NXP TFA8200HN Highly power-efficient DSP embedded class-D audio amplifier Data Sheet
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TFA8200
Mono BTL class-D audio amplifier with digital inputs for IOT applications
Rev. 1 — 19 August 2019 Product data sheet
1 General description
The TFA8200 is a high-efficiency filter-free mono class-D audio amplifier with two separate digital inputs for Internet of things (IOT) applications.
The TFA8200 contains a processor that supports a range of sound processing features including a 5-band parametric equalizer, separate bass and treble control, a dynamic range compressor, soft clip control, and volume control. Excellent audio performance combined with high power supply rejection ratio (PSRR) is achieved by using a closed loop configuration.
Two independent digital audio inputs (I 2 S-bus/PCM/IOM2) are available for connecting a baseband and a multimedia processor.
The TFA8200 is available in an HVQFN24 package.
2 Features and benefits
2.1 General features • • • • • • • • • • •
Closed loop amplifier for:
–
High power supply rejection ratio
–
Excellent audio performance Digital input for high RF immunity High efficiency for maximizing battery life Wide supply voltage range (fully operational from 2.5 V to 5.5 V)
– –
Delivers high output power into 4 Ω and 8 Ω load impedances Phase-locked loop (PLL); no system clock required Protection including diagnostics via I 2 C-bus:
–
Overcurrent protection (OCP) to protect against short circuits across the speaker, to the supply line, or to ground Overtemperature protection (OTP) Digital inputs protected with underfrequency protection (UFP), overfrequency protection (OFP), and Invalid bit-clock protection (IBP) ‘Pop noise’ free at power-up/power down, during sample rate switching and when switching between digital inputs Four separate I 2 C-bus addresses for multi-channel applications 1.8 V/3.3 V tolerant digital inputs Only three external components required
NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 2.2 Programmable digital sound processor (DSP) • • • • • • • • •
Digital volume control (−70 dB to +24 dB) Digital parametric 5-band equalizer Bass and treble control (−18 dB to +18 dB) Dynamic range compressor:
–
Programmable attack and release levels
–
Programmable attack and release rates Soft and hard mute control Programmable DC blocking via high-pass filter Power limiter (0 dB to −124 dB in 0.5 dB steps) Zero crossing volume control Stereo-to-mono down-mix function
2.3 Interface format support for digital audio inputs • •
I 2 S formats (f s = 8 kHz to 96 kHz):
– – – – –
Philips standard I 2 S-bus Japanese I 2 S-bus MSB-justified Sony I 2 S-bus LSB-justified PCM / IOM2 formats (f s = 8 kHz or f s = 16 kHz): Long frame sync Short frame sync
3 Applications
• • •
Internet of things (IOT) devices Notebooks Portable gaming devices TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
4 Quick reference data
Table 1. Quick reference data
All parameters are guaranteed for V DDD = 1.8 V; V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i = 1 kHz; f s = 48 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V DDP V DDD I P power supply voltage digital supply voltage supply current on pin V on pin V on pin V mute on DDP DDD DDP ; amplifier mode with load; soft 2.5
1.65
1.8
5.7
5.5
V 1.95 V mA I DDD digital supply current on pin V DDP ; power down mode on pin V DDD ; amplifier mode 1.2
20 μA mA
5 15 μA P o(RMS) RMS output power on pin V DDD ; power down mode R L = 8 Ω THD+N = 1 % THD+N = 10 % 0.65
0.7
0.85
W W η po output power efficiency R L = 4 Ω THD+N = 1 % THD+N = 10 % R L = 8 Ω; V DDP = 4.2 V THD+N = 1 % THD+N = 10 % R L = 4 Ω; V DDP = 4.2 V THD+N = 1 % THD+N = 10 % R L = 8 Ω; V DDP = 5.0 V THD+N = 1 % THD+N = 10 % R L = 4 Ω; V DDP = 5.0 V THD+N = 1 % THD + N = 10 % P o(RMS) = 850 mW 1.2
1.5
0.9
1.1
1.6
1.95
1.35
1.6
2.35
2.75
92 W W W W W W W W W W % [1] After switching from off/amplifier mode to power-down mode.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
5 Ordering information
Table 2. Ordering information Type number Package
TFA8200HN
Name
HVQFN24
Description
plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
6 Block diagram
V DDD 23 SDA 1 SCL 2 I 2 C CONTROL
TFA8200
SDI1 SCK1 LRCK1 20 21 22 n.c.
6, 14 STABA 13 PROTECTION CIRCUITS: OCP OTP OFP UFP IBP TEST1 3 TEST2 15 TEST3 5 SDI2 SCK2 LRCK2 17 18 19 MUX DIGITAL AUDIO RECEIVER PLL 2nd ORDER LOOP HIGH PASS FILTER DSP VOLUME CONTROL DRC 5 BAND EQUALIZER ADSEL1 16 ADSEL2 4
Figure 1. Block diagram
24 GNDD BASS TREBLE BOOST DAP POWER LIMITER PWM 2nd ORDER LOOP H-BRIDGE
Version
SOT616_3 7, 8 V DDP 10 OUTA 9 OUTB 11, 12 GNDP
aaa-032537
TFA8200
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NXP Semiconductors
7 Pinning information
7.1 Pinning TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
terminal 1 index area SDA SCL TEST1 ADSEL2 TEST3 n.c.
1 2 5 6 3 4
TFA8200
DAP (1) 18 17 16 15 14 13 SCK2 SDI2 ADSEL1 TEST2 n.c.
STABA TFA8200
Product data sheet
aaa-032538
Transparent top view 1. Exposed die attach paddle (DAP)
Figure 2. Pin configuration 7.2 Pin description Table 3. Pin description Symbol Pin Pin Type Description
SDA 1 IO I 2 C-bus data input/output SCL 2 I I 2 C-bus bit clock input TEST1 ADSEL2 4 TEST3 n.c.
V DDP OUTB OUTA GNDP STABA n.c
3 5 6 9 10 11, 12 P 13 O 14 O O test signal input 1; for test purposes only; connect to PCB ground address selection input 2 test signal input 3; for test purposes only; connect to PCB ground not connected; connect to PCB ground analog supply voltage (2.5 V to 5.5 V) output B (negative) output A (positive) analog ground, PCB ground reference 1.8 V analog stabilizer output not connected; connect to PCB ground TEST2 15 ADSEL1 16 SDI2 SCK2 LRCK2 17 18 19 SDI1 20 I I I I I I test signal input 2; for test purposes only; connect to PCB ground address selection input 1 digital audio data input 2 digital audio bit clock input 2 digital audio word select input 2 digital audio data input 1 All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Symbol
SCK1 LRCK1 V DDD GNDD DAP -
Pin
21 22 23 24 I
Pin Type Description
digital audio bit clock input 1 I P P digital audio word select input 1 digital supply voltage (1.8 V) digital ground, PCB ground reference P exposed Die Attached Paddle (DAP); connect to PCB ground TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
8 Functional description
The TFA8200 is a high-efficiency mono bridge tied load (BTL) class-D amplifier with digital audio inputs. It supports all commonly used formats.
The key functional blocks of the TFA8200 are shown in
second order feedback loop.
. In the digital domain, the audio signal is processed and converted into a pulse width modulated (PWM) signal using a 3-level modulation. In the analog domain, the PWM signal is amplified using a The audio signal-processing path is described below: 1. The MUX selects the serial interface input to be used.
2. The digital audio receiver translates the serial input signal into a standard internal mono audio stream.
3. The programmable high-pass filter blocks DC signals and low frequency signals.
4. The volume control provides gain and attenuation functionality. The user can adjust it or it can be adjusted dynamically via the dynamic range compressor (DRC). The volume control can be used to adjust the signal level between −70 dB and +24 dB.
5. The 5-band parametric equalizer can be used to equalize the mono audio stream.
It can be used for speaker transfer curve compensation to optimize the audio performance of the speakers.
6. The bass and treble boost function provides another way to adjust the sound.
7. The power limiter limits the maximum output signal of the TFA8200. The power limiter settings are 0 dB to −124 dB in steps of 0.5 dB. This function can be used to limit the maximum output power delivered to the speakers at a fixed supply voltage and speaker impedance.
8. The PWM controller block converts the audio signal into a 3-level modulated PWM signal. The 3-level modulation provides a high signal-to-noise performance and eliminates clock jitter noise.
9. The second-order feedback loop ensures excellent audio performance and high power supply rejection ratio.
10.The H-BRIDGE allows the TFA8200 to deliver the required output power between terminals OUTA and OUTB.
The internal clocks of the TFA8200 are derived from the digital audio interface (SCK1 and SCK2) using a PLL. The reference input for the PLL is selected via the digital input MUX.
The audio signal path can be selected via the I 2 C-bus interface.
• • • • • •
The PLL block generates the system clock.
The following protection circuits are built into the TFA8200: Overtemperature protection (OTP) Overcurrent protection (OCP) Underfrequency protection (UFP) Overfrequency protection (OFP) Invalid bit-clock protection (IBP) DC-blocking TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.1 Operating modes
The TFA8200 supports the following operating modes, which are controlled via the I 2 C bus interface:
• Power-down mode
minimum; the I 2 , used to switch off the device; current consumption is reduced to a C-bus remains operational; the PWM outputs are disabled.
• Off mode
, in which the class-D amplifier is switched off; the TFA8200 is completely biased and the PWM outputs are disabled.
• Amplifier mode,
in which the digital inputs are used to generate a signal between OUTA and OUTB.
The TFA8200 device control settings are detailed in
8.1.1 Power-up/power-down
The power-up and power-down timing of the TFA8200 is illustrated in Figure 3
. Before the operating mode is selected, the external power supply levels, V bits OPMODE, bit POWERUP in the device control register ( DDP
and V DDD , must be within the specified operating ranges. Before the operating mode can be selected via
After the turn-on delay (t d(on) ), the device automatically generates a soft unmute function.
When OPMODE is set to 0, a soft mute function is generated. The TFA8200 must be set to power-down mode before the power supplies are disconnected or turned off.
