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AMD Embedded
Solutions Guide
JULY-DECEMBER 2014
T hin Client Market: Small Footprint, Low-Power Solutions
A dvanced Power Management Improves Performance
S calable, Enterprise-Class Storage and Networking
AMD Innovation Continues
Introducing the 2nd Generation AMD Embedded R-Series APU
The 2nd generation AMD Embedded R-Series APU (previously
codenamed “Bald Eagle”) delivers breakthrough graphics
embedded systems designed to provide ultra-immersive HD
multimedia experiences and parallel processing compute
S
category by allowing system designers to take advantage of
Heterogeneous System Architecture (HSA).
AMD’s 2nd generation AMD Embedded R-Series APU is a
and multimedia immersion for embedded gaming, medical
imaging and digital signage applications.
Learn more at: www.amd.com/r-series
AMD EMBEDDED SOLUTIONS GUIDE
AMD’S EAGLES HAVE LANDED
By Scott Aylor, Corporate Vice President and General Manager, AMD Embedded Solutions
I
n September 2013, AMD
publically unveiled our
embedded product roadmap for 2014, previewing a
host of exciting new processors that promised to push
performance, power and price
boundaries and introduce
new features that would give
embedded system designers more options than ever
before to meet their unique
design requirements.
capabilities targeted at applications including industrial control and automation (IC&A) and thin clients. The new entries
in this portfolio support thermal design profiles (TDP) as low
as 5W while delivering up to 53% more overall performance
compared to previous G-Series SoC solutions1.
It was an ambitious roadmap that put AMD’s competitors on
notice of our aggressive pace of innovation in the embedded
processor market. This was reflected in the codenames that
we assigned to these new processors, each of which was
named after a type of eagle – nature’s most formidable birds
of prey, capable of extraordinary speed and agility.
All of these new products have a planned availability of 10
years. This unprecedented commitment gives our customers added confidence in the longevity of our embedded
product families, enabling customers to “go with AMD, and
stay with AMD.”
Today, we’re proud to tell you that AMD’s eagles have landed.
In May at the G2E event in Macao, we introduced our
“Bald Eagle” platform – the second generation of our AMD
Embedded R-Series APUs – breaking new performance
barriers for compute and graphics intensive applications
spanning digital gaming, medical imaging and beyond, and
enabling system designers to take full advantage of the
Heterogeneous System Architecture (HSA). Based on AMD’s
“Steamroller” CPU architecture, these new solutions deliver
from 2.2 to 3.6 GHz CPU frequency with max boost, and 533
to 686 MHz GPU frequency thanks to AMD’s latest Graphics
Core Next (GCN) architecture.
At Computex in June, we announced “Steppe Eagle” – the
newest additions to our AMD Embedded G-Series SoC portfolio – featuring improved performance and power profiles,
and enhanced security and dynamic power management
Computex also saw the debut of “Crowned Eagle” – AMD
Embedded G-Series CPUs – optimized to provide superior single-threaded performance for storage, networking and other
x86 IT systems. The new AMD G-Series CPUs deliver 1.2 to
2.0 GHz and a robust feature set including integrated PCI-E
Gen 2.0, USB3.0, SATA ports, and single-channel DDR3-1600
memory with error correction code (ECC) support.
And that’s not all that the AMD Embedded Solutions Group
has been up to so far in 2014.
We’re expanding our workforce and growing our expert
team of field application engineers, and we’re increasing our
embedded-focused R&D investment across both systems
and software. We’re also strengthening our presence in the
embedded software ecosystem, working closely with partners like Mentor Graphics and increasing our participation
in initiatives like the Yocto Project to drive greater industry
collaboration in the open source and Linux domains.
All of these initiatives – from the introduction of our new
“Eagle” codenamed processors, to our accelerating growth,
innovation and ecosystem engagement – are aimed at helping our customers spread their wings and achieve their most
ambitious embedded design goals. Enjoy the flight!
1. O
verall performance was measured using a suite of industry benchmarks consisting of 3DMark06, 3DMark11, POVRay v3.7, Passmark v7, PCMark8 v2.0, and
BasemarkCL 1.0. The GX-412HC’s TDP is 7W and GX-210HA’s TDP is 9W. The performance delta of 53% was calculated based on GX-412HC’s geometric mean
of 555.3 and GX-210HA’s geometric mean of 363.6. The performance-per-watt delta of 96% was calculated based on GX-412HC’s performance-per-watt ratio
of 79.3 and GX-210HA’s performance-per-watt ratio of 40.4. The AMD Steppe Eagle GX-412HC and G-S SOC GX-210HA used an AMD Larne motherboard with
4GB DDR3-1333 memory and 320GB Toshiba HDD. The system ran Windows® 7 Ultimate. EMB-104
WWW.AMD.COM/EMBEDDED | PAGE 3
AMD EMBEDDED SOLUTIONS GUIDE
SMALL FOOTPRINT, LOW-POWER,
GRAPHIC-RICH EMBEDDED
SOLUTIONS MEET THE NEEDS
OF THIN CLIENT MARKET
Scalability
Models range from 3W2 (expected average power) dual-core
(AMD G-Series SOC) to 35W quad-core APUs (AMD R-Series
APU). Because each product family is all in the same ball grid
array (BGA) package, AMD offers the option for OEMs to use
a one-board design for the entire range.
Industry-leading display support
Offers high-resolution on two independent displays and a
variety of display formats, including DisplayPort 1.2, HDMI™,
DVI, LVDS.
AMD THIN CLIENT SOLUTIONS
AMD has an extensive history of leadership in the thin client
market, offering solutions that provide reduced operating costs and power consumption, higher durability and
increased longevity over personal computers. Industries such
as healthcare, education and government can get high levels
of performance without compromise, empower IT staff, protect client/patient data, and manage tight budgets.
AMD BASED THIN CLIENTS PROVIDE THE FOLLOWING
BENEFITS FOR OEMS AND END-USERS:
High-definition, high quality video display Hardware-assisted, high-definition video decode for H.264, VC-1, MPEG-2,
MPEG-4 Part 2, and DivX.1 Multiple video streams supported include Decode HD + SD on select APU models, SD
+ SD on all models, plus additional SD streams in the CPU.
AMD Radeon™ Dual Graphics technology can combine the
processing power of 2nd Generation AMD R-Series APU with
an AMD Embedded Radeon™ E8860 discrete GPU to provide
up to 64% more 3D graphics performance than a standalone
2nd Generation AMD R-Series APU1.
Discrete-level GPU performance
Features the latest DirectX® 11 and OpenGL 4.2 graphics
with 80 shader processors; easily handles graphics overlays
on top of HD video, including videos found on sites such as
YouTube and Hulu.
PAGE 4 | JULY 2014
Key embedded features
Small form factor designs for smaller footprints and thermals as low as 3W with a dual CPU core.
Longevity
5-year, 7-year and 10-year support offered, depending upon
the AMD product. Please contact your AMD representative
for more details.
Broad software support
Compatible with VMware and Citrix; supports Windows®
XPe, Windows 7, Windows Embedded Standard 7, Windows
Embedded Compact 7, Linux®, Android, and others.
1. The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at
dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle
RX-427BB used an AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB
SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3
memory, 64GB Crucial M4 HDD, and RX-427BB. The system ran Windows® 7 Ultimate. EMB-97
2. The average power for the AMD GX-210JA SOC is approximately 3 watts, determined by
extrapolating the average of the results of the measured average power of the GX-210HA 9W
SOC running the following benchmarks: 3DMark® 11, AMD Sys Stress Test CPU, AMD Sys Stress
Test CPU & GPU, AMD Sys Stress Test GPU, Winbench® 99, CoreMark, Game: Meat Boy, PCMark®
7, POV-Ray, Sandra 2011, Game: Street Fighter. Testing was performed on an AMD E1-2100 (Rev
A1) that is equivalent to the AMD GX-210HA SOC. System configuration: AMD E1-2100 @ 70°C,
“Larne” development platform, 4GB RAM, Windows® 7 Ultimate. Please see AMD Publication ID
53395A for more information. EMB-48
For more information on AMD Embedded Solutions for Thin Client, please visit
www.amd.com/us/products/embedded/Pages/thin-client.aspx
AMD EMBEDDED SOLUTIONS GUIDE
AMD EMBEDDED G-SERIES
SYSTEM-ON-CHIP (SOC)
The embedded evolution continues with x86 CPU, integrated
discrete-class GPU and I/O controller on the same die.
T
he AMD Embedded G-Series SOC platform is a high-performance, low-power System-on-Chip (SOC) design, featured with
enterprise-class error-correction code (ECC) memory support, dual and quad-core variants, integrated discrete-class GPU
and I/O controller on the same die.
The AMD G-Series SOC achieves superior performance per watt in the low-power x86 microprocessor class of products when
running multiple industry standard benchmarks1. This helps enable the delivery of an exceptional HD multimedia experience
and provides a heterogeneous computing platform for parallel processing. The small-footprint, ECC-capable SOC sets the new
foundation for a power-efficient platform for content-rich multimedia processing and workload processing that is well-suited
for a broad variety of embedded applications.
Model
Opn
Tdp
# Of x86 (cpu,
gpu,
cores
& sb)
Shared
l2 cache
Cpu
freq.
Gpu freq.
(Graphics)
Ddr
speed
Tjc
DDR3-1600
0-90°C
DDR3-1600
0-90°C
DDR3-1600
0-90°C
DDR3-1333
0-90°C
w/GPU
600MHz
(HD 8400E)
500MHz
(HD 8330E)
1.65GHz 450MHz
(HD 8280E)
300MHz
(HD 8210E)
GX-420CA
GE420CIAJ44HM
4
25W
2MB
2.0GHz
GX-415GA
GE415GIBJ44HM
4
15W
2MB
1.5GHz
GX-217GA
GE217GIBJ23HM
2
15W
1MB
1.65GHz
GX-210HA
GE210HICJ23HM
2
9W
1MB
1.0GHz
GX-210JA
GE210JIHJ23HM
2
6W
1MB
1.0GHZ
225MHZ
DDR3-1066
0-90°C
GX-424CC
GE424CIXJ44JB
4
25W
2MB
2.4GHZ
497MHZ
DDR3-1866
0-90°C
GX-412HC
GE412HIYJ44JB
4
7W
2MB
1.2GHZ
300MHZ
DDR3-1333
0-90°C
GX-212JC
GE212JIYJ23JB
2
6W
1MB
1.2GHZ
300MHZ
DDR3-1333
0-90°C
GX-411GA
GE411GIRJ44HM
4
15W
2MB
1.0GHZ
300MHZ
DDR3-1066
-40-105°C
GX-210JC
TBD
2
6W
1MB
1.0GHZ
TBD
DDR3-1600
-40-105°C
GX-209HA
GE209HISJ23HM
2
9W
1MB
1.0GHz
225MHz
DDR3-1066
-40-105°C
GX-416RA
GE416RIBJ44HM
4
15W
2MB
1.6GHz
N/A
DDR3-1600
0-90°C
GX-420MC
GE420MIXJ44JB
4
17.5W
2MB
2.0GHz
N/A
DDR3-1600
0-90°C
GX-412TC
GE412TIYJ44JB
4
6W
2MB
1.2GHz
N/A
DDR3-1600
0-90°C
w/o GPU
1. The low-power x86 microprocessor class includes: GX-420CA @ 25W TDP (scored 19); GX-415GA @ 15W (25), GX-217GA @ 15W (17), GX-210HA @ 9W (20), G-T56N @ 18W (12), G-T52R @ 18W (7),
G-T40N @9W (14), G-T16R @ 4.5W (19), Intel Atom N270 @ 2.5W (20), Intel Atom D525 @ 13W (9), Intel Atom D2700 @ 10W (12) & Intel Celeron G440 @ 35W (5). Performance score based on an average of scores from the following benchmarks: Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics
Mark, and EEMBC CoreMark Multi-thread. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All
configurations used DirectX 11.0. AMD G-Series APU system configurations used iBase MI958 motherboards with 4GB DDR3 and integrated graphics. All AMD G-Series SOC systems used AMD “Larne” Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D2700 was tested with Jetway NC9KDL-2700 motherboard, 4GB DDR3 and integrated graphics. Intel Celeron system configuration
used MSI H61M-P23 motherboard with 4GB DDR3 and integrated graphics. Intel Atom N270 system configuration used MSI MS-9830 motherboard with maximum supported configuration of 1GB DDR2
(per http://download.intel.com/design/intarch/manuals/320436.pdf,) and Intel GM945 Intel Atom D525 used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics.
Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.
