STMicroelectronics IRF630FP Datasheet
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G(1)
TO-220FP
1
2
3
D(2)
IRF630FP
Datasheet
N-channel 200 V, 0.29 Ω typ., 9 A, STripFET™ Power MOSFET in a TO
‑
220FP package
S(3)
AM01475v1_noZen_noTab
Features
Order code
IRF630FP
V
DS
200 V
• Extremely high dv/dt capability
• Very low intrinsic capacitance
• Gate charge minimized
R
DS(on)
max.
0.40 Ω
I
D
9 A
Applications
• Switching applications
Description
This Power MOSFET series realized with STMicroelectronics unique STripFET™ process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced high-efficiency isolated
DC-DC converters.
Product status link
IRF630FP
Obsolete Product(s) - Obsolete Product(s)
Product summary
Order code IRF630FP
Marking IRF630FP
Package
Packing
TO-220FP
Tube
DS12883 - Rev 1 - January 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
V
DDS
V
DGR
V
GS
I
D
Parameter
Drain-source voltage (V
GS
= 0 V)
Drain-gate voltage (R
GS
= 20 kΩ)
Gate-source voltage
Drain current (continuous) at T
C
= 25 °C
Drain current (continuous) at T
C
= 100 °C
Drain current (pulsed) I
DM
P
E
V
TOT
AS
ISO
Total power dissipation at T
C
= 25 °C
Single pulse avalanche energy
Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s, T
C
= 25 °C)
Drain-body diode dynamic dv/dt ruggedness
T stg
T
J
Storage temperature range
Operating junction temperature range
1. Pulse width is limited by safe operating area.
2. Starting T
J
= 25 °C, I
D
= 4.5 A
3. I
SD
= 9 A, di/dt = 520 A/μs, V
DD
= 50 V, T
J
< T
Jmax
Symbol
R thj-case
R thj-amb
Table 2. Thermal data
Parameter
Thermal resistance junction-case
Thermal resistance junction-ambient
6.5
36
36
110
Value
200
200
±20
9
2000
5.8
-65 to 175
Value
4.17
62.5
IRF630FP
Electrical ratings
Unit
°C/W
°C/W
A
A
W mJ
Unit
V
V
V
A
V
V/ns
°C
Obsolete Product(s) - Obsolete Product(s)
DS12883 - Rev 1 page 2/13
IRF630FP
Electrical characteristics
2
Electrical characteristics
T
CASE
= 25 °C unless otherwise specified
Table 3. On/off states
Symbol
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Parameter Test conditions
Drain-source breakdown voltage V
GS
= 0 V, I
D
= 250 μA
V
GS
= 0 V, V
DS
= 200 V
Zero gate voltage drain current
Gate body leakage current
V
GS
= 0 V, V
DS
= 200 V,
T
C
= 125 °C
V
DS
= 0 V, V
GS
= 20 V
Gate threshold voltage V
DS
= V
GS
, I
D
= 250 µA
Static drain-source on-resistance V
GS
= 10 V, I
D
= 4.5 A
1. Defined by design, not subject to production test.
Min.
200
Typ.
Max.
1
Unit
V
µA
2 3
0.29
100
±100
4
0.40
µA nA
V
Ω
Symbol
C iss
C oss
C rss
Q g
Q gs
Q gd
Parameter
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Gate-source charge
Gate-drain charge
Table 4. Dynamic
V
V
DS
GS
Test conditions
= 25 V, f = 1 MHz,
= 0 V
V
DD
= 160 V, I
D
= 9 A
V
GS
= 0 to 10 V
(see
Figure 13. Test circuit for gate charge behavior
)
-
-
-
Min.
-
-
-
Typ.
370
77
14
11.6
2.2
5.5
-
-
-
Max.
-
-
-
Unit pF pF pF nC nC nC
Table 5. Switching times
Symbol t d(on)
Parameter
Turn-on delay time
Test conditions
V
DD
= 100 V, I
D
= 4.5 A,
Min.
-
Typ.
5.6
Max.
Obsolete Product(s) - Obsolete Product(s)
-
R
G
= 4.7 Ω, V
GS
= 10 V t r
Rise time
(see
Figure 12. Test circuit for resistive load switching times and
Figure 17. Switching time waveform
)
2.6
-
Unit ns ns
DS12883 - Rev 1 page 3/13
IRF630FP
Electrical characteristics
Symbol
V
SD
t rr
Q rr
I
RRM
Parameter
Forward on voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Table 6. Source-drain diode
Test conditions
I
SD
= 9 A, V
GS
= 0 V
I
SD
= 9 A, di/dt = 100 A/µs,
V
DD
= 50 V
(see
Figure 17. Switching time waveform
)
1. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Min.
-
-
-
-
Typ.
118.5
393
6.6
Max.
