STMicroelectronics VN920SP-E Datasheet
விளம்பரம்
விளம்பரம்
VN920SP-E
High-side driver
Features
Type R
DS(on)
VN920SP-E 15 m Ω
I
OUT
30 A
V
CC
36 V
■
■
■
■
■
■
■
■
■
■
ECOPACK
®
: lead free and RoHS compliant
Automotive Grade: compliance with AEC guidelines
Very low standby current
CMOS compatible input
Proportional load current sense
Current sense disable
Thermal shutdown protection and diagnosis
Undervoltage shutdown
Overvoltage clamp
Load current limitation
Description
The VN920SP-E is a monolithic device designed in STMicroelectronics™ VIPower™ M0-3 technology. The VN920SP-E is intended for driving any type of load with one side connected to ground. The active V
CC pin voltage clamp protects the device against low energy spikes
(see ISO7637 transient compatibility table).
Active current limitation combined with thermal shutdown and automatic restart protects the device against overload.
The device integrates an analog current sense output which delivers a current proportional to the load current. The device automatically turns-off in the case where the ground pin becomes disconnected.
Table 1.
Device summary
Package
PowerSO-10™
September 2013
Tube
VN920SP-E
Order codes
Tape and reel
VN920SPTR-E
Doc ID 10896 Rev 4 1/27 www.st.com
1
Contents
Contents
VN920SP-E
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 17
Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 18
PowerSO-10 maximum demagnetization energy (V
= 13.5 V) . . . . . . 19
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
®
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/27 Doc ID 10896 Rev 4
VN920SP-E
List of tables
List of tables
CC
= 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical transient requirements on V
pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements on V
pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements on V
pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Doc ID 10896 Rev 4 3/27
List of figures
List of figures
VN920SP-E
Switching characteristics (resistive load R
= 1.3
Ω ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
/I
SENSE
versus I
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
vs T case
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 20
PowerSO-10 suggested pad layout and tube shipment (no suffix) . . . . . . . . . . . . . . . . . . 25
4/27 Doc ID 10896 Rev 4
VN920SP-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
V
CC
GND
INPUT
V
CC
CLAMP
LOGIC
OVERTEMPERATURE
DETECTION
OVERVOLTAGE
DETECTION
UNDERVOLTAGE
DETECTION
Power CLAMP
DRIVER
CURRENT LIMITER
V
DS
LIMITER
I
OUT
K
OUTPUT
CURRENT
SENSE
Figure 2.
Configuration diagram (top view)
GROUND
INPUT
C.SENSE
N.C.
N.C.
V
CC
8
9
6
7
10
11
PowerSO-10
2
1
5
4
3
OUTPUT
OUTPUT
N.C.
OUTPUT
OUTPUT
Table 2.
Suggested connections for unused and not connected pins
Connection / pin Current sense N.C.
Output Input
Floating
To ground
Through 1 K Ω resistor
X
X
X X
Through 10K Ω resistor
Doc ID 10896 Rev 4 5/27
Electrical specifications VN920SP-E
Figure 3.
Current and voltage conventions
V
IN
I
IN
I
S
V
CC V
F
I
OUT
OUTPUT
INPUT
CURRENT SENSE
GND
I
GND
I
SENSE
V
SENSE
V
OUT
V
CC
6/27
Stressing the device above the rating listed in
may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document.
Table 3.
Symbol
V
CC
- V
CC
- I
GND
I
OUT
- I
OUT
I
IN
Absolute maximum ratings
Parameter
DC supply voltage
Reverse DC supply voltage
DC reverse ground pin current
DC output current
Reverse DC output current
DC input current
Value
41
-0.3
-200
Internally limited
-40
+/-10
-3
+15
V
CSENSE
Current sense maximum voltage
V
ESD
Electrostatic discharge
(Human Body Model: R = 1.5 K Ω; C = 100 pF)
– INPUT
– CURRENT SENSE
– OUTPUT
– V
CC
4000
2000
5000
5000
V
V
V
V
Unit
A mA
V
V
V
V mA
A
Doc ID 10896 Rev 4
VN920SP-E
Table 3.
