MX500 Data Sheet Rev B

MX500 Series NAND Flash SSD

Features

MX500 2.5-inch and M.2 SATA NAND

Flash SSD

CT250MX500SSD1, CT500MX500SSD1, CT1000MX500SSD1,

CT2000MX500SSD1, CT250MX500SSD4, CT500MX500SSD4,

CT1000MX500SSD4

Features

• Micron

®

3D TLC NAND Flash

• RoHS-compliant package

• SATA 6 Gb/s interface

• TCG/Opal 2.0-compliant self-encrypting drive (SED)

• Compatible with Microsoft eDrive

®

• Hardware-based AES-256 encryption engine

• ATA modes supported

– PIO mode 3, 4

– Multiword DMA mode 0, 1, 2

– Ultra DMA mode 0, 1, 2, 3, 4, 5, 6

• Industry-standard, 512-byte sector size support

• Hot-plug/hot-remove capable (2.5”)

• Device sleep (DEVSLP), extreme low-power mode

• Native command queuing support with 32-command support

• ATA-8 ACS-3 revision 5 command set compliant

• ATA security feature command set and password login support

• SECURE ERASE (data page) command set: fast and secure erase

• SANITIZE BLOCK ERASE and SANITIZE

CRYPTO SCRAMBLE support

• Self-monitoring, analysis, and reporting technology

(SMART) command set

• Performance

1,2

– Sequential 128KB READ: Up to 560 MB/s

– Sequential 128KB WRITE: Up to 510 MB/s

– Random 4KB READ: Up to 95,000 IOPS

– Random 4KB WRITE: Up to 90,000 IOPS

• Reliability

– MTTF: 1.8 million device hours

2

– Static and dynamic wear leveling

– NAND-integrated power loss immunity, to protect data at rest

• Low power consumption

– Device Sleep: <3mW

– DIPM: 110mW TYP

4

• Endurance – total bytes written (TBW)

– Up to 360TB

• Capacity (unformatted): 250GB, 500GB, 1000GB,

2000GB

• Mechanical:

– 2.5 inch x 7mm z-height

– M.2 Type 2280 (22mm x 80mm)

• Secure field-upgradeable firmware

• Power consumption: 250GB: <3.5W; 500GB: <4.5W;

1000GB/2000GB: <5.0W

• Operating temperature

– Commercial (0°C to 70°C)

5

Notes: 1. Typical I/O performance numbers as measured fresh-out-of-the-box (FOB) using CrystalDisk-

Mark with a queue depth of 32 and write cache enabled

2. 4 KB transfers used for READ/WRITE latency values.

3. The product achieves a mean time to failure

(MTTF) based on population statistics not relevant to individual units.

4. Active average power measured during execution of MobileMark

®

with DIPM (device initiated power management) enabled.

5. Temperature measured by SMART attribute

194.

Warranty: Contact your sales representative for further information regarding the product, including product warranties.

MX500 Series NAND Flash SSD

CTSSDMX500.fm - Rev. 11/28/17

1

Micron Technology Inc., reserves the right to change products or specifications without notice..

©2017 Micron Technology Inc.

Products and specifications discussed herein are subject to change without notice.


Features

Part Numbering Information

The SSD is available under Micron's Crucial brand in different configurations and densities. The chart below is a comprehensive list of options for the MX500 series devices; not all options listed can be combined to define an offered product.

Figure 1: Part Number Chart

Crucial Technology

CT = Crucial

Drive Capacity

250 = 250GB

500 = 5000GB

1000 = 1000GB = 1TB

2000 = 2000GB = 2TB

CT 500 MX500 SSD 1

Form Factor

1 = 2.5-inch 7mm

4 = M.2 (22mm x 80mm)

Solid State Drive

Product Line



2

Micron Technology Inc., reserves the right to change products or specifications without notice.

©2017 Micron Technolog Inc


General Description

General Description

Micron’s solid state drive (SSD) uses a single-chip controller with a SATA interface on the system side and 4-channels of Micron NAND Flash internally. Packaged in an 2.5-inch

HDD replacement enclosure, or in the ultra-portable M.2 configuration, the SSD integrates easily in existing storage infrastructures.