V DDP , V DDD I 2 C POWERUP (00h, bit 0) I 2 C OPMODE (00h, bit 3) serial interface input signals OUTA, OUTB TFA8200
Product data sheet
filtered BTL output signal t d(on) operating t d(mute_off)
Figure 3. Power-up/power-down timing
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t d(soft_mute)
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.1.2 Supported digital audio data formats
The TFA8200 supports a commonly used range of I data formats. The I 2 S, PCM, and IOM2 digital audio S formats, selected via bits I2S_SET in the serial interface control
), are listed in
Table 4 . The PCM/IOM2 formats are listed in
.
The TFA8200 automatically detects the number of slots by measuring the ratio between
the sync frequency (8 kHz) and the data clock. Table 24 details the I
C settings for the PCM/IOM2 formats.
Table 4. I 2 S-supported digital audio data formats SCK frequency Interface format (MSB first)
32 f s I 2 S (Philips) standard MSB-justified 32 f s 32 f s 64 f s 64 f s 64 f s I LSB-justified - 16 bits 2 S (Philips) standard MSB-justified LSB-justified - 16 bits 64 f s 64 f s 64 f s LSB-justified - 18 bits LSB-justified - 20 bits LSB-justified - 24 bits
Supported data format
up to 16-bit data up to 16-bit data 16-bit data up to 24-bit data up to 24-bit data 16-bit data 18-bit data 20-bit data 24-bit data TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
WS LEFT RIGHT 1 2 3 1 2 3 BCK DATA MSB B2 MSB B2 I 2 S-BUS FORMAT MSB WS 1 BCK DATA MSB B2 2 LEFT 3 1 2 RIGHT 3 WS LSB MSB B2 MSB-JUSTIFIED FORMAT LEFT 16 15 2 1 LSB MSB B2 RIGHT 16 15 BCK DATA MSB B2 B15 LSB LSB-JUSTIFIED FORMAT 16 BITS MSB B2 WS LEFT RIGHT 18 17 16 15 2 1 18 17 16 15 BCK DATA MSB B2 B3 B4 B17 LSB LSB-JUSTIFIED FORMAT 18 BITS MSB B2 B3 B4 WS LEFT 20 19 18 17 16 15 2 1 RIGHT 20 19 18 17 16 15 BCK DATA MSB B2 B3 B4 B5 B6 B19 LSB LSB-JUSTIFIED FORMAT 20 BITS MSB B2 B3 B4 B5 B6 WS BCK 24 23 22 21 LEFT 20 19 18 17 16 15 2 1 24 23 22 21 RIGHT 20 19 18 17 16 15 DATA MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 B23 LSB
Figure 4. I 2 S-supported digital audio data formats
LSB-JUSTIFIED FORMAT 24 BITS MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 2 1 B15 LSB 2 1 B17 LSB 2 1 B19 LSB 2 1 B23 LSB
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TFA8200
Product data sheet
2 4 4 6 8
Table 5. PCM/IOM2-supported audio data formats Number of slots f s (kHz) Sync frequency (kHz) on LRCK pin
2 8 or 16 8 8 or 16 8 or 16 8 or 16 8 or 16 8 or 16 8 8 8 8 8 12 16 reserved 2 8 or 16 8 or 16 8 or 16 8 8 8
Supported data formats
8-bit data 8-bit data 8-bit data 8-bit data 8-bit data 8-bit data 8-bit data 8-bit data 16-bit data
Data clock (kHz) on SCK pin
128 128 256 256 384 512 768 1024 256 All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Number of slots f s (kHz)
3 4 6 8 12 12 8 or 16 8 or 16 8 or 16 8 or 16 8 or 16 8 or 16 8 8 8 8
Sync frequency (kHz) on LRCK pin
8 8
Supported data formats
16-bit data 16-bit data 16-bit data 16-bit data 16-bit data 16-bit data
Data clock (kHz) on SCK pin
384 512 768 1024 1536 1536 LRCK SCK SDI MSB B2 Slot 0 LSB MSB B2 Slot 1 LSB MSB B2 Slot 2 SHORT SYNC PCM/IOM2 FORMAT Slot N - 1 LSB MSB B2 Slot N LSB LRCK SCK SDI MSB B2 LSB MSB B2 LSB MSB B2 Slot 0 Slot 1 Slot 2 LONG SYNC PCM/IOM2 FORMAT
Figure 5. PCM/IOM2-supported digital audio data formats
Slot N - 1 LSB MSB B2 Slot N LSB
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8.2 Digital signal processor (DSP) features 8.2.1 Serial interface selection • • •
The TFA8200 contains two serial interfaces. The active interface is selected via bit INPUT_SEL in the device control register (see
). When this bit is toggled, the following sequence is initiated: Soft mute is activated for 128/f s seconds The TFA8200 switches to off mode and the serial interface input is toggled The TFA8200 switches back to operating mode and soft mute is released TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.2.2 Mono selection
Mono selection is used to select the digital audio input channel to be amplified. The options are:
• • •
Left channel Right channel Left + right channels (sum divided by two) Separate mono selection is provided for the two serial interfaces via bits MONO_SEL in the serial interface control registers (addresses 01h and 03h; see
).
8.2.3 Programmable high-pass filter
To block DC and low frequency signals, the TFA8200 features a first-order high-pass filter on the digital audio input. DC values at the output can damage the speaker.
The high-pass filter cut-off frequency is determined by:
• •
The high-pass filter control setting (bits HP_CTRL, see Table 30 )
The sample frequency, f s The relationship between these parameters and the cut-off frequency is defined in
(1) HP_CTRL can be programmed to any integer value between 0 and 511 (see
). If
HP_CTRL = 0 or bit HPF_BP in the bypass control register is set to 1 (see Table 27 ), the
high-pass filter is bypassed.
8.2.4 De-emphasis
Digital de-emphasis is sometimes required. To achieve good SNR over the complete audio band, the high frequency components of the audio signal were amplified prior to transmission (= emphasis).
The de-emphasis filter is a simple first order filter. The cut-off frequency of the de emphasis low-pass filter is approximately 3.5 kHz. The TFA8200 de-emphasis filter is
supported for four sample frequencies, as detailed in Table 6
.
Table 6. De-emphasis control [1:0] Control value
00
01 10 11
f s (kHz)
de-emphasis inactive 32 44.1
48 [1] [2]
Default value.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.2.5 Equalizer
The equalizer can be used for speaker curve compensation or for customer equalizer settings, such as jazz, pop, rock, or classical music. The equalizer function can be bypassed or configured as 5-band.
8.2.5.1 Equalizer band function •
The following three filter parameters determine the shape of each parametric equalizer band: (Relative) center frequency (2)
• •
Quality factor Q Gain factor G In
, f c is the center frequency and f s is the sample frequency.
The definition of the quality factor is the center frequency divided by the 3 dB bandwidth
). In parametric equalizers, it is only valid when the gain is set very low (−30 dB).
(3) TFA8200
Product data sheet
Each band filter can be programmed to perform a band-suppression (G <⅛1) or a band amplification (G > 1) function around the center frequency.
Each band of the TFA8200 equalizer has a second order regalia-mitra all-pass filter
structure. The structure is shown in Figure 6
.
+ ½ + Y(z) + X(z) s K 0 /2 A(z)
010aaa406
Figure 6. Regalia-mitra filter flow diagram
The transfer function of this all-pass filter is given in
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
A(z) is the second-order filter structure. The transfer function of A(z) is given in
(5) Z −1 equals one f s delay period. The relationship between the programmable parameters K 0 , K 1 , and K 2 and the filter parameters G, ω, and Q is shown in
and
Equation 6 can be used to calculate band suppression (G < 1) functions.
(6)
Equation 7 can be used to calculate band amplification (G ≥ 1) functions.
(7) The ranges of the parametric equalizer settings for each band are:
• • •
The gain, G, is from −30 dB to +12 dB.
The center frequency, f c , is from 0.0004 ´ f The quality factor, Q, is from 0.001 to 8.
s to 0.49 ´ f s .
Filter coefficients must be entered for each filter stage via the I 2 C-bus interface to
configure the filters (see Section 9.4.3
, and
Figure 9 illustrate some possible equalizer band transfer
functions. The relationships are symmetrical for the suppression and amplification functions. A skewing effect can be observed at higher frequencies.
For optimum numerical noise performance, different configurations are available for a given filter transfer function. The binary filter configuration parameters t 1 and t 2 control the actual configuration. They must be chosen according to
.
(8) TFA8200
Product data sheet
A maximum of 12 dB amplification, regarding the input signal, can be achieved per equalizer stage. The equalizer band signals are processed in sequence from the highest (Band A) to the lowest (Band E). Each band can attenuate the signal by 6 dB. So, to All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
prevent numerical clipping at filter settings of over 6 dB amplification, band filters can be scaled by 0 dB or −6 dB. For optimum numerical noise performance, steps of −6 dB amplification must be applied to the bands in sequence, starting with B and A, as long as they are able to amplify the signal without clipping.
A filter scale factor, s, is associated with each of the equalizer bands. It is set via the
relevant EQx_s control bit (see Table 25
).
Table 7. Equalizer filter scale factor settings s
0 1
scale factor (dB)
0 −6
8.2.5.2 Equalizer band control
For compact representation with positive signed parameters, parameters k 1 ’ and k 2 ’ are introduced in
(9) TFA8200
Product data sheet
Parameters K 0 , k 1 ', k 2 ', t 1 , t 2 , and s must be combined in two 16-bit control words, word1 and word2 (see
Table 24 and Table 25 ), using the format shown in
k 1 ' and k 2 ' are unsigned floating-point representations in
(10) In
Equation 10 , M is the unsigned mantissa and E the negative signed exponent. For
example, in word2 bits [14:8] = [0111 010] represent k 2 ' = (7 / 2 4 ) × 2 −2 = 1.09375 × 10 −1 .