Symbol
E
MAX
P tot
T j
T c
T
STG
Absolute maximum ratings (continued)
Parameter
Maximum switching energy
(L = 0.25 mH; R
L
= 0 Ω ; V bat
= 13.5 V;
T jstart
= 150 °C; I
L
= 45 A)
Power dissipation T
C
≤ 25 °C
Junction operating temperature
Case operating temperature
Storage temperature
Electrical specifications
Value
362
96.1
Internally limited
-40 to 150
-55 to 150
Unit mJ
W
°C
°C
°C
Table 4.
Symbol
Thermal data
Parameter
R thj-case
Thermal resistance junction-case (max)
Max. value
1.3
R thj-amb
Thermal resistance junction-ambient (max) 51.3
(1)
1.
2.
When mounted on FR4 printed circuit board with 0.5 cm
2
of Cu (at least 35 µm thick).
When mounted on FR4 printed circuit board with 6 cm
2
of Cu (at least 35 µm thick).
37
(2)
Unit
°C/W
°C/W
°C/W
Doc ID 10896 Rev 4 7/27
Electrical specifications VN920SP-E
Values specified in this section are for 8 V < V
CC
< 36 V; -40 °C < T j < 150 °C, unless otherwise stated.
Table 5.
Symbol
V
CC
V
USD
V
OV
Power
Parameter
Operating supply voltage
Undervoltage shutdown
Overvoltage shutdown
R
ON
On-state resistance
V
CLAMP
Clamp voltage
Test conditions
I
OUT
= 10 A; T j
= 25 °C;
I
OUT
= 10 A;
I
OUT
= 3 A; V
CC
= 6 V
I
CC
= 20 mA
(1)
Off-state; V
CC
= 13 V;
V
IN
= V
OUT
= 0 V
Min.
Typ.
Max. Unit
5.5
3
36
13
4
36
5.5
41 48
15
30
50
55
V
V
V m
Ω m Ω m Ω
V
10 25 µA
I
S
Supply current
Off-state; V
CC
= 13 V;
V
IN
= V
OUT
= 0 V; T j
= 25 °C
I
I
I
I
L(off1)
L(off2)
L(off3)
L(off4)
On-state; V
CC
= 13 V; V
IN
= 5 V;
I
OUT
= 0 A; R
SENSE
= 3.9 k Ω
Off-state output current V
IN
= V
OUT
= 0 V
Off-state output current V
IN
= 0 V; V
OUT
= 3.5 V
Off-state output current
Off-state output current
V
IN
= V
OUT
= 0 V; V
CC
= 13 V;
T j
= 125 °C
V
IN
= V
OUT
= 0 V; V
CC
= 13 V;
T j
= 25 °C
1.
V
CLAMP
and V
OV
are correlated. Typical difference is 5 V.
0
-75
10 20 µA
5 mA
50 µA
0 µA
5 µA
3 µA
Table 6.
Symbol
Switching (V
CC
= 13 V)
Parameter Test conditions t t d(on) d(off) dV
OUT
/dt
(on) dV
OUT
/dt
(off)
Turn-on delay time R
L
= 1.3
Ω (see
Turn-off delay time R
L
= 1.3
Ω
(see
Turn-on voltage slope R
L
= 1.3
Ω (see
Turn-off voltage slope R
L
= 1.3
Ω (see
Min.
Typ.
Max.
Unit
50
50
See
See
µs
µs
V/µs
V/µs
8/27 Doc ID 10896 Rev 4
VN920SP-E Electrical specifications
Table 7.
Symbol
Logic inputs
Parameter
V
IL
I
IL
V
IH
I
IH
V
I(hyst)
Input low level voltage
Low level input current
Input high level voltage
High level input current
Input hysteresis voltage
V
ICL
Input clamp voltage
Test conditions
V
IN
= 1.25 V
V
IN
= 3.25 V
Min.
Typ.
Max.
