STPS30170DJF
Datasheet
170 V, 30 A power Schottky rectifier
Product status
STPS30170DJF
I
F(AV)
V
RRM
Product summary
30 A
T j
(max.)
V
F
(typ.)
170 V
150 °C
0.71 V
Features
• Very small conduction losses
• Negligible switching losses
• Extremely fast switching
• Low forward voltage drop
• Low thermal resistance
• High avalanche capability specified
• ECOPACK ® 2 compliant
Applications
• Switching diode
• SMPS
• DC/DC converter
• Telecom power
Description
This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters.
Packaged in PowerFLAT™ 5x6, the STPS30170DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications.
Its low profile was especially designed to be used in applications with space-saving constraints.
PowerFLAT™ is a trademark of STMicroelectronics.
DS6587 - Rev 5 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPS30170DJF
Characteristics
Characteristics
Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited)
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T stg
T j
Repetitive peak reverse voltage
Forward rms current
Parameter
Average forward current, δ = 0.5, square wave
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature
(1)
t t
T p
C
= 80 °C
= 10 ms sinusoidal p
= 10 µs , T j
= 125 °C
1. (dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Value
170
45
30
200
900
-65 to +175
150
A
W
°C
°C
Unit
V
A
A
Symbol
R th(j-c)
Junction to case
Table 2. Thermal resistance parameters
Parameter Max. value Unit
2.5
°C/W
For more information, please refer to the following application note :
• AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages
Symbol
I
R
(1)
V
F
(2)
Table 3. Static electrical characteristics (anode terminals short circuited)
Parameter
Reverse leakage current
Forward voltage drop
Test conditions
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
I
I
V
F
F
R
= V
RRM
= 15 A
= 30 A
Min.
-
-
-
-
Typ.
4
0.65
0.71
1. Pulse test: t p
= 5 ms, δ < 2%
2. Pulse test: t p
= 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.65 x I
F(AV)
+ 0.0046 I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
Max.
15
12
0.88
0.70
0.95
0.79
Unit
µA mA
V
DS6587 - Rev 5 page 2/9
STPS30170DJF
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus average forward current
32
P
F(AV)
(W)
28
24
20
16
12
8
4
0
0 5
δ = 0.05
10
δ = 0.1
15
δ
= 0.2
I
F(AV)
(A)
20
δ = 0.5
25
δ =tp/T
30
δ = 1
T
35 tp
40
20
15
10
5
0
0
Figure 2. Average forward current versus ambient temperature (δ = 0.5)
35
I
F(AV)
(A)
R th(j-a)
=R th(j-c)
30
25
T
δ =tp/T
25 tp
50
T amb
(°C)
75 100 125 150
Figure 3. Normalized avalanche power derating versus pulse duration (T j
= 125 °C)
1
P
ARM
(tp)
P
ARM
(10 µs)
0.1
0.01
0.001
1 10 100 1000
Figure 4. Relative variation of thermal impedance junction to case versus pulse duration
1.0
Z th(j-c)
/ R th(j-c)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Figure 5. Reverse leakage current versus reverse voltage applied (typical values)
I
R
(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
1.E-04
0 20 4 0 60 80 100 120 140 160 180
Figure 6. Junction capacitance versus reverse voltage applied (typical values)
1000
C(pF)
100
10
1 1 0 100
V
F=1 MHz
OSC
T j
=30 mV
=25 °C
RMS
1000
DS6587 - Rev 5 page 3/9
STPS30170DJF
Characteristics (curves)
Figure 7. Forward voltage drop versus forward current
I
F(A)
0.0
0.1
(Maximum values)
(Typical values)
(Maximum values)
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
75
50
25
0
0
Figure 8. Thermal resistance junction to ambient versus copper surface under tab
150
R th(j-a)
(°C/W) epoxy printed board FR4, e
Cu
= 35 µm 125
100
PowerFlat™_5X6
1 2 3 4 5 6 7 8
S
Cu
(cm²)
9 10
DS6587 - Rev 5 page 4/9
2
2.1
STPS30170DJF
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
•
•
PowerFLAT™ 5x6 package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
Bottom view
Side view
Top view
DS6587 - Rev 5 page 5/9
DS6587 - Rev 5
STPS30170DJF
PowerFLAT™ 5x6 package information
Ref
E2
L
K
L1
D2 e
E
A
A1 b c
D
5.90
3.34
0.50
1.10
0.05
Min.
0.80
0.00
0.30
Table 4. PowerFLAT™ 5x6 mechanical data
4.80
3.91
Dimensions
Millimeters
Typ.
Max.
1.00
0.05
0.50
0.25
5.40
4.45
1.27
0.15
6.35
3.70
0.80
1.575
0.25
0.232
0.138
0.020
0.015
0.002
Min.
Inches (for reference only)
Typ.
Max.
0.031
0.000
0.01
0.039
0.002
0.02
0.010
0.189
0.154
0.212
0.175
0.050
0.006
0.250
0.146
0.031
0.023
0.009
Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) page 6/9
3
STPS30170DJF
Ordering information
Ordering information
Order code
STPS30170DJF-TR
Marking
PS30 170
Table 5. Ordering information
Package
PowerFLAT 5x6
Weight
0.095 g
Base qty.
3000
Delivery mode
Tape and reel
DS6587 - Rev 5 page 7/9
STPS30170DJF
Revision history
Table 6. Document revision history
Date
06-Nov-2009
Revision
1 First issue.
30-Jul-2010
20-May-2011
2
3
Updated Table 1.
Corrected order code and marking in Table 6.
Changes
05-Jun-2018
08-Feb-2019
4
5
Updated
Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) and
Figure 3. Normalized avalanche power derating versus pulse duration
(T j
= 125 °C) . Minor text changes to improve readability.
Updated
Section Cover image
,
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
and
Table 4. PowerFLAT™ 5x6 mechanical data
.
DS6587 - Rev 5 page 8/9
STPS30170DJF
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© 2019 STMicroelectronics – All rights reserved
DS6587 - Rev 5 page 9/9
