IoT Demonstration Board
UM11209
Rev. 1.0 — 15 August 2019 User manual COMPANY PUBLIC
Document information Information Content
Keywords Class-D amplifier, Digital input, IoT Abstract This User Manual describes the IoT Demonstration PCB for NXP Semiconductors’ Class-D audio amplifier devices.
NXP Semiconductors Revision history Rev
1
Date
20190812
Description
Release
IoT Demonstration Board UM11209
UM11209
User manual COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 15 August 2019
© NXP B.V. 2019. All rights reserved.
2 / 9
NXP Semiconductors IoT Demonstration Board UM11209
1 Introduction
This User Manual describes the IoT Demonstration PCB for NXP Semiconductors’ Class D audio amplifier devices.
The IoT demonstration PCB is designed in such a way that it is easy to attach daughter boards containing several types of NXP Class D audio amplifiers.
IoT Demo Board
Tiny Translation PCB V BRD 3.6 – 6.5V
DC DATA POWER AUDIO I 2 S/ IOM2/PCM input 1 I 2 S/ IOM2/PCM input 2 I 2 C Switches and LEDs USB 3V3 LDO 1V8 LDO peripherals I 2 C uController i.MXRT1021
V V BAT DDD I 2 S/ IOM2/PCM input 1 I 2 S/ IOM2/PCM input 2 TFA8200HN 0x58 Tiny Translation PCB
(optional)
TFA8200HN 0x59 Version 1.0
5 June 2019 OUT_P OUT_S HF speaker HF speaker GPIO JTAG
Figure 1. : Block diagram demonstration PCB
2 Setup demonstration PCB
2.1 Hardware setup
Figure 2 is showing the hardware setup of the IoT demonstration PCB with screw
terminals for connecting the speaker cables (J26 and J27), J25 for the power supply and jumpers (JP1, JP2 and JP3) to configure the DUT voltages.
• •
The speaker(s) can be driven by the Class-D amplifier(s) (TFA#1 and TFA#2) with: A digital audio signal via the header J32; A USB audio stream via the USB-C connector J37.
Via the input selector (SW1) the audio path can be configured.
UM11209
User manual COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 15 August 2019
© NXP B.V. 2019. All rights reserved.
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NXP Semiconductors IoT Demonstration Board UM11209 Figure 2. : Setup demonstration PCB Table 1. Input/output connector assignment REF TYPE Pin
J26 Terminal block, screw 1 J27 Terminal block, screw 2 1 X32 Header, double row 2 1 2 3 4,6,8,10 5 7 9 UM11209
User manual COMPANY PUBLIC Label
OUTP OUTN OUTP OUTN MCLK 5V0 BCK GND FS TXD RXD
Description
TFA#1 PWM positive output TFA#1 PWM negative output TFA#2 PWM positive output TFA#2 PWM negative output TDM/ I 2 S Master Clock
[1]
5Vdc supply for peripheral TDM/ I 2 S Bit Clock
[1]
Ground TDM/ I 2 S Frame Select
[1]
TDM/ I 2 S Data Transmit
[1]
TDM/ I 2 S Data Receive
[1]
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NXP Semiconductors IoT Demonstration Board UM11209 REF
J37 JP1 JP2 JP3
TYPE
USB type C Header, single row Header, single row Header, single row 1 2 3 1 2
Pin
11 12 13 14 1 1 15 16 2 TFA#1 TFA#2 Headers, single row Headers, single row [1] Logic level can be set to 1.8V or 3.3V via solder joints
Label
DI2 SDA FS2 SCL BCK2 3V3 USB-C 1V8 VDDD 1V8 VDDE 3V3 5V0 VBAT TFA#1 TFA#2
Description
TDM/ I 2 S Data Receive bus 2 (if applicable)
[1]
I 2 C Data
[1]
TDM/ I 2 S Frame Select bus 2 (if applicable)
[1]
I 2 C Clock
[1]
TDM/ I 2 S Bit Clock bus 2 (if applicable)
[1]
3.3Vdc supply for peripheral Board supply, HID and USB Audio 1.8Vdc supply voltage TFA Supply Digital 1.8Vdc supply voltage TFA Supply I/O 3.3Vdc supply voltage 5Vdc supply voltage TFA Battery Daughter board #1 Daughter board #2
2.1.1 PCB switch settings
PCB switch SW1 is an array of DIP-switches for audio path input selection and configuration.
