STMicroelectronics TS882 Datasheet
Pubblicità
Pubblicità
TS882
TS884
Rail-to-rail 1.1 V dual and quad nanopower comparators
Datasheet
-
production data
Related product
•
See the TS881 datasheet for single operator with smaller package.
DFN8 (2 x 2 mm) MiniSO8
TSSOP14
SO14
Applications
• Portable systems
• Signal conditioning
• Medical
• Automotive
QFN16 (3 x 3 mm)
Description
•
•
Features
Ultra-low current consumption: 220 nA typ./op.
Propagation delay: 2 µs typ.
The TS882 is a dual and the TS884 device a quad comparator featuring ultra-low supply current (220 nA typical per operator with output high, V
CC
= 1.2 V, no load) with rail-to-rail input and output capability. The performance of these
• Rail-to-rail inputs
•
•
Push-pull outputs
Supply operation from 1.1 V to 5.5 V comparators allows them to be used in a wide range of portable applications. The TS882 and
TS884 devices minimize battery supply leakage and therefore enhance battery lifetime.
• Wide temperature range: -40 to +125 °C
• ESD tolerance: 8 kV HBM / 300 V MM
Operating from 1.1 to 5.5 V supply voltage, these comparators can be used over a wide
• Dual version available in MiniSO8 and DFN8
(2 x 2 mm) package temperature range (-40 to +125 °C) keeping the current consumption at an ultra-low level.
• Quad version available in SO14, TSSOP14 and QFN16 3 x 3 mm package
Table 1. Device summary
Order code Temperature range Package Packaging Marking
TS882IST
TS882IYST
(1)
TS882IQ2T
TS884IDT
TS884IPT
TS884IQ4T
-40 to +125 °C
-40 to +125 °C
MiniSO8
MiniSO8
(Automotive grade)
DFN8 2 x 2 mm
SO14
TSSOP14
QFN16 3 x 3 mm
Tape and reel
Tape and reel
K514
K524
K56
S884I
S884I
K514
1.
Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001
& Q002 or equivalent
July 2017
This is information on a product in full production.
DocID024119 Rev 4 1/25 www.st.com
1
Contents
Contents
TS882, TS884
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . 5
DFN8 2 x 2 mm package information . . . .
. . . . . . . . . . . . . . . . . . . . . . . 16
MiniSO8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SO14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
QFN16 3 x 3 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TSSOP14 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/25 DocID024119 Rev 4
TS882, TS884
Figure 1. Pin connections TS882 (top view)
Pin description
TS882IDT/IST/IQ2T
MiniSO8/DFN8
Figure 2. Pin connections TS884 (top view)
,1
9&&
1&
,1
SO14 / TSSOP14
287
,1
287
,1
,1
9&&
1&
,1
,1
287
,1
287
QFN16
DocID024119 Rev 4 3/25
25
Absolute maximum ratings and operating conditions
2
TS882, TS884
Absolute maximum ratings and operating conditions
Table 2. Absolute maximum ratings
Symbol
V
V
CC
ID
V
IN
Parameter
Supply voltage
(1)
Differential input voltage
(2)
R
THJA
Value
6
±6
Input voltage range
Thermal resistance junction to ambient (TS882)
(3)
MiniSO8
DFN8 2 x 2 mm
Thermal resistance junction to ambient (TS884)
(3)
SO14
TSSOP14
QFN16 3 x 3 mm
(V
CC
-) - 0.3 to (V
CC
+) + 0.3
190
57
105
100
45
Unit
V
V
V
°C/W
T
T
STG
T
J
LEAD
ESD
Storage temperature
Junction temperature
Lead temperature (soldering 10 seconds)
Human body model (HBM)
(4)
Machine model (MM)
(5)
Charged device model (CDM)
(6)
-65 to +150
150
260
8
300
1300
V
Latch-up immunity 200 mA
1.
All voltage values, except differential voltages, are referenced to V
CC between V
CC
+ and V
CC
-.
