AMS AS7261N Light Sensor Datasheet
The AMS AS7261N is a cutting-edge digital color sensor that offers precise XYZ color sensing, conforming to the human eye's response to color information. Its NIR channel enables additional application flexibility. It boasts high accuracy ambient light measurements and allows direct register read and write with an interrupt on sensor readiness. It operates with a low voltage of 2.7V to 3.6V with an I²C interface, making it energy-efficient. Packaged in a small and robust LGA package, it features a built-in aperture for controlling incoming light.
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AS7261N
XYZ Tri-Stimulus and NIR Sensor with
Electronic Shutter
General Description
The AS7261N provides direct XYZ sensor data which conforms to the tri-stimulus standard observer color response of the human eye. A near-IR channel enables additional application flexibility. LED drivers with programmable currents are provided for electronic shutter applications.
The AS7261N integrates Gaussian filters into standard CMOS silicon via nano-optic deposited interference filter technology and is packaged in an LGA package that provides a built in aperture to control the light entering the sensor array.
Control and spectral data access is implemented through an I²C register set.
and
Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS7261N, XYZ Tri-Stimulus and NIR
Sensor with Electronic Shutter are listed below:
Figure 1:
AS7261N Benefits and Features
Benefits
•
XYZ channel data conforming to human eye response to color information
•
High accuracy ambient light measurements
•
Direct register read and write with interrupt on sensor ready
•
High stability over lifetime with minimal drift over temperature
•
No additional signal conditioning required
•
Direct register read and write with interrupt on sensor ready
Features
•
XYZ tri-stimulus standard observer filter set
•
Ambient light sensing (photopic response)
•
I²C slave digital Interface with optional interrupt operation
•
Filter set realized by silicon interference filters
•
16-bit ADC with digital access
•
I²C slave digital Interface with optional interrupt operation
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AS7261N −
General Description
Benefits
•
Electronic shutter control/synchronization
•
Low voltage operation
•
Small, robust package, with built-in aperture
Features
•
Programmable LED drivers
•
2.7V to 3.6V with I²C interface
•
20-pin LGA package 4.5mm x 4.7mm x 2.5mm
-40°C to 85°C temperature range
Application
The AS7261N applications include:
•
Color measurement and absorbance
•
Color matching and identification
•
Precision color tuning/calibration
System Block Diagram
Figure 2:
AS7261N Sensor System
MCU
100nF
3.3V
10uF
3.3V
VDD1 VDD2
AS7261N
LED_IND
LED_DRV
SCL_S
SDA_S
INT
X, Y, Z,
NIR, C &
D Sensors
Light in
3.3V
Light
Source
GND
Reflective
Surface
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AS7261N −
Pin Assignments
Pin Assignments
Figure 3:
Pin Diagram of AS7261N (Top View)
The device pin assignments are described below.
20 16
1
15
5
11
6 10
Pin Description
Figure 4:
Pin Description of AS7261N
Pin Number
7
8
5
6
3
4
1
2
9
10
11
Pin Name
NF
NF
NF
NF
NF
RESN
NF
NF
SCL_S
SDA_S
NF
Description
Not Functional. Do not connect.
Reset, Active LOW
Not Functional. Do not connect.
Not Functional. Do not connect.
Not Functional. Do not connect.
Not Functional. Do not connect.
Not Functional. Do not connect.
Not Functional. Do not connect.
I²C Slave Clock pin
I²C Slave Data pin
Not Functional. Do not connect.
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Pin Assignments
Pin Number
16
17
18
19
20
12
13
14
15
Pin Name
NF
INT
VDD2
LED_DRV
GND
VDD1
LED_IND
NF
NF
Description
Not Functional. Do not connect.
Interrupt, active high
Voltage Supply
LED Driver Output for Driving LED Current Sink
Ground
Voltage Supply
LED Driver Output for Indicator LED Current Sink
Not Functional. Do not connect.
Not Functional. Do not connect.
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AS7261N −
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under
may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability. The device is not designed for high energy UV
(ultraviolet) environments, including upward looking outdoor applications, which could affect long term optical performance.
Figure 5:
Absolute Maximum Ratings
Symbol Parameter Min Max Units Comments
V
DD_MAX
V
T
T
DD_IO
I
SCR
ESD
ESD
HBM
CDM
STRG
BODY
Electrical Parameters
Supply Voltages VDD1,
VDD2
-0.3
5 V
Pins VDD1 & VDD2 must be sourced from the same supply voltage
Input/Output Pin
Voltage
Input Current
(latch-up immunity)
-0.3
±100
VDD+0.3
V mA
Input/Output Pin to GND
JESD78D
Electrostatic Discharge
Electrostatic Discharge
HBM
Electrostatic Discharge
CDM
±1000
±500
V
V
Temperature Ranges and Storage Conditions
JS-001-2014
JSD22-C101F
Storage Temperature -40 85 °C
Package Body
Temperature
260 °C
IPC/JEDEC J-STD-020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC
J-STD-020 “Moisture/Reflow
Sensitivity Classification for
Non-hermetic Solid State
Surface Mount Devices”
RH
NC
MSL
Relative Humidity
(non-condensing)
Moisture Sensitivity
Level
5
3
85 %
Maximum floor life time of
168 hours
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Electrical Characteristics
AS7261N −
Electrical Characteristics
All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V,
T
AMB
= 25°C. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality
Control) methods. VDD1 and VDD2 must be sourced from the same power supply.