Unit
1.25
1
3.25
0.5
6 6.8
-0.7
10
8
V
µA
V
µA
V
V
V
I
IN
= 1 mA
I
IN
= - 1 mA
Table 8.
Symbol
V
F
V
CC
output diode
Parameter Test conditions
Forward on voltage - I
OUT
= 5.3 A; T j
= 150 °C
Min.
Typ.
Max.
Unit
0.6
V
Table 9.
Symbol
Protections
(1)
Parameter Test conditions Min.
Typ.
Max.
Unit
V
T
TSD
T
R
T hyst
I lim demag
Shutdown temperature
Reset temperature
Thermal hysteresis
DC short circuit current
Turn-off output clamp voltage
V
CC
= 13 V
5 V < V
CC
< 36 V
I
OUT
= 2 A;
V
IN
= 0 V;
L = 6 mH
150
135
7
30
V
CC
175
15
45
- 41 V
CC
- 48 V
200
75
75
CC
- 55
°C
°C
°C
A
A
V
V
ON
Output voltage drop limitation
I
OUT
= 1 A;
T j
= -40 °C...150 °C
50
1.
To ensure long term reliability under heavy over-load or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles.
mV
Doc ID 10896 Rev 4 9/27
Electrical specifications VN920SP-E
Table 10.
Current sense
(1)
Symbol Parameter Test conditions
I
SENSE0
V
V dK dK dK
K
1
K
2
K
3
1
/K
2
/K
3
/K
1
2
3
SENSE
SENSEH
I
OUT
/I
SENSE
Current sense ratio drift
I
OUT
= 1 A; V
SENSE
= 0.5 V;
T j
= -40 °C...150 °C
I
OUT
= 1 A; V
SENSE
= 0.5 V;
T j
= - 40 °C...150 °C
I
OUT
I
OUT
/I
/I
SENSE
Current sense ratio drift
SENSE
Current sense ratio drift
Analog sense leakage current
Max analog sense output voltage
I
OUT
= 10 A; V
SENSE
= 4 V;
T j
= - 40 °C
T j
= 25 °C...150 °C
I
OUT
= 10 A; V
SENSE
= 4 V;
T j
= -40 °C...150 °C
I
OUT
= 30 A; V
SENSE
= 4 V;
T j
= -40 °C
T j
= 25 °C...150 °C
I
OUT
= 30 A; V
SENSE
= 4 V;
T j
= -40 °C...150 °C
V
CC
= 6...16 V; I
OUT
= 0 A;
V
SENSE
= 0 V;
T j
= -40 °C...150 °C
V
CC
= 5.5 V; I
OUT
= 5 A;
R
SENSE
= 10 k
Ω
V
CC
> 8 V, I
OUT
= 10 A;
R
SENSE
= 10 k
Ω
Sense voltage in overtemperature condition
V
CC
= 13 V; R
SENSE
= 3.9 k
Ω
R
VSENSEH
Analog sense output impedance in overtemperature condition
V
CC
= 13 V; T j output open
> T
TSD
; t
DSENSE
Current sense delay response
To 90 % I
SENSE
(2)
1.
9 V
≤
V
CC
≤
16 V.
2.
Current sense signal delay after positive input slope.
Min.
-10
4200
4400
-8
4200
4400
-6
0
2
4
Typ.
Max.
Unit
3300 4400 6000
4900
4900
4900
4900
5.5
400
+10
6000
5750
+8
5500
5250
+6
10
500
%
%
%
µA
V
V
V
Ω
µs
10/27 Doc ID 10896 Rev 4
VN920SP-E
Table 11.
Truth table
Conditions
Normal operation
Overtemperature
Undervoltage
Overvoltage
Short circuit to GND
Short circuit to V
CC
Negative output voltage clamp
Input
L
H
L
H
L
H
H
L
H
L
H
L
H
L
Electrical specifications
Output
L
L
L
L
L
L
L
L
L
L
H
H
H
L
Sense
0
Nominal
0
V
SENSEH
0
0
0
0
0
(T j
<T
TSD
) 0
(T j
>T
TSD
) V
SENSEH
0
< Nominal
0
Doc ID 10896 Rev 4 11/27
Electrical specifications VN920SP-E
Table 12.