1.5
Unit
V ns nC
A
Obsolete Product(s) - Obsolete Product(s)
DS12883 - Rev 1 page 4/13
IRF630FP
Electrical characteristics (curves)
2.1
Electrical characteristics (curves)
Figure 1. Safe operating area
Figure 2. Thermal impedance
8
4
0
0
I
D
(A)
20
Figure 3. Output characteristics
GADG221120181107OCH
V
GS
= 8, 9, 10 V
V
GS
= 7 V
16
V
GS
= 6 V
12
V
GS
= 5 V
5 10 15
V
GS
= 4 V
20 V
DS
(V)
Figure 4. Transfer characteristics
4
3
2
I
D
(A)
7
V
DS
= 10 V
6
5
1
0
0 1 2
T
J
GADG221120181221TCH
= 25 °C
T
J
= 150 °C
3 4
T
J
= -55 °C
5 V
GS
(V)
Obsolete Product(s) - Obsolete Product(s)
V
GS
(V)
GADG221120181107QVG
Figure 6. Static drain-source on-resistance
R
DS(on)
(mΩ)
GADG221120181108RID
12
V
DS
= 160 V, I
D
= 9 A
325 10
8
V
GS
= 10 V
300
6
4
2
0
0 2 4 6 8 10 12 Q g
(nC)
275
250
0 1 2 3 4 5 6 7 8 9 I
D
(A)
DS12883 - Rev 1 page 5/13
IRF630FP
Electrical characteristics (curves)
C
(pF)
Figure 7. Capacitance variations
GADG221120181107CVR
10 3
C
ISS
10 2
10 1
C
OSS
C
RSS
10 0
0 50 100 150 V
DS
(V)
Figure 9. Normalized on-resistance vs temperature
R
DS(on)
(norm.)
2.6
V
GS
= 10 V, I
D
= 4.5 A
GADG221120181109RON
2.2
1.8
1.4
1.0
0.6
0.2
-75 -25 25 75 125 175 T j
(°C)
Figure 8. Normalized gate threshold voltage vs temperature
V
GS(th)
(norm.)
1.1
GADG221120181109VTH
I
D
= 250 µA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
-75 -25 25 75 125 175 T j
(°C)
Figure 10. Normalized V
(BR)DSS
vs temperature
V
(BR)DSS
(norm.)
1.12
1.10
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0.92
0.90
0.88
-75 -25 25
GADG221120181109BDV
I
D
= 1 mA
75 125 175 T j
(°C)
Figure 11. Source-drain diode forward characteristics
Obsolete Product(s) - Obsolete Product(s)
0.9
T
J
= -55 °C
T
J
= 25 °C
0.8
0.7
0.6
0.5
0.4
0 2 4 6
T
J
= 175 °C
8 I
SD
(A)
DS12883 - Rev 1 page 6/13
IRF630FP
Test circuits
3
Test circuits
Figure 12. Test circuit for resistive load switching times
V
GS pulse width
V
D
R
G
R
L
+
2200
μF
3.3
μF
D.U.T.
V
DD
AM01468v1
Figure 14. Test circuit for inductive load switching and diode recovery times
Figure 13. Test circuit for gate charge behavior
12 V
V
GS pulse width
2200
μF
+
1 kΩ
I
G
= CONST
2.7 kΩ
47 kΩ
47 kΩ
100 nF
100 Ω
V
DD
1 kΩ
D.U.T.
V
G
AM01469v1
Figure 15. Unclamped inductive load test circuit
G
25 Ω
D
A
D.U.T.
S
B
+
_
R
G
A A fast diode
B
B
G
100 µH
D
D.U.T.
3.3
µF
S
+
1000
µF
V
DD
AM01470v1
Figure 16. Unclamped inductive waveform
V D
I
DM
I D
V DD V DD
AM01472v1
V i pulse width
V
D
L
I
D
+
2200
µF
3.3
µF
V
DD
D.U.T.
AM01471v1
0
Figure 17. Switching time waveform t d(on) t r t d(off) t off t f
90% 90%
10%
V
GS
V
DS
90%
10%
0 10%
AM01473v1
DS12883 - Rev 1 page 7/13
4
IRF630FP
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
Obsolete Product(s) - Obsolete Product(s)
DS12883 - Rev 1 page 8/13
4.1
TO-220FP package information
Figure 18. TO-220FP package outline
IRF630FP
TO-220FP package information
Obsolete Product(s) - Obsolete Product(s)
7012510_Rev_12_B page 9/13 DS12883 - Rev 1
Dim.
F2
G
G1
H
L2
L3
L4
L5
L6
L7
Dia
D
E
A
B
F
F1
Table 7. TO-220FP package mechanical data mm
Typ.
Min.
4.4
2.5
2.5
0.45
0.75
1.15
1.15
4.95
2.4
10
16
28.6
9.8
2.9
15.9
9
3
IRF630FP
TO-220FP package information
Max.
4.6
2.7
2.75
0.7
1
1.70
1.70
5.2
2.7
10.4
30.6
10.6
3.6
16.4
9.3
3.2
Obsolete Product(s) - Obsolete Product(s)
DS12883 - Rev 1 page 10/13
IRF630FP
Revision history
Date
10-Jan-2019
Table 8. Document revision history
Version
1
Changes
First release. This part number was previously included in datasheet DS0668.
Obsolete Product(s) - Obsolete Product(s)
DS12883 - Rev 1 page 11/13
IRF630FP
Contents
Contents
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DS12883 - Rev 1 page 12/13
IRF630FP
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Purchasers’ products.
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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
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DS12883 - Rev 1 page 13/13
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