Figure 6:
Electrical Characteristics of AS7261N
Symbol Parameter
VDD
Voltage Operating
Supply
T
AMB
I
VDD
Operating Temperature
Operating Current
I
STANDBY
Standby Current
Conditions
General Operating Conditions
Min
I²C Interface 2.7
-40
Internal RC Oscillator
F
OSC t
JITTER
Internal RC Oscillator
Frequency
Internal Clock Jitter @25°C
Temperature Sensor
15.7
D
TEMP
Absolute Accuracy of the
Internal Temperature
Measurement
-8.5
Indicator LED
1, 2, 4 or 8
I
IND
I
ACC
V
LED
LED Current
Accuracy of Current
Voltage Range of
Connected LED
1
-30
0.3
Vds of current sink
LED_DRV
12.5, 25, 50 or 100
I
LED1
I
ACC
V
LED
LED Current
Accuracy of Current
Voltage Range of
Connected LED
Vds of current sink
12.5
-10
0.3
Typ
3.3
25
12
16
Max
3.6
85
5
16.3
1.2
8.5
8
30
VDD
100
10
VDD
Unit
MHz ns mA
%
V
V
°C mA
μA
°C mA
%
V
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Electrical Characteristics
Symbol
I
IH
, I
IL
I
IL RESN
V
IH
Parameter Conditions Min
Logic Input Current
Logic Input Current
(RESN pin)
CMOS Logic High Input
Digital Inputs and Outputs
Vin=0V or VDD
Vin=0V
-1
-1
0.7* VDD
V
IL
CMOS Logic Low Input 0
Typ
V
OH
V
OL t
RISE
t
FALL
CMOS Logic High Output I=1mA
CMOS Logic Low Output I=1mA
Current Rise Time C(Pad)=30pF
Current Fall Time C(Pad)=30pF
Max
1
-0.2
VDD
0.3*
VDD
VDD -
0.4
0.4
5
5
Unit
V
V ns ns
V
V
μA mA
Note(s):
1. 15μA over temperature
2. Guaranteed, not tested in production
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Timing Characteristics
Timing Characteristics
Figure 7:
AS7261N I²C Slave Timing Characteristics
t
HS:STA t
LOW t
HIGH t
SU:STA t
HS:DAT t
SU:DAT t
R t
F t
SU:STO
Symbol
f
SCLK t
BUF
C
B
C
I/O
Parameter Conditions
I²C Interface
SCL Clock Frequency
Bus Free Time Between a STOP and START
Hold Time (Repeated) START
LOW Period of SCL Clock
HIGH Period of SCL Clock
Setup Time for a Repeated START
Data Hold Time
Data Setup Time
Rise Time of Both SDA and SCL
Fall Time of Both SDA and SCL
Setup Time for STOP Condition
Capacitive Load for Each Bus Line
CB — total capacitance of one bus line in pF
I/O Capacitance (SDA, SCL)
Min Typ Max Unit
0
1.3
0
100
20
20
0.6
0.6
1.3
0.6
0.6
400
0.9
300
300
400
10 kHz
μs pF pF
μs ns ns ns
μs
μs
μs
μs
μs
Figure 8:
I²C Slave Timing Diagram
SCL
P
SDA
Stop t
BUF
Start
S t
HD:STA
V
IH
V
IL t
R t
F t
LOW t
HD:DAT t
HIGH t
SU:DAT t
SU:STA
S t
SU:STO
P
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Operation Characteristics
Operation Characteristics
Figure 9:
Spectral Responsivity
Typical Response
0.8
0.6
1.2
1
0.4
0.2
0
300 400 500 600 700 800 900 1000 1100
X
D
C
Y
Z
NIR
Figure 10:
AS7261N Optical Characteristics (Pass Band)
Symbol Parameter
X
Y
Z
NIR
C
Channel X
Channel Y
Channel Z
Channel NIR
Channel C
D_LED Channel D
D_INCAN Channel D
Test Conditions
White LED 5700K source, Ee=116μW/cm
2
White LED 5700K source, Ee=116μW/cm
2
White LED 5700K source, Ee=116μW/cm
2
Incandescent light source, Ee=465μW/cm
2
White LED 5700K source, Ee=116μW/cm
2
White LED 5700K source, Ee=116μW/cm
2
Incandescent light source, Ee=465μW/cm
2
Min Typ Max Unit
7.7
8.6
4.7
14.0
18.1
0 15 counts/
(μW/cm
2
) counts/
(μW/cm
2
) counts/
(μW/cm
2
) counts/
(μW/cm
2
) counts/
(μW/cm
2
) counts
15 counts
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Operation Characteristics
Symbol Parameter
PFOV
Package Field of View
Test Conditions
Note(s):
1. Each channel is tested with GAIN = 3.7x, Integration Time (INT_T) = 166ms and T
AMB
=25°C
2. The accuracy of each channel count is ±25%
Figure 11:
AS7261N LGA Package Field of View
Min Typ Max Unit
±20.5
deg
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AS7261N −
Detailed Descriptions
Detailed Descriptions
Figure 12:
Internal Block Diagram
VDD1 VDD2
INT
SCL_S
SDA_S
X Y Z D C NIR
°C
XYZ
True
Color
Sensor
AS7261N
I
2
C Control
GND
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LED_IND
LED_DRV
RESN
XYZ Sensor
The AS7261N XYZ sensor is a next-generation digital color sensor device. It senses X, Y, Z standard observer filters compliant with the CIE 1931 standard observer color response in addition to near IR (NIR), Clear (C) and Dark (D) spectrum filters.
