MX500 Data Sheet Rev B

MX500 Series NAND Flash SSD

Electrical Characteristics

Electrical Characteristics

Environmental conditions beyond those listed may cause permanent damage to the device.

This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

Table 5: SATA Power Consumption

Capacity

250GB

500GB

1000GB

2000GB

Device Sleep

Typical

2

2

2

Idle Average Active Average

55 70

65

110

75

150

Active Maximum

(128KB transfer)

3000

4000

5000

6000

Unit

mW mW

Notes:

1. TData taken at 25°C using a 6 Gb/s SATA interface.

2. Active average power measured while running MobileMark Productivity Suite.

3. Host and device initiated power management (DIPM) enabled. DIPM slumber and DEVSLP enabled.

4. Active maximum power is an average power measurement performed using Iometer with

128KB sequential write transfers..

Table 6: Maximum Ratings

Parameter/Condition

Voltage input

Voltage input, M.2

Operating temperature

Non-operating temperature

Rate of temperature change

Relative humidity (non-condensing)

Symbol

V5

3V3

T

C

–

–

–

Min

4.5

3.14

0

–

40

–

5

Max

5.5

3.46

70

85

20

95

Unit

V

V

°C

°C

°C/hour

%

Notes

–

–

–

–

1

–

Notes:

1. Operating temperature is best measured by reading the SSD's on-board temperature sensor, which is recorded in SMART attribute 194 (or 0xC2).

Table 7: Shock and Vibration

Parameter/Condition

Non-operating shock

Non-operating vibration

Specification

1500G/0.5ms

5–800Hz @ 3.1G

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MX500 Series NAND Flash SSD

Dynamic Write Acceleration

Dynamic Write Acceleration

Dynamic write acceleration optimizes SSD performance for typical client-computing environments, where WRITE operations tend to occur in bursts of commands with idle time between these bursts.

Capacity for accelerated performance is derived from the adaptive usage of the SSD's native

NAND array, without sacrificing user-addressable storage. Recent advances in Micron

NAND technology enable the SSD firmware to achieve acceleration through on the fly mode switching between SLC and TLC modes to create a high-speed SLC pool that changes in size and location with usage conditions.

During periods of idle time between write bursts, the drive may free additional capacity for accelerated write performance. The amount of accelerated capacity recovered during idle time depends on the portion of logical addresses that contain user data and other runtime parameters. In applications that do not provide sufficient idle time, the device may need to perform SLC-to-TLC data migration during host activity.

Under accelerated operation, write performance may be significantly higher than nonaccelerated operations. Power consumption per-byte written is lower during accelerated operation, which may reduce overall power consumption and heat production.

MX500 Series NAND Flash SSD

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Micron Technology Inc., reserves the right to change products or specifications without notice.

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MX500 Series NAND Flash SSD

Adaptive Thermal Monitoring

Adaptive Thermal Monitoring

The device features adaptive thermal monitoring. While most host computers exhibit operating environments that keep an SSD running in the range of 40°C to 45°C, adaptive thermal monitoring enables the SSD to operate in a wide variety of environments by slowing data throughput when the device temperature, (as indicated by SMART attribute #194), exceeds the maximum specified operating temperature of 70°C helping to prevent the host computer from running at excessive temperatures.

The device may shut down completely at a temperature point well above the specified maximum, to prevent permanent damage to the SSD and to the host computer.

MX500 Series NAND Flash SSD

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MX500 Series NAND Flash SSD

TCG/Opal Support

TCG/Opal Support

Table 8: TCG/Opal Support Parameters

Property

TCG Storage Specifications

OPAL: TCG Storage Security SubSystem

Class

TCG Core Specification

TCG Storage Interface Interactions

Specification

Supported? Comments

Specification 2.00 Revision 1.00, Feb 24, 2012

Specification 2.00 Revision 2.00, Nov 4, 2011

TCG Reference

Specification

Specification Version 1.02 Revision 1.00 30 December,

2011

MX500 Series NAND Flash SSD

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MX500 Series NAND Flash SSD

Interface Connectors

Interface Connectors

The SATA signal segment interface cable has four conductors and three ground connections. As shown in Package Dimensions, the cable includes a 7-pin signal segment and a 15-pin power segment arranged in a single row with a 1.27mm (0.050in) pitch.

Figure 3: SSD Interface Connections

Table 9: SATA Signal Segment Pin Assignments

Signal Name

S1

S2

S3

S4

S5

S6

S7

Type

GND

A+

A–

GND

B–

B+

GND

Table 10: 2.5-Inch SATA Power Segment Pin Assignments

Pin#

P9

P10

P11

P12

P13

P14

P15

P5

P6

P7

P8

P1

P2

P3

P4

Signal Name

V5

GND

DAS

GND

V12

V12

V12

RETIRED

RETIRED

DEVSLP

GND

GND

GND

V5

V5

Description

No connect

No connect

Device sleep

Ground

Ground

Ground

5V power, precharge

5V power

5V power

Ground

Device activity signal

Ground

No connect

No connect

No connect

Description

Ground

Differential signal pair A and A

Ground

Differential signal pair B and B

Ground

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MX500 Series NAND Flash SSD

Interface Connectors

M.2 2280 (22mm x 80mm)

Figure 4: Interface Connections – M.2

Table 11: SATA Signal Segment Pin Assignments

45

47

49

51

37

39

41

43

53

55

57

29

31

33

35

21

23

25

27

Pin #

7

9

11

1

3

5

67

69

71

73

75

Primary Side

Signal Name

CONFIG_3

GND

N/C

N/C

N/C

N/C

Key

CONFIG_0

N/C

N/C

GND

N/C

N/C

GND

N/C

N/C

GND

SATA B+

SATA B–

GND

SATA A–

SATA A+

GND

N/C

N/C

GND

Key

N/C

CONFIG_1

GND

GND

CONFIG_2

Description

Ground

Ground

No connect

No connect

No connect

No connect

Ground

No connect

No connect

Ground

No connect

No connect

Ground

No connect

No connect

Ground

SATA B differential pair

Ground

SATA A differential pair

Ground

No connect

No connect

Ground

No connect

Ground

Ground

Ground

Ground

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20

46

48

50

52

38

40

42

44

54

56

58

30

32

34

36

22

24

26

28

Pin #

2

4

6

8

10

68

70

72

74

Secondary Side

Signal Name

3V3

3V3

N/C

N/C

DAS/DSS

Key

N/C

DEVSLP

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

N/C

Reserved

Reserved

Reserved

3V3

3V3

3V3

Key

Description

3.3V

3.3V

No connect

No connect

Drive activity (host LED)

No connect

3.3V

3.3V

3.3V

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

No connect

Vendor use

Vendor use

Micron Technology Inc., reserves the right to change products or specifications without notice.

©2017 Micron Technolog Inc