Electrical transient requirements on V
CC pin (part 1)
Test levels ISO T/R
7637/1 test pulse
I II III IV Delays and impedance
1
2
3a
3b
4
5
- 25V
+ 25 V
- 25 V
+ 25 V
- 4 V
+ 26.5 V
- 50 V
+ 50 V
- 50 V
+ 50 V
- 5 V
+ 46.5 V
- 75 V
+ 75V
- 100 V
+ 75 V
- 6 V
+ 66.5 V
- 100 V
+ 100V
- 150 V
+ 100 V
- 7 V
+ 86.5 V
2 ms, 10
Ω
0.2 ms, 10 Ω
0.1 µs, 50 Ω
0.1 µs, 50 Ω
100 ms, 0.01
Ω
400 ms, 2 Ω
Table 13.
Electrical transient requirements on V
CC
pin (part 2)
Test levels results ISO T/R
7637/1 test pulse
I II III
1
2
3a
3b
4
5
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
E
IV
C
C
C
C
C
E
Table 14.
Electrical transient requirements on V
CC
pin (part 3)
Class Contents
C
E
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
12/27 Doc ID 10896 Rev 4
VN920SP-E Electrical specifications
Figure 4.
Switching characteristics (resistive load R
L
= 1.3
Ω
)
V
OUT
90%
80% dV
OUT
/dt
(on) dV
OUT
/dt
(off) t r
10% t f
I
SENSE
90% t t
INPUT t
DSENSE t d(on) t d(off) t
Figure 5.
I
OUT
/I
SENSE
versus I
OUT
I
OUT
/I
SENSE max.Tj=25...150°C min.Tj=25...150°C max.Tj=-40°C typical value min.Tj=-40°C
0 2 4 6 8 10 12 14 16 18
I
OUT
(A)
20 22 24 26 28 30 32
Doc ID 10896 Rev 4 13/27
Electrical specifications
Figure 6.
Waveforms
NORMAL OPERATION
INPUT
LOAD CURRENT
SENSE
V
CC
INPUT
LOAD CURRENT
SENSE
V
USD
UNDERVOLTAGE
V
USDhyst
V
CC
INPUT
LOAD CURRENT
SENSE
V
OV
V
CC
> V
USD
OVERVOLTAGE
V
OVhyst
SHORT TO GROUND
INPUT
LOAD CURRENT
LOAD VOLTAGE
SENSE
SHORT TO V
CC
INPUT
LOAD VOLTAGE
LOAD CURRENT
SENSE
<Nominal
<Nominal
OVERTEMPERATURE
T j
INPUT
LOAD CURRENT
SENSE
T
TSD
T
R
VN920SP-E
I
SENSE
=
V
SENSEH
R
SENSE
14/27 Doc ID 10896 Rev 4
VN920SP-E Electrical specifications
Figure 7.
Off-state output current
8
7
IL(off1) (uA)
9
4
3
2
1
6
5
0
-50 -25 0 25 50 75 100
Tc (°C)
Figure 9.
Input clamp voltage
125 150 175
7.6
7.4
7.2
7
6.8
6.6
Vicl (V)
8
7.8
Iin=1mA
6.4
6.2
6
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
Figure 11.
On-state resistance vs T case
Ron (mOhm)
30
27.5
25
22.5
20
17.5
15
12.5
10
7.5
5
-25 0
Iout=10A
Vcc=8V; 36V
25 50 75
Tc (ºC)
100 125 150 175
Figure 8.
High level input current
Iih (uA)
5
4.5
4
3.5
3
2.5
2
1.5
1
Vin=3.25V
0.5
0
-50 -25 0 25 50 75
Tc (°C)
100 125 150
Figure 10.