The sensor contains analog-to-digital converters (16-bit resolution ADC), which integrate current from each channel’s photodiode. Upon completion of conversion cycle, the integrated result is transferred to the corresponding data register. Transfers are double-buffered to ensure integrity of the data is maintained.
Interference filters realize all filter responses and enable minimal life-time drift and very high temperature stability.
Filter accuracy is affected by the optical angle of incidence which itself is limited by an integrated aperture and an internal micro-lens structure in the AS7261N. The package field of view
(PFOV) is ±20.5° to deliver the specified accuracy. External optics can be used as needed to expand or reduce this built in
PFOV.
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Figure 13:
Bank Modes
Photo Diode Array
X Y C
Z D NIR
AS7261N −
Detailed Descriptions
Data Conversion
AS7261N spectral conversion is implemented via two photodiode banks. The first bank provides data from the X, Y, Z and NIR (near-IR) photodiodes. The second bank provides data from the same X and Y photodiodes as well as D (Dark) and
C (Clear) photodiodes.
The spectral conversion process is controlled with two BANK
Mode settings. Bank Mode 0 uses I²C registers for X, Y, D and C data. Bank Mode 1 uses I²C registers for X, Y, Z and NIR data.
Sensor data is available in four I²C registers (NDATAL/NDATAH,
XDATAL/XDATAH, YDATAL/YDATAH and ZDATAL/ZDATAH) as shown in the figures below.
BANK Mode 0
One Conversion
Integration Time
BANK Mode 1
One Conversion
Integration Time
X, Y, D and C
X, Y, Z and NIR
Figure 14:
AS7261N Sensor Data I²C Registers
I²C Register
NDATAL/NDATAH
XDATAL/XDATAH
YDATAL/YDATAH
ZDATAL/ZDATAH
Bank Mode 0
Y
D
C
X
Bank Mode 1
NIR
X
Y
Z
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Detailed Descriptions
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Spectral Conversion and Data Acquisition
Spectral conversion uses a register set for integration time
(register INT_T ). If both photodiode banks are required to complete the conversion, the second bank requires an additional integration time. Minimum conversion time for a single bank is 2.8 milliseconds. If data is required from all 6 photodiodes the device must perform 2 full conversions
(2 x integration time). The user has control of gain for the photodiode current, programmed into bits 0 and 1 of the GAIN_
IDRV register where gain can be set to 1x, 3.7x, 16x or 64x. A wait time between integration cycles can be programmed into register WTIME using the same units as the INT_T register.
An auto zero function is automatically performed before the first data conversion after a power-on or reset, in order to achieve the best data quality. Auto zero corrects for internal device temperature. But since it’s automatically done only once, it can also be manually run. Typically, if the temperature changes by 15 degrees C or more the auto zero should be manually run by writing to the Auto_Zero register (temperature is user calculated based on TMPL & TMPH registers values). But auto zero can also be manually done before every conversion.
When auto zero function is complete the DONE bit (bit7) of
Auto_Zero register will be set to 1.
The BANK bit (bit7) in the BANK register can be changed as needed before data conversion to acquire the desired channels.
While conversion is continuous, timing is done using registers.
Both polling and interrupt operation are then supported for
“conversion complete” timing. Both require programming the
INTR_POLL_EN register bit 2 to a 1. The conversion process is started by writing a 0x01 to the DATA_EN register followed by clearing any previous Data Valid bit in the INTR_POLL_CLR register. This is followed by a separate write of 0x03 to the
DATA_EN register.
If the AS7261N interrupt output is to be used for data conversion timing the INTR_PIN_Config register should be programmed to 0xCA. The INT pin will then be asserted high at the completion of the conversion cycle. A 0x04 should be written to the INTR_POLL_CLR register to clear this interrupt which also clears polling bit 2 in the register.
If only polling is to be used for conversion timing, an external interrupt is not required and the INTR_PIN_Config register should be programmed to 0x00. Polling of bit 2 in the INTR_
POLL_CLR register will return 0x00 if the conversion is not complete, and 0x04 if complete. Once complete a 0x04 should be written to the INTR_POLL_CLR register to clear bit 2, the polled bit.