Table 8. Equalizer control word construction Word Section Data
word1 word1 word1 word2 word2 15 [14:4] [3:0] 15 [14:11] t 1 11 mantissa bits of k 1 ’ four exponent bits of k 1 ’ t 2 four mantissa bits of k 2 ’ word2 word2 word2 [10:8] [7:1] 0 three exponent bits of k 2 ’ k 0 ’ s All information provided in this document is subject to legal disclaimers.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
010aaa222
12 G (dB) Q1 = 0.27
8 Q2 = 0.61
Q3 = 1.65
4 0 10 10 2 10 3 10 4 f (Hz) 10 5
Figure 7. Transfer functions for selected values of Q, the quality factor
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12 G (dB) 8 4 0 10 10 2 10 3 10 4 f (Hz)
Figure 8. Transfer functions for selected values of f c , the center frequency
10 5 TFA8200
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NXP Semiconductors
12 G (dB) 6
TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
010aaa224
0 -6 -12 10 10 2 10 3 10 4
Figure 9. Transfer functions for selected values of G, the gain factor
f (Hz) 10 5
8.2.6 Bass and treble control
The TFA8200 contains first-order shelving filters for bass and treble control. The device can attenuate or boost the bass and high frequency signals independently in 2 dB steps within a −18 dB to +18 dB range. Attenuation and boosting depend on the audio signal
zero crossing settings (see Section 8.2.9
for further details). The bass and treble corner
frequencies are adjustable.
The bass and treble corner frequencies, as a function of the I 2 C control settings and the
sample rate, are given in Table 9
.
Table 9. Corner frequency settings for bass and treble control Control value f s (kHz) Corner frequency (Hz) Bass
Treble
00 8, 16, 32, 64 11.025, 22.05, 44.1, 88.2
181 250 1090 1500 01
12, 24, 48, 96 8, 16, 32, 64 272 218 1630 2180 10 11 11.025, 22.05, 44.1, 88.2
12, 24, 48, 96 8, 16, 32, 64 11.025, 22.05, 44.1, 88.2
12, 24, 48, 96 reserved 300 326 300 413 450 3000 3260 3000 4130 4500 [1] [2] [3]
Value selected via bits F_BASS in the bass and treble control register (see Table 29
).
Value selected via bits F_TREBLE in the bass and treble control register (see Table 29 ).
Default value.
shows the bass function for a range of attenuation and boost settings with a sample rate of 48 kHz and a corner frequency of 272 Hz.
TFA8200
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NXP Semiconductors
dB 20 10
TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
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0 - 10 - 20 10 10 2 10 3 10 4 f (Hz) V DDP = 3.7 V, 2 × 8 Ω BTL configuration, treble control = 0 dB, clip control on
Figure 10. Bass function in 2 dB steps; the treble control is set to flat
10 5
shows the treble function for a range of attenuation and boost settings with a sample rate of 48 kHz and a corner frequency of 1630 Hz.
010aaa649
dB 20 10 0 - 10 - 20 10 10 2 10 3 10 4 f (Hz) V DDP = 3.7 V, 2 × 8 Ω BTL configuration, bass control = 0 dB, clip control on
Figure 11. Treble function in 2 dB steps; the bass control is set to flat
10 5
8.2.7 Muting
The TFA8200 support two muting options, which are controlled via the I 2 C-bus interface:
• •
Soft muting Hard muting Soft muting prevents audible pops. The function smoothly reduces the gain setting of the audio channel to the mute level according to a raised cosine shape. Soft muting is performed in 128 / f s steps. Soft unmute results in a similar gain increase. Bit S_MUTE in
enables and disables the soft mute function.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
The hard mute function immediately switches the outputs to 50 % duty cycle pulses. As a result, the input signals are abruptly blocked. Hard mute takes priority over soft mute.
Hard mute is enabled and disabled via bit H_MUTE in
.
8.2.8 Digital volume control
The digital volume control has a range of −70 dB to +24 dB, programmable in 0.5 dB steps. The default setting is mute (0 × BD). Attenuation and boosting behavior is affected
by the zero crossing volume setting (see Section 8.2.9
The volume control settings, and the resulting amplification or suppression factors, are
Table 10. Volume control amplification and suppression Control value
Gain (dB)
00h +24 01h ...
BBh +23.5
steps of 0.5 dB −69.5
BCh BDh
...
FFh −70 mute mute mute [1] [2] Control value is selected via bits VOL in the volume control register (see
).
Default value.
8.2.9 Zero-crossing volume control
To minimize pop noise when the volume or bass/treble control is changing, the TFA8200 employs zero-crossing volume control.
When zero-crossing volume control is enabled (ZR_CRSS = 1; see crossing.
TFA8200 increases or decreases the gain only when the audio signal passes a zero
8.2.10 Dynamic range compressor (DRC)
The TFA8200 provides a DRC to adjust power levels automatically according to programmable attack and release levels. The attack level is related to the peak value of the signal. The release level is related to the RMS value of the signal. The attack level is programmable using 16 available levels in the range −12 dB to +10 dB. The release level is programmable using 16 available levels in the range −29 dB to 0 dB relative to the attack level. The signal level is measured after equalizer, bass, and treble processing, but before it reaches the power limiter.
The DRC can be bypassed via bit DRC_BP in Table 27 .
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.2.10.1 Functional description
The DRC compresses the dynamic range of the audio stream. The volume control, equalizer, or bass/treble controls can be set so that the audio stream exceeds the 0 dBFS clip level. The DRC can be programmed to compress the louder audio content when the audio stream exceeds the 0 dBFS clip level, while quieter sounds remain unaffected, i.e. the DRC soft clips the audio stream. It is useful when background noise overpowers quiet audio passages. Increasing the volume using the volume control can make quiet audio passages audible but can cause louder audio passages to be distorted by clipping. The DRC prevents that this distortion happens by reducing the volume during loud audio passages and increasing it again for quiet passages.
The design of the DRC feedback loop, incorporating the equalizer and bass and treble controls, is illustrated in
.
DRC RMS volume control setting DRC volume LIMITER audio in PARAMETRIC 5-BAND EQUALIZER BASS AND TREBLE CONTROL
010aaa550
Figure 12. DRC feedback design 8.2.10.2 DRC control
The DRC has four programmable control settings:
• • • •
Attack level Attack rate Release level Release rate When the audio signal level exceeds the attack level, the DRC reduces the volume.
The attack level is based on the audio peak value. When the audio signal level drops below the attack level, the DRC stops reducing the volume. The rate of decrease is programmable via the attack rate. when the audio signal level drops to below the release level, the DRC increases it again. This level is based on the audio RMS-value and is related to the attack level. The rate of increase is programmable via the release level.
When the audio signal level reaches the release level or the DRC volume drops to 0 dB, the DRC stops increasing the volume.
shows the attack and release behavior of the DRC.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
audio in audio out attack level (peak value) release level (RMS-value) RMS value attack level (peak value) attack rate (dB/ms)
Figure 13. DRC attack and release behavior
TFA8200
Product data sheet Table 11. DRC attack and release levels Control value: attack level Attack level based on peak value; absolute value (dBFS) Control value: release level
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001
1010 1011 −12 −10 −8 −6 −5 −4 −3 −2 −1 0 +1 +2 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011
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release rate (dB/ms)
010aaa654
Release level based on RMS value (relative to the attack level ) (dB)
−29 −26 −23 −20 −18 −16 −14 −12 −10 −8 −6 −4 © NXP B.V. 2019. All rights reserved.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Control value: attack level Attack level based on peak value; absolute value (dBFS) Control value: release level
1100 1101 1110 1111 +4 +6 +8 +10 1100 1101 1110 1111 [1] [2] [3] [4]
The control value is selected via bits AT_LVL in the DRC control register (see Table 28 ).
The control value is selected via bits RL_LVL in the DRC control register (see Table 28 ).
0 dB (RMS) release level equals 0 dB (peak) attack level.
Default value.
Release level based on RMS value (relative to the attack level ) (dB)
−3 −2 −1 0
Table 12. DRC attack and release rates Control value: attack rate Attack rate (dB/ms)
0000 3 0001 0010
0011 0100 0101 0110 2.7
2.25
1.8
1.35
0.9
0.45
0111 1000 1001 1010 1011 0.225
0.15
0.11
0.09
0.075
1100 1101 1110 1111 0.065
0.06
0.055
0.05
0111 1000 1001 1010
1011 1100 1101 1110 1111
Control value: release rate
0000 0001 0010 0011 0100 0101 0110 [1] [2] [3]
The control value is selected via bits AT_RATE in the DRC control register (see Table 28
).
The control value is selected via bits RL_RATE in the DRC control register (see Table 28
).
Default value.
Release rate (dB/ms)
0.5
0.137
0.075
0.05
0.036
0.03
0.026
0.021
0.020
0.017
0.015
0.014
0.013
0.012
0.011
0.01
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.2.11 Power limiter
The power limiter controls the maximum output voltage in amplifier mode. This feature makes it possible to limit the output voltage across a peripheral (speaker) when necessary.
The TFA8200 output voltage depends on:
• • •
The analog supply voltage on pin V DDP The gain of the power limiter (G) The power limiter input signal (X i ) The bass/treble output signal is connected to the power limiter input and is relative to the fraction of full scale (FFS), from −1 to +1.
shows the relationship between these settings and the output voltage between pins OUTA and OUTB in the audio bandwidth: (11)
only applies with no load and with clip control off (see
control and the R dB.
DSon of the power switches reduce the maximum clipped output signal.
The power limiter gain can be reduced in 249 steps of 0.5 dB in the range 0 dB to −124 The maximum peak output voltage for the first ten power limiter gain settings is given in
.
Table 13. Power limiter control settings
All parameters are guaranteed for V DDP = 5 V; no load; f i = 1 kHz; f s = 48 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Control value
Power limiter gain (dB) Maximum peak output voltage (V)
00h
0.0
V DDP 01h 02h 03h 04h 05h −0.5
−1.0
−1.5
−2.0
−2.5
V DDP V DDP V DDP 4.7
4.4
06h 07h 08h 09h −3.0
−3.5
−4.0
−4.5
4.2
4.0
3.7
3.5
[1] [2] The control value is selected via bits P_LIM in the De-emphasis, soft/hard mute and power limiter control register (see
Default value.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.4 Protections
The TFA8200 incorporates a wide range of protection circuits to facilitate optimal and safe application.