The SSD is designed to use the SATA interface efficiently during both READs and

WRITEs while delivering bandwidth-focused performance. SSD technology enables enhanced boot times, faster application load times, reduced power consumption, and extended reliability.

The self-encrypting drive (SED) features an AES-256 encryption engine, providing hardware-based, secure data encryption, with no loss of SSD performance. This SED follows the TCG/Opal specification for trusted peripherals.

When TCG/Opal features are not enabled, the device can also perform data encrytion by invoking the ATA Security command set encryption features, to provide full drive encryption (FDE) managed by the host system BIOS. TCG/Opal and ATA Security feature sets cannot be enabled simultaneously.

The data encryption is always running; however, encryption keys are not managed and the data is not secure until either TCG/Opal or ATA Security feature sets are enabled.

Figure 2: Functional Block Diagram

SATA

SSD controller

NAND

NAND

NAND

NAND



DRAM buffer

3




Performance

Performance

Measured performance can vary for a number of reasons. The major factors affecting drive performance are the capacity of the drive and the interface of the host. Additinally, overall system performance can affect the measured drive performance. When comparing drives, it is recommended that all system variables are held unchanged, and only the drive being tested varies.

For SSDs designed for the client computing market, Micron specifies performance in fresh-out-of-box (FOB) state. Data throughput measured in steady state may be lower than

FOB state, depending on the nature of the data workload.

For a description of these performance states and of Micron's best practices for performance measurement, refer to Micron's technical marketing brief, Best Practices or SSD

Performance Measurement.

Table 1: Drive Performance - 1 2.5”

Capacity

Interface Speed

Sequential read (128KB transfer)

Sequential write (128KB transfer)

Random read (4KB transfer)

Random write (4KB transfer)

250GB

560

510

95,000

90,000

500GB

560

510

95,000

90,000

6 Gb/s

1000GB

560

510

95,000

90,000

2000GB

560

510

95,000

90,000

Unit

MB/s

MB/s

IOPS

IOPS

Notes:

1. Performance numbers are maximum values, except as noted.

2. I/O performance numbers as measured using CrystalDiskMark with a queue depth of 32 and write cache enabled. Fresh-out-of-box (FOB) state is assumed. For performance measurement purposes, the SSD may be restored to FOB state using the secure erase command

3. Iometer measurements are performed on an 20GB span of logical block addresses (LBAs).

4. System variations will affect measured results.



4




Logical Block Address Configuration

Logical Block Address Configuration

The drive is set to report the number of logical block addresses (LBA) that will ensure sufficient storage space for the specified capacity. Standard LBA settings, based on the

IDEMA standard (LBA1-03), are shown below.

Table 2: Standard LBA Settings

Decimal

Total LBA

Hexadecimal Capacity

250GB

500GB

1000GB

2000GB

Decimal

Max LBA

Hexadecimal

3,907,029,168 E8E088B0 3,907,029,167

User Available

Bytes

(Unformatted)

E8E088AF 2,000,398,934,016



5




Reliability

Reliability

Micron’s SSDs incorporate advanced technology for defect and error management. They use various combinations of hardware-based error correction algorithms, data parity protection, firmware-based static and dynamic wear-leveling algorithms.

Mean Time To Failure

Mean time to failure (MTTF) for the SSD can be predicted based on the component reliability data using the methods referenced in the Telcordia SR-332 reliability prediction procedures for electronic equipment, and is validated in Reliability Demonstration Test

(RDT).

Table 3: MTTF

Capacity

All capacities

MTTF (Operating Hours)

1

1.8 million

Notes:

1. Mean Time to Failure (MTTF) is a statistic which estimates the performance of a large population of devices, and is not predictive of the lifetime of individual units.



6




Reliability

Endurance

Endurance for the SSD can be predicted based on the usage conditions applied to the device, the internal NAND component cycles, the write amplification factor, and the wearleveling efficiency of the drive. The tables below show the drive lifetime for each SSD capacity by client computing and sequential input and based on predefined usage conditions.

Table 4: Drive Lifetime – Client Computing

Capacity

250GB

500GB

1000GB

2000GB

Drive Lifetime (Total Bytes Written)

100TB

180TB

360TB

700TB

Notes:

1. Total bytes written calculated with the drive 90% full.

2. SSD write cache is enabled.

3. Access patterns used during reliability testing are 25% sequential and 75% random and consist of the following: 1% are 512B; 44% are 4 KiB; 35% are 64 KiB; and 20% are 128 KiB. (Note:

Disabling write cache is not recommended.)