-. V
CC
is defined as the difference
2.
The magnitude of input and output voltages must never exceed the supply rail ±0.3 V.
3.
Short-circuits can cause excessive heating. These values are typical.
4.
According to JEDEC standard JESD22-A114F.
5.
According to JEDEC standard JESD22-A115A.
6.
According to ANSI/ESD STM5.3.1.
°C
°C
°C kV
Symbol
T oper
V
CC
V
ICM
Table 3. Operating conditions
Parameter Value
-40 to +125 Operating temperature range
Supply voltage
-40 °C < T amb
< +125 °C
Common mode input voltage range
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
1.1 to 5.5
(V
CC-
) - 0.2 to (V
CC+
) + 0.2
(V
CC-
) to (V
CC+
) + 0.2
Unit
°C
V
V
4/25 DocID024119 Rev 4
TS882, TS884 Electrical characteristics
Symbol
Table 4. V
CC
= +1.2 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
Parameter Test conditions Min.
Typ.
Max.
V
IO
Input offset voltage
(2)
T amb
= +25 °C
-40 °C < T amb
< +125 °C -6
1
6
Unit mV
Δ V
IO
Input offset voltage drift -40 °C < T amb
< +125 °C 3 µV/°C
V
HYST
I
I
IO
IB
Input hysteresis voltage
Input offset current
Input bias current
(4)
(4)
(3)
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
No load, output low, V
ID
-40 °C < T amb
< +125 °C
= -0.1 V
I
CC
Supply current per operator
I
SC
Short-circuit current
No load, output high, V
ID
-40 °C < T amb
< +125 °C
= +0.1 V
Source
Sink
V
V
OH
OL
Output voltage high
Output voltage low
I source
= 0.2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
I sink
= 0.2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
CMRR Common mode rejection ratio
T
PLH
Propagation delay
(low to high)
0 < V
ICM
< V
CC
-40 °C < T amb
< +125 °C f = 1 kHz, C
L
= 30 pF, R
Overdrive = 10 mV
L
= 1 M
Ω
-40 °C < T amb
< +125 °C
T
PHL
Propagation delay
(high to low)
Overdrive = 100 mV
-40 °C < T amb
< +125 °C f = 1 kHz, C
L
= 30 pF, R
Overdrive = 10 mV
L
= 1 M Ω
-40 °C < T amb
< +125 °C
T
R
Rise time (10% to 90%)
Overdrive = 100 mV
-40 °C < T amb
< +125 °C
C
L
= 30 pF, R
L
= 1 M Ω
1.5
220
1.13
1.10
1.00
1.0
1.7
1.15
35
50
2.4
1
300
68
5.5
2.1
5.1
1.9
100
8
10
2.6
3.1
11
13
3.1
3.4
4.2
10
100
10
100
450
350
50
60
70 mV pA pA nA mA
V mV dB
µs
µs ns
DocID024119 Rev 4 5/25
25
Electrical characteristics TS882, TS884
Table 4. V
CC
= +1.2 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
(continued)
Symbol Parameter Test conditions Min.
Typ.
Max.
Unit
T
F
Fall time (90% to 10%)
C
L
= 30 pF, R
L
= 1 M
Ω
110 ns
T
ON
Power-up time 1.1
1.7
ms
1.
All values over the temperature range are guaranteed through correlation and simulation. No production test is performed at the temperature range limits.
2.
The offset is defined as the average value of positive and negative trip points (input voltage differences requested to change the output state in each direction).
3.
The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.
4.
Maximum values include unavoidable inaccuracies of the industrial tests.
Symbol
Table 5. V
CC
= +2.7 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
Parameter Test conditions Min.
Typ.
Max.