The following protection circuits are included in the TFA8200:
• • • • • •
Overtemperature protection (OTP) Overcurrent protection (OCP) Underfrequency protection (UFP) Overfrequency protection (OFP) Invalid bit-clock protection (IBP) DC-blocking via high-pass filter (see
) The reaction of the device to fault conditions differs depending on the protection circuit involved.
8.4.1 Overtemperature protection (OTP) • • •
OTP is a ‘hard’ protection to prevent that heat damages the TFA8200. When the junction temperature exceeds 130 °C, overtemperature protection is triggered. When OTP is triggered, the output stages are set floating. OTP can be cleared automatically via a programmable timer or via the I bypass control register (
C-bus interface, after which the output stages start to operate normally again. The programmable timer settings, selected via bits L_OTP in the ), are: 4.5 μs 100 ms 1 s OTP can also be set to no recovery. When no recovery is selected, setting the TFA8200 to off mode and then to amplifier mode clears the OTP.
TFA8200
Product data sheet 8.3 Class-D amplification and clip control
A fourth order sigma delta PWM converter converts the digital audio streams into 3-level modulated PWM signals. The analog back end amplifies the two PWM signals in a BTL configuration with complementary output stages.
One of two clip control configurations can be selected:
• •
Smooth clipping, clip control on Maximum power, clip control off
If smooth clipping is selected (CLIPCTRL = 0; see
power.
Table 27 ), the clipping behavior has
no artifacts. To obtain the maximum output power, the device can be set to maximum The PWM frequency is related to the I 2 S input sample rate as detailed in
Table 14. Power limiter control settings PWM frequency (kHz) Sample rate (kHz)
256 8, 16, 32, 64 352.8
384 11.025, 22.05, 44.1, 88.2
12, 24, 48, 96
SCK relative to sample rate
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 8.4.2 Overcurrent protection (OCP)
The output current of the class-D amplifiers is current limited. When an output stage exceeds a current in the range 1.3 A to 2.3 A, the output stages are set floating. OCP can be cleared automatically via a programmable timer or via the I settings, selected via bits L_OCP in the bypass control register ( C-bus interface, after which the output stages start to operate normally again. The programmable timer
), are:
• • •
4.5 μs 27.5 μs 10 ms The OCP can also be set to no recovery. When no recovery is selected, setting the TFA8200 to off mode and then to amplifier mode clears the OCP.
8.4.3 Underfrequency protection (UFP)
When the clock input source is too low (< f UFP ), UFP sets the output stages floating. It can happen if, for example, the selected sample frequency (bits I2S_FS in low. Without UFP, peripheral devices in an application may be damaged.
) is not in line with the applied sample rate. When the frequency of the input clock is lower than the selected sample frequency, the PWM switching frequency can become critically The UFP status can be monitored by polling the I 2
C status register ( Table 33 ). When the
input sample rate is too low, the alarm is raised.
8.4.4 Overfrequency protection (OFP)
When the clock input source is too high (> f OFP ), OFP sets the output stages floating. It can happen if, for example, the selected sample frequency (bits I2S_FS in OFP, peripheral devices in an application may be damaged.
) is not in line with the applied sample rate. When the frequency of the input clock is higher than the selected sample frequency, the PWM controller can become unstable. Without The OFP status can be monitored by polling the I 2
C status register ( Table 33 ). When the
input sample rate is too high, the alarm is raised.
8.4.5 Invalid bit-clock protection (IBP)
If the SCK-to-LRCK ratio is not supported, the audio signal is distorted. The reason it occurs is that the sound processing blocks are operating at frequencies out of synchronization with the sample rate.
If the IBP alarm is raised for the selected channel, IBP prevents that the audio signal becomes distorted by shutting down the TFA8200. It disconnects the digital audio path.
Valid SCK-to-LRCK ratios for PCM interface formats are 16, 32, 48, 64, 96, 128, and 192. For I S interface formats, valid SCK-to-LRCK ratios are 32 and 64.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Table 15. Overview of protection circuits Protection circuits Symbol Conditions
OTP T j > 130 °C OCP UFP OFP IBP
8.4.6 Overview of protection circuits
provides an overview of the protection circuits implemented.
I O > I O(ocp) PWM frequency < 96 kHz PWM frequency > 1031 kHz SCK/WS is not 16 ± 1, 32 ± 1, 48 ± 1, 64 ± 1, or 128 ± 1
I 2 C flag
OTP OCP UFP OFP IBP
Output
floating floating floating floating floating
Recovery
automatic when timer set to 4.5 μs,
100 ms, or 1 s (via bits L_OTP in Table 27 )
and T j < 130 °C; when no recovery is selected, via I C-bus automatic when timer set to 4.5 μs, 27.5 μs, or 10 μs (via bits L_OCP in
O < I O(ocp) recovery is selected, via I ; when no C-bus restart (when PWM frequency > 96 kHz, fault to operating) restart (when PWM frequency < 1031 kHz, fault to operating) restart (when SCK/WS is 16 ± 1, 32 ± 1, 48 ± 1, 64 ± 1, or 128 ± 1, fault to operating) TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
9 I
2
C-bus interface and register settings
9.1 I 2 C-bus interface
The TFA8200 supports the 400 kHz I The I 2 C-bus microcontroller interface mode standard.
C-bus is used to control the TFA8200 and to transmit and receive data.
The TFA8200 can operate only in I 2 C slave mode, as a slave receiver or as a slave transmitter.
The TFA8200 is accessed via an 8-bit code (see
). Bits 1 to 7 contain the device address. Bit 0 (R/W) indicates whether a read (1) or a write (0) operation has been requested. Four separate addresses are supported for multichannel applications.
Applying the appropriate voltage to pins ADSEL1 (A1) and ADSEL2 (A2) select the required I C address as detailed in
Table 16. I 2 C-bus device address Bit 7 (MSB) Bit 6 Bit 5 Bit 4
1 1 0 1
Bit 3
1
Bit 2
A2
Bit 1
A1
Bit 0 (LSB)
R/W
Table 17. I 2 C pin voltages in I 2 C control mode Logic value Voltage on pins ADSEL1 and ADSEL2
0 1 < V IL > V IH
9.2 I 2 C-bus write cycle
The sequence of events that must be followed when writing data to the I 2 C-bus registers of the TFA8200 is detailed in MSB first.
. One byte is transmitted at a time. Each register stores two bytes of data. Data is always written in byte pairs. Data transfer is always The write cycle sequence using SDA is as follows: 1. The microcontroller asserts a start condition (S).
2. The microcontroller transmits the 7-bit device address of the TFA8200, followed by the R/W bit set to 0.
3. The TFA8200 asserts an acknowledge (A).
4. The microcontroller transmits the 8-bit TFA8200 register address to which the first data byte is written.
5. The TFA8200 asserts an acknowledge.
6. The microcontroller transmits the first byte (the most significant byte).
7. The TFA8200 asserts an acknowledge.
8. The microcontroller transmits the second byte (the least significant byte).
9. The TFA8200 asserts an acknowledge.
10.The microcontroller can either assert the stop condition (P) or continue transmitting data by sending another pair of data bytes, repeating the sequence from step 6. In the latter case, the TFA8200 auto-increments the targeted register address.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Table 18. I 2 C-bus write cycle Start TFA8200 Address R/W
S 11011A 2 A 1 0 A
TFA8200 first register address
ADDR A
MSB
MS1 A
LSB
LS1 A
More data...
<....>
Stop
P
9.3 I 2 C-bus read cycle
The sequence of events that must be followed when reading data from the I 2 C-bus registers of the TFA8200 is detailed in transfer is always MSB first.
Table 19 . One byte is transmitted at a time.
Each of the registers stores two bytes of data. Data is always written in byte pairs. Data The read cycle sequence using SDA is as follows: 1. The microcontroller asserts a start condition (S).
2. The microcontroller transmits the 7-bit device address of the TFA8200, followed by the R/W bit set to 0.
3. The TFA8200 asserts an acknowledge (A).
4. The microcontroller transmits the 8-bit TFA8200 register address from which the first data byte is read.
5. The TFA8200 asserts an acknowledge.
6. The microcontroller asserts a repeated start (Sr).
7. The microcontroller retransmits the device address followed by the R/W bit set to 1.
8. The TFA8200 asserts an acknowledge.
9. The TFA8200 transmits the first byte (the MSB).
10.The microcontroller asserts an acknowledge.
11.The TFA8200 transmits the second byte (the LSB).
12.The microcontroller asserts either an acknowledge or a negative acknowledge (NA).
•
If the microcontroller asserts an acknowledge, the TFA8200 auto-increases the target register address and steps 9 to 12 are repeated.
•
If the microcontroller asserts a negative acknowledge, the TFA8200 frees the I 2 C bus and the microcontroller generates a stop condition (P).
Table 19. I 2 C-bus read cycle Start TFA8200 address R/W First register address
S 11011A 2 A 1 0 A ADDR
TFA8200 address R/W
A Sr 11011A 2 A 1 1 A
MSB
MS1 A
LSB
LS1 A
More data...
<....>
Stop
NA P TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 9.4 Top-level register map
describes the top-level assignment of register addresses to the functional control and status areas. There are 21 control registers and 1 status register.