4. Host workload parameters, including write cache settings, I/O alignment, transfer sizes, randomness, and percent full, that are substantially different than the described notes may result in varied endurance results.

5. GB/day can be calculated by dividing the total bytes written value by the number of days in the interval of interest (365 days × number of years). For example: 100 TB/3 years/365 days = 91

GB/day for 3 years.



7




Electrical Characteristics

Electrical Characteristics

Environmental conditions beyond those listed may cause permanent damage to the device.

This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Table 5: SATA Power Consumption

Capacity

250GB

500GB

1000GB

2000GB

Device Sleep

Typical

2

2

2

Idle Average Active Average

55 70

65

110

75

150

Active Maximum

(128KB transfer)

3000

4000

5000

6000

Unit

mW mW

Notes:

1. TData taken at 25°C using a 6 Gb/s SATA interface.

2. Active average power measured while running MobileMark Productivity Suite.

3. Host and device initiated power management (DIPM) enabled. DIPM slumber and DEVSLP enabled.

4. Active maximum power is an average power measurement performed using Iometer with

128KB sequential write transfers..

Table 6: Maximum Ratings

Parameter/Condition

Voltage input

Voltage input, M.2

Operating temperature

Non-operating temperature

Rate of temperature change

Relative humidity (non-condensing)

Symbol

V5

3V3

T

C

–

–

–

Min

4.5

3.14

0

–

40

–

5

Max

5.5

3.46

70

85

20

95

Unit

V

V

°C

°C

°C/hour

%

Notes

–

–

–

–

1

–

Notes:

1. Operating temperature is best measured by reading the SSD's on-board temperature sensor, which is recorded in SMART attribute 194 (or 0xC2).

Table 7: Shock and Vibration

Parameter/Condition

Non-operating shock

Non-operating vibration

Specification

1500G/0.5ms

5–800Hz @ 3.1G



8




Dynamic Write Acceleration

Dynamic Write Acceleration

Dynamic write acceleration optimizes SSD performance for typical client-computing environments, where WRITE operations tend to occur in bursts of commands with idle time between these bursts.

Capacity for accelerated performance is derived from the adaptive usage of the SSD's native

NAND array, without sacrificing user-addressable storage. Recent advances in Micron

NAND technology enable the SSD firmware to achieve acceleration through on the fly mode switching between SLC and TLC modes to create a high-speed SLC pool that changes in size and location with usage conditions.

During periods of idle time between write bursts, the drive may free additional capacity for accelerated write performance. The amount of accelerated capacity recovered during idle time depends on the portion of logical addresses that contain user data and other runtime parameters. In applications that do not provide sufficient idle time, the device may need to perform SLC-to-TLC data migration during host activity.

Under accelerated operation, write performance may be significantly higher than nonaccelerated operations. Power consumption per-byte written is lower during accelerated operation, which may reduce overall power consumption and heat production.



9




Adaptive Thermal Monitoring

Adaptive Thermal Monitoring

The device features adaptive thermal monitoring. While most host computers exhibit operating environments that keep an SSD running in the range of 40°C to 45°C, adaptive thermal monitoring enables the SSD to operate in a wide variety of environments by slowing data throughput when the device temperature, (as indicated by SMART attribute #194), exceeds the maximum specified operating temperature of 70°C helping to prevent the host computer from running at excessive temperatures.

The device may shut down completely at a temperature point well above the specified maximum, to prevent permanent damage to the SSD and to the host computer.



10




TCG/Opal Support

TCG/Opal Support

Table 8: TCG/Opal Support Parameters

Property

TCG Storage Specifications

OPAL: TCG Storage Security SubSystem

Class

TCG Core Specification

TCG Storage Interface Interactions

Specification

Supported? Comments

Specification 2.00 Revision 1.00, Feb 24, 2012

Specification 2.00 Revision 2.00, Nov 4, 2011

TCG Reference

Specification

Specification Version 1.02 Revision 1.00 30 December,

2011



11




Interface Connectors


The SATA signal segment interface cable has four conductors and three ground connections. As shown in Package Dimensions, the cable includes a 7-pin signal segment and a 15-pin power segment arranged in a single row with a 1.27mm (0.050in) pitch.