WWW.AMD.COM/EMBEDDED | PAGE 5
AMD EMBEDDED SOLUTIONS GUIDE
COM Express Compact
COM-KB
EPIC Board
EMB-KB1
A MD Embedded G-Series SOC
DDR3/DDR3L-1600MHz SODIMM, Up to 16GB
SATA 6.0Gb/s x 2, USB 3.0 x 2, USB 2.0 x 8
PCI-Express [x1] x 5
24-bit single channel LVDS
High Definition Audio Interface
Communications, Industrial Controllers, Medical,
Single Board Computers, Networking, Point Of Sale
Aaeon
PHONE(714) 996-1800
FAX
(714) 996-1811
AMD Embedded G-Series SOC
DDR3 1600MHz SODIMM x 2, Up to 16GB
USB3.0 x 2 and SATA 6.0 Gb/s x 2
Realtek 8111F, Gigabit Ethernett
Dual Independent Display: VGA, DVI-D, LVDS
Rich Expansion: PCI-E[x4] x 1, Mini Card x 2
Industrial Controllers, Medical, Single Board Computers
Aaeon
EMAIL [email protected]
WEB www.aaeon.com
PHONE(714) 996-1800
FAX
(714) 996-1811
Pico-ITX
MIO-2270
3.5” SBC
EM-6335
A MD Embedded G-Series SOC
DDR3/ DDR3L 1600MHz support up to 8GB
DirectX®11.1 support, dual independent display
by 18-bit LVDS + VGA or 18-bit LVDS + HDMI
2 COM, 1 SATA, USB3.0, PCIe Mini Card and mSATA
Supports SUSIAcccess and Embedded Software APIs
Advantech
PHONE(949) 789-7178
FAX
(949) 789-7179
A MD Embedded G-Series SOC
SODIMM, 4GB, DDR3, 1x, 1600/1333/1066
2x TypeA USB 3.0; 4x Header USB 2.0
1x Mini-PCIe w/ USB signal, full-size; 1x MiniPCIe w/ USB & SATA signal, half-size
1x SATA, 6.0Gbps, 3.0 compliant
Gaming, Information Appliance, Industrial Controllers,
Storage, Digital Set Top Boxes, Single Board Computers,
Digital Signage, Point Of Sale, Thin Clients
AEWIN Technologies Co., Ltd.
EMAIL [email protected]
WEB www.advantech.com/embcore
PHONE+886-2-8692 6677
FAX
+886-2-8692 6655
Industrial Computer
SEM-6335
AEWIN Technologies Co., Ltd.
PAGE 6 | JULY 2014
EMAIL [email protected]
WEB www.aewin.com.tw
EMAIL [email protected]
WEB www.aewin.com.tw
Custom Board
KCGX210
A MD Embedded G-Series SOC
SODIMM, 4GB, DDR3, 1x 1600/1333/1066
x USB 3.0; 2x USB 2.0
1x Mini-PCIe w/USB Signal, full-size; 1x MiniPCIe w/USB & SATA Signal, half-size
1x SATA, 6.0Gbps, 3.0 compliant, 2.5” drive bay
Fanless operation
aGaming, Information Appliance, Industrial Controllers,
Digital Signage, Point Of Sale, Thin Clients
PHONE+886-2-8692 6677
FAX
+886-2-8692 6655
EMAIL [email protected]
WEB www.aaeon.com
A MD Embedded G-Series SOC
1x SODIMM DDR3 1333/1066/800 MHz, Max up to 4GB
2x TypeA USB 3.0 Host, 6x TypeA USB 2.0 Host,
1x Header USB 2.0 Host
1x HDMI
2x SATA 6.0Gbps
1x Mini-PCIe
Digital Signage
Albatron
PHONE886-2-8227-3277 FAX
886-2-8227-3266
EMAIL [email protected]
WEB www.albatron.com.tw
AMD EMBEDDED SOLUTIONS GUIDE
Custom Board
KCGX210J
Custom Board
KCGX210J-LV
A MD Embedded G-Series SOC
1x SODIMM DDR3 1066/800 MHz , Max up to 4GB
2x TypeA USB 3.0 Host, 6x TypeA USB 2.0 Host, 1x TypeA
1x HDMI
2x SATA 6.0Gbps, 3.0 compliant
1x Mini-PCIe
Digital Signage
Albatron
PHONE886-2-8227-3277 FAX
886-2-8227-3266
A MD Embedded G-Series SOC
1x SODIMM DDR3 1333/1066/800 MHz , Max up to 4GB
2x TypeA USB 2.0, 2x TypeA USB 3.0
1x HDMI
2x SATA 6.0Gbps, 3.0 compliant, 1x mSATA slot
Digital Signage
Albatron
EMAIL [email protected]
WEB www.albatron.com.tw
PHONE886-2-8227-3277 FAX
886-2-8227-3266
Custom Board
KCGX217-DH
Custom Board
KCGX415-DH
A MD Embedded G-Series SOC
1x SODIMM DDR3 1600/1333/1066 MHz , Max up to 4GB
2x TypeA USB 3.0, 6x TypeA USB 2.0, 1x Header USB 2.0
1x HDMI
2x SATA 6.0Gbps, 3.0 compliant
1x Mini-PCIe
Digital Signage
Albatron
PHONE886-2-8227-3277 FAX
886-2-8227-3266
EMAIL [email protected]
WEB www.albatron.com.tw
A MD Embedded G-Series SOC
1x SODIMM DDR3 1600/1333/1066 MHz , Max up to 4GB
2x TypeA USB 3.0, 6x TypeA USB 2.0, 1x Header USB 2.0
2x HDMI
2x SATA 6.0Gbps
1x Mini-PCIe
Digital Signage
Albatron
EMAIL [email protected]
WEB www.albatron.com.tw
PHONE886-2-8227-3277 FAX
886-2-8227-3266
Custom Board
BioDigitalPC 7 Family
Mini-ITX Motherboard
IMB-A180-H
A MD Embedded G-Series SOC
2GB, 4GB or 8GB of DDR3 RAM
4 USB 2.0 Ports, 1 USB 3.0 Port,
DisplayPort, 2 PCIe x1 Gen 2
Size: 84mm x 52mm x 6mm
Epoxied for Rugged Design and Harsh
Environmental Conditions, Waterproof
Information Appliance, Medical, Digital Set
Top Boxes, Single Board Computers, Digital
Signage, Point Of Sale, Thin Clients
Arnouse Digital Devices Corp.
PHONE1 (516) 673-4444
EMAIL [email protected]
WEB
http://arnousedigitaldevices.com/newsite/home.php
EMAIL [email protected]
WEB www.albatron.com.tw
A MD Embedded G-Series SOC
Supports DDR1600MHz
1 x VGA, 2 x HDMI
24 bit dual channel LVDS (optional)
6 x COM ports, 6 x USB 2.0, 2 x USB 3.0
1 x PCIex4, 1 x SATA 3.0, 1 x mSATA
Industrial Controllers, Single Board
Computers, Digital Signage
ASRock Inc.
PHONE(909) 590-8308
FAX
(909) 590-1026
EMAIL [email protected]
WEB www.asrock.com
WWW.AMD.COM/EMBEDDED | PAGE 7
AMD EMBEDDED SOLUTIONS GUIDE
3.5” Micro Module
ECM-KA
SMARC
CSB1690SM1-D10
• AMD Embedded G-Series SOC
• One 204-pin DDR3 SODIMM Socket Supports
Up to 8GB DDR3 1600 SDRAM
• 1 x Mini PCIe (mSATA Supported)
• 2 x USB 3.0, 6 x USB 2.0
• Supports HDMI and LVDS
• Industrial Controllers, Single Board Computers
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
A MD Embedded G-Series SOC
Industry Standard SMARC, 82mm x 50mm
32KByte Instruction and Data Caches; 1MByte L2 Cache
4GByte 64-Bit Wide DDR3L-1066 Memory
Three x1 GEN II (5G/s) Ports
Dual Simultaneous Display via HDMI and eDP/LVDS
Gaming, Information Appliance,
Communications, Industrial Controllers,
Storage, Medical, Digital Set Top Boxes
Cogent Computer Systems, Inc.
EMAIL [email protected]
WEB www.avalue.com.tw
PHONE1-401-349-3999
EMAIL [email protected]
WEB
http://www.cogcomp.com/
COM Express Module
CSB1890T10-Q15
COM Express Compact/Type 6
conga-TCG
• AMD Embedded G-Series SOC
• Max. 8 GByte DDR3L 1600 MHz
• 4 x PCIe 2.0
• 2 x USB 3.0; 8 x USB 2.0
• 1 x HDMI; VGA; LVDS; 1 x DisplayPort
• Gaming, Information Appliance, Communications,
Industrial Controllers, Medical, Digital Set Top Boxes,
Networking, Digital Signage, Point Of Sale, Thin Clients
A MD Embedded G-Series SOC
Excellent choice for size restricted, low power,
ruggedized embedded applications
4GByte 64-Bit Wide DDR3-1600 Memory with 8-Bit ECC
PCIe: One x4 and Two x1 GEN II (5G/s) Ports
Dual Simultaneous Display via HDMI,
DisplayPort 1.2, eDP or LVDS
Gaming, Information Appliance, Communications,
Industrial Controllers, Storage, Medical,
Digital Set Top Boxes, Networking, Digital
Signage, Point Of Sale, Thin Clients
Cogent Computer Systems, Inc.
PHONE1-401-349-3999
EMAIL [email protected]
WEB
http://www.cogcomp.com/
congatec Inc.
PHONE(858) 457-2600
FAX
(858) 457-2602
Network Appliance
Netboard A10
Proprietary Network Board
Netboard A10
A MD Embedded G-Series SOC
SODIMM, max. 8GB, DDR3 non-ECC, 1x 1600/1333/1066
1 x PCIe x4 Edge Connector
5x USB 2.0
2x SATA 3 + mini power header (JST)
1x Display Port ++, 1x VGA
Communications, Networking
Deciso B.V.
PHONE+31187744020
WEB
www.deciso.com
PAGE 8 | JULY 2014
EMAIL [email protected]
WEB www.congatec.us
A MD Embedded G-Series SOC
185mm x 125mm
SODIMM, max. 8GB, DDR3 non-ECC, 1x 1600/1333/1066
1 x PCIe x4 Edge Connector
5x USB 2.0
2x SATA 3 + mini power header (JST)
1x Display Port ++, 1x VGA
Communications, Storage, Single Board Computers,
Networking, Digital Signage, Point Of Sale, Thin Clients
Deciso B.V.