10h 11h 12h 13h 14h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh
Table 20. Top-level register map Register address (hex) Default (hex) Access Description
00h 0x0000 R/W
01h 02h 03h 04h 05h 0x0A18 0x0007 0x0A18 0x0007 0x59DD R/W R/W R/W R/W R/W
serial Interface input 1; see serial Interface input 2; see
PCM/IOM2 format input 1; see PCM/IOM2 format input 2; see
15h 0xC63E 0x651A 0xE53E 0x4616 0xD33E 0x4DF3 0xEA3E 0x5EE0 0xF93E 0x0093 0x92BA 0x12A5 0x0004 0x10BD 0x0000 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R
equalizer_A word_2; see equalizer_B word_1; see equalizer_B word_2; see
equalizer_C word_1; see equalizer_C word_2; see
high-pass filter; see volume control; see
Table 25 Table 24 Table 25 Table 24 Table 25
equalizer_D word_1; see
equalizer_D word_2; see
Table 25 equalizer_E word_1; see Table 24 equalizer_E word_2; see Table 25
bypass control; see
dynamic range compressor; see
de-emphasis, soft/hard mute and power limiter;
miscellaneous status; see Table 33
The following subsections provide details of the bits in these registers and the control and status functionality assigned to each.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 9.4.1 Device control Table 21. Device control register (address 00h) bit description Bit Symbol Access Default Description
15:5 reserved 0x000 4 INPUT_SEL R/W 0 serial interface input selection 0: serial interface input 1 1: serial interface input 2 3 OPMODE R/W 0 operating mode selection 0: off mode 1: amplifier mode 2 1 reserved RESET R/W 0 0 0 POWERUP R/W 0 I 2 C reset activation 0: reset inactive 1: reset active; 1 is written to generate a reset, after which the RESET bit is automatically reset to 0 Power-down mode selection 0: Power-down mode 1: operating mode (dependent on OPMODE) TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 9.4.2 Serial interface control Table 22. Serial interface control registers (addresses 01h and 03h
) bit description Bit Symbol Access Default Description
15:12 reserved 11:10 MONO_SEL R/W 0000 10 mono selection 00: left channel; left channel content is amplified in amplifier mode 01: right channel; right channel content is amplified in amplifier mode 10: left + right channels; sum of left and right channels, divided by two, is amplified in amplifier mode 9:6 I2S_FS R/W 1000 11: reserved sample frequency (f s ) of digital-in signal 0000: 8 kHz 0001: 11.025 kHz 0010: 12 kHz 0011: 16 kHz 0100: 22.05 kHz 0101: 24 kHz 0110: 32 kHz 0111: 44.1 kHz 5:3 2 I2S_SET SCK_POL R/W R/W 011 0 1000: 48 kHz 1001: 64 kHz 1010: 88.2 kHz 1011: 96 kHz 1100 to 1111: reserved I 2 S format selection 000: reserved 001: reserved 010: MSB-justified data up to 24 bits 011: I 2 S data up to 24 bits 100: LSB-justified 16-bit data 101: LSB-justified 18-bit data 110: LSB-justified 20-bit data 111: LSB-justified 24-bit data enable SCK signal polarity inversion 0: no SCK signal polarity inversion 1: SCK signal polarity inversion enabled TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Bit
1:0
Symbol
I_MODE
Access Default Description
R/W 00 input audio mode selection 00: I 2 S mode 01: PCM/IOM2 Short Frame Sync Format 10: PCM/IOM2 Long Frame Sync Format 11: reserved [1] Serial interface 1 settings are controlled via register 01h; serial interface 2 settings are controlled via register 03h.
3:0
Table 23. PCM/IOM2 format control registers (addresses 02h and 04h
) bit description Bit Symbol Access Default Description
15:12 11 reserved PCM_FS R/W 0000 0 PCM sample frequency 0: 8 kHz 1: 16 kHz 10 A_LAW R/W 0 9 PCM_COMP R/W 0 U-LAW/A-LAW decoding selection (depending on PCM_COMP) 0: U-law decoding; default value 1: A-law decoding companded PCM data 8 7:4 PCM_DL D1_SLOT R/W R/W 0 0000 0: linear 1: companded (U/A-law) PCM data length (number of bits per slot) 0: 8-bit; default value 1: 16-bit slot number position of the first sample (at 8 kHz and 16 kHz) 0000: slot 0 0001: slot 1 .. ..
D2_SLOT R/W 0111 1111: slot 15 slot number position of the second sample (16 kHz) 0000: slot 0 0001: slot 1 .. ..
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Bit
3:0 (continued)
Symbol Access Default Description
0111: slot 7 .. ..
1111: slot 15 [1] PCM/IOM2 format settings of serial interface 1 are controlled via register 02h; PCM/IOM2 format settings of serial interface 2 are controlled via register 04h.
9.4.3 Equalizer configuration Table 24. Equalizer word1 control registers (addresses 05h, 07h, 09h, 0Bh, and 0Dh for equalizer bands A, B, C, D, and E respectively) bit description
‘x’ represents the equalizer band A, B, C, D, or E
Bit Symbol Access Default
Description
15 EQx_t1 R/W filter configuration parameter t 1
) 14:4 3:0 EQx_k1m EQx_k1e R/W R/W 11 mantissa bits of filter parameter k 1
) four exponent bits of filter parameter k 1
) [1]
Default settings are given in Table 20
. The corresponding equalizer configuration is shown in
Table 25. Equalizer word2 control register (addresses 06h, 08h, 0Ah, 0Ch, and 0Eh for equalizer bands A, B, C, D, and E respectively) bit description
x’ represents the equalizer band A, B, C, D, or E
Bit Symbol Description
15 10:8 7:1 0 EQx_t2 14:11 EQx_k2m EQx_k2e EQx_K0 EQx_s R/W R/W R/W R/W R/W filter configuration parameter t 2
) four mantissa bits of filter parameter k 2
) three exponent bits of filter parameter k 2
) seven-bit of filter gain parameter K 0
)
filter scale-factor (s) (see Section 8.2.5.1
) 0: no scaling applied 1: −6 dB amplification enabled [1]
Default settings are given in Table 20
. The corresponding equalizer configuration is shown in
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Table 26. Default equalizer configuration for f s = 48 kHz Band A B
frequency (Hz) 100 300 Q-factor gain (dB) 1.65
0 1.65
0
C
1000 1.65
0
D
3000 1.65
0
E
10000 1.65
0
9.4.4 Bypass control Table 27. Bypass control register (addresses 0Fh) bit description Bit Symbol Access Default Description
15:8 reserved 0x00 7:6 L_OCP R/W 10 overcurrent protection timer setting 00: 4.5 μs floating when an overcurrent is detected 01: 27.5 μs floating when an overcurrent is detected 10: 10 ms floating when an overcurrent is detected 5:4 L_OTP R/W 01 11: no recovery (stays floating) when an overcurrent is detected overtemperature protection timer setting 00: 4.5 μs floating when an overtemperature is detected 3 2 1 0 CLIPCTRL HPF_BP DRC_BP EQ_BP R/W R/W R/W R/W 0 0 1 1 01: 100 ms floating when an overtemperature is detected 10: 1 s floating when an overtemperature is detected 11: no recovery (stays floating) when an overtemperature is detected clip control bypass setting (see
) 0: clip control on (smooth clipping) 1: clip control off (maximum power) high-pass filter bypass setting 0: high-pass filter active 1: high-pass filter bypassed dynamic range compressor bypass setting 0: dynamic range compression active 1: dynamic range compression bypassed equalizer bypass setting: 0: equalizer active 1: equalizer bypassed TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 9.4.5 Dynamic range compressor Table 28. DRC control register (addresses 10h) bit description Bit Symbol Access Default Description
15:12 AT_LVL R/W 1001 dynamic range compressor attack level; see
Table 11 for the attack level as a function of the
value of AT_LTV.
11:8 AT_RATE R/W 0010 37:4 RL_LVL R/W 1011 dynamic range compressor attack rate; see
Table 12 for the attack rate as a function of the
value of AT_RATE dynamic range compressor release level; see
Table 11 for the release level as a function of
the value of RL_LTV.
3:0 RL_RATE R/W 1010 dynamic range compressor release rate; see
Table 12 for the release rate as a function of
the value of RL_RATE
9.4.6 Bass and treble control Table 29. Bass and treble control register (addresses 11h) bit description Bit Symbol Access Default Description
15:14 reserved 13:9 G_TRBLE R/W 01001 treble gain (2 dB steps) 00000: −18 dB 00001: −16 dB .. ..
8:7 6:2 F_TRBLE G_BASS R/W R/W 01 01001 01001: 0 dB .. ..
10001: +16 dB 10010: +18 d8 10011 to 11111: reserved
treble control corner frequency (see
of F_TREBLE)
for the corner frequency as a function of the value bass gain (2 dB steps) −18 dB −16 dB .. ..
01001: 0 dB .. ..
+16 dB +16 d8 reserved TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Bit
1:0
Symbol
F_BASS
Access Default Description
R/W 01 bass control corner frequency (see of F_BASS)
the corner frequency as a function of the value
9.4.7 High-pass filter Table 30. High-pass filter control register (addresses 12h) bit description Bit Symbol Access Default Description
15:9 reserved 8:0 HP_CTRL R/W 0x04
high-pass filter control (see Section 8.2.3
discussion of the high pass corner frequency as a function of the value of HP_CTRL)
[1]
s .
