up to 16GB

1x HDMI, 3X DVI

4x USB 3.0, 8x USB 2.0

1x PCIe, X8, X16 slot

1x Mini-PCIe, X1 or mSATA

Gaming, Industrial Controllers, Medical

Win Enterprises

PHONE (978) 688-2000

(978) 688-4884

EMAIL


www.win-ent.com

Mini-ITX

MB-73330



DDR3 up to 16GGB

3 x HDMI + 1 x DP display

2 x SATA, 2 x COM, 8 x USB, HD Audio

PCIe X16 & X1 slots, Mini-PCIe socket

Gaming, Information Appliance, Medical, Single

Board Computers, Digital Signage, Point Of Sale

Win Enterprises

PHONE (978) 688-2000

(978) 688-4884

EMAIL


www.win-ent.com


PL-63010



2x SODIMM DDR3 1600/1333/1066, Max up to 16GB


3x HDMI + 1x HDMI

2x SATA, 6.0Gbps

8x PCIe, 1x Mini-PCIe Card or mSATA, 8x PCI,

1x miniPCI Gaming

Win Enterprises

PHONE (978) 688-2000

(978) 688-4884

EMAIL


www.win-ent.com

Follow AMD Embedded Solutions on Twitter! @AMDembedded

PAGE 30 | JULY 2014


AMD EMBEDDED

RADEON

TM

E8860 GPU

Powerful, immersive graphics for embedded applications

T he AMD Embedded Radeon TM E8860 discrete GPU – the first embedded GPU developed on the groundbreaking

Graphics Core Next (GCN) architecture – pushes AMD

Radeon graphics and parallel processing performance to unprecedented new heights while increasing power efficiency.

The AMD Radeon E8860 GPU 1 delivers industry-leading 3D video graphics performance, enabling stunning, multi-display visual experiences for a range of embedded applications spanning digital gaming, digital signage, medical imaging, avionics, and more.

The AMD Radeon E8860 GPU supports DirectX® 11.1,

OpenGL 4.2, and OpenCL™ 1.2, enabling high-performance graphics and massive parallel processing. Supporting thermal design power of 37 watts, the AMD Radeon E8860

GPU provides the optimal performance-per-watt profile for embedded applications that require outstanding multi-display experiences, superior visual quality, and massive parallel compute but have exacting power efficiency and heat dissipation requirements.

The AMD Embedded Radeon™ E8860 GPU is available in the following formats

OPN MODEL OUTPUT

100-CG2514 AMD E8860 GPU N/A

100-K00190

100-K00189

100-438110

100-438111

AMD E8860 MXM 3.0 Type A 5 DisplayPort

AMD E8860 MXM 3.0 Type A 5 DisplayPort

AMD E8860 PCIe®

AMD E8860 PCIe

2x DVI + mini DisplayPort

2x DVI + mini DisplayPort

100-438148

100-438147

100-438116

100-438115

100-438117

AMD E8860 PCIe

AMD E8860 PCIe

AMD E8860 PCIe

AMD E8860 PCIe

AMD E8860 PCIe

5x mini DisplayPort

5x mini DisplayPort

4x mini DisplayPort LPX



COOLING

N/A

Fansink

Heatpipe

Fansink

Heatpipe

Fansink

Heatpipe

Fansink

Heatpipe

Low-power Heatsink

1. AMD Radeon™ E8860 scored 2689 and AMD Radeon E6760 scored 1327 when running 3DMark® 11P benchmark paired with the AMD R-464L APU. AMD Radeon E8860 and AMD Radeon E6760 used an

AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and the AMD R-464L APU. The system ran Windows® 7 Ultimate (EMB-79).



MXM3.0

54631A

AMD Embedded Radeon™ E8860 GPU

2GB of GDDR5

OpenCL™ 1.2, DirectCompute 11.1

VCE (video encode), UVD4 (video decode)

768 / 48 GFLOPS single / double precision peak (600e/4.5Gbps)