EMAIL [email protected]
PHONE+31187744020
WEB
www.deciso.com
EMAIL [email protected]
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX
KB160/161 Series
COM Express Compact
KB968 Series
A MD Embedded G-Series SOC
1 DDR3 SODIMM up to 8GB
1 PCIe x4, 4 PCIe x1
8 USB: 2 USB 3.0/2.0, 6 USB 2.0
1 VGA, 1 LVDS, 1 DDI
2 SATA 3.0
Gaming, Communications, Industrial
Controllers, Medical, Printers, Single Board
Computers, Networking, Digital Signage
A MD Embedded G-Series SOC
2 DDR3L SODIMM up to 8GB
1 PCIe x4, 1 Mini PCIem 1 DFI Proprietary
Extension Bus (optional), 1 DFI ECX interface
1 USB 3.0, 3 USB 2.0
1 VGA, 1 LVDS
Information Appliance, Communications,
Industrial Controllers, Medical, Single
Board Computers, Networking
DFI
PHONE(916) 568-1234
FAX
(916) 568-1233
DFI
EMAIL [email protected]
WEB www.dfi.com
PHONE(916) 568-1234
FAX
(916) 568-1233
Mini-ITX
D3313-S
Mini-ITX
FUTRO S520
A MD Embedded G-Series SOC
DDR3 1866/1600 SDRAM Memory
USB 2.0 and USB3.0 onboard
PCIe x4 connector and Mini-PCI Express onboard
DVI-I, DP V1.2 and Dual Channel LVDS support
Designed for fanless operation
Gaming, Server, Information Appliance,
Communications, Industrial Controllers, Medical,
Digital Set Top Boxes, Single Board Computers,
Networking, Digital Signage, Point Of Sale, Thin Clients
Fujitsu
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
A MD Embedded G-Series SOC
1x SODIMM DDR3 1600/1333/1066 MHz, Max up to 2GB
2x Front USB 3.0, 2x Rear USB 2.0
2x DVI-I 1920 x 1200
Thin Clients
Fujitsu
EMAIL [email protected]
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
Mini-ITX
FUTRO S720/ S920
Fujitsu
EMAIL [email protected]
QSeven
H6069
A MD Embedded G-Series SOC
1x SODIMM DDR3 1600/1333/1066 MHz, Max up to 4GB
2x Front USB 3.0, 4x Rear USB 2.0
1x DisplayPort 2560 x 1600, 1x DVI-I 1920 x 1200
Thin Clients
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
EMAIL [email protected]
WEB www.dfi.com
A MD Embedded G-Series SOC
Soldered DDRIII RAM 2GB (Module prepared for 4GB)
1 x SATA ports
2 x USB 3.0, 4 x USB 2.0
4 ports for PCIe x1
Dual 24-bit LVDS and Displayport or DVI or HDMI
Gaming, Information Appliance, Communications,
Industrial Controllers, Medical, Single Board
Computers, Digital Signage, Point Of Sale
Hectronic AB
EMAIL [email protected]
PHONE+46-733-660704
WEB
www.hectronic.se
EMAIL [email protected]
WWW.AMD.COM/EMBEDDED | PAGE 9
AMD EMBEDDED SOLUTIONS GUIDE
Digital Signage Player
SI-22
Desktop Thin Client
t520 Flexible Thin Client
A MD Embedded G-Series SOC
Operating Temp: 0 ~ 45 C
SODIMM, 8GB, DDR3, 1x 1600/1333/1066
2x, Mini-PCIe, X1, Including mSATA
2x, HDMI, 1920 x 1080
2x TypeA, USB 3.0, Host; 1x TypeA, USB 2.0, Host
iSMART for EuP/ErP power saving,
auto-scheduler and power resume
Single Board Computers, Digital Signage, Thin Clients
A MD GX-212JC Dual-Core SOC APU
AMD Radeon HD Graphics (1.2 GHz)
DDR3L-1600 SDRAM, Max up to 8 GB
2x DisplayPort 1.2, 1x VGA
2x USB 3.0, 2x USB 2.0
Thin Clients
IBASE
Hewlett-Packard
PHONE800-334-5144
WEB
http://www.hp.com
EMAIL [email protected]
PHONE+886-2-2655-7588
FAX
+886-2-2655-7388
3.5” Single Board Computer
IB903
COM Express Compact
MSC C6C-GX
A MD Embedded G-Series SOC
1x DDR3 SO-DIMM , Max. 8GB
Supports DVI-I and 24-bit dual channel LVDS
2x Realtek RTL8111G PCI-E Gigabit LAN
Watchdog timer, Digital I/O, mSATA, iSAMRT
6x USB, 4x COM, 2x SATA III
2x Mini PCI-E (half-sized)
Gaming, Single Board Computers,
Digital Signage, Thin Clients
IBASE
PHONE+886-2-2655-7588
FAX
+886-2-2655-7388
A MD Embedded G-Series SOC
Up to 16GB DDR3 SDRAM, dual-channel
2 SATA 3Gb/s mass storage interfaces
2x USB 3.0 and 6x USB 2.0 interfaces
1x Digital Display Interface (DP 1.2, DVI, HDMI 1.4a)
1x Embedded DisplayPort 1.3 (shared
with LVDS 24 bit, dual channel )
Gaming, Information Appliance,
Communications, Industrial Controllers,
Medical, Digital Signage, Point Of Sale
MSC Vertriebs GmbH
EMAIL [email protected]
WEB www.IBASE-usa.com
PHONE49-8165-906-240
FAX
49-72-49-79-93
Digital Gaming System
QXi-300
Quixant UK Ltd
PAGE 10 | JULY 2014
EMAIL [email protected]
WEB www.msc-ge.com
Mini-ITX Motherboard
IPC-FT3GS
A MD Embedded G-Series SOC
2x DDR3-1600 (PC3-12800) SODIMM sockets
4x USB 2.0 ports
Advanced PCI Express gaming logic and NVRAM
Meets the requirements of GLI-11 and all
major global gaming jurisdictions
Fanless operation
Cost-effective “all-in-one” two-screen gaming platform
PHONE+44 (0) 1223 89296
FAX
+44 (0) 1223 892401
EMAIL [email protected]
WEB www.IBASE-usa.com
A MD Embedded G-Series SOC
AMD Radeon 8000 series graphic
Dual Memory DIMMS Non-ECC
Dual simultaneous displays
4 SATA ports, 8 USB ports
2x DDR3 DIMMs up to 1600
1x PCI-E (x16 at x4 BW); 1x Mini PCI-E
Gaming, Single Board Computers, Digital
Signage, Point Of Sale, Thin Clients
Sapphire Technology Limited
EMAIL [email protected]
WEB www.quixant.com
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
AMD EMBEDDED SOLUTIONS GUIDE
4”x4”
BP-FT3GS
Pico-ITX
SECOpITX-GX
A MD Embedded G-Series SOC
Reduced space, with low power
consumption and high performance
Up to 8GB on DDR3 1600MHz SO-DIMM @1.5V
18 bit single channel LVDS or embedded
Display Port internal connector
VGA interface (requires external optional Video Adapter)
2 x standard USB 3.0 Type A connectors;
4 x internal USB 2.0 ports
Gaming, Medical, Digital Set Top Boxes, Single Board
Computers, Digital Signage, Point Of Sale, Thin Clients
A MD Embedded G-Series SOC
AMD Radeon 8000 series graphics
Dual memory SO-DIMMS non-ECC
Dual simultaneous displays
4”x 4”, Audio Jacks
GDigital Set Top Boxes, Single Board
Computers, Digital Signage, Point Of Sale, Thin
ClientsSignage, Point Of Sale, Thin Clients
Sapphire Technology Limited
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
Seco
PHONE+39 0575 26979
FAX
+39 0575 350210
QSeven
Q7-GX
Panel PC
Thinlabs TL2300/2400
22” POE AiO Touch Computer
A MD Embedded G-Series SOC
Soldered Down, 8GB, DDR3, 1600/1333/1066
1x DisplayPort, 2560 x 1600, 1x HDMI, 1920 x 1200
1x USB 3.0, Host, 6x USB 2.0, Hos
2x SATA 6.0Gbps, 3.0 compliant
Industrial Controllers, Point Of Sale, Thin Clients
Seco
PHONE+39 0575 26979
FAX
+39 0575 350210
A MD Embedded G-Series SOC
2x DDR3, 1600/1333/1066, Max up to 16GB
1x LVDS 2 Channel 1920 x 1080
1x DVI/HDMI 1920 x 1080
2x USB 3.0, 4x USB 2.0, Host
3x SATA 3.0Gbps, 2.0 compliant
Digital Signage, Point Of Sale, Thin Clients
Thinlabs
EMAIL [email protected]
WEB www.seco.com
PHONE44 (0) 20 33 22 60 50
WEB
thinlabs.com
Panel PC
Thinlabs TL8500/8600
19” POE AiO Touch Computer
Thinlabs
EMAIL [email protected]
Fanless System
PL-60830
A MD Embedded G-Series SOC
HDMI & VGA Dual Display
DDR3 1600 up to 4GB
Support 1 x 2.5” SATA HDD and 1 x Half-size mSATA
3 x COM, USB3.0, Audio
2 x Mini-PCIe sockets, DC 8V~32V input
Gaming, Industrial Controllers, Digital Set Top
Boxes, Networking, Digital Signage, Point Of Sale
A MD Embedded G-Series SOC
2x DDR3, 1600/1333/1066, Max up to 16GB
1x LVDS 2 Channel 1366 x 768, 19”
1x DVI/HDMI 1920 x 1080, 19”
2x USB 3.0, 4x USB 2.0, Host
3x SATA 3.0Gbps, 2.0 compliant
Digital Signage, Point Of Sale, Thin Clients
PHONE44 (0) 20 33 22 60 50
WEB
thinlabs.com
EMAIL [email protected]
WEB www.seco.com
Win Enterprises
EMAIL [email protected]
PHONE(978) 688-2000
FAX
(978) 688-4884
EMAIL [email protected]
WEB www.win-ent.com
WWW.AMD.COM/EMBEDDED | PAGE 11
AMD EMBEDDED SOLUTIONS GUIDE
ADVANCED POWER MANAGEMENT
HELPS BRING IMPROVED
PERFORMANCE TO HIGHLY
INTEGRATED X86 PROCESSORS
Complex heterogeneous processors have the potential to leave a large amount of performance
headroom untapped when workloads don’t utilize all cores. Advanced power management
techniques for x86 processors are designed to reduce the power of underutilized cores while also
allowing for dynamic allocation of the thermal budget between cores for improved performance.
T
HE IMPORTANCE OF POWER MANAGEMENT
Those with experience implementing microprocessors
know the importance of proper power management.
Whether for simple applications processors or high-end
server processors, the ability to down-clock, clock-gate,
power-off, or in some manner disable unused or underused
hardware blocks is crucial in limiting power consumption.
Better power management benefits range from energy
savings within the data center to improved battery life in
mobile devices. But don’t underestimate the value of reducing power and increasing efficiency. In fact, power reduction
and increased efficiencyis even more important today, as
processors integrate more and varied functional blocks.
THE X86 EXAMPLE
Typical x86 processors widely used in both consumer and
embedded applications are a perfect example: Integration of
network and security engines, memory controllers, graphicsprocessing units (GPUs), and videoencode/decode engines
has effectively turned them into heterogeneous compute
units that excel at a wide variety of workloads.
The notable thing about traditional reduction-based power
management is that a particular functional block is only
turned off when unused, or down clocked when higher performance is not needed by the application. What about applications that desire more performance? Shouldn’t saving power
in one area allow you to utilize it in another?
Specifying power usage is complex, particularly with highly integrated processors. If the worst-case power for each
individual hardware block in a heterogeneous processor were
added together, the resulting total could be several times the
PAGE 12 | JULY 2014
achievable worst-case power for the device. The fact that it is
nearly impossible to write software that will simultaneously
utilize all functional blocks to their fullest extent is one reason.
Simply feeding the various compute engines and I/O ports
with enough data to keep them all 100% utilized would likely
exceed the available bandwidth of internal buses. Central
processing unit (CPU) cores manage data movement, and
time spent there is less time spent executing higher power
instructions.
Another issue is that different instruction sequences can incur
vastly different power usage, which can further complicate
specifying processor power. For instance, complex floating-point instructions burn much more power than a simple
I/O data read due to the significant difference in transistor
logic they activate during execution. The combination of
varying instruction types and utilized hardware blocks makes
the actual power usage of the processor highly workload-dependent, and explains why it is rare to see a “typical” power
specification for this device type. Still, implementers expect a
maximum power specification on which to base their design.
ESTABLISH A REALISTIC WORST-CASE FOR POWER
The pragmatic approach for silicon providers is to survey
real-world application software to establish a more realistic
worst-case power and add some guard-band for safety. Both
AMD and Intel use this type of methodology and specify
it as thermal design power (TDP). TDP is essentially the
maximum sustained power a processor can draw with “real
world” software while operating under defined temperature
and voltage limits.
POWER LIMITS CAN TRANSLATE TO PERFORMANCE LIMITS
Most embedded x86-based systems are power-constrained
AMD EMBEDDED SOLUTIONS GUIDE
MEMORY INTERFACE
PCI EXPRESS®
in some way. Designers
will look for the best
2MB L2
"PILEDRIVER"
performance they can
DUAL-CORE
get in a given power
X86 MODULE
envelope, at a price they
can afford. The worstNORTHBRIDGE
case power limit can
translate directly into a
performance limit for a
"PILEDRIVER"
DUAL-CORE
given
processor product
2MB L2
X86 MODULE
by effectively defining
the maximum operating
frequency. Using TDP
as a worst-case power
specification instead of
GRAPHICS CORES
& MULTIMEDIA
the cumulative per-block
maximum power helps to
increase that operating
frequency,
but it’s also
Integration of large GPU cores,
based
on
an
assumption
as done in AMD R-Series APUs,
of
the
software
workload.
increases the potential for unused
Applications
using
fewer
power budget.
hardware blocks, or using
them to a lesser extent,
use less power and effectively leave performance headroom
on the table.
a while. However, the complexity lies in determining when and
which cores to boost. For AMD Embedded R-Series APUs, the
process starts by dividing the processor into separate thermal
entities: one for each CPU core-pair and one for the GPU. I/O
power is small by comparison, so it is defined as a fixed value
based on characterization to reduce complexity.
Increasing performance by boosting to higher frequencies is
relatively simple, since the use of multiple performance states
(voltage and frequency operating points) has been around for
Even if an application with a high CAC drives the APU to consume the full TDP, operation at this level may occur in bursts
AMD’s recent move to integrate discrete-class GPUs with
x86 processor cores in accelerated processing units (APUs)
underscores this power management challenge. Some APUs
contain a GPU that accounts for more than half of the silicon
die and a proportional amount of the power budget. A much
larger potential for under-utilization of the APU’s power
envelope exists in this scenario if the software workload is
highly CPU centric or GPU-centric. The trend toward integration of these complex, heterogeneous cores is likely to
continue and necessitates a means of harnessing the excess
thermal headroom.
AMD TACKLES THE UNDERUSED TDP HEADROOM ISSUE
AMD Turbo CORE technology1 was launched several years ago
to address underutilized TDP headroom. AMD Turbo CORE
began with a simple core-counting mechanism that allowed
some CPU cores to use higher-frequency “boost” states
while other CPU cores were idle. This approach only affected
the CPU cores, and was primarily targeted at accelerating
single-threaded applications that didn’t leverage a multi-core
architecture.
DIE TEMP
APU POWER
DP & VGA
Generational improvements have increased the granularity
and effectiveness of the technology by adding more boost
states for CPU and GPU cores, real-time power and temperature monitors, and enabling dynamic power budget allocation
between cores.
An integrated
microcontroller
manages AMD
TDP BUDGET
Turbo CORE calculations, allowing a
Unused
CPU
Power
more
complex and
CORE
Budget
therefore
more
PWR
effective
algorithm.
CPU
CORE
In deciding whethPWR
er boosting a given
CPU
CORE
CPU
core is possible,
PWR
CORE
the
power usage
PWR
of each thermal
I/O
I/O
entity must be
PWR
PWR
determined. Ondie analog power
APP 1
APP 2
measurement
at
high CAC
low CAC
many amps is not
Applications with a low CAC can leave unused
practical in a 32nm
TDP and temperature headroom. New power
silicon on insulator
management techniques can exploit both for
(SOI) process, and
improved performance.
external measurement is not
possible because
the various cores share power rails. Alternatively, proprietary activity monitors that are integrated throughout the
processor architecture model current logic activity as an AC
capacitance (CAC). The CAC monitors effectively profile the
running application to determine if it is one of those “worstcase” workloads that defines TDP or something less laborious.
Static power of the core is determined by transistor leakage at
a given voltage and temperature which can be characterized
for the device and hard-coded into the algorithm as a function
of temperature. A calculated temperature value from a previous iteration is used for reasons that will be explained later.
Total instantaneous power of the thermal entity can then be
calculated by P=CAC*V2*f + Pstatic, and total power for the
APU equals the summation of the power for each thermal
entity and the I/O power offset. The instantaneous power
calculation result is compared to an allocated power budget
for the thermal entity, as well as the device’s thermal design
current specification to ensure that current demand does not
exceed what the voltage regulator can provide. If either value
is too close to the limit, firmware can impose throttling by
reducing the core’s performance state. The ability to boost the
performance state is maintained when headroom exists on
both parameters.