9.4.8 Volume control Table 31. Volume control register (address 13h) bit description Bit Symbol Access Default Description
15:13 reserved 000 12 ZR_CRSS R/W 1 volume update at zero crossing audio stream 0: zero-crossing volume control disabled 1: zero-crossing volume control enabled; default value 11:8 7:0 reserved VOL R/W R/W 0000 0xBD volume control (see
for the amplification and suppression factors as a function of the value of bits VOL)
9.4.9 De-emphasis, soft/hard mute, and power limiter Table 32. De-emphasis, soft/hard mute and power limiter control register (address 14h) bit description Bit Symbol Access Default Description
15:12 reserved 0000 11:10 DE_PHAS 9 H_MUTE R/W R/W 00 0 de-emphasis settings (see hard mute
emphasis configuration for four sample rates as a function of the value of DE_PHASE) 8 S_MUTE R/W 0 0: no hard mute; default value 1: hard mute enabled; implemented by PWM signal with 50 % duty cycle soft mute; default value 0: soft mute disabled using raised cosine 1: soft mute enabled using raised cosine TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Bit
7:0
Symbol
P_LIM
Access Default Description
R/W 0xBD power limiter control settings (see of P_LIM)
for suppressions factors as a function of the value
9.4.10 Miscellaneous status Table 33. Miscellaneous status register (address 15h) bit description Bit Symbol Access Description
15 reserved 14 PS R power stage status 0: class-D audio amplifier power stage floating 13 PORA R 1: class-D audio amplifier power stage switching; PWM signals on pins OUTA and OUTB analog 1V8 regulator status 0: 1V8 analog regulator is off or output voltage level is too low 1: 1V8 analog regulator output is available and correct 12:11 reserved 10:9 AMP R 8 IBP(2) R amplifier mode status 00: amplifier is off 01: startup 10: startup 11: amplifier is functional invalid bit clock protection on serial interface input 2 0: the ratio in frequency between the signal on pin SCK2 and the signal on pin LRCK2 is valid for the selected interface format 7 6 OFP(2) UFP(2) R R 1: the ratio in frequency between the signal on pin SCK2 and the signal on pin LRCK2 is invalid for the selected interface format overfrequency protection on serial interface input 2 0: the frequency of the signal on pin LRCK2 is in line with (or lower than) the selected interface format 1: the frequency of the signal on pin LRCK2 is higher than the selected interface format underfrequency protection on serial interface input 2 0: the frequency of the signal on pin LRCK2 is in line with (or higher than) the selected interface format 1: the frequency of the signal on pin LRCK2 is lower than the selected interface format TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Bit
5 4 3 2 1 0
Symbol
IBP(1) OFP(1) UFP(1) OCPOKA OCPOKB OTPOK
Access
R R R R R R
Description
invalid bit clock protection on serial interface input 1 0: the ratio in frequency between the signal on pin SCK1 and the signal on pin LRCK1 is valid for the selected interface format 1: the ratio in frequency between the signal on pin SCK1 and the signal on pin LRCK1 is invalid for the selected interface format overfrequency protection on serial interface input 1 0: the frequency of the signal on pin LRCK1 is in line with (or lower than) the selected interface format 1: the frequency of the signal on pin LRCK1 is higher than the selected interface format underfrequency protection on serial interface input 1 0: the frequency of the signal on pin LRCK1 is in line with (or higher than) the selected interface format 1: the frequency of the signal on pin LRCK1 is lower than the selected interface format overcurrent protection on pin OUTA 0: overcurrent protection on pin OUTA active 1: overcurrent protection on pin OUTA inactive overcurrent protection on pin OUTB 0: overcurrent protection on pin OUTB active 1: overcurrent protection on pin OUTB inactive overtemperature protection 0: overtemperature protection active 1: overtemperature protection inactive TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
10 Internal circuitry
Table 34. Internal circuitry Pin Symbol
1 SDA
Equivalent circuit
1 ESD 11, 12, 24
010aaa632
2 3 4 5 16 17 18 19 20 21 22 7; 8 SCL TEST1 ADSEL2 TEST3 ADSEL1 SDI2 SCK2 LRCK2 SDI1 SCK1 LRCK2 V DDP 2 to 5 16 to 22 11, 12, 24 ESD
010aaa633
7, 8 ESD 11, 12, 24
010aaa634
9 10 OUTB OUTA 7, 8 9, 10 11, 12, 24
010aaa635
TFA8200
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NXP Semiconductors Pin
13 15
TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Symbol
STABA
Equivalent circuit
7,8 13 11, 12, 24 ESD
010aaa636
TEST2 7, 8 15 11, 12, 24 ESD
010aaa637
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
11 Limiting values
Table 35. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions
V V DDA DDD T j T stg T amb V x analog supply voltage digital supply voltage junction temperature storage temperature ambient temperature voltage on pin x on pin V DDP on pin V DDD pins LRCKx, SCKx, SDIx, SDA, SCL, ADSEL1, ADSEL2, TEST1, and TEST3 pin TEST2 pins OUTA and OUTB V ESD electrostatic discharge voltage pin STABA according to human body model (HBM) according to charge device model (CDM)
Min
−0.3
−0.3
−55 −20 −0.3
−0.3
−0.6
−0.3
−2 −500
12 Thermal characteristics
Table 36. Thermal characteristics Symbol Parameter
R th(j-a) thermal resistance from junction to ambient
Conditions
in free air with natural convection JEDEC test board
Typ
49 2-layer application board 67 23 Ψ Ψ R j-lead j-top th(j-c) thermal characterization parameter from junction to lead thermal characterization parameter from junction to top of package thermal resistance from junction to case in free air with natural convection [1] [2] Measured on a JEDEC high K-factor test board (standard EIA/JESD 51-7).
Value depends on where measurement is taken on package.
6 5
Max
+5.5
+1.95
150 +150 +85 +3.6
V DDP + 0.3 V V DDP + 0.6 V +1.95
+2 V kV +500 V
Unit
V V °C °C °C V
Unit
K/W K/W K/W K/W K/W TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
13 Characteristics
13.1 DC characteristics Table 37. DC characteristics
All parameters are guaranteed for V DDD = 1.8 V; V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i = 1 kHz; f s = 48 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V DDP V DDD I P power supply voltage digital supply voltage supply current on pin V on pin V on pin V DDP DDD DDP ; amplifier mode with load; soft mute on 2.5
1.65
1.8
5.7
5.5
1.95
V V mA I DDD digital supply current on pin V DDP ; power-down mode on pin V DDD ; amplifier mode on pin V DDD ; power-down mode
1.2
5 20 15 μA mA μA
Series resistance output power switches
R DSon drain-source on-state resistance lower switch (NMOS) upper switch (PMOS) 190 260 mΩ mΩ f f I
Amplifier output pins; OUTA and OUTB
V O(offset) output offset voltage
Regulator; pin STABA
V O(reg) regulator output voltage STABA to GNDP
LRCK1, SCK1, SDI1, LRCK2, SCK2, SDI2, SDA, SCL, ADSEL1, and ADSEL2
V IH V IL C i V OL
Protection
T act(th_prot) HIGH-level input voltage LOW-level input voltage input capacitance LOW-level output voltage at I OL = 2.6 mA O(ocp) OFP UFP thermal protection activation temperature overcurrent protection output current overfrequency protection frequency underfrequency protection frequency at PWM output frequency at PWM output frequency −15 1.65
0.7V
130 1.3
96 DDD 0 175 +15 1.95
0.3V
DDD 3 400 2.3
710 1031 mV V V V pF mV °C A kHz kHz [1] After switching from Off/Amplifier mode to Power-down mode.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 13.2 AC characteristics Table 38. AC characteristics
All parameters are guaranteed for V DDD = 1.8 V; V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i = 1 kHz; f s = 48 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Symbol Parameter Class D amplifier Conditions Min Typ Max Unit
P o(RMS) RMS output power R L = 8 Ω THD+N = 1 % THD+N = 10 % 0.65
0.7
0.85
W W R L = 4 Ω THD+N = 1 % 1.2
W 1.5
W THD+N = 10 % R L = 8 Ω; V DDP = 4.2 V THD+N = 1 % THD+N = 10 % R L = 4 Ω; V DDP = 4.2 V THD+N = 1 % THD+N = 10 % R L = 8 Ω; V DDP = 5.0 V THD+N = 1 % THD+N = 10 % 0.9
1.1
1.6
1.95
1.35
1.6
W W W W W W η THD+N V V po n(o) S/N PSRR o(RMS) output power efficiency total harmonic distortion-plus-noise output noise voltage signal-to-noise ratio power supply rejection ratio RMS output voltage R L = 4 Ω; V DDP = 5.0 V THD+N = 1 % THD+N = 10 % P o(RMS) = 850 mW P o(RMS) = 100 mW soft mute; a-weighted V PVDD = 5 V; P o(RMS) = 1.3 W; a weighted V ripple = 200 mV; f ripple = 217 Hz At −9 dBFS (RMS) digital input; volume control = 0 dB; bass and treble control = 0 dB; equalizer bypassed and DRC bypassed 65 1.9
2.35
2.75
92 0.02
60 94 80 2.1
0.1
2.3
dB V W W % % μV dB
Power-up, power-down, and propagation times
t d(on) turn-on delay time off mode to operating mode; soft demute excluded 5.6
ms t d(mute_off) t d(soft_mute) mute off delay time soft mute delay time 2.67 ms 2.67 ms TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications Symbol
t PD
Parameter
propagation delay
Conditions
bass and treble control = 0 dB; equalizer bypassed and DRC bypassed.
-
Min Typ
600 -
Max Unit
μs
13.3 I 2 C timing characteristics Table 39. I 2
C-bus interface characteristics (see
)
All parameters are guaranteed for V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i = 1 kHz; f s = 48 kHz; clip control off; T amb = 25 °C unless otherwise specified.
f t
Symbol
SCL t LOW t HIGH t r t f t HD;STA SU;STA
Parameter
SCL clock frequency LOW period of the SCL clock HIGH period of the SCL clock rise time fall time hold time (repeated) START condition set-up time for a repeated START condition
Conditions
SDA and SCL signals SDA and SCL signals
-
Min
1.3
0.6
20 + 0.1C
20 + 0.1C
0.6
0.6
b b -
Typ
-
Max Unit
400 kHz μs μs ns ns μs μs t t t t SU;STO t BUF SU;DAT HD;DAT SP set-up time for STOP condition bus free time between a STOP and START condition data set-up time data hold time pulse width of spikes that must be suppressed by the input filter 0.6
1.3
100 0 0 50 μs μs ns μs ns C b capacitive load for each bus line 400 pF [1] [2] C b is the total capacitance of one bus line in pF. The maximum capacitive load for each bus line is 400 pF.
After this period, the first clock pulse is generated.