For acquisition, done after conversion, data needs to be latched by writing 0x83 to the DATA_EN register. The purpose of latching the data by the user is to provide a mechanism for data to be coherent and under user control. Now, the data bank register can be read (one bank per single conversion-acquisition cycle). The CLR bit (bit2) should be
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AS7261N −
Detailed Descriptions cleared by writing a 1 to the CLR bit (bit2) of the INTR_POLL_
CLR register (0xF8) after each conversion-acquisition cycle is completed.
(EQ1)
Temperature Sensor
The Temperature Sensor measures on-chip temperature on demand, and enables temperature compensation procedures.
The basic equation for calculating the internal temperature of the device is:
0.7604
–
TMP
–
VALUE
•
2.048
•
–
TMP_VALUE is the derived from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) register data. Temperature conversions are performed by writing 0x24 to the TMP_Config register. Polling the TMP_Config register will indicate data acquisition is complete upon reading 0x84. After reading 0x84 the TMP_
Config register should be written to either 0x00 for idle or 0x24 to perform another temperature measurement. The result of the calculation is the device temperature in degree Celsius (°C).
Electronic Shutter with LED_IND or LED_DRV
Driver Control
Under user control there are two LED driver outputs that can be used to control LEDs on the two driver pins. This allows different wavelength light sources to be used in the same system. The LED output sink currents are programmable and can drive external LED sources. After programming for current the sources can be turned off and on via registers to provide the AS7261N with an electronic shutter capability. If turning
LEDs on, they should be fully on optically before a conversion begins and not shut off until after the conversion-acquisition cycle completes
The LED_IND pin can be turned on/off via the LED_IND register with values 0x01, 0x05, 0x09 and 0x0D for sink currents of 1mA,
2mA, 4mA and 8mA respectively.
For the LED_DRV pin, the GAIN_IDRV Register (0xB9) bits 7 and
6 control the drive strength of the pin for current values 12.5mA,
25mA, 50mA and 100mA. This register also controls the gain of all light acquisitions so care should be taken when writing to it.
The LED_DRV pin can be turned on/off via the LED_DRV register bit 2.
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AS7261N −
Detailed Descriptions
Low Power Mode
AS7261N can be put into the low power mode by writing 0x02 to the POWER MODE Register (0x73). Write 0x00 to set it back to normal mode. Wait at least 50μs before doing further
AS7261N operations after powering back to normal.
The sequence to configure AS7261N into low power mode:
•
Write 0x00 to Register 0xFA
•
Write 0x02 to Register 0x73
•
AS7261N is in low power mode
The sequence to configure AS7261N out of low power mode:
•
Write 0x00 to Register 0x73
•
Wait for at least 50μS
•
Write 0x03 to Register 0xFA
•
AS7261N is in normal mode
Device Initialization and Pin Assignment
On power up device needs to be initialized as follows before programming registers to do data conversion and acquisition:
•
Device Config 1 register: 0x70 written to 0x8A
•
Device Config 2 register: 0x71 written to 0x02
•
Device Config 3 register: 0xB0 written to 0x02
•
Device Config 4 register: 0x88 written to 0x00
•
Device Config 5 register: 0x9A written to 0x02
•
Interrupt Operation: The only user defined pin functionality is whether to use pin 13 as an interrupt signal at the completion of data conversion. This is done by programming the INTR_PIN_Config register (0x22) to
0xCA. To disable interrupt function the INTR_PIN_Config register should be programmed to 0x00, which is the power-on and reset default.
RC Oscillator
An internal on-chip timing generation circuit provides a 16MHz temperature compensated oscillator for the AS7261N master clock.
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Figure 15:
Reset Circuit
AS7261N −
Detailed Descriptions
Reset
Pulling down the RESN pin for longer than 100ms resets the
AS7261N.
I
2
C
Registers
AS7261N
Reset
RESN
Push > 100ms
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Detailed Descriptions
Figure 16:
I²C Register Programming Flow Chart
External
Micro-
Controller
(MCU)
AS7261N
Power-on or device reset
AS7261N
System Configuration
Start AS7261N
Data Cycle
AS726 1N
Inte rrupt
Enable d?
NO
YES
Interrupt Service Entry Point
One Time Device Configuration
DEV_Config_1, DEV_Config_2,
DEV_Config_3, DEV_Config_4,
DEV_Config_5
Interrupt Configuration
INTR_PIN_Config,
INTR_POLL_CLR,
INTR_POLL_EN
Turn off Low Power Mode (if on)
PWR_MODE, DATA_EN
Configure LEDs (if needed)
LED_IND, LED_DRV
Sensor Configuration
INT_T, GAIN_IDRV, BANK, WTIME
Perform Auto Zero (optional)
Auto_Zero, TMPH, TMPL, TMP_Config
Conversion Start
INTR_POLL_CLR,
DATA_EN (first write),
DATA_EN (separate, second write)
Read For Conversion Complete
INTR_POLL_CLR
= 0x04 ?