MAX DIE TEMP LIMIT
GOING ABOVE TDP
WWW.AMD.COM/EMBEDDED | PAGE 13
AMD EMBEDDED SOLUTIONS GUIDE
or be preceded by idle time such that the die temperature at
the start of the high CAC period is far below the maximum
specification. The latest version of AMD Turbo CORE also
takes the opportunity to boost in this scenario by allowing
brief excursions above TDP when there is adequate temperature headroom. After all, the purpose of a TDP limit is only to
ensure die temperature stays in check.
Real-time temperature values from around the thermal entity
provide a scaling factor to the power calculation so they influence the boost decision without controlling it directly. Derivation of a calculated temperature comes from application of
the calculated power to a reference thermal solution model.
Reducing the influence of actual die temperature on the boost
algorithm is an intentional tradeoff to increase deterministic
performance of the device. The calculated temperature is then
combined with temperature data from other thermal entities
to determine if thermal headroom exists.
Other thermal entities can act as heat sources or sinks, depending on their temperature state, and therefore must be
considered. Temperature offsets are also included to account
for sensor tolerance and help make sure that the maximum
junction temperature is never exceeded. The calculated temperature is compared to predefined thresholds to determine
the amount of boost that is possible.
INTELLIGENT BOOST
The final stage of AMD Turbo CORE technology is called
Intelligent Boost; it uses a proprietary algorithm that helps
improve efficiency by only allowing a core to boost if it can
translate that higher frequency to increased performance.
If each thermal entity control loop operated independently
under a demanding workload, all cores would attempt to
boost until they reach their maximum performance state or
until the device thermal limit is reached. It is very unlikely that
the application will be perfectly balanced, but rather limited by
one core type (CPU or GPU) being saturated.
Intelligent Boost examines the workload at a very high frequency to give more thermal budget to the core that needs it
the most by preventing the other cores from boosting more
than necessary, maximizing efficiency without affecting overall processer performance.
With an understanding of how boost technologies work,
designers should consider where it could affect their application or design practices. A common concern is that designers
may have become accustomed to the idea that the power
draw of their software application doesn’t come close to
driving a processor near its TDP, leading them to design to
a lower specification. Historically, this may have been safe,
but boost technologies will tend to drive the processor closer
to TDP than before by allowing the active cores to consume
more power.
PAGE 14 | JULY 2014
Operating closer to TDP may sound like a bad thing, but keep
in mind that performance can be gained with the increase
in power. An example could be a machine vision application
achieving higher frame rates for faster recognition. Total processor power might increase in that scenario, but doesn’t materially increase with applications such as media playback in a
digital signage player. Fixed, periodic workloads may complete
faster at a higher power level, but when the burst of activity is
over, cores then spend more time in lower-power idle states,
so the average power is approximately the same. Applications
like this can still benefit from boosted performance through
better responsiveness.
CONFIGURABLE TDP
Beyond performance benefits, the ability of AMD Turbo
CORE algorithms to control average power consumption of
the processor also enables a new and interesting feature on
the latest generation of AMD APUs, called configurable TDP.
It essentially provides the system designer a knob to modify
the processor TDP to better fit the needs of the application.
A useful example might be a system design with a thermal
budget for a 20W processor but vendor offerings that only
include 15W and 25W options. Configurable TDP enables
flexibility so the designer isn’t forced to choose a lower-performing 15W option in order to remain within the 20W
power budget. Instead, the 25W processor might be used
but configured for 20W.
SUMMARY
AMD Turbo CORE technology will help to dynamically provide
the processor’s best available performance while keeping
thermal dissipation under the specified amount. Support for
configurable TDP and the level of configurability varies by processor model, but it can be a very useful feature for those that
support it. System designers should keep these new concepts
in mind when choosing and implementing embedded x86
processors. Power management isn’t just about saving power
anymore.
1. AMD Turbo CORE technology is available only with select AMD APUs and GPUs.
AMD EMBEDDED SOLUTIONS GUIDE
AMD EMBEDDED G-SERIES
APU PLATFORM
AMD’s original combination of low-power CPU and advanced GPU integrated
into a single embedded device.
T
he AMD Embedded G-Series processor is the world’s first
integrated circuit to combine a low-power CPU and a
discrete-level GPU into a single embedded Accelerated
Processing Unit (APU). This unprecedented level of graphics
integration builds a new foundation for high-performance
multimedia content delivery in a small form factor and
power-efficient platform for a broad range of embedded
Model
x86 Core Clock
Speed Base/
Boost
L2 Cache
GPU
designs. Based on a new power-optimized core, the AMD
Embedded G-Series platform delivers levels of performance
in a compact BGA package that is ideal for low-power designs in embedded applications such as Digital Signage, x86
Set-Top-Box (xSTB), IP-TV, Thin Client, Information Kiosk,
Point-of-Sale, Casino Gaming, Media Servers, and Industrial
Control Systems.
DDR3 Speed
x86 Cores
UVD 1 3
Display Ouptuts4
Max TDP
AMD Embedded G-Series APU – FT1 413-pin
T56N
1.65GHz2
AMD Radeon™ HD 6320
T56E
1.65GHz2
AMD Radeon™ HD 6250
18W
2
DDR3-1333
T52R
AMD Radeon™ HD 6310
1.5GHz
T48E
1.4GHz
T44R
1.2GHz
T40N
1.0GHz
AMD Radeon™ HD 6250
1
DDR3-1066
AMD Radeon™ HD 6250
AMD Radeon™ HD 6290
2
DDR3-1066
AMD Radeon™ HD 6310
T40E
1.0GHz2
AMD Radeon™ HD 6250
DDR3-1066
T40R
1.0GHz2
AMD Radeon™ HD 6250
Unbuffered
T16R
615mHz
AMD Radeon™ HD 6250
T48L
1.4GHz
N/A
T30L
1.4GHz
N/A
1
Yes
N/A
2 active outputs
from:
18W
2x single link DVI
1X single link LVDS
2
18W
9W
9W
2x DisplayPort 1.1a
2
Unbuffered
3
1x HDMI
2
1X DVO
18W
6.4W
1
5.5W
LVDDR3-1066
1
4.5W
DDR3-1066
2
18W
1
Unbuffered
DDR3-1066
1.0GHz2
3
Unbuffered
1.4GHz
18W
1xVGA
DDR3-1066
T48n
Dual independent
display controllers
2
Unbuffered
512KB
T24L
2
Unbuffered
Unbuffered
18W
N/A
3
N/A
1
5W
1. Unified Video Decoder (UVD 3) for hardware decode of high-definition video.
2. Models enabled by AMD Turbo CORE technology, up to 10% clock speed increase is planned. For CPU boost, only one processor core of a dual-core has boost enabled.
3. Low voltage (1.35V) DDR3 is assumed for the 9W TDP processors. The use of 1.5V DDR3 will incur a power adder.
4. Other resolutions available that do not oversubscribe link bandwidth. Display resolutions limited by available memory bandwidth.
Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.
WWW.AMD.COM/EMBEDDED | PAGE 15
AMD EMBEDDED SOLUTIONS GUIDE
Gaming System
ACE-S7400
Mini-ITX
AA55E-IF
A MD Embedded G-T56N APU
with AMD Radeon™ HD 6320 Graphics
Digital inputs and digital outputs
with Micro fit 3.0 connector
2 x ccTalk
2MB Battery back up SRAM
Timer & Meter pulse generator, counters
Intrusion Logger
Storage:2 x CF connectors
aCrosser Technology Limited
PHONE(866) 401-9463
FAX
(714) 903 5629
EMAIL [email protected]
WEB www.acrosser.com
A MD Embedded G-Series APU
AMD A55E Controller Hub
1x DDR3 1066 SODIMM, Max up to 4GB
1x PCI-E x 4 Gen.2, 1x Mini PCI-E , 1x CFas
5 SATA 3.0 (6Gb/s)
8x USB 2.0 (4 Rear, 4 Internal)
Storage, Single Board Computers, Digital
Signage, Point Of Sale, Thin Clients, Gaming
Advansus
PHONE886-2-8177-7089
FAX
886-2-2794-7306
PICMG 1.0
PCA-6763
EMAIL [email protected]
WEB www.advansus.com.tw
Desktop Network Security
Appliance CAF-1000
A MD Embedded G-Series APU
AMD A55E Controller Hub
1x DDR3 1066/800, Max up to 1GB
1 x Mini-PCIe
4 SATA 6.0 Gbps, 3.0 compliant
6x Header USB 2.0, 1x TypeA USB 2.0
1x DVI 1920 x 1200, LVDS 1920 x 1200
Industrial Controllers, Single Board Computers
Advantech
PHONE(949) 789-7178
FAX
(949) 789-7179
A MD Embedded G-Series APU
AMD A50M Controller Hub
SODIMM, 8GB, DDR3, 1x, 1066/800
2x USB 2.0
1x SATA, 3.0Gbps, 2.0 compliant
200(W) x 112(D) x 52(H) mm
American Portwell Technology, Inc.
EMAIL [email protected]
WEB www.advantech.com/embcore
PHONE(510) 403-3399
FAX
(510) 403-3184
Industrial Tablet WA-10
Fanless Box PC
ARES-1500-A10
A MD Embedded G-T56N APU
with AMD Radeon™ HD 6320 Graphics
Memory: SODIMM, 2GB, DDR3
Amtek System Company
PHONE+886-2-26492212#133 EMAIL [email protected]
FAX
+886-2-26492363
WEB www.amtek.com
PAGE 16 | JULY 2014
EMAIL [email protected]
WEB www.portwell.com
A MD Embedded G-Series APU
AMD A50M Controller Hub
Fanless with Aluminum Chassis Design
Suitable for Harsh Environment
Support Optional WiFi or 3G Connection
Slim, Compact & Cable-free Design
4 x USB, 4 x COM, 2 GbE LAN, DVI-I)
Industrial Controllers, Medical, Networking,
Point Of Sale, Thin Clients
Arbor Technology Corp.
PHONE(866) 270-2617
FAX
(408) 452-8909
EMAIL [email protected]
WEB www.arbor.com.tw
AMD EMBEDDED SOLUTIONS GUIDE
Thin Client
A9S/A9SD
3.5” Single Board Computer
ECM-A50M
A MD Embedded G-Series APU
AMD A50M Controller Hub
SODIMM, 2GB (4GB for A9SD), DDR3, 1x 1066/800
Dual Video (DVI + DP) Support
6x USB 2.0
Supports DirectX 11 and 3D Visual Effect
Low power consumption
Astec Technology Co., Ltd.
PHONE+886-2-86983077 Ext. 108 EMAIL [email protected]
WEB
www.astec-tech.com
A MD Embedded G-T40N APU
with AMD Radeon™ HD 6290 Graphics
(Optional G-T56N APU)
AMD A50M Controller Hub
One 204-pin DDR3 SODIMM Socket Supports
Up to 4GB DDR3 1066 SDRAM
Dual View, 2-CH LVDS, CRT, HDMI
7.1-CH Audio, Dual GbE
1 CF, 2 SATA, 2 COM, 7 USB, 16-bit GPIO
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
5.25” Single Board
Computer EBM-A50M
EMAIL [email protected]
WEB www.avalue.com.tw
COM Express Module
ERS-A50M
A MD Embedded G-T40E APU
with AMD Radeon™ HD 6250 Graphics
Fan-less (Optional G-T56N APU/ with fan)
With AMD Radeon™ HD 6250 Graphics or
Optional AMD Radeon™ HD 6320 Graphics
AMD A50M Controller Hub
Onboard 2GB DDR3 1333 SDRAM, One 204-pin
DDR3 SODIMM Up to 4GB DDR3 1333 SDRAM
Dual View, 2-CH LVDS, HDMI
7.1-CH Audio, Dual GbE, 2W Amplifier
Two Mini PCIe Slots, Optional Supports mSATA
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
A MD Embedded G-T56N APU
with AMD Radeon™ HD 6320 Graphics
AMD A50M Controller Hub
One 204-pin DDR3 SODIMM Up to
4GB DDR3 1066 SDRAM
1 mSATA, 1 CF, 1 SSD
Dual GbE, 7.1-CH Audio
1 VGA, 1 HDMI, 2 COM, 6 USB
Service Windows, Easy to Install HDD/ SSD and Memory
Operating Temperature -10 ~ 50°C, Ambient w/ Air Flow
Avalue Technology Inc.
EMAIL [email protected]
WEB www.avalue.com.tw
PHONE+886-2-8226-2345
FAX
+886-8226-2777
Mini-ITX
EMX-A55E
EMAIL [email protected]
WEB www.avalue.com.tw
Panel PC
APC-18W4
A MD Embedded G-Series APU
AMD A55E Controller Hub
1x SODIMM DDR3 1066/800, Max up to 4GB
1 x Mini-PCIe, 1 x PCIe, X4
5 SATA 3.0 Gbps
8x USB 2.0
Accelerated Parallel Processing, Gaming, Medical,
Networking, Digital Signage, Point Of Sale, Thin Clients
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
A MD Embedded G-T40E APU
with AMD Radeon™ HD 6250 Graphics
18” Projected Capacitive Multitouch Screen
1 GbE, 2W Amplifier
1 CF, 2 USB, 1 COM, 1 Mini PCIe
Wide Voltage 12V~28V Input, ErP Power
Over Current & Surge Protection
Backlight controlled by PWM, Timer-Power-on
Programmable Function Key
Avalue Technology Inc.