On-state resistance vs V
CC
Ron (mOhm)
30
T c = 150ºC
27.5
25
175
22.5
20
17.5
15
12.5
10
7.5
5
2.5
0
5
I
OUT
=10A
10 15 20 25
Vcc (V)
Figure 12.
Input high level
T c = 25ºC
T c = - 40ºC
30 35 40
Vih (V)
3.6
3.4
3.2
3
2.8
2.6
2.4
2.2
2
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
Doc ID 10896 Rev 4 15/27
Electrical specifications
Figure 13.
Input low level
Vil (V)
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
Figure 15.
Turn-on voltage slope dVout/dt(on) (V/ms)
700
650
600
550
Vcc=13V
Rl=1.3Ohm
500
450
400
350
300
250
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
Figure 17.
Overvoltage shutdown
Vov (V)
50
48
46
44
42
40
38
36
34
32
30
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
VN920SP-E
Figure 14.
Input hysteresis voltage
Vhyst (V)
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
Figure 16.
Turn-off voltage slope dVout/dt(off) (V/ms)
550
500
450
400
350
300
250
200
150
100
50
0
-50
Vcc=13V
Rl=1.3Ohm
-25 0 25 50 75
Tc (°C)
100 125 150 175
Figure 18.
I
LIM
vs T case
Ilim (A)
100
90
Vcc=13V
80
70
60
50
40
30
20
10
0
-50 -25 0 25 50 75
Tc (°C)
100 125 150 175
16/27 Doc ID 10896 Rev 4
VN920SP-E Application information
Figure 19.
Application schematic
+5V
R prot
INPUT
μ
C
V
CC
R prot
R
SENSE
CURRENT SENSE
GND
V
GND
R
GND
D
GND
OUTPUT
D ld
3.1
3.1.1
GND protection network against reverse battery
Solution 1: resistor in the ground line (R
GND
only)
This can be used with any type of load.
The following is an indication on how to dimension the R
GND resistor.
1.
R
GND
≤ 600 mV / (I
S(on)max
)
2. R
GND
≥ (
-V
CC
) / (-I
GND
) where - I
GND
is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device’s datasheet.
Power dissipation in R
GND
(when V
CC
< 0: during reverse battery situations) is:
P
D
= (-V
CC
)
2
/ R
GND
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where I
S(on)max
becomes the sum of the maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
R
GND produces a shift (I
S(on)max
* R
GND
) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in the case of several high-side drivers sharing the same R
GND
.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2
Doc ID 10896 Rev 4 17/27
Application information
3.1.2
VN920SP-E
Solution 2: diode (D
GND
) in the ground line
A resistor (R
GND
= 1 k
Ω) should be inserted in parallel to D inductive load.
GND
if the device drives an
This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (
∼
600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused INPUT and STATUS pin is to leave them unconnected, while unused SENSE pin has to be connected to ground pin.
3.2
3.3
Load dump protection
D ld
is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
CC
max DC rating. The same applies if the device is subject to transients on the V
CC
line that are greater than the ones shown in
MCU I/Os protection
If a ground protection network is used and negative transient are present on the V
CC
line, the control pins is pulled negative. ST suggests to insert a resistor (R prot
) in line to prevent the microcontroller I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os.
-V
CCpeak
/I latchup
≤
R prot
≤
(V
OH µ C
-V
IH
-V
GND
) / I
IHmax
Calculation example:
For V
CCpeak
= -100 V and I latchup
≥
20 mA; V
OH µ C
≥
4.5 V
5 k
Ω ≤
R prot
≤
65 k
Ω
.
Recommended values:
R prot
= 10 k
Ω
.
18/27 Doc ID 10896 Rev 4
VN920SP-E
3.4
Application information
PowerSO-10 maximum demagnetization energy
(V
CC
= 13.5 V)
Figure 20.
PowerSO-10 maximum turn-off current versus inductance
I
LM AX (A)
100
10 B
C
A
1
0,01 0,1 1
L(mH)
10 100
A: T jstart
= 150 °C single pulse
B: T jstart
= 100 °C repetitive pulse
C: T jstart
= 125 °C repetitive pulse
V
IN
, I
L
Demagnetization Demagnetization Demagnetization
Note: t
Values are generated with R
L
= 0
Ω.
