STMicroelectronics STGWA40H120DF2 Datasheet
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STGW40H120DF2, STGWA40H120DF2 Trench gate field-stop IGBT, H series 1200 V, 40 A high speed Datasheet - production data Features Maximum junction temperature: TJ = 175 °C High speed switching series Minimized tail current VCE(sat) = 2.1 V (typ.) @ IC = 40 A 5 μs minimum short circuit withstand time at TJ=150 °C Safe paralleling Very fast recovery antiparallel diode Low thermal resistance Applications Figure 1: Internal schematic diagram Uninterruptible power supply Welding machines Photovoltaic inverters Power factor correction High frequency converters Description These devices are IGBTs developed using an advanced proprietary trench gate field-stop structure. These devices are part of the H series of IGBTs, which represents an optimum compromise between conduction and switching losses to maximize the efficiency of high switching frequency converters. Furthermore, a slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. Table 1: Device summary Order code Marking Package Packaging STGW40H120DF2 G40H120DF2 TO-247 Tube STGWA40H120DF2 G40H120DF2 TO-247 long leads Tube June 2016 DocID023753 Rev 5 This is information on a product in full production. 1/17 www.st.com Contents STGW40H120DF2, STGWA40H120DF2 Contents 1 Electrical ratings ............................................................................. 3 2 Electrical characteristics ................................................................ 4 2.1 Electrical characteristics (curves) ...................................................... 6 3 Test circuits ................................................................................... 11 4 Package information ..................................................................... 12 5 2/17 4.1 TO-247 package information ........................................................... 12 4.2 TO-247 long leads package information ......................................... 14 Revision history ............................................................................ 16 DocID023753 Rev 5 STGW40H120DF2, STGWA40H120DF2 1 Electrical ratings Electrical ratings Table 2: Absolute maximum ratings Symbol VCES Parameter Collector-emitter voltage (VGE = 0) Value Unit 1200 V IC Continuous collector current at TC = 25 °C 80 A IC Continuous collector current at TC = 100 °C 40 A ICP(1) Pulsed collector current 160 A VGE Gate-emitter voltage ±20 V VGE Transient gate-emitter voltage (tp ≤ 10 μs, D ≤ 0.01) ±30 V IF Continuous forward current at TC = 25 °C 80 A IF A Continuous forward current at TC = 100 °C 40 IFP(1) Pulsed forward current 160 A PTOT Total dissipation at TC = 25 °C 468 W TSTG Storage temperature range -55 to 150 °C Operating junction temperature range -55 to 175 °C TJ Notes: (1)Pulse width limited by maximum junction temperature. Table 3: Thermal data Symbol Parameter Value Unit RthJC Thermal resistance junction-case IGBT 0.32 °C/W RthJC Thermal resistance junction-case diode 1.3 °C/W RthJA Thermal resistance junction-ambient 50 °C/W DocID023753 Rev 5 3/17 Electrical characteristics 2 STGW40H120DF2, STGWA40H120DF2 Electrical characteristics TC = 25 °C unless otherwise specified Table 4: Static characteristics Symbol Parameter V(BR)CES Collector-emitter breakdown voltage VCE(sat) VF