EMAIL [email protected]
WEB www.avalue.com.tw
PHONE+886-2-8226-2345
FAX
+886-8226-2777
EMAIL [email protected]
WEB www.avalue.com.tw
WWW.AMD.COM/EMBEDDED | PAGE 17
AMD EMBEDDED SOLUTIONS GUIDE
Panel PC
FPC-08WA4
Ultra Slim Industrial Computer
ASM-A50M-40E
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SODIMM DDR3, Max up to 4GB
1x HDMI
1x RS-232, 1x RS-232 or Optional RS-422/485
3x USB 2.0
Communications, Point Of Sale, Thin Clients
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
A MD Embedded G-T40E APU
with AMD Radeon™ HD 6250 Graphics
AMD A50M Controller Hub Chipset
Onboard 2GB DDR3 1066 SDRAM and One 204-pin
SODIMM Up to 6GB
Dual Display Output, VGA, HDMI
7.1-CH Audio, Dual GbE
1 CF, 1 SATA, 2 COM, 4 USB
ErP/EuP 2.0 compliant
Avalue Technology Inc.
EMAIL [email protected]
WEB www.avalue.com.tw
PHONE+886-2-8226-2345
FAX
+886-8226-2777
COM Express Module
ESM-A50
EMAIL [email protected]
WEB www.avalue.com.tw
Industrial Panel PC
LPC-10/12/15/17
A MD Embedded G-T56N APU
with AMD Radeon™ HD 6320 Graphics
Also supports AMD G-T40E APU with
AMD Radeon™ HD 6250
AMD A50M Controller Hub
Two 204-pin DDR3 SODIMM Up to
8GB DDR3 1066/1333 SDRAM
Dual View, Dual-Channel 18/24-bit LVDS
GbE
4 SATA, 8 USB, 8-bit GPIO
Pin-out Type 6
Avalue Technology Inc.
PHONE+886-2-8226-2345
FAX
+886-8226-2777
A MD Embedded G-T40E APU
with AMD Radeon™ HD 6250 Graphics
8”/10”/12”/15”/17” 5-wire Resistive Touch Screen
VGA/HDMI, Audio, GbE, optional WiFi
1 CF, 2 COM, 4 USB
Fanless operation, VESA Compliance
IP-65 Compliant Front Panel
High Brightness, Anti-scratch Panel (option)
Compatible installation/mounting Accessories
Avalue Technology Inc.
EMAIL [email protected]
WEB www.avalue.com.tw
PHONE+886-2-8226-2345
FAX
+886-8226-2777
Custom Board
GA690-2r
Industrial Computer
Modular Thin Platform DT135D
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SODIMM DDR3 1066/80, Max up to 4GB
1x SATA, 3.0Gbps, 3.0 compliant
5x TypeA USB 2.0
Thin Clients
Centerm Information Co., Ltd.
PHONE0591-28053888-8757
FAX
0591-83057710
PAGE 18 | JULY 2014
EMAIL [email protected]
WEB www.centerm.com.cn
EMAIL [email protected]
WEB www.avalue.com.tw
A MD Embedded G-Series APU Platform
High performance with low power consumption
Support for Linux, Microsoft® Windows® XP
Embedded or Windows® Embedded Standard 7
2 video-out ports: 1 DVI-I connector and 1 VGA Port
Fanless design; no moving parts
Integrates major thin-client/server computing protocols
(Citrix ICA, Microsoft RDP) and web browsers
Comprehensive remote device administration through
server-based WebDT Device Manager software
DT Research, Inc.
PHONE(408) 934-6220
FAX
(408) 934 6222
EMAIL [email protected]
WEB www.dtresearch.com
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX Single Board
Computer D3003-S
Custom Board
FUTRO X913
A MD Embedded G-Series APU
HD Audio on board
Dual GbE LAN on board
Serial ATA III RAID on board
mSATA socket support (for Embedded OS) onboard
USB 2.0 onboard
8 Bit GPIO onboard
Infineon TPM V1.2 onboard
Designed for fanless operation
Mainboard ready for EuP
Fujitsu
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
A MD Embedded G-Series APU
2x SODIMM DDR3 1600/1333/1066 MHz, Max up to 4GB
2x Left side USB 2.0, 2x Rear USB
2.0, 2x Internal USB 2.0
1x DVI-I 1920 x 1200
Thin Clients
Fujitsu
EMAIL [email protected]
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
Custom Board
FUTRO X913-T
Industrial Computer
JBC361F35
A MD Embedded G-Series APU
2x SODIMM DDR3 1600/1333/1066 MHz, Max up to 4GB
2x Left side USB 2.0, 2x Rear USB
2.0, 2x Internal USB 2.0
1x DVI-I 1920 x 1200
Thin Clients
Fujitsu
PHONE+49 821 804 3387
WEB www.ts.fujitsu.com
A MD Embedded G-Series APU
AMD A50M Controller Hub
Support DirectX 11 3D Graphics Acceleration
Support 2 * Gigabit LAN
Equipped with 802.11 b/g/n WiFi card &
Internal Antenna (JBC361F35W-B only)
Support 2.5” SATA HDD
Small size and provide VESA mount bracket
Gaming, Digital Set Top Boxes, Digital
Signage, Point Of Sale, Thin Clients
JETWAY Information Co., Ltd
EMAIL [email protected]
PHONE+886 2 89132711
FAX
+886 2 89132722
Mini-ITX Single Board
Computer
NF81-T56N
JETWAY Information Co., Ltd
EMAIL [email protected]
WEB www jetway.com.tw
EMAIL [email protected]
WEB www jetway.com.tw
Digital Gaming System
QXi-200
A MD Embedded G-Series APU
AMD A55E Controller Hub
2x DDR3-1333 (PC3-10600) SODIMM sockets
1x DVI-I (analogue or digital), 1x DVI-D (digital)
2x PCI Express® Gigabit LAN controllers
4x USB 2.0 ports
Cost effective, compact “all-in-one” gaming platform
AMD Embedded G-T56N APU with AMD
Radeon™ HD 6320 Graphics
Silent fan, silent drivers
6x SATA, 6.0Gbps, 3.0 compliant, 1
port is m-SATA connector
Designed for Digital Signage and
Gaming machine applications
PHONE+886 2 89132711
FAX
+886 2 89132722
EMAIL [email protected]
Quixant UK Ltd
PHONE+44 (0) 1223 89296
FAX
+44 (0) 1223 892401
EMAIL [email protected]
WEB www.quixant.com
WWW.AMD.COM/EMBEDDED | PAGE 19
AMD EMBEDDED SOLUTIONS GUIDE
SILVERCOR AND AMD ACHIEVE
SCALABLE, ENTERPRISE-CLASS
STORAGE AND NETWORKING
WITH ULTRA-MODULAR ‘SAN
IN A DISK DRIVE’ TECHNOLOGY
Big Data analytics and cloud storage have
emerged as core applications in the enterprise
IT domain, enabling users to harness huge
data sets across a distributed network of
servers and storage arrays for a wide range of
business purposes. With this decentralization
of hardware infrastructure, new approaches
to storage networking and the underlying
processing platforms are needed.
C
onventional storage arrays and servers are typically
architected around centralized controllers or boards that
process the aggregate storage IO via general purpose
CPUs. In these systems, the processor is the main bottleneck of data flows to and from the system, so system vendors design in the highest performing CPUs they can, adding
significant expense and power consumption in the process.
single 3.5’’ drive. With integrated Ethernet connectivity,
native virtualization support, outstanding energy efficiency
and a high performance AMD-enabled multicore processing
platform, Silvercor’s family of Refugio, Vulcan and Magnum
disk drives enables users to implement a full-featured, ultra-scalable SAN with minimal upfront investment.
Silvercor’s approach is to decentralize storage hardware infrastructure, giving IT administrators the flexibility to deploy
storage resources incrementally in ‘building block’ fashion
wherever these resources are needed in the distributed
network. By equipping each individual Silvercor disk drive
with a high-performance, power efficient multicore AMD
Embedded APU, the aggregate number of processor cores in
the storage network can exceed the amount of cores within
legacy storage systems, allowing users to process more
data at the same rate or faster - at less cost, and with lower
power consumption.
From expensive, monolithic storage arrays to commodity servers with direct attach storage (DAS) architectures,
legacy enterprise storage systems can add considerable
cost, management complexity and power consumption
to Big Data and cloud storage-optimized IT infrastructure.
With AMD Embedded G-Series APUs (Accelerated Processing Units) at the heart of its disk drive portfolio, Silvercor
is helping storage administrators achieve enterprise-class
storage performance and versatility via a highly scalable and
extremely cost effective platform. Among the many benefits offered with this solution:
Utilizing AMD Embedded G-Series Accelerated Processing
Units (APUs), Silvercor has pioneered a new category of enterprise storage with the introduction of a new class of hard
disk drives (HDDs) and solid state drives (SSDs) that harness
the full capabilities of a Storage Area Network (SAN) in a
Extreme Flexibility and Affordability – Start implementing
a SAN with a single disk drive and add additional drives as
storage performance and capacity requirements evolve —
with little or no downtime or disruption — helping to provide
a low total cost of ownership.
PAGE 20 | JULY 2014
A SAN IN THE PALM OF YOUR HAND
AMD EMBEDDED SOLUTIONS GUIDE
Low Power Consumption – Utilizing Power over Ethernet
(PoE), Silvercor disk drives use less power than comparable
solutions without sacrificing processing performance.
Built-in Virtualization Support – The ability to run virtual
machines (VMs) natively on a Silvercor disk drive helps enable granular provisioning at the disk drive level for diverse
workloads and/or multi-tenant usage.
Simplified Management and Interoperability – Offering
iSCSI VM compliant and out-of-the-box Windows Server®
and Linux® support, Silvercor disk drives require no specialized training to get started. Users can configure and provision storage, and manage and monitor logical volumes and
LUNs, using standard cloud management tools to deploy
VMs on a large scale.
Optimized Support for Big Data and Cloud Storage Applications – With a multicore AMD G-Series processor embedded
locally in each individual Silvercor drive, optimal performance
is virtually assured for distributed, scale-out computing
architectures. Hadoop and OpenStack Swift run natively on
the disk drive, minimizing performance degradation of the
cluster when adding or replacing nodes. Additionally, Silvercor’s innovative caching solution helps enable operators to
achieve challenging performance and service level objectives
AMD APUS FOR NEXT-GENERATION STORAGE
SYSTEM ARCHITECTURES
AMD Embedded G-Series APUs enabled Silvercor’s design
team to achieve aggressive design and functionality goals,
at a lower cost than other processing platforms that perform
comparably. Offering seamless interoperability with the
rich ecosystem of industry-standard x86 software, drivers
and tools, and supported by AMD’s expert technical support
team, AMD Embedded G-Series APUs provide Silvercor with
a host of benefits:
High Performance Processing – The combination of a general purpose CPU and discrete-class GPU on a single silicon
die assists in high-speed parallel processing that dramatically improves the performance of each individual Silvercor disk
drive ‘node.’
AMD EMBEDDED SOLUTIONS FOR
ENTERPRISE STORAGE
AMD Embedded APUs are well-suited for enterprise storage
systems and components requiring an optimal balance of
processing performance, scalability, and low power consumption in a small footprint. For SAN, NAS, DAS and next
generation networked storage architectures in physical,
virtual and cloud-based computing environments, AMD
APUs provide a powerful, reliable processing platform that
maximizes storage IO with minimal design complexity.
www.silvercor.com | www.amd.com/embedded
The information presented in this document is for informational purposes only and may
contain technical inaccuracies, omissions and typographical errors. AMD reserves the right to
revise this information and to make changes from time to time to the content hereof without
obligation of AMD to notify any person of such revisions or changes.
AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF
AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY
APPEAR IN THIS INFORMATION.
© 2014 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD arrow logo, and
combinations thereof are a trademark of Advanced Micro Devices, Inc. Windows Server is a
registered trademark of Microsoft. Linux is a registered trademark of Linus Torvalds. All other
names used in this publication are for informational purposes only and may be trademarks of
their respective owners.
Ultra Compact Form Factor – The AMD G-Series APU’s twochip architecture – the APU and the companion controller
hub – simplifies design complexity through a reduction
in board layers, allowing Silvercor’s designers to architect
extremely dense 3.5’’ disk drive systems that can be configured 12 across in a standard 19’’ rack.
Low Power Consumption – Supporting thermal design
power (TDP) profiles from 5.5 W to 18 W, AMD G-Series
APUs are an optimal fit for Silvercor’s advanced POE power
distribution approach, and help to lower system-level heat
generation considerably.