YES
Latch Data for Acquisition
DATA_EN
Read Sensor Data
If BANK MODE 0, read X, Y, D & C
If BANK MODE 1, read X, Y, Z, & NIR
NO
More Data?
YES
NO
Clear Poll Bit
INTR_POLL_CLR
Turn off LEDs
LED_IND, LED_DRV
Turn on Low Power Mode
DATA_EN, PWR_MODE
Note(s):
1. When using shuttered LEDs, the LED source(s) should be at desired brightness before conversion starts.
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AS7261N −
Detailed Descriptions
I²C Slave Interface
Interface, control and reading sensor data is accomplished through an I²C compatible slave interface via a set of registers.
I²C Feature List
•
Fast mode (400 kHz) and standard mode (100 kHz) support
•
7+1-bit addressing mode
•
Write format: Byte
•
Read format: Byte
I²C Register Set
The 7-bit I²C slave address of AS7261N is 0x49 plus one bit for read/write. When reading from I²C registers, the 7 + 1-bit address should be 0x93. When writing to I²C registers, the
7+1-bit address should be 0x92.
The figure below provides a summary of the AS7261N I²C register set. Figures after that provide additional details. All register data is hex, and all multi-byte entities are Big Endian
(most significant byte is situated at the lower register address).
I²C register addresses not listed should be treated as reserved and not used.
Figure 17:
I²C Register Set Overview
Addr Name
0x10
0x11
0x70
0x71
0xB0
0x88
0x9A
DEV_Config_1
DEV_Config_2
DEV_Config_3
DEV_Config_4
DEV_Config_5
0x73
DEV_ID
DEV_VER
PWR_MODE
<D7> <D6> <D5> <D4> <D3> <D2> <D1> <D0>
Device Version Registers
Device Identification
Device Version
Device Configuration Registers
Device Configuration 1
Device Configuration 2
Device Configuration 3
Device Configuration 4
Device Configuration 5
Power Mode Register
RESV PM RESV
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AS7261N −
Detailed Descriptions
Addr Name
0x22 INTR_PIN_Config
0xF8 INTR_POLL_CLR
0xF9 INTR_POLL_EN
0xEA
0x84
0xDB
0xB9
0xD9
0xDA
0xFA
0xEC
0xED
0xEE
0xEF
0xDC
0xDD
0xDE
0xDF
0xBA
0xD1
0xD2
0xD3
LED_DRV
LED_IND
Auto_Zero
TMPH
TMPL
TMP_Config
BANK
GAIN_IDRV
INT_T
WTIME
DATA_EN
NDATA_L
NDATA_H
YDATA_L
YDATA_H
ZDATA_L
ZDATA_H
XDATA_L
XDATA_H
<D7> <D6> <D5> <D4> <D3> <D2> <D1> <D0>
Interrupt and Polling Control Registers
OPIN FUNCT
RESV
RESV
CLR
EN
LED Control Registers
RESV ON_OFF
CURRENT RESV
Auto Zero and Temperature Control Registers
RESV C_EN X_EN Y_EN
Most Significant bits (9:2) of Temperature Measurement
RESV
RESV
RESV
ON_OFF
TMPL
Z_EN
ISTAT RESVSTRT RESV
Sensor Control Registers
SRC
RESV
RESV
BANK RESV
GAIN
DL
IDRV
RESV
Integration Time
Wait Time
RESV
Sensor Data Registers
WAIT
N Channel Low Byte
N Channel High Byte
RESV
Y Channel Low Byte
Y Channel High Byte
Z Channel Low Byte
Z Channel High Byte
X Channel Low Byte
X Channel High Byte
CON PON
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AS7261N −
Detailed Descriptions
Detailed Register Description
Figure 18:
Device ID and Version Registers
Bit
Addr: 0x01
Bit Name
7:0 DEV_ID
Addr: 0x11
Bit
7:0
Bit Name
DEV_VER
Default Access
01110010 R
Device Identification
Bit Description
Device identification number
Device Version
Default Access
R
Bit Description
Device version number
Figure 19:
Device Configuration Registers
Bit
7:0
Bit
7:0
Bit
7:0
Bit
7:0
Bit
7:0
Addr: 0x70
Bit Name
DEV_Config_1
Addr: 0x71
Bit Name
DEV_Config_2
Addr: 0xB0
Bit Name
DEV_Config_3
Addr: 0x88
Bit Name
DEV_Config_4
Addr: 0x9A
Bit Name
DEV_Config_5
Default Access
Device Configuration 1
Bit Description
R/W
Default Access
Device Configuration 1, must be initialized to 0x8A by external MCU
Device Configuration 2
Bit Description
R/W
Default Access
Device Configuration 1, must be initialized to 0x02 by external MCU
Device Configuration 3
Bit Description
R/W
Default Access
Device Configuration 1, must be initialized to 0x02 by external MCU
Device Configuration 4
Bit Description
R/W
Default Access
R/W
Device Configuration 1, must be initialized to 0x00 by external MCU
Device Configuration 5
Bit Description
Device Configuration 1, must be initialized to 0x02 by external MCU
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AS7261N −
Detailed Descriptions
Figure 20:
Power Mode Register
Addr: 0x04/0x84
Bit Bit Name Default Access
7:2 RESV 0 R/W
1
0
PM
RSVD
1
0
R/W
R/W
PWR_MODE
Bit Description
Reserved, set to 000000 if writing the register
1= Normal Operation Power Mode
0= Low Power Mode
Reserved, set to 0 if writing the register
Figure 21:
Interrupt Pin Configuration Register
Bit
7:0
Addr: 0x22
Bit Name
INTR_PIN_Config
Default Access
0x00 R/W
INTR_PIN_Config
Bit Description
0x00 = INT pin disabled
0xCA = INT pin enabled
Figure 22:
Interrupt and Polling Clear Register
Bit
Addr: 0xF8
Bit Name Default Access
7:3 RESV 00000 R/W
2
1:0
CLR
RSVD
0
00
R/W
R/W
INTR_POLL_CLR
Bit Description
Reserved, set to 00000 if writing the register
Set to 1 to clear any asserted interrupt pin INT (the interrupt channel ready must be enabled). If the interrupt channel ready is enabled this bit will read a 1.