TFA8200
Product data sheet
SDA t BUF t LOW t r t f SCL P S t HD;STA t HD;DAT t HIGH t SU;DAT t SU;STA Sr
Figure 14. I 2 C timing
t HD;STA t SP t SU;STO P
010aaa225
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 13.4 I 2 S timing characteristics Table 40. I 2 S bus interface characteristics (see
All parameters are guaranteed for V DDD = 1.8 V; V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i =1 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Symbol
f s
Parameter
sampling frequency
Conditions
on LRCK1 or LRCK2 pins
Min
8 -
Typ Max Unit
96 kHz t f clk t su h clock frequency set-up time hold time on SCK1 or SCK2 pins LRCK edge to SCK HIGH SDI edge to SCK HIGH SCK HIGH to LRCK edge SCK HIGH to SDI edge 32f 10 10 10 10 s 64f s Hz ns ns ns ns SCK LRCK SDI
Figure 15. I 2 S timing
t h t su
010aaa624
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 13.5 PCM/IOM2 timing characteristics
Table 41. PCM/IOM2 characteristics (see
)
All parameters are guaranteed for V DDD = 1.8 V; V DDP = 3.7 V; R L = 8 Ω; L L = 44 μH; f i = 1 kHz; clip control off; T amb = 25 °C unless otherwise specified.
Symbol
f p
Parameter
pulse frequency
Conditions
on LRCK1 or LRCK2 pins -
Min
-
Typ Max Unit
8 kHz t f clk t su h clock frequency set-up time hold time on SCK1 or SCK2 pin SCK HIGH to LRCK edge SCK HIGH to SDI edge LRCK edge to SCK HIGH SDI edge to SCK HIGH 16f 10 10 10 10 p 192f p Hz ns ns ns ns t p pulse duration pulse on LRCK1 pin or LRCK2 pin 1/f clk s SCK LRCK, FSC (long) LRCK, FSC (short) SDI
Figure 16. PCM/IOM2 timing
t p t h t su
010aaa625
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
14 Application information
The TFA8200 is a filter-free BTL class-D amplifier that uses a fixed frequency PWM
modulation scheme (see the simplified application schematic in Figure 18
frequency. A typical voice coil inductance is in the range 30 μH to 80 μH.
TFA8200 is idle (no audio input signal), the voltage across the speaker is 0 V, generating no additional current. Even when the audio input signal modulates the PWM output, the out-of-band AC ripple current in the voice coil is very small compared to the audio current. The reason is the inductive behavior of the voice coil at the PWM switching
14.1 Power capability 14.1.1 Estimating the RMS output power (P o(RMS) )
The RMS output power, P o(RMS) , at THD+N = 1 % just before clipping can be estimated
using Equation 12 , with clip-control off, or using Equation 13
, with clip-control on.
Clip control off: (12) Clip control on: (13) Where: R L = load resistance (Ω) R S = total series resistance of application R DSon = on-resistance of power switch (typically 230 mΩ) V DDP = power supply voltage (V) M max = maximum modulation depth (clip control on; typically 0.9)
Example (clip control off): With V DDP = 5 V; R DSon = 0.23 Ω (at T j = 25 °C); R S = 0.14 Ω: P o(RMS)1% = 1.35 W in an 8 Ω load P o(RMS)1% = 2.35 W in a 4 Ω load
The RMS output power at THD+N = 10 % can be estimated using Equation 14
: (14) TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 14.1.2 Output current limiting
OCP internally limits the peak output current I be calculated using
O(max) . The minimum OCP trigger level is 1.3 A. During normal operation, the output current must not exceed this threshold level, otherwise the audio signal is distorted. The peak output current in BTL configuration can (15) Where: V DDP = power supply voltage (V) R L = load resistance (Ω) R DSon = drain-source on-state resistance (Ω)
Example: A 4 Ω speaker can be used with a 5 V supply without triggering OCP.
14.2 PWM output filtering
The TFA8200 PWM power stage is optimized to meet the legal limits (FCC) for radiated emissions without requiring an external filter (speaker cable < 5 cm). However, a low pass LC filter is recommended if a long speaker cable cannot be avoided or other components in the application are sensitive to frequencies in the 10 MHz to 150 MHz range (for example, an FM tuner). The suggested differential low-pass filter consists of a ferrite bead inductor (Z > 80 Ω at 100 MHz) and a small ceramic capacitor of about 1 nF
TFA8200
CLASS-D AMPLIFIER OUTA speaker cables > 5 cm OUTB ferrite bead 1 nF 1 nF
aaa-032686
Figure 17. Optional low-pass LC filter 14.3 Supply decoupling and filtering
To minimize the size of the high-frequency current loop and therefore optimize EMC performance, a ceramic decoupling capacitor of between 1 μF and 10 μF must be placed close to the TFA8200. Optionally, to reduce the impedance further, a small 1 nF ceramic capacitor can be connected in parallel.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 14.4 PCB layout considerations
When designing the PCB layout for a Class-D amplifier circuit, great care must be taken.
The layout can affect the audio performance, the EMC performance, and/or the thermal performance. It can even affect the functionality of the TFA8200.
14.4.1 EMC considerations
The decoupling capacitors on pins V be connected to this ground plane.
DDD , V DDP , and STABA must be placed close to the TFA8200 and must be referenced to a solid ground plane. The exposed DAP must also
14.4.2 Thermal considerations
The TFA8200 is available in a thermally enhanced HVQFN24 (SOT616-3) package for reflow soldering. The HVQFN24 has an exposed DAP that significantly reduces the thermal resistance, R implementation is: th(j-a) . To achieve a lower overall thermal resistance, the exposed DAP must be soldered to a thermal copper plane. Increasing the area of the thermal plane, the number of planes, or the copper thickness can reduce the thermal resistance further. The typical thermal resistance (free air and natural convection) of a practical PCB R th(j-a) = 67°K/W for a two-layer application board (18 mm × 22 mm, 35 μm copper, FR4 base material).
describes the relationship between the maximum allowable power dissipation (P) and the thermal resistance from junction to ambient.
(16) Where: R th(j-a) = thermal resistance from junction to ambient T j(max) = maximum junction temperature (125 °C) T amb = ambient temperature P = power dissipated in the TFA8200 To avoid thermal damage, OTP limits the maximum junction temperature to 130 °C.
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 14.5 Typical application diagram (simplified)
BASEBAND PROCESSOR I 2 S output I 2 S output MULTIMEDIA PROCESSOR SCL SDA address select 1 address select 2 1.8 V CVDDD 100 nF LRCK1 22 SCK1 21 SDI1 20 7 V DDP 8 V DDP LRCK2 19 SCK2 18 SDI2 17 SCL 2 SDA 1 ADSEL1 16 ADSEL2 4 V DDD GNDD 23 24 3
TFA8200
5 6, 14 15 10 OUTA 9 OUTB 11 GNDP 12 GNDP 13 STABA battery CVDDP 10 µF CSTABA 100 nF speaker 4 Ω or 8 Ω
aaa-032543
Figure 18. Typical application (simplified)
TFA8200
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NXP Semiconductors
10 (%) 2 THD+N 10
TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 14.6 Curves measured in reference design (demonstration board)
All measurements were taken with V DDD = 1.8 V; f s = 48 kHz, clip control on; the high pass filter off; unless otherwise specified.
010aaa675 010aaa676
10 (%) 2 THD+N 10 1 10 - 1 10 - 2 10 - 3 10 - 2 10 - 1 (1) f i = 6 kHz (2) f i = 1 kHz (3) f i = 100 Hz a. V DDP = 3.7 V; R L = 8 Ω 10 (%) 2 THD+N 10 (1) (3) (2) 1 P o (W) 10
010aaa677
1 10 - 1 10 - 2 10 - 3 10 - 2 10 - 1 (1) f i = 6 kHz (2) f i = 1 kHz (3) f i = 100 Hz b. V DDP = 5 V; R L = 8 Ω 10 (%) 2 THD+N 10 (1) (2) (3) 1 P o (W) 10
010aaa678
1 10 - 1 10 - 2 (2) (1) (3) 1 10 - 1 10 - 2 10 - 3 10 - 2 10 - 1 1 10 10 - 3 10 - 2 10 - 1 P o (W) (1) f i = 6 kHz (2) f i = 1 kHz (3) f i = 100 Hz c. V DDP = 3.7 V; R L = 4 Ω d. V (1) f (2) f (3) f DDP i i i = 6 kHz = 1 kHz = 100 Hz = 5 V; R L = 4 Ω
Figure 19. Total harmonic distortion-plus-noise as a function of output power
(1) (2) (3) 1 P o (W) 10 TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
010aaa680
10 (%) 2 THD+N 10
010aaa679
10 (%) 2 THD+N 10 1 10 - 1 10 - 2 (2) (1) 10 - 3 10 10 2 (1) P o = 100 mW (2) P o = 500 mW a. V DDP = 3.7 V; R L = 8 Ω 10 (%) 2 THD+N 10 10 3 10 4 f (Hz) 10 5
010aaa681
1 10 - 1 10 - 2 (1) (2) 10 - 3 10 10 2 1. P o = 100 mW 2. P o = 500 mW b. V DDP = 5 V; R L = 8 Ω 10 (%) 2 THD+N 10 10 3 1 1 10 - 1 10 - 1 10 - 2 (1) (2) 10 - 2 (1) (2) 10 - 3 10 10 2 10 3 10 4 f (Hz) 10 5 10 - 3 10 10 2 (1) P o = 100 mW (2) P o = 500 mW c. V DDP = 3.7 V; R L = 4 Ω d. V (1) P (2) P DDP o o = 100 mW = 1 W = 5 V; R L
Figure 20. Total harmonic distortion-plus-noise as a function of frequency
= 4 Ω 10 3 10 4 f (Hz) 10 5
010aaa682
10 4 f (Hz) 10 5 TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
10 2 THD+N (%) 10
010aaa683
10 2 THD+N (%) 10
010aaa684
1 1 (4) 10 - 1 (4) 10 - 1 (2) (1) (3) (3) 10 - 2 10 - 2 (2) (1) 10 - 3 10 10 2 10 3 10 4 f (Hz) 10 5 (1) V ripple = 0 V (f ripple = 0 Hz) (2) f ripple = 217 Hz (3) f ripple = 1 kHz (4) f ripple = 6 kHz a. V DDP = 3.7 V; R L = 8 Ω; P o = 100 mW; V ripple = 200 mV (RMS) 10 - 3 10 10 2 10 3 (1) V ripple = 0 V (f ripple = 0 Hz) (2) f ripple = 217 Hz (3) f ripple = 1 kHz (4) f ripple = 6 kHz b. V DDP = 5 V; R L = 8 Ω; P o = 100 mW; V ripple = 200 mV (RMS) 10 4 f (Hz) 10 5
Figure 21. Total harmonic distortion-plus-noise and power supply intermodulation distortion as a function of frequency
G dB 10 0 (1) (2) (3)
010aaa685
PSRR (dB) 0 - 20
010aaa686
- 10 - 40 - 20 - 60 - 30 - 40 10 10 2 10 3 10 4 10 5 f (Hz) V DDP = 3.7 V; R L = 8 Ω; P o = 500 mW (1) High-pass filter off (2) High-pass filter cut-off frequency: 100 Hz (3) High-pass filter cut-off frequency: 500 Hz
Figure 22. Normalized gain as a function of frequency
- 80 (1) (2) - 100 10 10 2 10 3 10 4 f ripple (Hz) 10 5 V DDP = 5 V; R L = 8 Ω; V ripple = 200 mV (RMS) (1) V DDP = 3.7 V (2) V DDP = 5 V
Figure 23. Power supply rejection ration as a function of ripple frequency
TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications
120 S/N (dB) 100 80 60 40 (1) (2)
010aaa687
20 10 - 2 10 - 1 1 P o (W) V DDP = 5 V; R L = 8 Ω; reference signal: 3.5 V (RMS) (1) A-weighted (2) 20 kHz brick wall filter
Figure 24. Signal-to-noise ratio as a function of output power
10 P o (W) 4 3
010aaa688
P o (W) 4 3 2 1 (4) (3) (2) (1) 2 1 0 2 3 4 5 V DDP (V) 6 (1) THD+N = 1 %; R L = 8 Ω (2) THD+N = 10 %; R L = 8 Ω (3) THD+N = 1 %; R L = 4 Ω (4) THD+N = 10 %; R L = 4 Ω a. f i = 100 Hz; clip control on
Figure 25. Output power as a function of supply voltage
0 2 3 4 (1) THD+N = 1 %; R L = 8 Ω (2) THD+N = 10 %; R L = 8 Ω (3) THD+N = 1 %; R L = 4 Ω (4) THD+N = 10 %; R L = 4 Ω b. f i = 100 Hz; clip control off (4) (3) (2) (1)
010aaa689
5 V DDP (V) 6 TFA8200
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0.20
P (W) 0.15
010aaa694
0.5
P (W) 0.4
010aaa696
0.3
0.10
0.2
0.05
(2) 0.1
(2) (1) 0.00