WWW.AMD.COM/EMBEDDED | PAGE 21
AMD EMBEDDED SOLUTIONS GUIDE
Nano-ITX Single Board
Computer
K-A8HD
Mini PC Solution
SP-FT1M1
A MD Embedded G-Series APU
AMD A50M Controller Hub
SODIMM, 8GB, DDR3, 1x 1333/1066/800
320 GB SATA 2.5” Hard Drive (Optional)
1x HDMI, 1x VGA
0.5L: 19.3 x 14.8 x 2.2cm (L / W / H)
Digital Signage, Point Of Sale, Thin Clients
Sapphire Technology Limited
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
A MD Embedded G-Series APU
Able to drive two independent monitors
using VGA/HDMI/LVDS
Support 3G and onboard SIM interface
Support 1*Mini PCIE+1*DDRIII-SODIMM
Small size and full function
Communications, Industrial Controllers,
Medical, Digital Signage, Thin Clients
Shenzhen Comstar Technology Co,.LTD
PHONE(86) (0) 13590253820
WEB
www.cst-tek.com
Custom Board
IM-AMD-Ontario
Giada Mini PC A51
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066/800, Max up to 2GB
4x TypeA USB 2.0, 1 x TypeA USB 3.0
1x HDMI 1366 x 76
Server, Information Appliance, Storage, Medical,
Digital Signage, Point Of Sale, Thin Clients, Other
A MD Embedded G-Series APU
AMD A50M Controller Hub
SODIMM, 4GB, DDR3, 1x 1033/1066/800
2x TypeA, USB 2.0, Host, Front
3x TypeA, USB 2.0, Host, Back
6x Header, USB 2.0, Host, Internal
3x SATA, 6.0Gbps, 3.0 compliant
Information Appliance, Industrial Controllers,
Medical, Digital Set Top Boxes, Digital
Signage, Point-of-Sale, Thin Clients
Shenzhen i-long Business Machine Co., Ltd.
PHONE86-755-82877033
FAX
86-755-82874781
WEB i-long.en.gongchang.com
SHENZHEN JIEHE TECHNOLOGY DEVELOPMENT
PHONE(408) 235-8582
WEB
www.giadatech.com
A MD Embedded G-Series APU
AMD A50M Controller Hub
2x SO DIMM DDR3 1333/1066/800, Max up to 8GB
4x TypeA USB 2.0 Host, 4x Header USB 2.0 Host
6x SATA 3.0 Gbps, 2.0 compliant
2x Mini-PCIe X1
1x HDMI 2560 x 1600
Gaming, Storage, Medical, Digital Set Top
Boxes, Single Board Computers, Digital
Signage, Point Of Sale, Thin Clients
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x DIMM DDR3 1066/800, Max up to 8GB
4x TypeA USB 2.0 Host, 2x Header USB 2.0 Host
5x SATA 3.0 Gbps
2x Mini-PCIe X1, 1x PCIe X1
1x DVI 1280 x 720
Accelerated Parallel Processing, Gaming, Medical,
Networking, Digital Signage, Point Of Sale, Thin Clients
PHONE86 0755 83663196
WEB
www.micputer.com
PAGE 22 | JULY 2014
EMAIL [email protected]
EMAIL [email protected]
Mini-ITX
ITX-AF2X62A
Mini-ITX
ITX-AF2X21B
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
EMAIL [email protected]
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX Motherboard
ITX-A35E21A
Mini-ITX Motherboard
ITX-AF2E21C
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
2x SATA 3Gb
2x MINI PCI-E slot (1pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x VGA port, 1x DVI port
Gaming, Digital Set Top Boxes, Single Board Computers,
Digital Signage, Point Of Sale, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
2x SATA 3Gb
2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x VGA port, 1x DVI port
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
Nano-ITX
Nano AF2S1E
Nano-ITX Motherboard
NANO-AF2S1F
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1333/1066/800, Max up to 2GB
4x TypeB USB 2.0 Host, 2x Header USB 2.0 Host
1x SATA 3.0 Gbps, 2.0 compliant
1x Mini-PCIe X1
LVDS 1024 x 768, HDMI 24-bit
Industrial Controllers, Digital Set Top Boxes, Single Board
Computers, Digital Signage, Point Of Sale, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 800/1066MHz of memory up to 4GB
1x Notebook SATA 3Gb/s with power interface
2x MINI PCI-E slot (support wifi and SSD)
6x USB 2.0
1x VGA port, 1x HDMI port
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
Mini-ITX Motherboard
ITX-AF2E21A
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
EMAIL [email protected]
Mini-ITX Motherboard
ITX-AF2X62B
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066 MT/S, Max up to 8GB
2x SATA 3Gb/s
2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x VGA port, 1x DVI port
Gaming, Storage, Single Board Computers, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
EMAIL [email protected]
A MD Embedded G-Series APU
AMD A50M Controller Hub
2x desk pc DDR3 1066MHz, Max up to 8GB
5x SATA 3Gb/s
2x MINI PCI-E slot, 1x PCI-E 1x
8x USB 2.0
1x VGA port, 1x HDMI port
Industrial Controllers, Storage, Digital Set
Top Boxes, Digital Signage, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
WWW.AMD.COM/EMBEDDED | PAGE 23
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX Motherboard
ITX-AF2X21D
Nano-ITX
Nano AF2S1A
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 4GB
2x SATA 3Gb
2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x VGA port, 1x HDMI port
Industrial Controllers, Digital Set Top
Boxes, Digital Signage, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SO DIMM DDR3 1066/800, Max up to 4GB
4x TypeA USB 2.0 Host, 1x Header USB 2.0 Host
1x SATA 3.0 Gbps, 2.0 compliant
1x Mini-PCIe X1
1x HDMI 1920 x 1080, 1x HDMI 1280 x 1024
Digital Set Top Boxes, Single Board Computers,
Digital Signage, Point Of Sale, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
Nano-ITX Single Board
Computer NANO-AF2S1A
3.5”
Refugio/Vulcan/Magnum Series
A MD Embedded G-Series APU
OS Supported: Linux™, Windows™ 7
Power Consumption: <25W
Memory: SODIMM, up to 4GB, DDR3, 1x 1333/1066/800
Industrial Controllers, Digital Set Top Boxes,
Digital Signage, Point-of-Sale, Thin Clients
SHENZHEN XINZHIXIN ENTERPRISE DEVELOPMENT CO.,LTD
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
A MD Embedded G-Series APU
Ethernet Flash drive with ISCSI protocol built in.
POE powered from standard Network switch.
Single 1Gi, dual 1 Gig and dual 10 Gig.
Flash capacities up to 1TByte.
Management software
SAN, NAS, Object Storage and Hadoop
Silvercor
PHONE(408) 426-4428
WEB
www.silvercor.com
EmbeddedITX Single Board
Computer UMB-AFEI01
PHONE0512 87185616 13962146197
[email protected]
WEB www.uetcn.com
PAGE 24 | JULY 2014
EMAIL [email protected]
NANO PC HD ITX
TS 1000/TS 1100
A MD Embedded G-Series APU
AMD A55E C
OS Supported: Windows® Vista, Linux®, Windows®
XP, Windows® 7, Linux® Terminal, Redhat® Linux
Power Consumption: <36W
AMD Radeon™ HD 6310
Memory: SODIMM, 4GB, DDR3, 1x, 1066/800
Suzhou UET Electronics Co. Ltd.
EMAIL [email protected]
A MD Embedded G-Series APU
AMD A50M Controller Hub
1x SODIMM DDR3 1066/80, Max up to 4GB
3x SATA, 3.0Gbps, 2.0 compliant
7x TypeA USB 2.0
1x HDMI 1920 x 1080
1x Mini-PCIe
Accelerated Parallel Processing, Information
Appliance, Industrial Controllers, Storage, Digital Set
Top Boxes, Single Board Computers, Networking,
Digital Signage, Point Of Sale, Thin Clients
TECSYS
PHONE55 12 3797-8800
FAX
55 12 3797-8824
EMAIL [email protected]
WEB www.tecsysbrasil.com.br
AMD EMBEDDED SOLUTIONS GUIDE
INTRODUCING THE 2ND
GENERATION AMD EMBEDDED
R-SERIES APU
T
he 2nd Generation AMD Embedded R-Series APU (previously codenamed “Bald Eagle”) delivers breakthrough
graphics performance and power efficiency for a new
generation of embedded systems designed to provide
ultra-immersive HD multimedia experiences and parallel
processing compute performance. The AMD R-Series APU
offers next-generation performance-per-watt compute
efficiency in the x86 product category by allowing system
designers to take advantage of Heterogeneous System
Architecture (HSA)
2nd Generation AMD Embedded R-Series APUs enable
stunningly crisp 3D, 4K, and HD video content and offer
support for up to four independent displays (4096 x 2160
resolution per display output). The AMD Dual Graphics1
configuration allows you to combine the power of the 2nd
Generation AMD R-Series APU with an AMD Embedded
Radeon™ E8860 discrete GPU to provide up to 64% more
3D graphics performance than a standalone 2nd Generation
AMD R-Series APU2.
AMD’s 2nd Generation AMD Embedded R-Series APU is a
revolutionary leap in processing performance, power efficiency and multimedia immersion, well-suited for embedded
gaming, medical imaging, digital signage and other embedded applications.
Model#
OPN
# x86
Cores
# GPU CU
TDP
L2 Cache
(MBytes)
CPU Frequency
(GHz) Max/Base
GPU (MHz)
Max/Base
Memory
Max
DDR3
Rate
CTDP
Range
RX-427BB
RE427BDGH44JA
4
8
35W
4
3.6/2.7
686/600
DDR3
2133
30W-35W
RX-425BB
RE425BDGH44JA
4
6
35W
4
3.4/2.5
654/576
DDR3
1866
30W-35W
RX-225FB
RE225FECH23JA
2
3
17W
1
3.0/2.2
533/464
DDR3
1600
15W-17W
RX-427NB
RE427NDGH44JA
4
0
35W
4
3.6/2.7
-
DDR3
2133
30W-35W
RX-219NB
RE219NECH23JA
2
0
17W
1
3.0/2.2
-
DDR3
1600
15W-17W
1. A MD Dual Graphics technology combines the 3D graphics rendering resources of the APU’s discrete-class graphics processor with the discrete graphics processor to accelerate the Microsoft® Direct3D
function for software applications using Microsoft DirectX® 10 or DirectX 11 technology.
2. The AMD RX-427BB scored 2,051, and the AMD Radeon™ E8860 paired with RX-427BB at dual-graphics mode scored 3,359 when running 3DMark®11P benchmark. The AMD Bald Eagle RX-427BB used an
AMD Ballina motherboard with 8GB DDR3 SO-DIMM memory and 256GB SanDisk HDD. The AMD Radeon E8860 used an AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and
RX-427BB. The system ran Windows® 7 Ultimate. EMB-97
Note: Always refer to the processor/chipset data sheets for technical specifications. Feature information in this document is provided for reference only.
WWW.AMD.COM/EMBEDDED | PAGE 25
AMD EMBEDDED SOLUTIONS GUIDE
micro-ATX Motherboard
GMB-A75
Digital Gaming SBC
DPX-S430
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A75 Controller Hub
Built-in SMI 750 GPU to support extension 2 display
Extended up to 2 PCIex16 slot
System memory up to 16 GB (DDR3)
Comprehensive I/O: 2 x RJ45, 10 x USB (2.0/3.0),
8 x COM, 4 x VGA, 2 x DVI-D, CF card, and audio
Gaming, Information Appliance,
Digital Signage, Point Of Sale
Advantech
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A75 Controller Hub
Quad and Dual Core APUs
Comprehensive Gaming features
High performance integrated or PCI-Express graphics
Up to 4 independent displays from the chipset
Low power consumption
Small format
Advantech-Innocore
PHONE886-2-2792-7818 #1431 EMAIL [email protected]
WEB
www.advantech.com
PHONE(949) 789-7178
FAX
(949) 789-7179
Digital Engine
DE6140
Industrial Computer
GA-5010
A MD Embedded R-Series APU
AMD A70 Controller Hub
USB 2.0 Port : x 2
DDRIII SO-DIMM x 2
HDMI Port : x 4
eSATA port: x 2
Purpose-built for powering video walls and
displaying dynamic content on multiple displays
A MD Embedded R-Series APU
AMD A75 Controller Hub
PCIe x16 slot + mini-PCIe/mSATA slot
USB 3.0 x 4 + USB 2.0 x 8
Two SATA + One CF or optional onboard NANDrive
Up to 4 digital displays: HDMI + 3 x DVI-D
Optional ODM module memory & I/O
expansion for specific applications
Gaming, Industrial Controllers, Single Board Computers
AEWIN Technologies Co., Ltd.
PHONE+886-2-8692 6677
FAX
+886-2-8692 6655
EMAIL [email protected]
WEB www.aewin.com.tw
Aopen Inc.
PHONE886-2-77101161
EMAIL [email protected]
WEB
www.aopen.com/global/home
COM Express / Type
6 conga-TFS
MiniITX Single Board Computer
MANO111
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A70 Controller Hub
SODIMM, 16GB, DDR3, 2x 1066/800
7 x PCI Express™
4 x SATA
4 x USB 3.0, 4 x USB 2.0
High performance DirectX®11 GPU supports
OpenCL™ 1.1 and OpenGL 4.2
Gaming, Server, Information Appliance, Communications,
Industrial Controllers, Medical, Digital Signagedfi
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A75 Controller Hub
DDR3 Dual channel SO-DIMM
1333/1600 max. up to 16 GB
4 SATA-600 support RAID 0,1,5,10
4 USB 3.0 supported
3 independent displays
DisplayPort 2 supports multi-stream
Gaming, Communications, Industrial Controllers,
Medical, Digital Signage, Point Of Sale
congatec Inc.