5 6 7 8
Table 2. Switch Label
1 SWITCH 1 2 3 4 SWITCH 2 SWITCH 3 SWITCH 4 TFA IMX EN TFA EXT EN IMX MIC EN IMX EXT EN
Description ON
Automatic configuration ON I 2 S Clock always on 64FS mode
reserved
Audio path i.MX ↔ TFA enabled Audio path TFA ↔ I/O enabled Audio path MIC ↔ i.MX enabled Audio path i.MX ↔ I/O enabled
Description OFF
Automatic configuration OFF I 2 S Clock only on when there is data active 32FS mode
reserved
Audio path i.MX ↔ TFA disabled Audio path TFA ↔ I/O disabled Audio path MIC ↔ i.MX disabled Audio path i.MX ↔ I/O disabled SW8, SW11 and SW12 are Firmware defined push buttons and are not assigned to any function in the current version.
Pressing SW4 causes the TFA(s) to reset. By default, this function is ‘active high’. By opening solder joint SJ12 and closing solder joint SJ13 it can be changed to ‘active low’.
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NXP Semiconductors IoT Demonstration Board UM11209
2.1.2 LEDs
The demo board has seven LEDs which have an indicator function.
Table 3. Label
LED1 LED2 LED3 LED4 1V8 3V3 5V0
Description
Control active / Heart beat Audio active, playback/ record Automatic configuration successful
reserved
1.8Vdc supply available 3.3Vdc supply available 5.0Vdc supply available
2.2 Firmware update • • • • • •
The firmware controlling the demonstration PCB may be updated by the user in a simple way. No specific hardware is needed.
Follow the steps below to update your board: Contact your NXP sales agent for the latest available FW revision.
Save the zipped file called "flash_bin_v
x_y
" to your local disk. (
x_y
stands for the revision number of the FW version) Unpack the zipped file and open the folder.
Close jumper J40 on the demonstration PCB (you may use tweezers) and plug in the USB connector. (you can remove the tweezers after plugging the USB) Double click the file "flash_bin_c
x_y
.bat" and wait till the script finishes. This takes about 15 - 20 seconds.
Unplug the USB connector, open jumper J40 and plug the USB connector to use the board with the updated firmware.
UM11209
User manual COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 15 August 2019
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NXP Semiconductors IoT Demonstration Board UM11209
3 Legal information
3.1 Definitions Draft
— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
3.2 Disclaimers Limited warranty and liability
— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes
to the publication hereof.
— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior
Suitability for use
— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications
— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Export control
— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Evaluation products
— This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.
Translations
— A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
3.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
UM11209
User manual COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 15 August 2019
© NXP B.V. 2019. All rights reserved.
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NXP Semiconductors IoT Demonstration Board UM11209
Tables
Tab. 1.
Tab. 2.
Input/output connector assignment ................... 4
............................................................................ 5
Figures
Fig. 1.
: Block diagram demonstration PCB ................. 3
Tab. 3.
............................................................................ 6
Fig. 2.
: Setup demonstration PCB .............................. 4
UM11209
User manual COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 15 August 2019
© NXP B.V. 2019. All rights reserved.
8 / 9
NXP Semiconductors
Contents
1 2
2.1
2.1.1
2.1.2
2.2
3
Introduction ......................................................... 3 Setup demonstration PCB ................................. 3
Hardware setup ................................................. 3
PCB switch settings ...........................................5
LEDs .................................................................. 6 Firmware update ................................................6
Legal information ................................................7
IoT Demonstration Board UM11209
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 August 2019 Document identifier: UM11209