DP1.2, HDMI™ 1.4, Wireless Display, Stereo 3D

AMD

PHONE 408-749-4000 www.amd.com/embedded


Low Profile

Sapphire E8860 4mDP-2


DirectX® 11.1 and Shader Model 5.0 support

Dual stream HD content decoding

H.264 encoding support

825MHz 640 stream processors

128-bit GDDR5 memory, Max up to 2GB




VPX 3U

VPX3-716


2GB GDDR5

DirectX® 11.1, OpenCL™ 1.2, OpenGL 4.2

4x DVI 1920 x 1200, 2x DisplayPort 2560 x 1600

Tested between -40°C ~ 85°C

PCIe x8 Gen 3

CutissWright

PHONE 613-254-5112 www.cwcdefense.com


XMC

Condor 4000x


2GB of high-speed GDDR5

DirectX® 11.1, OpenCL™ 1.2, OpenGL 4.2

768/48 GFLOPS

DVI-I and DisplayPort++

TechSource

PHONE 800-330-8301 www.techsource.com


ATX tE8860RFA


2GB of high-speed GDDR5

4 Displayport outputs

DirectX® 11.1 and Shader Model 5.0 support

Decode support of H.264 and VC-1

Entropy decode of MPEG-2 HD and MPEG-4 Part 2

16 lanes PCI Express® 3.0 interface

TUL Corporation

PHONE 886 8698 3000 ext. 261 www.tulembedded.com


PAGE 32 | JULY 2014

VPX3U

E8860-H264


Dedicated H.264 encoder with UDP output over GigE

Encoder Input from GPU output or from SDI source

2xHD-SDI 1080p30 inputs, or 1×3G-SDI 1080p60 input

1×GigE Port

RTOS drivers available

No drivers required for H.264 encoder

Wolfe

PHONE 905-852-1163 www.wolf.ca



AMD RADEON™ E6460

EMBEDDED GPU

Entry-Level Discrete GPU Enables 3D Graphics and HD Video with Support for Multiple Displays

T he AMD Radeon™ E6460 embedded discrete graphics processor unit (GPU) is AMD’s entry-level embedded graphics processor, enabling rich 3D graphics and outstanding HD multimedia. The advanced 3D graphics engine and programmable shader architecture support Microsoft® DirectX® 11 technology and OpenGL 4.1 for superior graphics rendering.

The third generation unified video decoder enables dual HD decode of H.264, VC-1, MPEG4 and MPEG2 compressed video streams.

AMD Embedded GPU Specifics

Package Dimensions

Thermal Design Power (TDP)

Process Technology

Graphics Engine Operating Frequency (max)

CPU Interface

Shader Processing Units

Floating Point Performance (single precision, peak)

3DMark™ VantageP Score 1

Display Engine

DirectX™ capability

Shader Model

OpenGL

Compute

Unified Video Decoder (UVD)

Operating Frequency (max)

Configuration type

Analog RGB

Analog TV

Single / Dual-Link DVI

DisplayPort 1.1a

DisplayPort 1.2

Single / Dual-Link LVDS

HDMI™

Number Independent Displays (max)2

HD Audio Controller (Azalia)

HDCP Keys

DVO

GPU BGA enabling embedded system designers to develop one system for both the AMD Radeon™ E6460 GPU and the high-performance AMD Radeon™ E6760 GPU.

AMD understands the unique requirements of the embedded market. With the graphics memory integrated onto the same BGA package, the AMD Radeon™ E6460 GPU saves development time plus AMD manages memory device obsolescence. The performance, flexibility, and easy design of the AMD Radeon™ E6460 GPU provides system designers with an exciting and innovative solution for their embedded graphics applications.

Speed time to market, reduce inventory costs, and enable multiple product categories. The AMD Radeon™ E6460 GPU ball grid array (BGA) is a subset of the AMD Radeon™ E6760

AMD Radeon™ E6460

GPU + memory, 33 mm x 33 mm BGA

~20W

40 nm

600 MHz

PCI Express® 2.1 (x1, x2, x4, x8, x16)

2 SIMD engines x 80 processing elements = 160 shaders

192 GFLOPS

2195

AMD App Acceleration, AMD Eyefinity & AMD HD3D technologies

DirectX® 11

Shader Model 5.0

OpenGL 4.1

AMD App Acceleration2, OpenCL™ 1.1, DirectCompute 11

UVD3 for H.264, VC-1, MPEG-2, MPEG-4 part 2 decode

800 MHz / 3.2 Gbps

64-bit wide, 512 MB, GDDR5, 25.6 GB/s

1x Triple 10-bit DAC, 400 MHz

NA

4x Single-Link DVI / 1x Dual-Link DVI

2x

3x

1 x Single-Link / Dual-Link

1x HDMI 1.4a

Up to 2 display outputs from VGA, Single / Dual- Link DVI, Single / Dual-Link LVDS, HDMI 1.4a, DisplayPort 1.1a /