10 - 3 10 - 2 10 - 1 1 P o (W) 10 0.0
10 - 3 10 - 2 (1) 10 - 1 (1) V DDP = 3.7 V (2) V DDP = 5 V a. R L = 8 Ω; f i = 1 kHz; clip control off
Figure 26. Power dissipation as a function of output power
(1) V DDP = 3.7 V (2) V DDP = 5 V b. R L = 4 Ω; f i = 1 kHz; clip control off 1 P o (W) 10 η (%) 100 80 60 40 20 (1) (2)
010aaa695
0 0 0.5
1 1.5
P o (W) 2 (1) V DDP = 3.7 V (2) V DDP = 5 V a. R L = 8 Ω; f i = 1 kHz; clip control off
Figure 27. Efficiency as a function of output power
100 η (%) 80 60 40 20 (1) (2)
010aaa697
0 0 1 2 (1) V DDP = 3.7 V (2) V DDP = 5 V b. R L = 4 Ω; f i = 1 kHz; clip control off P o (W) 3 TFA8200
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15 Package outline
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm SOT616-3
D B A terminal 1 index area A A 1 E c detail X L 6 7 e e 1 1/2 e b 12 13 e v w C C A B y 1 C E h 1/2 e e 2 terminal 1 index area 1 18 24 19 D h Dimensions (mm are the original dimensions) 0 2.5
scale Unit (1) A (1) A 1 b c D (1) D h E (1) E h e e 1 e 2 mm max nom min 1 0.05
0.00
0.30
0.18
0.2
4.1 2.75 4.1
3.9 2.45 3.9
2.75
2.45
0.5
2.5
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline version IEC JEDEC References JEITA 2.5
SOT616-3 MO-220 L 0.5
0.3
v 5 mm w y y 1 0.1
0.05 0.05
0.1
European projection
Figure 28. Package outline TFA8200 (HVQFN24)
X C y
sot616-3_po
Issue date 16-02-17 16-07-14 TFA8200
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16 Soldering of SMD packages
This section gives a very brief insight into a complex technology. An in-depth account of soldering ICs can be found in the "Surface mount reflow soldering description" application note (AN10365).
16.1 Introduction to soldering
To form electrical circuits, soldering is one of the most common methods through which packages are attached to printed-circuit boards (PCBs). The soldered joint provides the mechanical connection and the electrical connection. No single soldering method is ideal for all IC packages. When through-hole and surface mount devices (SMDs) are mixed on one printed wiring board, wave soldering is often preferred. However, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology with which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
• •
Through-hole components Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave-soldered. Packages with solder balls and some leadless packages which have solder lands underneath the body cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered due to an increased probability of bridging.
• • • • • •
The reflow soldering process involves applying solder paste to a board followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave soldering and reflow soldering are: Board specifications, including the board finish, solder masks, and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
16.3 Wave soldering • •
Key characteristics in wave soldering are: Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave Solder bath specifications, including temperature and impurities TFA8200
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications 16.4 Reflow soldering • • •
Key characteristics in reflow soldering are: Lead-free versus SnPb soldering A lead-free reflow process usually leads to higher minimum peak temperatures
) than a SnPb process, therefore reducing the process window Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board Reflow temperature profile This profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic).
In addition, the peak temperature must be low enough, so the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume. It is classified in accordance with
and
Table 42. SnPb eutectic process (from J-STD-020D) Package thickness (mm) Package reflow temperature (°C) Volume (mm 3 ) < 350 ≥ 350
< 2.5
≥ 2.5
235 220 220 220
Table 43. Lead-free process (from J-STD-020D) Package thickness (mm) Package reflow temperature (°C) Volume (mm 3 )
< 1.6
1.6 to 2.5
> 2.5
< 350
260 260 250
350 to 2 000
260 250 245
> 2 000
260 245 245 Moisture sensitivity precautions, as indicated on the packing, must always be respected.
Studies have shown that small packages reach higher temperatures during reflow
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maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time
001aac844
MSL: Moisture sensitivity level
Figure 29. Temperature profiles for large and small components
For further information on temperature profiles, refer to the "Surface mount reflow soldering description" application note (AN10365).
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17 Revision history
Table 44. Revision history Document ID Release date
TFA8200 v.1
20190819
Data sheet status
Product data sheet -
Change notice
-
Supersedes
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18 Legal information
18.1 Data sheet status Document status
Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status
Development Qualification Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] [2] [3] Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions Draft
— The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet
— A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification
Product data sheet.
— The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the
18.3 Disclaimers Limited warranty and liability
— Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes
— NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use
— NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications
— Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
Limiting values
— Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale
— NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
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NXP Semiconductors TFA8200 Mono BTL class-D audio amplifier with digital inputs for IOT applications No offer to sell or license
— Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Quick reference data
— The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Export control
— This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Non-automotive qualified products
— Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of non automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Security
— While NXP Semiconductors has implemented advanced security features, all products may be subject to unidentified vulnerabilities.
Customers are responsible for the design and operation of their applications and products to reduce the effect of these vulnerabilities on customer’s applications and products, and NXP Semiconductors accepts no liability for any vulnerability that is discovered. Customers should implement appropriate design and operating safeguards to minimize the risks associated with their applications and products.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
I 2 C-bus
— logo is a trademark of NXP B.V.
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Contents
General features ................................................1
Applications .........................................................2
Quick reference data .......................................... 3
Pinning information ............................................ 5
Pinning ...............................................................5
Pin description ................................................... 5
Functional description ........................................7
Supported digital audio data formats .................9
De-emphasis ....................................................12
Equalizer ..........................................................13
Equalizer band function ................................... 13
Equalizer band control .....................................15
Bass and treble control ....................................17
Muting .............................................................. 18
8.2.10.1 Functional description ......................................20
8.2.10.2 DRC control ..................................................... 20
Power limiter ....................................................23
Class-D amplification and clip control ..............24
Protections .......................................................24
Overtemperature protection (OTP) .................. 24
Overcurrent protection (OCP) ..........................25
Underfrequency protection (UFP) ....................25
Overfrequency protection (OFP) ......................25
Invalid bit-clock protection (IBP) ...................... 25
Overview of protection circuits .........................26
I2C-bus interface and register settings ...........27
I2C-bus read cycle .......................................... 28
Top-level register map .....................................29
Device control ..................................................30
Serial interface control .....................................31
Equalizer configuration .................................... 33
Bypass control ................................................. 34
Dynamic range compressor .............................35
Bass and treble control ....................................35
High-pass filter .................................................36
Volume control .................................................36
Miscellaneous status ....................................... 37
Internal circuitry ................................................39
Limiting values ..................................................41
Thermal characteristics ....................................41
Characteristics .................................................. 42
DC characteristics ............................................42
AC characteristics ............................................43
I2C timing characteristics ................................ 44
I2S timing characteristics .................................45
PCM/IOM2 timing characteristics .....................46
Application information ....................................47
Thermal considerations ................................... 49
Typical application diagram (simplified) ........... 50
Curves measured in reference design (demonstration board) ..................................... 51
Package outline .................................................56
Soldering of SMD packages .............................57
Reflow soldering .............................................. 58
Revision history ................................................ 60
Legal information ..............................................61
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 August 2019 Document identifier: TFA8200
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