Reserved, set to 00 if writing the register
Figure 23:
Interrupt and Polling Enable Register
Bit
Addr: 0xF9
Bit Name Default Access
7:3 RESV 0 R/W
2:1
0
EN
RSVD
0
0
R/W
R/W
INT_POLL_EN
Bit Description
Reserved, set to 00000 if writing the register
Set to 1 to enable the channel data ready for polling or interrupt.
Reserved, set to 0 if writing the register
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AS7261N −
Detailed Descriptions
Figure 24:
LED Driver Register
Bit
Addr: 0xEA
Bit Name Default Access
7:3 RESV 0 R/W
2
0:1
ON_OFF
RSVD
0
0
R/W
R/W
LED_DRV
Bit Description
Reserved, set to 00000 if writing the register
Set to 1 to enable the LED_DRV pin to the current level specified by the register GAIN_IDRV (0xB9). Set to 0 to turn off.
Reserved, set to 00 if writing the register
Figure 25:
LED Indicator Register
Bit
Addr: 0x84
Bit Name Default Access
7:4 RESV 0 R/W
3:2
1
0
CURRENT
RSVD
ON_OFF
00
0
0
R/W
R/W
R/W
LED_IND
Bit Description
Reserved, set to 0 if writing the register
For LED_IND pin current value (when on).
Set to:
‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8mA;
Reserved, set to 0 if writing the register
Set to 1 to enable the LED_DRV pin to the current level specified by the CURRENT bits. Set to 0 to turn off.
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AS7261N −
Detailed Descriptions
Figure 26:
Auto Zero Register
Bit
Addr: 0xBA
Bit Name Default Access
7
6:4
3
2
1
0
DONE
RESV
C_EN
X_EN
Y_EN
Z_EN
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
Auto_Zero
Bit Description
Will be set to 1 when any auto zero function is completed. Set to 0 if writing to the register.
Reserved, set to 000 if writing the register
Set to 1 to manually run auto zero on the C channel. Will be automatically set to 0 when DONE bit is set.
Set to 1 to manually run auto zero on the X channel. Will be automatically set to 0 when DONE bit is set.
Set to 1 to manually run auto zero on the Y channel. Will be automatically set to 0 when DONE bit is set.
Set to 1 to manually run auto zero on the Z channel. Will be automatically set to 0 when DONE bit is set.
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AS7261N −
Detailed Descriptions
Figure 27:
Temperature Measurement High Register
Temperature Measurement High Register (bits 9:2)
TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) registers (see the Temperature Sensor section of this datasheet). Temperature conversion controlled by the TEMP_
Config register.
Bit
Addr: 0xD1
Bit Name Default Access
7:0 TMPH R
TMPH
Bit Description
Most significant 8 bits (9:2) of the Temperature
Measurement.
Temperature Measurement Low Register (bits 1:0)
TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and
0xD1 [7:0]) registers (see the Temperature Sensor section of this datasheet). Temperature conversion controlled by the TEMP_
Config register.
Figure 28:
Temperature Measurement Low Register
Bit
Addr: 0xD2
Bit Name Default Access
7:0 TMPL R
TMPL
Bit Description
Least significant 2 bits (1:0) of the Temperature
Measurement.
Figure 29:
Temperature Configure Register
Bit
Addr: 0xD3
Bit Name Default Access
7
6
5
4
3:0
ISTAT
RESV
START
RESV
SRC
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
TEMP_Config
Bit Description
Will be set to 1 when internal temperature measurement is complete. Set to 0 if writing to the register.
Reserved, set to 0 if writing the register
Set to 1 to start a temperature conversion cycle. Set to 0 for IDLE state.