Figure 3: SSD Interface Connections

Table 9: SATA Signal Segment Pin Assignments

Signal Name

S1

S2

S3

S4

S5

S6

S7

Type

GND

A+

A–

GND

B–

B+

GND

Table 10: 2.5-Inch SATA Power Segment Pin Assignments

Pin#

P9

P10

P11

P12

P13

P14

P15

P5

P6

P7

P8

P1

P2

P3

P4

Signal Name

V5

GND

DAS

GND

V12

V12

V12

RETIRED

RETIRED

DEVSLP

GND

GND

GND

V5

V5

Description

No connect

No connect

Device sleep

Ground

Ground

Ground

5V power, precharge

5V power

5V power

Ground

Device activity signal

Ground

No connect

No connect

No connect

Description

Ground

Differential signal pair A and A

Ground

Differential signal pair B and B

Ground



12





M.2 2280 (22mm x 80mm)

Figure 4: Interface Connections – M.2

Table 11: SATA Signal Segment Pin Assignments

45

47

49

51

37

39

41

43

53

55

57

29

31

33

35

21

23

25

27

Pin #

7

9

11

1

3

5

67

69

71

73

75

Primary Side

Signal Name

CONFIG_3

GND

N/C

N/C

N/C

N/C

Key

CONFIG_0

N/C

N/C

GND

N/C

N/C

GND

N/C

N/C

GND

SATA B+

SATA B–

GND

SATA A–

SATA A+

GND

N/C

N/C

GND

Key

N/C

CONFIG_1

GND

GND

CONFIG_2

Description

Ground

Ground

No connect

No connect

No connect

No connect

Ground

No connect

No connect

Ground

No connect

No connect

Ground

No connect

No connect

Ground

SATA B differential pair

Ground

SATA A differential pair

Ground

No connect

No connect

Ground

No connect

Ground

Ground

Ground

Ground



13

20

46

48

50

52

38

40

42

44

54

56

58

30

32

34

36

22

24

26

28

Pin #

2

4

6

8

10

68

70

72

74

Secondary Side

Signal Name

3V3

3V3

N/C

N/C

DAS/DSS

Key

N/C

DEVSLP

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

Reserved

Reserved

Reserved

3V3

3V3

3V3

Key

Description

3.3V

3.3V

No connect

No connect

Drive activity (host LED)

No connect

3.3V

3.3V

3.3V

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

Vendor use

Vendor use




Physical Configuration


2.5-Inch 7mm

Product mass: 70 grams MAX

Physical dimensions conform to the applicable form factor specifications as listed in the figure below.

Figure 5: 2.5-Inch Package – 7mm

H +0.00/-0.50

(2X M3)

(Both sides)

(3.50)

(4.80)

(3.00)

(14.00)

W ±0.25

(90.60)

L MAX

(4X M3)

4.07

61.71

14.00

Notes: 1. All dimensions are in millimeters.

90.60

Table 12: 2.5-Inch Package Dimensions

Density (GB)

250

500

1000

2000

W

69.85

L

100.45

Notes: 1. Dimension values in millimeter per SFF 8201 Rev. 3.3.

H

7.00



14

Unit

mm





M.2 2280 (22mm x 80mm)

Product mass: less than 10 grams

Physical dimensions conform to the applicable form factor specifications as listed in the figure below.

Figure 6: M.2 Type 2280 Package

Notes: 1. All dimensions are in millimeters.

Table 13: M.2 Type 2280 Package Dimensions

Capacity (GB)

250

500

1000

Specification

S2

D3

W

22.00

L

80.00

A

1.35

Notes: 1. Dimension values in millimeter per SFF 8201 Rev. 3.3.

B

0.80

C

1.50

Unit

mm



15




Compliance

Compliance

Micron SSDs comply with the following:

• Micron Green Standard

• Built with sulfur resistant resistors

• CE (Europe): EN55032, EN55024 Class B, RoHS

• FCC: CFR Title 47, Part 15, Class B

• UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN

60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013

• BSMI (Taiwan): approval to CNS 13438 Class B, CNS 15663

–

http://www.crucial.com/usa/en/company-environmental

• CM (Morocco): Approval to No. 2574.14 and No. 2573.14 of 16 July 2015

• RCM (Australia, New Zealand): AS/NZS CISPR32 Class B

• KC RRL (Korea): approval to KN32 Class B, KN 35 Class B

• W.E.E.E.: Compliance with EU WEEE directive 2012/19/EC. Additional obligations may apply to customers who place these products in the markets where WEEE is enforced.