1
Δ
V
V
V
IO
IO
HYST
I
I
IO
IB
Input offset voltage
(2)
Input offset voltage drift
Input hysteresis voltage
Input offset current
Input bias current
(4)
(4)
(3)
T amb
= +25 °C
-40 °C < T amb
< +125 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
No load, output low, V
ID
-40 °C < T amb
< +125 °C
= -0.1 V
I
CC
Supply current per operator
I
SC
Short-circuit current
No load, output high, V
ID
-40 °C < T amb
< +125 °C
= +0.1 V
Source
Sink
V
OH
Output voltage high
I source
= 2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
V
CMRR Common mode rejection ratio
T
OL
PLH
Output voltage low
Propagation delay
(low to high)
I sink
= 2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
0 < V
ICM
< V
CC
-40 °C < T amb
< +125 °C f = 1 kHz, C
L
= 30 pF, R
Overdrive = 10 mV
L
-40 °C < T amb
< +125 °C
= 1 M Ω
Overdrive = 100 mV
-40 °C < T amb
< +125 °C
-6
1.6
2.48
2.40
2.10
55
3
2.7
1
310
220
10
13
2.51
130
74
6.4
2.3
6
450
350
210
230
310
12
14
3.0
3.7
4.2
10
100
10
100
Unit mV
µV/°C mV pA pA nA mA
V mV dB
µs
6/25 DocID024119 Rev 4
TS882, TS884 Electrical characteristics
Table 5. V
CC
= +2.7 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
(continued)
Symbol Parameter Test conditions Min.
Typ.
Max.
Unit f = 1 kHz, C
L
-40 °C < T amb
= 30 pF, R
Overdrive = 10 mV
< +125 °C
L
= 1 M
Ω
T
PHL
Propagation delay
(high to low)
6.4
12
14
µs
T
R
T
F
T
ON
Rise time (10% to 90%)
Fall time (90% to 10%)
Power-up time
Overdrive = 100 mV
-40 °C < T amb
< +125 °C
C
C
L
L
= 30 pF, R
= 30 pF, R
L
L
= 1 M
= 1 M
Ω
Ω
2.2
120
130
1.1
3.0
3.7
1.7
ns ns ms
1.
All values over the temperature range are guaranteed through correlation and simulation. No production test is performed at the temperature range limits.
2.
The offset is defined as the average value of positive and negative trip points (input voltage differences requested to change the output state in each direction).
3.
The hysteresis is a built-in feature of the TS882. It is defined as the voltage difference between the trip points.
4.
Maximum values include unavoidable inaccuracies of the industrial tests.
Symbol
Table 6. V
CC
= +5 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
Parameter Test conditions Min.
Typ.
Max.
1
Δ
V
V
V
IO
IO
HYST
I
I
IO
IB
Input offset voltage
(2)
Input offset voltage drift
Input hysteresis voltage
Input offset current
Input bias current
(4)
(4)
(3)
T amb
= +25 °C
-40 °C < T amb
< +125 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
T amb
= +25 °C
-40 °C < T amb
< +125 °C
No load, output low, V
ID
-40 °C < T amb
< +125 °C
= -0.1 V
I
CC
Supply current per operator
I
SC
Short-circuit current
No load, output high, V
ID
-40 °C < T amb
< +125 °C
= +0.1 V
Source
Sink
V
OH
Output voltage high
I source
= 2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
V
OL
Output voltage low
I sink
= 2 mA
-40 °C < T amb
< +85 °C
-40 °C < T amb
< +125 °C
CMRR Common mode rejection ratio
0 < V
ICM
< V
CC
-40 °C < T amb
< +125 °C
-6
1.6
4.86
4.75
4.60
55
3
3.1
1
350
250
32
32
4.88
90
78
6
500
400
130
170
280
4.2
10
100
10
100
Unit mV
µV/°C mV pA pA nA mA
V mV dB
DocID024119 Rev 4 7/25
25
Electrical characteristics TS882, TS884
Table 6. V
CC
= +5 V, T amb
= +25 °C, V
ICM
= V
CC
/2 (unless otherwise specified)
(1)
(continued)
Symbol Parameter Test conditions Min.
