®
STPS20L25CT/CG
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
Tj (max)
V
F
(max)
2 x 10 A
25 V
150 °C
0.35 V
A1
A2
K
FEATURES AND BENEFITS n n n
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
AVALANCHE CAPABILITY SPECIFIED
DESCRIPTION
Dual center tap Schottky rectifier suited to
Switched Mode Power Supplies and high frequency DC to DC converters.
Packaged in TO-220AB and D
2
PAK, this device is especially intended for use as a rectifier at the secondary of 3.3V SMPS units.
TO-220AB
A1
K
A2
STPS20L25CT
ABSOLUTE RATINGS (limiting values, per diode)
Symbol Parameter
V
RRM
Repetitive peak reverse voltage
I
F(RMS)
RMS forward current
I
F(AV)
Average forward current Tc = 145°C
δ
= 0.5
Per diode
Per device
I
FSM
Surge non repetitive forward current tp = 10 ms Sinusoidal
I
RRM
Repetitive peak reverse current tp=2 µs square F=1kHz
I
RSM
Non repetitive peak reverse current tp = 100 µs square
P
ARM
Repetitive peak avalanche power tp = 1µs Tj = 25°C
T stg
Storage temperature range
Tj Maximum operating junction temperature * dV/dt Critical rate of rise of reverse voltage
K
D
2
A1
PAK
A2
STPS20L25CG
Value
25
30
10
20
220
1
3
5300
- 65 to + 150
150
10000
Unit
V
A
A
A
A
A
W
°
C
°C
V/µs
* : dPtot dTj
<
July 2003 - Ed : 4A
1
(
− a ) thermal runaway condition for a diode on its own heatsink
1/5
STPS20L25CT/CG
THERMAL RESISTANCES
Symbol
R
R th (j-c) th (c)
Junction to case
Parameter
Per diode
Total
Coupling
When the diodes 1 and 2 are used simultaneously :
∆
Tj(diode 1) = P(diode1) x R th(j-c)
(Per diode) + P(diode 2) x R th(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Value
1.5
0.8
0.1
°
Unit
C/W
Symbol Tests conditions Tests conditions
I
V
R
F
*
*
Reverse leakage current Tj = 25
°
C
Tj = 125
°
C
Forward voltage drop Tj = 25
°
C
Tj = 125
°
C
Tj = 25
°
C
Tj = 125
°
C
Pulse test: * tp = 380 µs,
δ
< 2%
I
I
I
I
V
F
F
F
F
R
= V
RRM
= 10 A
= 10 A
= 20 A
= 20 A
Min.
Typ.
125
0.30
0.41
Max.
800
250
0.46
0.35
0.56
0.48
Unit
µ
A mA
V
To evaluate the maximum conduction losses use the following equation :
P = 0.22 x I
F(AV)
+ 0.013 I
F
2
(RMS)
Fig. 1: Average forward power dissipation versus average forward current.
Fig. 2: Average forward current versus ambient temperature (
δ
= 0.5).
5
PF(av)(W)
δ
= 0.05
δ
= 0.1
4
δ
= 0.2
δ
= 0.5
3
δ
= 1
2
T
1
IF(av) (A)
δ
=tp/T tp
0
0 1 2 3 4 5 6 7 8 9 10 11
12
IF(av)(A)
10
8
6
4
T
2
0
0
δ
=tp/T
25 tp
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
50
Tamb(°C)
75 100 125 150
Fig. 3: Normalized avalanche power derating versus pulse duration.
1
P (t )
P
ARM
(1µs)
0.1
0.01
0.001
0.01
0.1
1 10 100 1000
Fig. 4: Normalized avalanche power derating versus junction temperature.
1.2
P (t )
P
ARM
(25°C)
1
0.8
0.6
0.4
0.2
0
0 25 50 75 100 125 150
2/5
Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values).
200
IM(A)
180
160
140
120
100
80
60
40
20
0
1E-3
I M t
δ
=0.5
1E-2 t(s)
1E-1
Tc=25°C
Tc=75°C
Tc=100°C
1E+0
STPS20L25CT/CG
Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration.