Reserved, set to 0 if writing the register
Set to 0100 to start a temperature conversion cycle. Set to 0000 for IDLE state.
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AS7261N −
Detailed Descriptions
Figure 30:
Bank Register
Bit
Addr: 0xDB
Bit Name Default Access
7
6:0
BANK
RESV
0
0
R/W
R/W
BANK
Bit Description
Sets Bank mode for sensor channel selection:
0= Mode 0 for X, Y, D and D sensor data
1= Mode 1 for X, Y, Z and NIR sensor data
Reserved, set to 0000000 if writing the register
Figure 31:
Sensor Gain and LED_DRV Current Drive Register
Bit
Addr: 0xB9
Bit Name Default Access
7:6
5:2
1:0
IDRV
RESV
GAIN
0
0
0
R/W
R/W
R/W
GAIN_IDRV
Bit Description
For LED_DRV pin current limit (when on).
Set to:
‘b00=100mA; ‘b01=50mA; ‘b10=25mA; ‘b11=12.5mA;
Reserved, set to 0000 if writing the register
Sensor Channel Gain Setting (all channels)
‘b00=1x; ‘b01=3.7x; ‘b10=16x; ‘b11=64x;
Figure 32:
Integration Time Register
Bit
Addr: 0xD9
Bit Name Default Access
7:0 INT_T 0xFF R/W
INT_T
Bit Description
Sets sensor integration time
Integration time = (256 - value) * 2.8ms
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AS7261N −
Detailed Descriptions
Figure 33:
Integration Wait Time Register
Bit
Addr: 0xDA
Bit Name Default Access
7:0 INT_WT 0xFF R/W
INT_WT
Bit Description
Sets time between sensor integrations
Integration wait time = (256 - value) * 2.8ms
Figure 34:
Data Enable Register
2
1
0
Bit
Addr: 0xFA
Bit Name Default Access
7
6:4
3
DL
RESV
WAIT
RESV
CON
PON
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
DATA_EN
Bit Description
Data Latch. Set to 1 to latch the data after acquisition completes
Reserved, set to 000 if writing the register
Set to 1 to enable the wait timer between data channel acquisitions
Reserved, set to 0 if writing the register
Set to 1 to enable data channel acquisitions
Set to 1 if writing the register
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AS7261N −
Detailed Descriptions
Figure 35:
Sensor Data Registers
Bit
Addr: 0xDC
Bit Name Default Access
7:0 NDATA_L
Addr: 0xDD
R
NDATA_L
Bit Description
Channel N Low Data Byte
NDATA_H
Bit Bit Name Default Access
R 7:0 NDATA_H
Addr: 0xDE
Bit Description
Channel N High Data Byte
YDATA_L
Bit Bit Name Default Access
R 7:0 YDATA_L
Addr: 0xDF
Bit Description
Channel Y Low Data Byte
YDATA_H
Bit Bit Name Default Access
R 7:0 YDATA_H
Addr: 0xEC
Bit Description
Channel Y High Data Byte
ZDATA_L
Bit Bit Name Default Access
R 7:0 ZDATA_L
Addr: 0xED
Bit Description
Channel Z Low Data Byte
ZDATA_H
Bit Bit Name Default Access
R 7:0 ZDATA_H
Addr: 0xEE
Bit Description
Channel Z High Data Byte
XDATA_L
Bit Bit Name Default Access
R 7:0 XDATA_L
Addr: 0xEF
Bit Description
Channel X Low Data Byte
XDATA_H
Bit
7:0
Bit Name Default Access
XDATA_H R
Bit Description
Channel X High Data Byte
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AS7261N −
Application Information
Application Information
Figure 36:
AS7261N Typical Application Circuit
Schematic
3V3
100nF 10uF
10K
RST
17 VDD1
14 VDD2
2 RESN
16 GND
3V3 3V3
15 LED_DRV
18 LED_IND
AS7261N
Micro
Controller
Unit
SCL_M
SDA_M
INT
9
10
SCL_S
SDA_S
13 INT
NF
NF
NF
NF
NF
19
20
1
11
12
NF
NF
NF
NF
NF
NF
5
4
3
8
7
6
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AS7261N −
Application Information
Figure 37:
Typical Layout Routing
PCB Layout
ams Datasheet
[v1-02] 2017-Feb-27
In order to prevent interference, avoid trace routing feedthroughs with exposure directly under the AS7261N. An example routing is illustrated in the diagram.
Page 29
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Package Drawings & Markings
Figure 38:
Package Drawing
AS7261N
AS7261N −
Pack age Drawings & Mark ings
RoHS
Green
Note(s):
1. All linear dimensions are in millimeters
2. XXXXX = tracecode
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AS7261N −
PCB Pad Layout
PCB Pad Layout
Figure 39:
Recommended PCB Pad Layout
Suggested PCB pad layout guidelines for the LGA device are shown.