Typ.
Max.
Unit
SVR Supply voltage rejection
Δ
V
CC
= 1.2 V to 5 V
-40 °C < T amb
< +125 °C f = 1 kHz, C
L
Overdrive = 10 mV
-40 °C < T amb
= 30 pF, R
< +125 °C
L
= 1 M Ω
65
80 dB
T
PLH
Propagation delay
(low to high)
8.3
13
22
µs
Overdrive = 100 mV
-40 °C < T amb
< +125 °C f = 1 kHz, C
L
-40 °C < T amb
= 30 pF, R
Overdrive = 10 mV
< +125 °C
L
= 1 M Ω
2.5
3.4
4.1
T
PHL
Propagation delay
(high to low)
9.0
16
19
µs
T
R
T
F
Rise time (10% to 90%)
Fall time (90% to 10%)
Overdrive = 100 mV
-40 °C < T amb
< +125 °C
C
L
= 30 pF, R
L
= 1 M Ω
C
L
= 30 pF, R
L
= 1 M Ω
2.6
160
150
3.5
4.2
ns ns
T
ON
Power-up time 1.1
1.7
ms
1.
All values over the temperature range are guaranteed through correlation and simulation. No production test is performed at the temperature range limits.
2.
The offset is defined as the average value of positive and negative trip points (input voltage differences requested to change the output state in each direction).
3.
The hysteresis is a built-in feature of the TS882 device. It is defined as the voltage difference between the trip points.
4.
Maximum values include unavoidable inaccuracies of the industrial tests.
8/25 DocID024119 Rev 4
TS882, TS884 Electrical characteristics
Figure 3. Current consumption per operator vs. supply voltage - output low
Figure 4. Current consumption per operator vs. supply voltage - output high
Figure 5. Current consumption per operator vs. input common mode voltage at V
CC
= 1.2 V
Figure 6. Current consumption per operator vs. input common mode voltage at V
CC
= 5 V
Figure 7. Current consumption per operator vs. temperature
Figure 8. Current consumption per operator vs. toggle frequency
DocID024119 Rev 4 9/25
25
Electrical characteristics TS882, TS884
Figure 9. Input offset voltage vs. input common mode voltage at V
CC
= 1.2 V
Figure 10. Input hysteresis voltage vs. input common mode voltage at V
CC
= 1.2 V
Figure 11. Input offset voltage vs. input common mode voltage at V
CC
= 5 V
Figure 12. Input hysteresis voltage vs. input common mode voltage at V
CC
= 5 V
Figure 13. Input offset voltage vs. temperature Figure 14. Input hysteresis voltage vs. temperature
10/25 DocID024119 Rev 4
TS882, TS884 Electrical characteristics
Figure 15. Output voltage drop vs. sink current at V
CC
= 1.2 V
Figure 16. Output voltage drop vs. source current at V
CC
= 1.2 V
Figure 17. Output voltage drop vs. sink current at V
CC
= 2.7 V
Figure 18. Output voltage drop vs. source current at V
CC
= 2.7 V
Figure 19. Output voltage drop vs. sink current at V
CC
= 5 V
Figure 20. Output voltage drop vs. source current at V
CC
= 5 V
DocID024119 Rev 4 11/25
25
Electrical characteristics TS882, TS884
Figure 21. Propagation delay T
PLH vs. input common mode voltage at V
CC
= 1.2 V
Figure 22. Propagation delay T
PLH
vs. input common mode voltage at V
CC
= 1.2 V
Figure 23. Propagation delay T
PLH
vs. input common mode voltage at V
CC
= 5 V
Figure 24. Propagation delay T
PHL
vs. input common mode voltage at V
CC
= 5 V
Figure 25. Propagation delay T
PLH
vs. input signal overdrive at V
CC
= 1.2 V
Figure 26. Propagation delay T
PHL
vs. input signal overdrive at V
CC
= 1.2 V
12/25 DocID024119 Rev 4
TS882, TS884 Electrical characteristics
Figure 27. Propagation delay T
PLH
vs. input signal overdrive at V
CC
= 5 V
Figure 28. Propagation delay T
PHL
vs. input signal overdrive at V
CC
= 5 V
Figure 29. Propagation delay T
PLH
vs. supply voltage for signal overdrive 10 mV
Figure 30. Propagation delay T
PHL
vs. supply voltage for signal overdrive 10 mV
Figure 31. Propagation delay T
PLH vs. supply voltage for signal overdrive 100 mV
Figure 32. Propagation delay T
PHL
vs. supply voltage for signal overdrive 100 mV
DocID024119 Rev 4 13/25
25
Electrical characteristics TS882, TS884
Figure 33. Propagation delay vs. temperature for signal overdrive 10 mV
Figure 34. Propagation delay vs. temperature for signal overdrive 100 mV
14/25 DocID024119 Rev 4
TS882, TS884 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK is an ST trademark.