Axiomtek
PHONE(626) 581-3232
FAX
(626) 581-3552
PAGE 26 | JULY 2014
EMAIL [email protected]
WEB www.advantech.com/embcore
EMAIL [email protected]
WEB www.axiomtek.com/US
PHONE(858) 457-2600
FAX
(858) 457-2602
EMAIL [email protected]
WEB www.congatec.us
AMD EMBEDDED SOLUTIONS GUIDE
COM Express Compact
R2.0, Type 6 CM901-B
Mini-ITX Motherboard
CM100-C
MD Embedded R-Series APU
A MD Radeon™ HD 7000G Series Graphics integrated
AMD A70 Controller Hub
2 DDR3 SODIMM up to 8GB
VGA, LVDS, DDI (DisplayPort, LVDS, VGA)
1 PCIe x16, 7 PCIe x1 (first 4 PCIe support PCIe x4)
4 SATA 3.0
8 USB 2.0 (first 4 USB ports support up to USB 3.0)
Gaming, Information Appliance, Industrial Controllers,
Medical, Digital Signage, Point Of Sale
DFI
PHONE(916) 568-1234
FAX
(916) 568-1233
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A70 Controller Hub
2 DDR3 SODIMM up to 8GB
1 HDMI, 2 DVI (1 supports DVI-D signal), 1 LVDS
1 PCIe x16, 2 PCIe x1 gold fingers, 1 Mini PCIe
4x SATA 3.0
4x USB 3.0, 6x USB 2.0
Gaming, Industrial Controllers, Medical,
Digital Signage, Point Of Sale
DFI
EMAIL [email protected]
WEB www.dfi.com
PHONE(916) 568-1234
FAX
(916) 568-1233
Mini-ITX Motherboard
MI959
Digital Signage Player
SI-38
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A70 Controller Hub
2 x DDR3-1600 Memory, up-to 16GB Dual Channel
1 x DVI-, DVI-D, Display Port & LVDS
2 x Mini PCI-E(x1), PCI-E(x16)
4 x USB 3.0 + 8 USB 2.0
Server, Communications, Industrial Controllers,
Medical, Networking, Digital Signage, Point of Sale
IBASE
PHONE+886-2-2655-7588
FAX
+886-2-2655-7388
A MD R-Series Quad-Core / Dual-Core APU, up to 35W
Integrated AMD Radeon™ 384/240 Cores
DirectX® 11 GPU in Processor
Winner of Computex 2012 Design & Innovation Award
Dual independent 1080p Hybrid DVI-I display outputs
Supports DDR3 memory up to 16GB
iSMART - for EuP/ErP power saving,
auto-scheduler and power resume
Dual Mini PCI-E(x1) slots for WiFi and TV tuner options
2x USB 3.0 and serial port (RS232)
IBASE
EMAIL [email protected]
WEB www.IBASE-usa.com
PHONE+886-2-2655-7588
FAX
+886-2-2655-7388
Mini-ITX Motherboard
NF82
JETWAY Information Co., Ltd
EMAIL [email protected]
WEB www jetway.com.tw
EMAIL [email protected]
WEB www.IBASE-usa.com
COM Express Compact Module
MSC C6C-A7
A MD Embedded R-Series APU
AMD A75 Controller Hub
2 x SODIMM Sockets for un-buffered Dual
Channel DDR3 1600 SDRAM up to 16 GB
6 x Serial ATA3 6Gb/s connectors
support RAID 0, 1 & 10 functions
1 x PCI x 16 slot, 1 x Mini PCI-E
Embedded 4 x USB 3.0 & 8 x USB 2.0/1.1
Gaming, Digital Signage, Point Of Sale
PHONE+886 2 89132711
FAX
+886 2 89132722
EMAIL [email protected]
WEB www.dfi.com
A MD Embedded R-Series APU
AMD A75 Controller Hub
Up to 16GB DDR3-1333 SDRAM, dual channel
4X SATA-300 mass storage interfaces
1x, LVDS 2 Channel
1x, DVI/HDMI/DisplayPort, 4096 x 2560
4X USB 3.O, 4X USB 2.0
Gaming, Information Appliance, Industrial
Controllers, Medical, Digital Signage, Point Of Sale
MSC Vertriebs GmbH
PHONE49-8165-906-240
FAX
49-72-49-79-93
EMAIL [email protected]
WEB www.msc-ge.com
WWW.AMD.COM/EMBEDDED | PAGE 27
AMD EMBEDDED SOLUTIONS GUIDE
Multi-Display Embedded
Computer
NDiS B862
Multi-Display Embedded
Computer
NDiS B842
A MD Embedded R-Series APU
AMD A70 Controller Hub
Slim and compact design
6 x HDMI
2 x USB3.0 support
WLAN and TV tuner support
Removable Fan Module
Designed for Digital Signage
Nexcom
PHONE(510) 656-2248
FAX
(510) 656-2158
A MD Embedded R-Series APU
AMD A70 Controller Hub
Slim and compact design
4 x HDMI
2 x USB3.0 support
WLAN and TV tuner support
Removable Fan Module
Designed for Digital Signage
Nexcom
EMAIL [email protected]
WEB www.nexcom.com
PHONE(510) 656-2248
FAX
(510) 656-2158
Digital Gaming System
QX-40
Digital Gaming System
QX-50
A MD Embedded R-Series APU
AMD Radeon™ HD 6760 Graphics integrated
AMD A75 Controller Hub
SODIMM, 8GB, DDR3, 2x 1600/1333/1066
OpenGL 4.1, DirectX® 11, OpenCL™ 1.1 compatible
Advanced PCI Express® gaming logic & SRAM / MRAM
Support for up to 10 independent monitors
7x DisplayPort, 2560 x 1600
4x DVI, 2560 x 1600
Quixant UK Ltd
PHONE+44 (0) 1223 89296
FAX
+44 (0) 1223 892401
2 nd Generation AMD Embedded R-Series APU
2x DDR3-2133 (PC3-17000), Max up to 16GB
2x USB 3.0, 11x USB 2.0 (4 internal, 7 on BP board)
1x DisplayPort, 1x DVI, 1x HDMI
2x SATA, 6.0Gbps, 1x eSATA, 6.0Gbps
4x PCIe
Gaming
Quixant UK Ltd
EMAIL [email protected]
WEB www.quixant.com
PHONE+44 (0) 1223 89296
FAX
+44 (0) 1223 892401
Digital Gaming System
QXi-4000
Quixant UK Ltd
PAGE 28 | JULY 2014
EMAIL [email protected]
WEB www.quixant.com
Embedded System
SP-FP2M3
A MD Embedded R-Series APU
AMD Radeon™ HD 7000G Series Graphics integrated
AMD A70 Controller Hub
Fanless all-in-one PC-based gaming
controller for slot machines
Supports up to four independent HD monitors
Advanced PCI Express® gaming logic & SRAM/MRAM
4x, DisplayPort, 2560 x 1600
5x TypeA USB 2.0, Host
4x SATA, 6.0Gbps, 3.0 compliant, 2 x CFAST sockets
PHONE+44 (0) 1223 89296
FAX
+44 (0) 1223 892401
EMAIL [email protected]
WEB www.nexcom.com
A MD Embedded R-Series APU
AMD A70 Controller Hub
SODIMM, 4-16GB, DDR3, 2x 1333/1066/800
1x HDMI, 1x DP, 1920 x 1080
500Gb SATA 2.5” Hard Drive (Optional)
7.8” x 7.2” x 1.2” 197.5 x 182.5 x 31.6mm (L / W / H)
Digital Signage, Point Of Sale, Thin Clients
Sapphire Technology Limited
EMAIL [email protected]
WEB www.quixant.com
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX
IPC-FS1r2A75
COM Express Basic
SECOMExp-Rseries
A MD Embedded R-Series APU
AMD A70 Controller Hub
Up to 8GB of 1600MHz DDR3 on two SO-DIMMs
Able to drive up to 4 independent monitors using
the LVDS / CRT / Digital Display interfaces
Offering a PCI Express Graphics x8 interface
4 x S-ATA Channels 6Gb/s
8 x USB 2.0 ports; 4 x USB 3.0 ports
Gaming, Digital Signage
A MD Embedded R-Series APU
AMD A75 Controller Hub
2x DDR3 SO-DIMM, Max. 16GB (Non-ECC)
2x TypeA USB 3.0, 4x TypeA USB 2.0, 2x Header USB 2.0
1x PCI-E(x4), 2x Mini PCI-E(x1), (one with mSATA)
4x HDMI, 6x DisplayPort
Accelerated Parallel Processing, Gaming,
Information Appliance, Digital Signage, Other
Sapphire Technology Limited
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
Seco
PHONE+39 0575 26979
FAX
+39 0575 350210
Mini-ITX
WTM-A4
Mini-ITX Motherboard
ITX-AT2X21B and ITX-AT2X21B-1
A MD Embedded R-Series APU
AMD A70 Controller Hub
2x DIMM DDR3 1600/1333/1066, Max up to 8GB
8x USB 2.0, 3x USB 3.0
1x Mini-PCIe
4x DVI
Gaming, Digital Signage
Shenzhen IPCWTM Technology Co., Ltd.
PHONE+8613927447156
WEB
www.ipcwtm.com
EMAIL cy[email protected]
A MD Embedded R-Series APU
AMD A70 Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
2x SATA 3Gb/s with power
2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x HDMI port, 3x DVI port
Industrial Controllers, Digital Set Top Boxes,
Digital Signage, Point Of Sale, Thin Clients
Shenzhen Xinzhixin Enterprise Development Co.,Ltd
PHONE86 0755 83663196
WEB
www.micputer.com
Mini-ITX Motherboard
ITX-AT2X21E, ITX-AT2X21F
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
EMAIL [email protected]
Mini-ITX Motherboard
ITX-AT2X21D
A MD Embedded R-Series APU
AMD A70 Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
4x SATA 3Gb/s with power
2x MINI PCI-E slot (1 pcs for wifi, 1
pcs for SSD); 2x SIM slot
Supports USB 3.0 and USB 2.0
Supports HDMI and DVI
Gaming, Storage, Digital Set Top Boxes,
Single Board Computers, Point Of Sale
Shenzhen Xinzhixin Enterprise Development Co.,Ltd
EMAIL [email protected]
WEB www.seco.com
A MD Embedded R-Series APU
AMD A70 Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
2x SATA 3Gb/s with power
2x MINI PCI-E slot (1 pcs for wifi, 1
pcs for SSD), 1x SIM slot
2x USB 3.0, 6x USB 2.0
1x HDMI port, 1x DVI port
Gaming, Industrial Controllers, Digital Set Top
Boxes, Printers, Point Of Sale, Thin Clients
Shenzhen Xinzhixin Enterprise Development Co.,Ltd
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
WWW.AMD.COM/EMBEDDED | PAGE 29
AMD EMBEDDED SOLUTIONS GUIDE
Mini-ITX Motherboard
ITX-AT2X21A
Embedded Gaming Board
MB-63010
A MD Embedded R-Series APU
AMD A70 Controller Hub
1x SO DIMM DDR3 1066/1333MHz, Max up to 8GB
2x SATA 3Gb/s with power
2x MINI PCI-E slot (1 pcs for wifi, 1 pcs for SSD)
8x USB 2.0
1x HDMI port, 1x DVI port
Gaming, Industrial Controllers, Single Board
Computers, Digital Signage, Thin Clients
Shenzhen Xinzhixin Enterprise Development Co.,Ltd
PHONE86 0755 83663196
WEB
www.micputer.com
EMAIL [email protected]
A MD Embedded R-Series APU
AMD A75 Controller Hub
2x SODIMM DDR3 1600/1333/1066, Max up to 16GB
1x HDMI, 3X DVI
4x USB 3.0, 8x USB 2.0
1x PCIe, X8, X16 slot
1x Mini-PCIe, X1 or mSATA
Gaming, Industrial Controllers, Medical
Win Enterprises
PHONE(978) 688-2000
FAX
(978) 688-4884
Mini-ITX
MB-73330
Industrial Computer
PL-63010
A MD Embedded R-Series APU
AMD A75 Controller Hub
DDR3 up to 16GGB
3 x HDMI + 1 x DP display
2 x SATA, 2 x COM, 8 x USB, HD Audio
PCIe X16 & X1 slots, Mini-PCIe socket
Gaming, Information Appliance, Medical, Single
Board Computers, Digital Signage, Point Of Sale
Win Enterprises
PHONE(978) 688-2000
FAX
(978) 688-4884
EMAIL [email protected]
WEB www.win-ent.com
A MD Embedded R-Series APU
AMD A75 Controller Hub
2x SODIMM DDR3 1600/1333/1066, Max up to 16GB
4x TypeA USB 3.0, 2x TypeA USB 2.0, 6x Header USB 2.0
3x HDMI + 1x HDMI
2x SATA, 6.0Gbps
8x PCIe, 1x Mini-PCIe Card or mSATA, 8x PCI,
1x miniPCI Gaming
Win Enterprises
EMAIL [email protected]
WEB www.win-ent.com
PHONE(978) 688-2000
FAX
(978) 688-4884
EMAIL [email protected]
WEB www.win-ent.com
Follow AMD Embedded Solutions
on Twitter! @AMDembedded
PAGE 30 | JULY 2014
AMD EMBEDDED SOLUTIONS GUIDE
AMD EMBEDDED
TM
RADEON E8860 GPU
Powerful, immersive graphics for embedded applications
T
he AMD Embedded RadeonTM E8860 discrete GPU – the
first embedded GPU developed on the groundbreaking
Graphics Core Next (GCN) architecture – pushes AMD
Radeon graphics and parallel processing performance to unprecedented new heights while increasing power efficiency.
The AMD Radeon E8860 GPU1 delivers industry-leading 3D
video graphics performance, enabling stunning, multi-display visual experiences for a range of embedded applications
spanning digital gaming, digital signage, medical imaging,
avionics, and more.