Test conditions Collector-emitter saturation voltage Forward on-voltage VGE = 0 V, IC = 2 mA Min. Typ. 1200 2.1 VGE = 15 V, IC = 40 A, TJ = 125 °C 2.4 VGE = 15 V, IC = 40 A, TJ = 175 °C 2.5 IF = 40 A 3.9 IF = 40 A, TJ = 125 °C 3.05 IF = 40 A, TJ = 175 °C 2.8 Gate threshold voltage VCE = VGE, IC = 2 mA ICES Collector cut-off current IGES Gate-emitter leakage current 5 Unit V VGE = 15 V, IC = 40 A VGE(th) Max. 6 2.6 V 4.9 V 7 V VGE = 0 V, VCE = 1200 V 25 µA VCE = 0 V, VGE = ±20 V ±250 nA Unit Table 5: Dynamic characteristics Symbol 4/17 Parameter Cies Input capacitance Coes Output capacitance Cres Reverse transfer capacitance Test conditions VCE= 25 V, f = 1 MHz, VGE = 0 V Qg Total gate charge Qge Gate-emitter charge Qgc Gate-collector charge VCC = 960 V, IC = 40 A, VGE = 15 V (see Figure 30: " Gate charge test circuit") DocID023753 Rev 5 Min. Typ. Max. - 3200 - - 220 - - 80 - - 158 - - 17 - - 85 - pF nC STGW40H120DF2, STGWA40H120DF2 Electrical characteristics Table 6: IGBT switching characteristics (inductive load) Symbol td(on) tr (di/dt)on td(off) tf Parameter Test conditions Typ. Max. Unit Turn-on delay time 18 - ns Current rise time 37 - ns 1755 - A/µs 152 - ns 83 - ns 1 - mJ Turn-on current slope Turn-off-delay time Current fall time Min. VCE = 600 V, IC = 40 A, VGE = 15 V, RG = 10 Ω (see Figure 31: " Switching waveform") Eon(1) Turn-on switching energy (2) Turn-off switching energy 1.32 - mJ Total switching energy 2.32 - mJ Turn-on delay time 36 - ns Current rise time 20 - ns 1580 - A/µs 161 - ns 190 - ns 1.81 - mJ Eoff Ets td(on) tr (di/dt)on td(off) tf Turn-on current slope Turn-off-delay time Current fall time VCE = 600 V, IC = 40 A, VGE = 15 V, RG = 10 Ω TJ = 175 °C (see Figure 31: " Switching waveform" ) Eon(1) Turn-on switching energy (2) Turn-off switching energy 2.46 - mJ Ets Total switching energy 4.27 - mJ tsc Short-circuit withstand time - µs Max. Unit Eoff VCC = 600 V, VGE = 15 V, TJstart = 150 °C 5 Notes: (1)Including the reverse recovery of the diode. (2)Including the tail of the collector current. Table 7: Diode switching characteristics (inductive load) Symbol Parameter Test conditions Min. Typ. - 488 ns - 2.59 µC - 11.6 A - 406 A/µs trr Reverse recovery time Qrr Reverse recovery charge Irrm Reverse recovery current dIrr/dt Peak rate of fall of reverse recovery current during tb Err Reverse recovery energy - 0.38 mJ trr Reverse recovery time - 484 ns Qrr Reverse recovery charge - 4.5 µC Irrm Reverse recovery current - 18.6 A dIrr/dt Peak rate of fall of reverse recovery current during tb - 170 A/µs Err Reverse recovery energy - 0.94 mJ IF = 40 A, VR = 600 V, VGE = 15 V (see Figure 31: " Switching waveform") di/dt = 500 A/µs IF = 40 A, VR = 600 V, VGE = 15 V TJ = 175 °C (see Figure 31: " Switching waveform") di/dt = 500 A/µs DocID023753 Rev 5 5/17 Electrical characteristics 2.2 STGW40H120DF2, STGWA40H120DF2 Electrical characteristics (curves) Figure 2: Power dissipation vs. case temperature Figure 3: Collector current vs. case temperature GIPG130320141053FSR Ptot (W) 450 VGE ≥ 15V, TJ ≤ 175 °C 400 GIPG130320141109FSR IC (A) 80 VGE ≥ 15V, TJ ≤ 175 °C 70 350 60 300 50 250 40 200 30 150 100 20 50 10 0 0 25 50 0 0 75 100 125 150 175 TC(°C) Figure 4: Output characteristics (TJ = 25 °C) 13V VGE=15V 140 11V 100 100 9V 60 40 40 7V 1 2 3 4 5 VCE(V) Figure 6: VCE(sat) vs. junction temperature GIPG130320141146FSR VCE(sat) (V) IC= 80A VGE= 15V 3.4 VGE=15V 13V 11V 80 60 0 0 TC(°C) GIPG130320141127FSR 140 120 20 150 IC (A) 120 80 100 Figure 5: Output characteristics (TJ = 175 °C) GIPG130320141114FSR IC (A) 50 9V 20 7V 0 0 1 2 3 4 5 VCE(V) Figure 7: VCE(sat) vs. collector current GIPG190320151413 RV VCE(sat) (V) VGE= 15V 5.0 TJ= 175°C 4.2 3.0 TJ= 25°C IC= 40A 2.6 2.2 IC= 20A 3.4 2.6 TJ= - 40°C 1.8 1.8 1.4 -50 6/17 0 50 100 150 TJ(°C) DocID023753 Rev 5 1.0 0 30 60 90 120 150 IC(A) STGW40H120DF2, STGWA40H120DF2 Electrical characteristics Figure 8: Collector current vs. switching frequency Figure 9: Forward bias safe operating area GIPG130320141328FSR Ic [A] GIPG130320141339FSR IC (A) 120 100 100 1 µs Tc=80° C 10 µs 80 Tc=100 °C 10 100 µs 60 40 20 rectangular current shape, (duty cycle=0.5, VCC = 600V, RG=10 Ω, VGE = 0/15 V, TJ =175°C) 0 1 0.1 f [kHz] 10 1 10 100 1000 VCE(V) Figure 11: Diode VF vs. forward current Figure 10: Transfer characteristics GIPG130320141348FSR IC (A) 140 1 ms Single pulse Tc= 25°C, TJ<= 175°C VGE= 15V 1 VCE=10V 120 TJ=25°C 100 80 TJ=175°C 60 40 20 0 5 11 VGE(V) 9 7 Figure 12: Normalized VGE(th) vs. junction temperature Figure 13: Normalized V(BR)CES vs. junction temperature GIPG130320141400FSR VGE(th) (norm) IC= 2mA VCE= VGE 1.1 GIPG130320141405FSR V(BR)CES (norm) 1.06 IC= 2mA 1.0 1.02 0.9 0.98 0.8 0.94 0.7 0.6 -50 0 50 100 150 TJ(°C) DocID023753 Rev 5 0.9 -50 0 50 100 150 TJ(°C) 7/17 Electrical characteristics STGW40H120DF2, STGWA40H120DF2 Figure 15: Gate charge vs. gate-emitter voltage Figure 14: Capacitance variations VGE (V) GIPG190320151507 RV C (pF) Cies GIPG200320151700 RV VCC 15 f=1 MHz,VGE=0V 12 1000 IC 40A IG 1mA 9 Coes 6 Cres 3 100 10 0.1 0 1 10 100 0 VCE(V) Figure 16: Switching energy vs. collector current E (µJ) 5000 30 60 90 120 150 Qg(nC) Figure 17: Switching energy vs. gate resistance GIPG130320141432FSR GIPG130320141439FSR E (µJ) 4000 VCC = 600V, VGE = 15V, RG = 10Ω, TJ = 175°C EOFF 3500 4000 EON 3000 EOFF 2500 3000 EON 2000 2000 1500 VCC = 600 V, VGE = 15 V, IC = 40 A, TJ = 175 °C 1000 1000 500 0 0 20 40 60 80 Figure 18: Switching energy vs. temperature E (µJ) 2500 0 0 IC(A) 10 20 30 40 RG(Ω) Figure 19: Switching energy vs. collector emitter voltage GIPG130320141450FSR VCC= 600V, VGE= 15V, RG= 10Ω, IC= 40A E (µJ) 3200 GIPG130320141459FSR TJ= 175°C, VGE= 15V, RG= 10Ω, IC= 40A 2300 2100 EOFF 2600 EOFF 1900 2000 1700 EON 1400 1500 EON 1300 800 1100 900 0 8/17 50 100 150 TJ(°C) DocID023753 Rev 5 200 200 400 600 800 VCE(V) STGW40H120DF2, STGWA40H120DF2 Electrical characteristics Figure 20: Short-circuit time and current vs. VGE Figure 21: Switching times vs. collector current GIPG190320151623 RV tsc30 (µs) t (ns) Isc (A) tSC ISC VCC ≤ 600 V TJ ≤ 150 °C 26 22 320 GIPG140320141159FSR TJ= 175°C, VGE= 15V, RG= 10Ω, VCC= 600V tf tdoff 100 260 tdon 18 200 14 140 10 10 10 11 13 12 80 VGE(V) 14 Figure 22: Switching times vs. gate resistance t (ns) 1 0 20 40 Irm (A) tdoff 30 tf GIPG140320141215FSR IF = 40A, VCC = 600V, VGE = 15V 25 100 TJ =175°C 20 tdon 15 tr 10 80 IC(A) 60 Figure 23: Reverse recovery current vs. diode current slope GIPG140320141205FSR TJ= 175°C, VGE= 15V, IC= 40A, VCC= 600V tr 10 5 1 0 10 20 30 40 0 0 RG(Ω) Figure 24: Reverse recovery time vs. diode current slope IF = 40A, VCC = 600V, VGE = 15V 1400 