DocID024119 Rev 4 15/25
25
Package information
4.1 DFN8 2 x 2 mm package
information
Figure 35. DFN8 2 x 2 mm package outline
4&"5*/(
1-"/&
$
EEE $
TS882, TS884
" " "
F
%
1*/*%
&
&
-
%
C b
D
D2
E
A
A1
A3
E2 e
L ddd
Symbol
Table 7. DFN8 2 x 2 mm package mechanical data (pitch 0.5 mm)
Dimensions
Millimeters Inches
Min.
0.51
Typ.
0.55
Max.
0.60
0.05
Min.
0.020
Typ.
0.022
0.18
1.85
1.45
1.85
0.75
0.15
0.25
2.00
1.60
2.00
0.90
0.50
0.30
2.15
1.70
2.15
1.00
0.50
0.08
0.007
0.073
0.057
0.073
0.030
0.006
0.010
0.079
0.063
0.079
0.035
0.020
Max.
0.024
0.002
0.012
0.085
0.067
0.085
0.039
0.020
0.003
16/25 DocID024119 Rev 4
TS882, TS884 Package information
Figure 36. DFN8 2 x 2 mm footprint recommendation
PP
PP
PP PP
PP
PP
DocID024119 Rev 4 17/25
25
Package information
4.2 MiniSO8 package information
Figure 37. MiniSO8 package outline
TS882, TS884
18/25
Symbol
L1
L2 k ccc
E1 e
L
A
A1
A2 b c
D
E
Min.
0
0.75
0.22
0.08
2.80
4.65
2.80
0.40
Table 8. MiniSO8 package mechanical data
Dimensions
Millimeters
Typ.
Min.
0.85
3.00
4.90
3.00
0.65
0.60
0.95
0.25
Max.
0.23
3.20
5.15
3.10
1.10
0.15
0.95
0.40
0.80
0
0.030
0.009
0.003
0.11
0.183
0.11
0.016
Inches
Typ.
0.033
0.118
0.193
0.118
0.026
0.024
0.037
0.010
0° 8°
0.10
0°
Max.
0.043
0.006
0.037
0.016
0.009
0.126
0.203
0.122
0.031
8°
0.004
DocID024119 Rev 4
TS882, TS884
4.3 SO14 package information
Figure 38. SO14 package outline
Package information
Table 9. SO14 package mechanical data
Dimensions
(1)
Millimeters Inches
Symbol Note
Min.
Typ.
Max.
Min.
Typ.
Max.
E e
C
D
A
A1
A2
B
H
L k ddd
1.35
0.10
1.10
0.33
0.19
8.55
3.80
5.80
0.40
0°
1.27
1.75
0.25
1.65
0.51
0.25
8.75
4.0
6.20
1.27
8°
0.10
0.05
0.004
0.04
0.01
0.007
0.33
0.15
0.22
0.015
0°
0.05
0.068
0.009
0.06
0.02
0.009
0.34
0.15
0.24
0.05
8°
0.004
(2)
1.