1.0
Zth(j-c)/Rth(j-c)
0.8
0.6
δ
= 0.5
0.4
0.2
δ
= 0.2
δ = 0.1
0.0
1.0E-4
Single pulse
1.0E-3 tp(s)
1.0E-2
T
δ
=tp/T
1.0E-1 tp
1.0E+0
Fig. 7: Reverse leakage current versus reverse voltage applied (typical values).
5E+2
IR(mA)
1E+2
1E+1
1E+0
1E-1
1E-2
0 5
Tj=150°C
Tj=125°C
Tj=25°C
10
VR(V)
15 20 25
Fig. 8: Junction capacitance versus reverse voltage applied (typical values).
5.0
C(nF)
F=1MHz
Tj=25°C
1.0
0.1
1 2 5
VR(V)
10 20 50
Fig. 9: Forward voltage drop versus forward current (maximum values).
100.0
IFM(A)
Typical values
Tj=150°C
10.0
Tj=25°C
1.0
Tj=125°C
VFM(V)
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm).
(STPS20L25G only)
80
70
60
50
40
30
20
10
0
0
Rth(j-a) (°C/W)
4 8 12
S(Cu) (cm²)
16 20 24 28 32 36 40
3/5
STPS20L25CT/CG
PACKAGE MECHANICAL DATA
D
2
PAK
L
L2
L3
E
G
B2
B
A1
C2
C
A2
A
R
D
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
L2
L3
M
D
E
G
L
R
V2
A
A1
A2
B
B2
C
C2
REF.
DIMENSIONS
Millimeters Inches
Min.
Max.
Min.
Max.
4.40
2.49
0.03
0.70
1.14
0.45
1.23
4.60
2.69
0.23
0.93
1.70
0.60
1.36
0.173
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.045
0.067
0.017
0.024
0.048
0.054
8.95
9.35
0.352
0.368
10.00
10.40
0.393
0.409
4.88
5.28
0.192
0.208
15.00
15.85
0.590
0.624
1.27
1.40
2.40
1.40
1.75
3.20
0°
0.40 typ.
8°
0.050
0.055
0.094
0.055
0.069
0.126
0.016 typ.
0° 8°
FOOTPRINT DIMENSIONS (in millimeters)
16.90
10.30
3.70
1.30
5.08
8.90
n
COOLING METHOD: BY CONDUCTION
(METHOD C)
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STPS20L25CT/CG
PACKAGE MECHANICAL DATA
TO-220AB
REF.
L2
F2
F1
F
G1
H2
Dia
G
L5
L9
L6
L4
C
A
D
M
E
L7
L2
L4
L5
L6
F2
G
G1
H2
A
C
D
E
F
F1
L7
L9
M
Diam.
n n n
COOLING METHOD : C
RECOMMENDED TORQUE VALUE : 0.55 M.N
MAXIMUM TORQUE VALUE : 0.70 M.N
DIMENSIONS
Millimeters Inches
Min.
4.40
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
Max.
4.60
1.32
2.72
0.70
0.88
1.70
0.173
0.181
0.048
0.051
0.094
0.107
0.019
0.027
0.024
0.034
0.044
0.066
1.70
5.15
0.044
0.066
0.194
0.202
2.70
0.094
0.106
10.40
0.393
0.409
13
16.4 typ.
14
0.645 typ.
0.511
0.551
2.65
2.95
0.104
0.116
15.25
15.75
0.600
0.620
6.20
3.50
6.60
3.93
2.6 typ.
3.75
3.85
Min.
0.244
0.137
Max.
0.259
0.154
0.102 typ.
0.147
0.151
Ordering type Marking
STPS20L25CT
STPS20L25CG
STPS20L25CT
STPS20L25CG
STPS20L25CG-TR STPS20L25CG n
EPOXY MEETS UL94,V0
Package
TO-220AB
D
2
D
2
PAK
PAK
Weight
2.23g
1.48g
1.48g
Base qty
50
50
1000
Delivery mode
Tube
Tube
Tape & reel
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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