STPS3045DJF
Datasheet
45 V, 30 A power Schottky rectifier
Product status link
STPS3045DJF
Product summary
Symbol
I
F(AV)
V
RRM
T j
(max.)
V
F
(typ.)
Value
30 A
45 V
175 °C
0.50 V
Features
• Very small conduction losses
• Negligible switching losses
• Extremely fast switching
• Low forward voltage drop
• Low thermal resistance
• High avalanche capability specified
• Thin package: 1 mm
• ECOPACK ® 2 compliant
Applications
• Telecom power supply
• Desktop power supply
Description
This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters.
Packaged in PowerFLAT™ 5x6, the STPS3045DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications.
Its low profile was especially designed to be used in applications with space-saving constraints.
PowerFLAT™ is a trademark of STMicroelectronics.
DS6592 - Rev 5 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STPS3045DJF
Characteristics
Characteristics
Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited)
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T stg
T j
Repetitive peak reverse voltage
Forward rms current
Parameter
Average forward current, δ = 0.5, square wave
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature
(1)
t t
T p
C
= 120 °C
= 10 ms sinusoidal p
= 10 µs , T j
= 125 °C
1. (dP tot
/dT j
) < (1/R th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Value
45
45
30
380
900
-65 to +175
175
A
W
°C
°C
Unit
V
A
A
Symbol
R th(j-c)
Junction to case
Table 2. Thermal resistance parameters
Parameter Max. value Unit
2.5
°C/W
For more information, please refer to the following application note :
• AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages
Symbol
I
R
(1)
V
F
(1)
Table 3. Static electrical characteristics (anode terminals short circuited)
Parameter
Reverse leakage current
Forward voltage drop
Test conditions
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 125 °C
I
I
V
F
F
R
= V
RRM
= 15 A
= 30 A
Min.
-
-
-
-
-
-
Typ.
20
0.41
0.50
1. Pulse test: t p
= 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.43 x I
F(AV)
+ 0.00433 I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode
Max.
300
80
0.56
0.46
0.64
0.56
Unit
µA mA
V
DS6592 - Rev 5 page 2/9
STPS3045DJF
Characteristics (curves)
1.1
Characteristics (curves)
20
16
12
8
4
0
0
Figure 1. Average forward power dissipation versus average forward current
24
PF(AV)(W)
5 10
IF(AV)(A)
15 20 25
T
30
δ
=tp/T
35 tp
40
Figure 2. Average forward current versus ambient temperature (δ = 0.5)
20
15
10
5
0
0
35
I
F(AV)
(A)
Rth(j-a) = Rth(j-c)
30
25
δ
=tp/T
25
T tp
50 75
Tamb(°C)
100 125 150 175
Figure 3. Normalized avalanche power derating versus pulse duration (T j
= 125 °C)
1
P
ARM
(tp)
P
ARM
(10 µs)
0.1
0.01
0.001
1 10 100 1000
Figure 4. Relative variation of thermal impedance junction to case versus pulse duration
Z th(j-c)
/R th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-05
Single pulse
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
DS6592 - Rev 5 page 3/9
STPS3045DJF
Characteristics (curves)
Figure 5. Reverse leakage current versus reverse voltage applied (typical values)
1.E+02
1.E+01
1.E+00
Figure 6. Junction capacitance versus reverse voltage applied (typical values)
10000
C(pF)
F = 1 MHz
V osc
T = 25 °C
RMS j
= 30 mV
1000
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40 45
100
1 1 0 100
Figure 7. Forward voltage drop versus forward current
60
55
50
45
40
35
30
25
20
15
10
5
0
0.0
0.1
(Maxim um v alues)
(Typical v alues)
(Maxim um v alues)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
75
50
25
0
0
Figure 8. Thermal resistance junction to ambient versus copper surface under tab
150
R th(j-a)
(°C/W) epoxy printed board FR4, e
Cu
= 35 µm 125
100
PowerFlat™_5X6
1 2 3 4 5 6 7 8
S
Cu
(cm²)
9 10
DS6592 - Rev 5 page 4/9
2
2.1
STPS3045DJF
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
•
•
PowerFLAT™ 5x6 package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
Bottom view
Side view
Top view
DS6592 - Rev 5 page 5/9
DS6592 - Rev 5
STPS3045DJF
PowerFLAT™ 5x6 package information
Ref
E2
L
K
L1
D2 e
E
A
A1 b c
D
5.90
3.34
0.50
1.10
0.05
Min.
0.80
0.00
0.30
Table 4. PowerFLAT™ 5x6 mechanical data
4.80
3.91
Dimensions
Millimeters
Typ.
Max.
1.00
0.05
0.50
0.25
5.40
4.45
1.27
0.15
6.35
3.70
0.80
1.575
0.25
0.232
0.138
0.020
0.015
0.002
Min.
Inches (for reference only)
Typ.
Max.
0.031
0.000
0.01
0.039
0.002
0.02
0.010
0.189
0.154
0.212
0.175
0.050
0.006
0.250
0.146
0.031
0.023
0.009
Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) page 6/9
3
STPS3045DJF
Ordering information
Ordering information
Order code
STPS3045DJF-TR
Marking
PS30 45
Table 5. Ordering information
Package
PowerFLAT™ 5x6
Weight
0.095 g
Base qty.
3000
Delivery mode
Tape and reel
DS6592 - Rev 5 page 7/9
STPS3045DJF
Revision history
Table 6. Document revision history
Date
09-Nov-2009
Revision
1 First issue.
05-Jul-2010
20-May-2011
2
3
Replace Power QFN with PowerFLAT™.
Changes
Updated package graphics and marking in Table 6. Added Figure 10.
12-Aug-2015
14-Feb-2019
4
5
Updated cover image and Table 1 on cover page. Updated Table 2 and Section 1.1: Characteristics
(curves).
Updated
Section Cover image
,
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
and
Table 4. PowerFLAT™ 5x6 mechanical data
. Minor text changes to improve readability.
DS6592 - Rev 5 page 8/9
STPS3045DJF
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© 2019 STMicroelectronics – All rights reserved
DS6592 - Rev 5 page 9/9