Drawing dimensions include “Single” and “Matrix” versions.
2.
Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side.
DocID024119 Rev 4 19/25
25
Package information
4.4
TS882, TS884
QFN16 3 x 3 package information
Figure 39. QFN16 3 x 3 mm (pitch 0.5 mm) package outline
6($7,1*
3/$1(
&
$
GGG&
$
'
'
H
$
3,1,'
&
(
E
H ( (
E
'
%277209,(:
/
/
20/25 DocID024119 Rev 4
TS882, TS884 Package information
A
A1
A3 b
D
D1
D2
E
E1
E2 e
L ddd
Symbol
Table 10. QFN16 3 x 3 mm (pitch 0.5 mm) package mechanical data
Dimensions
Millimeters
Min.
Typ.
Max.
0.80
0.90
0.02
1.00
0.05
0.18
0.20
0.25
0.30
2.85
3.00
1.50
3.15
See exposed pad variation
2.85
3.00
3.15
1.50
See exposed pad variation
0.45
0.30
0.50
0.40
0.55
0.50
0.08
Inches
Min.
Typ.
Max.
0.031
0.035
0.001
0.039
0.002
0.007
0.008
0.010
0.012
0.112
0.118
0.059
0.124
See exposed pad variation
0.112
0.118
0.124
0.059
See exposed pad variation
0.018
0.012
0.020
0.016
0.022
0.020
0.003
DocID024119 Rev 4 21/25
25
Package information TS882, TS884
Figure 40. QFN16 3 x 3 mm (pitch 0.5 mm) footprint recommendation
%
$
22/25 DocID024119 Rev 4
TS882, TS884 Package information
Figure 41. TSSOP14 package outline
' (
$ $ $
DDD&
E
F
(
6($7,1*
3/$1(
&
PP
*$*(3/$1(
E1 e
L
L1 k aaa
D
E b c
A
A1
A2
N
3,1,'(17,),&$7,21
Symbol
/
/
H
76623
Min.
0.05
0.80
0.19
0.09
4.90
6.20
4.30
0.45
Table 11. TSSOP14 package mechanical data
Dimensions
Millimeters Inches
Typ.
1.00
5.00
6.40
4.40
0.65
0.60
1.00
Max.
1.20
0.15
1.05
0.30
0.20
5.10
6.60
4.50
0.75
Min.
0.002
0.031
0.007
0.004
0.193
0.244
0.169
0.018
Typ.
0.004
0.039
0.197
0.252
0.173
0.0256
0.024
0.039
0° 8°
0.10
0°
Max.
0.047
0.006
0.041
0.012
0.0089
0.201
0.260
0.176
0.030
8°
0.004
DocID024119 Rev 4 23/25
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Revision history TS882, TS884
Date
18-Jan-2013
02-May-2013
14-Jul-2014
06-Jul-2017
Revision
Table 12. Document revision history
Changes
1
2
3
4
Initial release.
Added TS884 device to header, Description, and Table 1: Device summary.
Updated title (added “quad” comparator).
Updated Features and Table 2 (ESD tolerance: “6 kV” HBM replaced by “8 kV” HBM).
Updated Description in accordance with added TS884 device.
Added SO14, TSSOP14 and QFN16 3 x 3 mm package to Features, figure on page 1, Section 4: Package information. and Table 1:
Device summary.
Moved Figure 1: Pin connections TS882 (top view) to page 3.
Added Figure 2: Pin connections TS884 (top view).
Updated Table 2: Absolute maximum ratings (added TS884 device
RTHJA values).
Minor corrections throughout document.
Updated Table 1: Device summary on page 1.
Added order code TS882IYST in Table 1: Device summary and
“Automotive” in Applications .
24/25 DocID024119 Rev 4
TS882, TS884
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
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