800 1200 1600 di/dt(A/µs) Figure 25: Reverse recovery charge vs. diode current slope GIPG140320141222FSR trr (ns) 400 1200 Qrr (nC) 6000 GIPG140320141238FSR IF = 40A, VCC = 600V, VGE = 15V 5500 1000 5000 800 4500 600 TJ =175°C 400 3500 200 0 0 TJ =175°C 4000 400 800 1200 1600 di/dt(A/µs) DocID023753 Rev 5 3000 0 400 800 1200 1600 di/dt(A/µs) 9/17 Electrical characteristics STGW40H120DF2, STGWA40H120DF2 Figure 26: Reverse recovery energy vs. diode current slope GIPG140320141247FSR Err (µJ) IF = 40A, VCC = 600V, VGE = 15V 1400 1200 1000 800 TJ =175°C 600 400 0 400 800 1200 1600 di/dt(A/µs) Figure 27: Thermal impedance for IGBT Figure 28: Thermal impedance for diode 10/17 DocID023753 Rev 5 STGW40H120DF2, STGWA40H120DF2 3 Test circuits Test circuits Figure 29: Test circuit for inductive load switching Figure 30: Gate charge test circuit VCC C A A 12 V L=100 µH G E B G RG 1 kΩ 100 nF B 3.3 µF C + 47 kΩ VCC 1000 µF Vi ≤ VGMAX D.U.T 2200 µF E - IG=CONST 100 Ω D.U.T. 2.7 kΩ VG 47 kΩ PW AM01504v 1 Figure 31: Switching waveform DocID023753 Rev 5 1 kΩ AM01505v1 Figure 32: Diode reverse recovery waveform 11/17 Package information 4 STGW40H120DF2, STGWA40H120DF2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 4.1 TO-247 package information Figure 33: TO-247 package outline 12/17 DocID023753 Rev 5 STGW40H120DF2, STGWA40H120DF2 Package information Table 8: TO-247 package mechanical data mm Dim. Min. Typ. Max. A 4.85 5.15 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.30 L 14.20 14.80 L1 3.70 4.30 L2 5.45 5.60 18.50 ØP 3.55 ØR 4.50 S 5.30 DocID023753 Rev 5 3.65 5.50 5.50 5.70 13/17 Package information 4.2 STGW40H120DF2, STGWA40H120DF2 TO-247 long leads package information Figure 34: TO-247 long lead package outline 14/17 DocID023753 Rev 5 STGW40H120DF2, STGWA40H120DF2 Package information Table 9: TO-247 long lead package mechanical data mm Dim. Min. Typ. Max. A 4.90 5.00 5.10 A1 2.31 2.41 2.51 A2 1.90 2.00 2.10 b 1.16 1.26 b2 3.25 b3 2.25 c 0.59 0.66 D 20.90 21.00 21.10 E 15.70 15.80 15.90 E2 4.90 5.00 5.10 E3 2.40 2.50 2.60 e 5.34 5.44 5.54 L 19.80 19.92 20.10 P 3.50 3.60 Q 5.60 S 6.05 L1 4.30 DocID023753 Rev 5 3.70 6.00 6.15 6.25 15/17 Revision history 5 STGW40H120DF2, STGWA40H120DF2 Revision history Table 10: Document revision history Date Revision 03-Oct-2012 1 First release. 2 Updated features in cover page. Updated Table 4: Static characteristics, Table 5: Dynamic characteristics and Table 7: Diode switching characteristics (inductive load). Minor text changes. 3 Updated title and description in cover page. Updated Table 4: Static characteristics, Table 5: Dynamic characteristics and Table 7: Diode switching characteristics (inductive load). Added Section 2.1: Electrical characteristics (curves). 4 Added device in TO-247 long leads. Updated 4: Package information. Updated Figure 7, Figure 11, Figure 14, Figure 15, Figure 20, Figure 21 and added Figure 26. Minor text changes. 5 Modified: Table 2: "Absolute maximum ratings", Section 2: "Electrical characteristics", Table 6: "IGBT switching characteristics (inductive load)" Minor text changes. 29-Jan-2014 24-Mar-2014 31-Mar-2015 28-Jun-2016 16/17 Changes DocID023753 Rev 5 STGW40H120DF2, STGWA40H120DF2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID023753 Rev 5 17/17 ">
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