1.2 + up to 2 display outputs from DisplayPort 1.1a / 1.2

3

1x

4x

12-bit DDR or 24-bit SDR / DDR

1 System configuration: 1280x1024, E2400: 600e/700m, 128MB GDDR3, E6460: 600e/800m, 512MB GDDR5, E6760: 600e/800m, 1 GB GDDR5, AMD: AMD Athlon™ II X4 620 @ 2.6GHz, MSI Gigabyte GA-

2

MA770T-UD3P, Corsair XMS3 4GB (2x2GB) 1333MHz 9-9-9-24 (TW3X4G1333C9A G), Windows® 7 64-bit Ultimate

Not all display interfaces available at same time. Maximum resolution dependent on link bit-rate and available memory bandwidth.

3 Two internal PLLs + an integrated DisplayPort reference clock can support (1) two legacy display outputs + two DisplayPort outputs, (2) one legacy display output + three DisplayPort outputs or (3) four

DisplayPort outputs. Legacy display output includes VGA, single / dual-link DVI, single / dual-link LVDS and HDMI 1.4a.



MCM BGA

AMD Radeon™ E6460 GPU

AMD Embedded Radeon™ 6460 GPU

PCIe x16 Gen 2

DVI, 2560 x 1600

HDMI, 1920 x 1080

DisplayPort, 2560 x 1600

LVDS, 2048 x 1536

AMD



ATX - 4x DVI



PCIe x16 Gen 2

4x DVI, 1600 x 1200

Fanless (heatsink)

MXM v3.0



PCIe x16 Gen 2

HDMI, 1920 x 1080

DisplayPort, 2560 x 1600

LVDS, 2048 x 1536

Also available with fan or heatpipe

AMD



ATX - 4x mDP



PCIe x16 Gen 2

4x mDP, 2560 x 1600

Fanless (heatsink)

AMD



GE Intelligent Platforms

PHONE 1-800-433-2682 http://defense.ge-ip.com/

PAGE 34 | JULY 2014

Rugged Graphics

Mezzanine Card

XMCGA7


512 MB GDDR5 SDRAM

x8 PCI Express (Gen 2 capable)

Two independent output channels (Dual Head)

Front and rear I/O options

Air- and conduction-cooled variants

AMD



Graphic Card

PCIe-6460



2x DVI-I Connectors

Support Active and passive dangle

Heatsink + 2-BB Fan ( 1 x slot )

PCI Express® 2.1 (x1, x2, x4, x8, x16)

IBASE

PHONE +886-2-2655-7588

+886-2-2655-7388

EMAIL


www.IBASE-usa.com

MXM v3.0

MXM-A6460


Up to 4 DP HD 1080P output

DRAM Type: GDDR5

Gaming, Server, Information Appliance,

Medical, Digital Signage

J&WIPC Technology Development CO., Ltd.

PHONE +86-0755-23981698 http://en.jwipc.com/


ATX

ER91F


1x DVI-I, 2x Mini DP, 1x HDMI display output

Memory: 512MB GDDR5

Tested between -20 ~ 55°C

Digital signage, digital gaming

TUL Corporation



MCM BGA

ER91FL


4 sets of Mini Display outputs

Industrial-grade passive electronic components

Memory: 512MB GDDR5


TUL Corporation




MXM v3.0

EM91F



Memory: 512MB GDDR5


Industrial control and automation

TUL Corporation



ATX

ER91FC


1x Dual Link DVI-I, 1x Single Link DVI-I port


Memory: 512MB GDDR5


TUL Corporation



ATX

ER91FLA


VGA, DVI and HDMI outputs


Memory: 512MB GDDR5


TUL Corporation




SMALL FOOTPRINT, LARGE IMPACT.

AMD has an extensive history of leadership in the thin client market, offering solutions that provide reduced operating costs and power consumption, higher durability and increased longevity over personal computers. Industries such as healthcare, education and government can get high levels of performance without compromise, empower IT staff, protect client/patient data, and manage tight budgets.

Learn more at www.amd.com/embedded

WHAT YOU DON’T SEE IS AS

IMPRESSIVE AS WHAT YOU DO.

Inspiring Embedded Innovation.

© 2014 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. PID: 54853-A

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