• TUV (Germany): approval to IEC60950/EN60950

• VCCI (Japan): 2015-04 Class B

• IC (Canada): ICES-003 Class B

– This Class B digital apparatus complies with Canadian ICES-003.

– Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada



16



FCC Rules


Compliance

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.



17



References


References

• Serial ATA: High-speed serialized AT attachment, Serial ATA working group, available at www.sata-io.org

• SATA 3.3 GOLD,

• ATA-8 ACS4 (T13/BSR INCITS 529, Revision 14)

• SFF 8201 Rev. 3.3: 2.5-inch form factor

• PCI Express M.2 Specification rev 1.0: For M.2 form factor

• TCG Storage Security Subsystem Class Opal; Specification 2.00 Revision 1.00, Feb 24,

2012

• TCG Core Specification; Specification 2.00 Revision 2.00, Nov 4, 2011

• TCG Storage Interface Interactions: Specification Version 1.02 Revision 1.00 30

December, 2011

• IEEE-1667: "Standard Protocol for Authentication in Host Attachments of Transient

Storage Devices

• Trade Agreements Act of 1979 (19 U.S.C. 2501)



18




Revision History

Revision History

Rev. A – 12/17

• Initial release

Rev.

B – 12/17

•

Table 5, revised Device Sleep to typical values.

3475 E. Commercial Ct., Meridian, ID 83642, Tel: 208-363-5500, Internet: http://www.crucial.com © 2017 Micron Technology, Inc.

All rights reserved. Micron and the Crucial logo are registered trademarks of Micron Technology, Inc.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

All other brands and names used herein are the property of their respective owners. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.



19

Micron Technology Inc., reserves the right to change products or specifications without notice..

©2017 Micron Technology Inc.

MX500 Data Sheet Rev B

MX500 Series NAND Flash SSD

Features

MX500 2.5-inch and M.2 SATA NAND

Flash SSD

CT250MX500SSD1, CT500MX500SSD1, CT1000MX500SSD1,

CT2000MX500SSD1, CT250MX500SSD4, CT500MX500SSD4,

CT1000MX500SSD4

Features

MX500 Series NAND Flash SSD

Features

Part Numbering Information

Crucial Technology

Drive Capacity

CT 500 MX500 SSD 1

Form Factor

Solid State Drive

Product Line

MX500 Series NAND Flash SSD

General Description

General Description

SSD controller

DRAM buffer

MX500 Series NAND Flash SSD

Performance

Performance

MX500 Series NAND Flash SSD

Logical Block Address Configuration

Logical Block Address Configuration

MX500 Series NAND Flash SSD

Reliability

Reliability

Mean Time To Failure

MX500 Series NAND Flash SSD

Reliability

Endurance

MX500 Series NAND Flash SSD

Electrical Characteristics

Electrical Characteristics

MX500 Series NAND Flash SSD

Dynamic Write Acceleration

Dynamic Write Acceleration

MX500 Series NAND Flash SSD

Adaptive Thermal Monitoring

Adaptive Thermal Monitoring

MX500 Series NAND Flash SSD

TCG/Opal Support

TCG/Opal Support

MX500 Series NAND Flash SSD

Interface Connectors

Interface Connectors

MX500 Series NAND Flash SSD

Interface Connectors

M.2 2280 (22mm x 80mm)

MX500 Series NAND Flash SSD

Physical Configuration

Physical Configuration

2.5-Inch 7mm

MX500 Series NAND Flash SSD

Physical Configuration

M.2 2280 (22mm x 80mm)

MX500 Series NAND Flash SSD

Compliance

Compliance

FCC Rules

MX500 Series NAND Flash SSD

Compliance

References

MX500 Series NAND Flash SSD

References

MX500 Series NAND Flash SSD

Revision History

Revision History

Rev. A – 12/17

Rev.

B – 12/17

Related manuals

Crucial

CT500MX500SSD1

Crucial