The AMD Radeon E8860 GPU supports DirectX® 11.1,
OpenGL 4.2, and OpenCL™ 1.2, enabling high-performance
graphics and massive parallel processing. Supporting
thermal design power of 37 watts, the AMD Radeon E8860
GPU provides the optimal performance-per-watt profile for
embedded applications that require outstanding multi-display experiences, superior visual quality, and massive
parallel compute but have exacting power efficiency and
heat dissipation requirements.
The AMD Embedded Radeon™ E8860 GPU is available in the following formats
OPN
MODEL
OUTPUT
COOLING
100-CG2514
AMD E8860 GPU
N/A
N/A
100-K00190
AMD E8860 MXM 3.0 Type A
5 DisplayPort
Fansink
100-K00189
AMD E8860 MXM 3.0 Type A
5 DisplayPort
Heatpipe
100-438110
AMD E8860 PCIe®
2x DVI + mini DisplayPort
Fansink
100-438111
AMD E8860 PCIe
2x DVI + mini DisplayPort
Heatpipe
100-438148
AMD E8860 PCIe
5x mini DisplayPort
Fansink
100-438147
AMD E8860 PCIe
5x mini DisplayPort
Heatpipe
100-438116
AMD E8860 PCIe
4x mini DisplayPort LPX
Fansink
100-438115
AMD E8860 PCIe
4x mini DisplayPort LPX
Heatpipe
100-438117
AMD E8860 PCIe
4x mini DisplayPort LPX
Low-power Heatsink
1. AMD Radeon™ E8860 scored 2689 and AMD Radeon E6760 scored 1327 when running 3DMark® 11P benchmark paired with the AMD R-464L APU. AMD Radeon E8860 and AMD Radeon E6760 used an
AMD DB-FS1r2 motherboard with 8GB DDR3 memory, 64GB Crucial M4 HDD, and the AMD R-464L APU. The system ran Windows® 7 Ultimate (EMB-79).
WWW.AMD.COM/EMBEDDED | PAGE 31
AMD EMBEDDED SOLUTIONS GUIDE
MXM3.0
54631A
VPX 3U
VPX3-716
A MD Embedded Radeon™ E8860 GPU
2GB of GDDR5
OpenCL™ 1.2, DirectCompute 11.1
VCE (video encode), UVD4 (video decode)
768 / 48 GFLOPS single / double
precision peak (600e/4.5Gbps)
DP1.2, HDMI™ 1.4, Wireless Display, Stereo 3D
AMD
A MD Embedded Radeon™ E8860 GPU
2GB GDDR5
DirectX® 11.1, OpenCL™ 1.2, OpenGL 4.2
4x DVI 1920 x 1200, 2x DisplayPort 2560 x 1600
Tested between -40°C ~ 85°C
PCIe x8 Gen 3
CutissWright
PHONE408-749-4000
EMAIL [email protected]
WEB
www.amd.com/embedded
PHONE613-254-5112
WEB
www.cwcdefense.com
Low Profile
Sapphire E8860 4mDP-2
XMC
Condor 4000x
A MD Embedded Radeon™ E8860 GPU
DirectX® 11.1 and Shader Model 5.0 support
Dual stream HD content decoding
H.264 encoding support
825MHz 640 stream processors
128-bit GDDR5 memory, Max up to 2GB
Sapphire Technology Limited
PHONE886226270685
WEB
www.sapphiretech.com
EMAIL [email protected]
A MD Embedded Radeon™ E8860 GPU
2GB of high-speed GDDR5
DirectX® 11.1, OpenCL™ 1.2, OpenGL 4.2
768/48 GFLOPS
DVI-I and DisplayPort++
TechSource
PHONE800-330-8301
WEB
www.techsource.com
ATX
tE8860RFA
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
PAGE 32 | JULY 2014
EMAIL [email protected]
VPX3U
E8860-H264
A MD Embedded Radeon™ E8860 GPU
2GB of high-speed GDDR5
4 Displayport outputs
DirectX® 11.1 and Shader Model 5.0 support
Decode support of H.264 and VC-1
Entropy decode of MPEG-2 HD and MPEG-4 Part 2
16 lanes PCI Express® 3.0 interface
TUL Corporation
EMAIL [email protected]
A MD Embedded Radeon™ E8860 GPU
Dedicated H.264 encoder with UDP output over GigE
Encoder Input from GPU output or from SDI source
2xHD-SDI 1080p30 inputs, or 1×3G-SDI 1080p60 input
1×GigE Port
RTOS drivers available
No drivers required for H.264 encoder
Wolfe
PHONE905-852-1163
WEB
www.wolf.ca
EMAIL [email protected]
AMD EMBEDDED SOLUTIONS GUIDE
AMD RADEON™ E6460
EMBEDDED GPU
Entry-Level Discrete GPU Enables 3D Graphics and HD Video with Support for Multiple Displays
T
he AMD Radeon™ E6460 embedded discrete graphics processor unit (GPU) is AMD’s entry-level embedded graphics
processor, enabling rich 3D graphics and outstanding HD
multimedia. The advanced 3D graphics engine and programmable shader architecture support Microsoft® DirectX® 11
technology and OpenGL 4.1 for superior graphics rendering.
The third generation unified video decoder enables dual HD
decode of H.264, VC-1, MPEG4 and MPEG2 compressed video
streams.
Speed time to market, reduce inventory costs, and enable
multiple product categories. The AMD Radeon™ E6460 GPU
ball grid array (BGA) is a subset of the AMD Radeon™ E6760
AMD Embedded GPU Specifics
Package Dimensions
Thermal Design Power (TDP)
Process Technology
Graphics Engine Operating Frequency (max)
CPU Interface
Shader Processing Units
Floating Point Performance (single precision, peak)
3DMark™ VantageP Score1
Display Engine
DirectX™ capability
Shader Model
OpenGL
Compute
Unified Video Decoder (UVD)
Operating Frequency (max)
Configuration type
Analog RGB
Analog TV
Single / Dual-Link DVI
DisplayPort 1.1a
DisplayPort 1.2
Single / Dual-Link LVDS
HDMI™
Number Independent Displays (max)2
HD Audio Controller (Azalia)
HDCP Keys
DVO
GPU BGA enabling embedded system designers to develop
one system for both the AMD Radeon™ E6460 GPU and the
high-performance AMD Radeon™ E6760 GPU.
AMD understands the unique requirements of the embedded market. With the graphics memory integrated onto the
same BGA package, the AMD Radeon™ E6460 GPU saves
development time plus AMD manages memory device
obsolescence. The performance, flexibility, and easy design
of the AMD Radeon™ E6460 GPU provides system designers
with an exciting and innovative solution for their embedded
graphics applications.
AMD Radeon™ E6460
GPU + memory, 33 mm x 33 mm BGA
~20W
40 nm
600 MHz
PCI Express® 2.1 (x1, x2, x4, x8, x16)
2 SIMD engines x 80 processing elements = 160 shaders
192 GFLOPS
2195
AMD App Acceleration, AMD Eyefinity & AMD HD3D technologies
DirectX® 11
Shader Model 5.0
OpenGL 4.1
AMD App Acceleration2, OpenCL™ 1.1, DirectCompute 11
UVD3 for H.264, VC-1, MPEG-2, MPEG-4 part 2 decode
800 MHz / 3.2 Gbps
64-bit wide, 512 MB, GDDR5, 25.6 GB/s
1x Triple 10-bit DAC, 400 MHz
NA
4x Single-Link DVI / 1x Dual-Link DVI
2x
3x
1 x Single-Link / Dual-Link
1x HDMI 1.4a
Up to 2 display outputs from VGA, Single / Dual- Link DVI, Single / Dual-Link LVDS, HDMI 1.4a, DisplayPort 1.1a /
1.2 + up to 2 display outputs from DisplayPort 1.1a / 1.23
1x
4x
12-bit DDR or 24-bit SDR / DDR
System configuration: 1280x1024, E2400: 600e/700m, 128MB GDDR3, E6460: 600e/800m, 512MB GDDR5, E6760: 600e/800m, 1 GB GDDR5, AMD: AMD Athlon™ II X4 620 @ 2.6GHz, MSI Gigabyte GAMA770T-UD3P, Corsair XMS3 4GB (2x2GB) 1333MHz 9-9-9-24 (TW3X4G1333C9A G), Windows® 7 64-bit Ultimate
2
Not all display interfaces available at same time. Maximum resolution dependent on link bit-rate and available memory bandwidth.
3
Two internal PLLs + an integrated DisplayPort reference clock can support (1) two legacy display outputs + two DisplayPort outputs, (2) one legacy display output + three DisplayPort outputs or (3) four
DisplayPort outputs. Legacy display output includes VGA, single / dual-link DVI, single / dual-link LVDS and HDMI 1.4a.
1
WWW.AMD.COM/EMBEDDED | PAGE 33
AMD EMBEDDED SOLUTIONS GUIDE
MCM BGA
AMD Radeon™ E6460 GPU
MXM v3.0
AMD Radeon™ E6460 GPU
A MD Embedded Radeon™ 6460 GPU
PCIe x16 Gen 2
DVI, 2560 x 1600
HDMI, 1920 x 1080
DisplayPort, 2560 x 1600
LVDS, 2048 x 1536
AMD
A MD Embedded Radeon™ 6460 GPU
PCIe x16 Gen 2
HDMI, 1920 x 1080
DisplayPort, 2560 x 1600
LVDS, 2048 x 1536
Also available with fan or heatpipe
AMD
PHONE408-749-4000
EMAIL [email protected]
WEB
www.amd.com/embedded
PHONE408-749-4000
EMAIL [email protected]
WEB
www.amd.com/embedded
ATX - 4x DVI
AMD Radeon™ E6460 GPU
ATX - 4x mDP
AMD Radeon™ E6460 GPU
A MD Embedded Radeon™ 6460 GPU
PCIe x16 Gen 2
4x DVI, 1600 x 1200
Fanless (heatsink)
AMD
A MD Embedded Radeon™ 6460 GPU
PCIe x16 Gen 2
4x mDP, 2560 x 1600
Fanless (heatsink)
AMD
PHONE408-749-4000
EMAIL [email protected]
WEB
www.amd.com/embedded
PHONE408-749-4000
EMAIL [email protected]
WEB
www.amd.com/embedded
Rugged Graphics
Mezzanine Card
XMCGA7
Graphic Card
PCIe-6460
A MD Embedded Radeon™ 6460 GPU
Gaming, Digital Signage
2x DVI-I Connectors
Support Active and passive dangle
Heatsink + 2-BB Fan ( 1 x slot )
PCI Express® 2.1 (x1, x2, x4, x8, x16)
A MD Embedded Radeon™ 6460 GPU
512 MB GDDR5 SDRAM
x8 PCI Express (Gen 2 capable)
Two independent output channels (Dual Head)
Front and rear I/O options
Air- and conduction-cooled variants
GE Intelligent Platforms
PHONE1-800-433-2682
WEB
http://defense.ge-ip.com/
PAGE 34 | JULY 2014
IBASE
PHONE+886-2-2655-7588
FAX
+886-2-2655-7388
EMAIL [email protected]
WEB www.IBASE-usa.com
AMD EMBEDDED SOLUTIONS GUIDE
MXM v3.0
MXM-A6460
MXM v3.0
EM91F
A MD Embedded Radeon™ 6460 GPU
Up to 4 DP HD 1080P output
DRAM Type: GDDR5
Gaming, Server, Information Appliance,
Medical, Digital Signage
J&WIPC Technology Development CO., Ltd.
PHONE+86-0755-23981698
WEB
http://en.jwipc.com/
EMAIL [email protected]
A MD Embedded Radeon™ 6460 GPU
Industrial-grade passive electronic components
Memory: 512MB GDDR5
Tested between -20 ~ 55°C
Industrial control and automation
TUL Corporation
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
ATX
ER91F
ATX
ER91FC
A MD Embedded Radeon™ 6460 GPU
1x DVI-I, 2x Mini DP, 1x HDMI display output
Memory: 512MB GDDR5
Tested between -20 ~ 55°C
Digital signage, digital gaming
TUL Corporation
A MD Embedded Radeon™ 6460 GPU
1x Dual Link DVI-I, 1x Single Link DVI-I port
Industrial-grade passive electronic components
Memory: 512MB GDDR5
Tested between -20 ~ 55°C
TUL Corporation
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
MCM BGA
ER91FL
ATX
ER91FLA
A MD Embedded Radeon™ 6460 GPU
4 sets of Mini Display outputs
Industrial-grade passive electronic components
Memory: 512MB GDDR5
Tested between -20 ~ 55°C
TUL Corporation
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
AMD Embedded Radeon™ 6460 GPU
V GA, DVI and HDMI outputs
Industrial-grade passive electronic components
Memory: 512MB GDDR5
Tested between -20 ~ 55°C
TUL Corporation
PHONE886 8698 3000 ext. 261 EMAIL [email protected]
WEB
www.tulembedded.com
WWW.AMD.COM/EMBEDDED | PAGE 35
SMALL FOOTPRINT, LARGE IMPACT.
AMD has an extensive history of leadership in the thin
WHAT YOU DON’T SEE IS AS
IMPRESSIVE AS WHAT YOU DO.
client market, offering solutions that provide reduced operating
costs and power consumption, higher durability and increased
longevity over personal computers. Industries such as healthcare,
education and government can get high levels of performance
without compromise, empower IT staff, protect client/patient
data, and manage tight budgets.
Learn more at www.amd.com/embedded
Inspiring Embedded Innovation.
© 2014 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. PID: 54853-A
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