STMicroelectronics STF140N8F7 Datasheet
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STF140N8F7 N-channel 80 V, 3.5 mΩ typ., 64 A STripFET™ F7 Power MOSFET in a TO-220FP package Datasheet - production data Features Order code VDS RDS(on) max. ID PTOT STF140N8F7 80 V 4.3 mΩ 64 A 35 W Among the lowest RDS(on) on the market Excellent figure of merit (FoM) Low Crss/Ciss ratio for EMI immunity High avalanche ruggedness Applications TO-220FP Figure 1: Internal schematic diagram Switching applications Description This N-channel Power MOSFET utilizes STripFET™ F7 technology with an enhanced trench gate structure that results in very low onstate resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. Table 1: Device summary October 2014 Order code Marking Package Packaging STF140N8F7 140N8F7 TO-220FP Tube DocID023888 Rev 3 This is information on a product in full production. 1/12 www.st.com Contents STF140N8F7 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 2.1 Electrical characteristics (curves) ...................................................... 5 3 Test circuits ..................................................................................... 7 4 Package mechanical data ............................................................... 8 4.1 5 2/12 TO-220FP package information ........................................................ 9 Revision history ............................................................................ 11 DocID023888 Rev 3 STF140N8F7 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 80 V VGS Gate-source voltage ±20 V ID Drain current (continuous) at TC = 25 °C 64 (1) A A Drain current (continuous) at TC = 100 °C 45(1) IDM(2) Drain current (pulsed) 256 A ID PTOT Total dissipation at TC = 25 °C 35 W EAS(3) Single pulse avalanche energy 515 mJ VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s, TC = 25 °C) 2.5 kV -55 to 175 °C Tj Operating junction temperature Tstg Storage temperature Notes: (1)Limited (2)Pulse by package. width is limited by safe operating area. (3)Starting Tj =25 °C, Id = 18.5 A, Vdd = 50 V Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 4.29 °C/W Rthj-amb Thermal resistance junction-ambient 62.5 °C/W DocID023888 Rev 3 3/12 Electrical characteristics 2 STF140N8F7 Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4: On/off states Symbol V(BR)DSS Parameter Test conditions Drain-source breakdown voltage VGS = 0, ID = 250 µA Min. Typ. Max. 80 Unit V VGS = 0, VDS = 80 V 1 µA VGS = 0, VDS = 80 V, TJ=125 °C 10 µA Gate-source leakage current VDS = 0, VGS = ±20 V ±100 nA VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 4.5 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 32 A 3.5 4.3 mΩ Symbol Parameter Min. Typ. Max. Unit - 6340 - pF - 1195 - pF - 105 - pF - 96 - nC - 30 - nC - 26 - nC Min. Typ. Max. Unit - 26 - ns - 51 - ns - 82 - ns - 44 - ns Min. Typ. Max. Unit IDSS Zero gate voltage Drain current IGSS 2.5 Table 5: Dynamic Ciss Test conditions Input capacitance VGS = 0, VDS = 40 V, f = 1 MHz Coss Output capacitance Crss Reverse transfer capacitance Qg Total gate charge Qgs Gate-source charge Qgd Gate-drain charge VDD = 40 V, ID = 64 A, VGS = 10 V Table 6: Switching times Symbol td(on) Parameter Test conditions Turn-on delay time tr Rise time td(off) VDD = 40 V, ID = 45 A RG = 4.7 Ω, VGS = 10 V Turn-off-delay time tf Fall time Table 7: Source drain diode Symbol ISD ISDM(1) VSD (2) Parameter Test conditions Source-drain current - 64 A Source-drain current (pulsed) - 256 A Forward on voltage VGS = 0, ISD = 64 A trr Reverse recovery time Qrr Reverse recovery charge IRRM Reverse recovery current ISD = 64 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C Notes: 4/12 (1)Pulse width is limited by safe operating area (2)Pulse test: pulse duration = 300 µs, duty cycle 1.5% DocID023888 Rev 3 - 1.2 V - 58 ns - 92 nC - 3.2 A STF140N8F7 2.1 Electrical characteristics Electrical characteristics (curves) Figure 3: Thermal impedance Figure 2: Safe operating area K ID (A) δ= 0.5 0.2 100 -1 0.1 10 0.05 10 100µs Operation in this area is 0.02 Limited by max RDS(on) 10 1ms Tj=175°C Tc=25°C 1 Single pulse 10ms Sinlge pulse 10 0.1 0.1 1 -3 10 V DS(V) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 tp(s) Figure 5: Transfer characteristics Figure 4: Output characteristics GIPD130920130919MT ID (A) -2 0.01 ID (A) V GS= 10V 300 300 7V 250 V DS= 2V 250 6V 200 200 150 150 5V 100 100 50 50 4V 0 0 2 4 6 8 0 0 V DS(V) Figure 6: Normalized V(BR)DSS vs. temperature V (BR)DSS 1 2 3 4 5 6 7 8 9 V GS(V) Figure 7: Static drain-source on resistance R DS(on) 3.52 ID= 250µA 1.04 V GS= 10V 3.51 1.02 3.50 1 3.49 0.98 3.48 0.96 0.94 -75 3.47 10 -25 0 25 75 125 20 30 40 50 60 ID(A) 175 T J(°C) DocID023888 Rev 3 5/12 Electrical characteristics STF140N8F7 Figure 8: Gate charge vs. gate-source voltage Figure 9: Capacitance variations V GS (V) C (pF) 8000 12 7000 10 C iss 6000 8 5000 6 4000 3000 4 2000 2 0 1000 0 20 40 80 60 0 0 100 Q g(nC) 10 20 30 40 50 60 C oss C rss 70 V DS(V) Figure 11: Normalized on resistance vs. temperature Figure 10: Normalized gate threshold voltage vs. temperature V GS(th) R DS(on) V GS= 10V 1.2 1.8 ID= 250µA 1.6 1 1.4 1.2 0.8 1 0.8 0.6 0.6 0.4 -75 -25 0 25 75 125 0.4 -75 175 T J(°C) -25 0 25 75 Figure 12: Source-drain diode forward characteristics V SD T J= -55°C 1.1 1 0.9 T J= 25°C 0.8 T J= 175°C 0.7 0.6 20 6/12 30 40 50 60 DocID023888 Rev 3 70 80 90 ID(A) 125 175 T J(°C) STF140N8F7 3 Test circuits Test circuits Figure 13: Switching times test circuit for resistive load Figure 15: Test circuit for inductive load switching and diode recovery times Figure 17: Unclamped inductive waveform DocID023888 Rev 3 Figure 14: Gate charge test circuit Figure 16: Unclamped inductive load test circuit Figure 18: Switching time waveform 7/12 Package mechanical data 4 STF140N8F7 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8/12 DocID023888 Rev 3 STF140N8F7 4.1 Package mechanical data TO-220FP package information Figure 19: TO-220FP package outline DocID023888 Rev 3 9/12 Package mechanical data STF140N8F7 Table 8: TO-220FP mechanical data mm Dim. Min. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 10/12 Typ. 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 DocID023888 Rev 3 STF140N8F7 5 Revision history Revision history Table 9: Document revision history Date Revision 18-Sep-2013 1 Changes First release. 22-Aug-2014 2 10-Oct-2014 3 The part numbers STH140N8F7-2 and STP140N8F7 have been moved to a separate datasheet. Modified: not found Minor text changes Updated Figure 3: "Thermal impedance" DocID023888 Rev 3 11/12 STF140N8F7 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved 12/12 DocID023888 Rev 3 ">
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