In case of repetitive pulses, T jstart
(at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C.
Doc ID 10896 Rev 4 19/27
Package and PCB thermal data
4 Package and PCB thermal data
Figure 21.
PowerSO-10 PC board
VN920SP-E
Note: Layout condition of R th
and Z th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad layout to
8 cm
2
).
Figure 22.
R thj-amb
vs PCB copper area in open box free air condition
20/27 Doc ID 10896 Rev 4
VN920SP-E Package and PCB thermal data
Figure 23.
PowerSO-10 thermal impedance junction ambient single pulse
Equation 1 : pulse calculation formula
Z
TH
δ where
= R
TH
⋅ δ
+ Z
THtp
( 1 –
δ )
δ = t p
⁄ T
Figure 24.
Thermal fitting model of a single channel HSD in PowerSO-10
Tj
C1
R1
C2
R2
C3
R3
C4
R4
C5
R5
C6
R6
Pd
T_amb
Doc ID 10896 Rev 4 21/27
Package and PCB thermal data
Table 15.
Thermal parameters
Area / island (cm
2
)
R1 (°C/W)
R2 (°C/W)
R3 (°C/W)
R4 (°C/W)
R5 (°C/W)
R6 (°C/W)
C1 (W.s/°C)
C2 (W.s/°C)
C3 (W.s/°C)
C4 (W.s/°C)
C5 (W.s/°C)
C6 (W.s/°C)
Footprint
0.02
0.1
0.2
0.8
12
37
0.0015
7.00E-03
0.015
0.3
0.75
3
VN920SP-E
6
22
5
22/27 Doc ID 10896 Rev 4
VN920SP-E
5
Package and packing information
Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 25.
PowerSO-10 package dimensions
Doc ID 10896 Rev 4 23/27
Package and packing information
E2
E2
(1)
E4
E4
(1) e
F
F
(1)
H
H
(1) h
L
L
(1) a
α (1)
1.
Muar only POA P013P.
A
A
(1)
A1
B
B
(1)
C
C
(1)
D
D1
E
Table 16.
PowerSO-10 mechanical data
Dim.
Min.
3.35
3.4
0.00
0.40
0.37
0.35
0.23
9.40
7.40
9.30
7.20
7.30
5.90
5.90
1.20
0.80
0°
2°
1.25
1.20
13.80
13.85
Millimeters
Typ.
1.27
0.50
VN920SP-E
1.80
1.10
8°
8°
1.35
1.40
14.40
14.35
Max.
3.65
3.6
0.10
0.60
0.53
0.55
0.32
9.60
7.60
9.50
7.60
7.50
6.10
6.30
24/27 Doc ID 10896 Rev 4
VN920SP-E Package and packing information
Figure 26.
PowerSO-10 suggested pad layout and tube shipment (no suffix)
Figure 27.
PowerSO-10 tape and reel shipment (suffix “TR”)
Reel dimensions
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
600
600
330
1.5
13
20.2
24.4
60
30.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width
Tape hole spacing
Component spacing
Hole diameter
Hole diameter
Hole position
Compartment depth
Hole spacing
W
P0 (± 0.1)
24
4
P 24
D (± 0.1/-0) 1.5
D1 (min) 1.5
F (± 0.05) 11.5
K (max)
P1 (± 0.1)
6.5
2
All dimensions are in mm.
End
Top cover tape
No components
500mm min
Components No components
Empty components pockets saled with cover tape.
500mm min
User direction of feed
Start
Doc ID 10896 Rev 4 25/27
Revision history
Table 17.
Document revision history
Date Revision
01-Oct-2004
17-May-2010
07-Feb-2011
19-Sep-2013
3
4
1
2
Changes
Initial release.
Updated Disclaimer.
VN920SP-E
26/27 Doc ID 10896 Rev 4
VN920SP-E
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
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DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
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Doc ID 10896 Rev 4 27/27
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