Unit: mm
0.65
0.30
1
Note(s):
1. Unless otherwise specified, all dimensions are in millimeters.
2. Dimensional tolerances are ±0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
4.40
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Mechanical Data
Figure 40:
Tape & Reel Information
AS7261N −
Mechanical Data
Note(s):
1. All dimensions in millimeters unless of otherwise stated.
2. Measured from centreline of sprocket hole to centreline of pocket.
3. Cumulative tolerance of 10 sprocket holes is ±0.20.
4. Measured from centreline of sprocket hole to centreline of pocket.
5. Other material available.
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AS7261N −
Soldering & Storage Information
Soldering & Storage
Information
Figure 41:
Solder Reflow Profile
Parameter
Average temperature gradient in preheating
Soak time
Time above 217 ° C(T
1
)
Time above 230
°
C(T
2
)
Time above T peak
- 10
°
C(T
3
)
Peak temperature in reflow
Temperature gradient in cooling
Figure 42:
Solder Reflow Profile Graph
Soldering Information
The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile.
Reference
t
SOAK t
1 t
2 t
3
T peak
Device
2.5
° C/s
2 to 3 minutes
Max 60s
Max 50s
Max 10s
260 ° C
Max -5 ° C/s
ams Datasheet
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AS7261N −
Soldering & Storage Information
Manufacturing Process Considerations
The AS7261N package is compatible with standard reflow no-clean and cleaning processes including aqueous, solvent or ultrasonic techniques. However, as an open-aperture device, precautions must be taken to avoid particulate or solvent contamination as a result of any manufacturing processes, including pick and place, reflow, cleaning, integration assembly and/or testing. Temporary covering of the aperture is allowed.
To avoid degradation of accuracy or performance in the end product, care should be taken that any temporary covering and associated sealants/debris are thoroughly removed prior to any optical testing or final packaging.
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
•
Shelf Life: 12 months
•
Ambient Temperature: <40°C
•
Relative Humidity: <90%
Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region.
ams Datasheet
[v1-02] 2017-Feb-27
AS7261N −
Soldering & Storage Information
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
•
Floor Life: 168 hours
•
Ambient Temperature: <30°C
•
Relative Humidity: <60%
If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
ams Datasheet
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AS7261N −
Ordering & Contac t Information
Ordering & Contact Information
Figure 43:
Ordering Information
Ordering
Code
Package Marking
AS7261N-BLGT 20-pin LGA AS7261N
Description
Delivery
Form
XYZ and NIR Sensor with
Electronic Shutter
Tape & Reel
Delivery
Quantity
2000 pcs/reel
Buy our products or get free samples online at: www.ams.com/ICdirect
Technical Support is available at: www.ams.com/Technical-Support
Provide feedback about this document at: www.ams.com/Document-Feedback
For further information and requests, e-mail us at: [email protected]
For sales offices, distributors and representatives, please visit: www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
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AS7261N −
RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS:
The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br):
ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information:
The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
ams Datasheet
[v1-02] 2017-Feb-27
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Copyrights & Disclaimer
AS7261N −
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services.
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AS7261N −
Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Product Status
Pre-Development
Pre-Production
Production
Discontinued
Definition
Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice
Information in this datasheet is based on products in the design, validation or qualification phase of development.
The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice
Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of
Trade
Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and should not be used for new designs
ams Datasheet
[v1-02] 2017-Feb-27
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AS7261N −
Revision Information
Revision Information
Changes from 1-01 (2017-Feb-08) to current revision 1-02 (2017-Feb-27)
Updated Figure 10
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page
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ams Datasheet
[v1-02] 2017-Feb-27
AS7261N −
Content Guide
Content Guide
ams Datasheet
[v1-02] 2017-Feb-27
1 General Description
1 Key Benefits & Features
2 Application
2 System Block Diagram
3 Pin Assignments
3 Pin Description
5 Absolute Maximum Ratings
6 Electrical Characteristics
8 Timing Characteristics
9 Operation Characteristics
11 Detailed Descriptions
11 XYZ Chromatic White Color Sensor
12 Data Conversion
13 Spectral Conversion and Data Acquisition
14 Temperature Sensor
14 Electronic Shutter with LED_IND or LED_DRV Driver
Control
15 Low Power Mode
15 Device Initialization and Pin Assignment
15 RC Oscillator
15 Reset
18 I²C Slave Interface
18 I²C Feature List
18 I²C Register Set
20 Detailed Register Description
22 Temperature Measurement High Register (bits 9:2)
22 Temperature Measurement Low Register (bits 1:0)
27 Application Information
27 Schematic
27 PCB Layout
28 Package Drawings & Markings
29 PCB Pad Layout
30 Mechanical Data
31 Soldering & Storage Information
31 Soldering Information
32 Manufacturing Process Considerations
32 Storage Information
32 Moisture Sensitivity
32 Shelf Life
32 Floor Life
33 Rebaking Instructions
34 Ordering & Contact Information
Page 41
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AS7261N −
Content Guide
35 RoHS Compliant & ams Green Statement
36 Copyrights & Disclaimer
37 Document Status
38 Revision Information
Page 42
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