STTH25M06
Datasheet
600 V, 25 A ultrafast high voltage diode
K
A K
K
A
NC
DPAK
NC
A
TO220FPAC
K
A
Product status
STTH25M06
Product summary
Symbol
I
F(AV)
V
RRM t rr(typ.)
T
j(max.)
V
F(typ.)
Value
25 A
600 V
25 ns
175 °C
1.6 V
Features
• Ultrafast recovery, soft recovery
• Low power losses at high switching frequency operations
• Low leakage current
• High junction temperature
• High overcurrent capability
• ECOPACK2 compliant
Applications
• PFC
• Boost diode
• LLC clamping diode
Description
The STTH25M06 is an ultrafast recovery power rectifier especially suited for boost or
LLC clamping circuits working at high switching frequencies in heavy duty applications such as air conditioning equipment or telecom power supplies.
Designed with the latest ST’s ultrafast technology, this 600 V 25 A diode in DPAK and
TO-220FPAC has a robust behavior against electrostatic discharge and high overcurrent capability.
DS13169 - Rev 2 - February 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1
STTH25M06
Characteristics
Characteristics
Symbol
V
RRM
I
F(AV)
I
FSM
T stg
T j
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Parameter
Repetitive peak reverse voltage
Average forward current
Surge non repetitive forward current
Storage temperature range
Maximum operating junction temperature t p
= 10 ms sinusoidal
Value
600
25
170
-65 to +175
+175
A
°C
°C
Unit
V
A
Symbol
R th(j-c)
Junction to case
Table 2. Thermal resistance parameter
Parameter
DPAK
TO-220FPAC
Typ.
value
0.5
2.45
Unit
°C/W
For more information, please refer to the following application note :
• AN5088 : Rectifiers thermal management, handling and mounting recommendations
Symbol
I
R
(1)
V
F
(2)
Parameter
Forward voltage drop
Table 3. Static electrical characteristics
Reverse leakage current
Test conditions
T j
= 25 °C
T j
= 125 °C
T j
= 25 °C
T j
= 150 °C
T j
= 25 °C
T j
= 150 °C
V
R
= 600 V
I
F
= 15 A
I
F
= 25 A
1. Pulse test: t p
= 5 ms, δ < 2%
2. Pulse test: t p
= 380 µs, δ < 2%
Min.
Typ.
Max.
Unit
60
µA
70 800
-
2.1
1.3
V
-
2.5
1.6
3.4
2.0
To evaluate the conduction losses, use the following equation:
P = 1.04 x I
F(AV)
+ 0.0385 x I
F
2
(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4058: Calculation of turn-off power losses generated by an ultrafast diode
DS13169 - Rev 2 page 2/13
STTH25M06
Characteristics
Symbol t rr
I
RM
Q rr
Table 4. Dynamic electrical characteristics
Parameters Test conditions
Reverse recovery time
Reverse recovery current
Reverse recovery charge
T j
= 25 °C
T j
= 125 °C
T j
= 125 °C
I
F
= 1 A dI
F
/dt = -50 A/µs
V
R
= 30 V
I
F
= 1 A dI
F
/dt = -100 A/µs
V
R
= 30 V
I
F
= 15 A dI
F
/dt = -200 A/µs
V
R
= 400 V
I
F
= 25 A dI
F
/dt = -200 A/µs
V
R
= 400 V
I
F
= 25 A dI
F
/dt = -200 A/µs
V
R
= 400 V
Min.
Typ.
Max.
Unit
50
25 35
55
60
-
7
250 ns
A nC
DS13169 - Rev 2 page 3/13
STTH25M06
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus average forward current (square waveform)
100
P(W)
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
80
δ = 1
60
40
T
20
0
0 8 16
I
F(AV)
(A)
24
δ =tp/T
32 tp
40
Figure 2. Forward voltage drop versus forward current
(typical values)
1000.0
100.0
10.0
1.0
T j
=150 °C
0.1
0.0
1.0
2.0
T j
=25 °C
3.0
4.0
5.0
Figure 3. Forward voltage drop versus forward current
(maximum values)
1000.0
100.0
T j
=150 °C
10.0
T j
=25 °C
1.0
0.1
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
Figure 4. Relative variation of thermal impedance, junction to case versus pulse duration (DPAK)
Z th(j-c
)/R th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
Single pulse
1.E-03 t p
(s)
1.E-02 1.E-01 1.E+00
Figure 5. Relative variation of thermal impedance, junction to case versus pulse duration (TO-220FPAC)
1.0
0.9
Z th(j-c
)/R th(j-c)
Single pulse
TO-220FPAC
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-03 1.E-02 1.E-01 t p
(s)
1.E+00 1.E+01 1.E+02 1.E+03
Figure 6. Peak reverse recovery current versus dI
F
/dt
(typical values)
16
I
RM
(A)
V
T
I
F
= I
F(AV)
R
=400V j
= 125 °C
12
8
4
0
0 50 100 150 200 250 300 350 dI
F
/dt(A/µs)
400 450 500
DS13169 - Rev 2 page 4/13
STTH25M06
Characteristics (curves)
Figure 7. Reverse recovery time versus dI
F
/dt (typical values)
120 t
RR
(ns)
I
F
V
= I
F(AV)
R
=400V
T j
=125°C
90
Figure 8. Reverse recovery charges versus dI
F
/dt (typical values)
400
Q
RR
(nC)
I
F
V
R
= I
F(AV)
=400V
T j
=125°C
300
60
200
30
0
0 50 dI
F
/dt(A/µs)
100 150 200 250 300 350 400 450 500
100
0
0 50 100 150 200 250 300 350 dI
F
/dt(A/µs)
400 450 500
Figure 9. Reverse recovery softness factor versus dI
F
/dt
(typical values)
0.8
S
FACTOR
I
F
V
= I
F(AV)
R
=400V
T j
=125°C
0.6
0.4
0.2
0.0
0 50 100 150 dI
F
/dt(A/µs)
200 250 300 350 400 450 500
Figure 10. Relative variations of dynamic parameters versus junction temperature
2.0
1.6
S
FACTOR
1.2
0.8
I
RM
0.4
0.0
25
Q
RR
50 75
T j
(°C)
I
F
V
R
=I
F(AV)
=400 V
Reference: T j
=125 °C
100 125
Figure 11. Junction capacitance versus reverse voltage applied (typical values)
1000
C(pF)
V osc
F=1MHz
=30mV
T j
=25°C
RMS
100
10
1 10
V
R
(V)
100 1000
Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, e
Cu
= 70 µm)
100
R th(j-a)
(°C/W)
Epoxy printed circuit board, copper thickness: 35 µm 90
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30
DPAK
S
Cu
(cm²)
35 40
DS13169 - Rev 2 page 5/13
STTH25M06
Characteristics (curves)
Figure 13. Relative variation of non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform)
Figure 14. Relative variation of non-repetitive peak surge forward current versus initial junction temperature
(sinusoidal waveform)
1.2
I
FSM
(T j
) / I
FSM
(25 °C)
4.0
I
FSM
(t p
) / I
FSM
(10ms)
3.5
1.0
0.8
3.0
2.5
2.0
1.5
1.0
0.1
1.0
t p
(ms)
10.0
0.6
0.4
0.2
0.0
25 50 75
T j
(°C)
100 125 150 175
DS13169 - Rev 2 page 6/13
2
2.1
STTH25M06
Package information
Package information
•
•
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com
. ECOPACK is an ST trademark.
DPAK package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 15. DPAK package outline
E b4 c2
A
Thermal pad
E1
L2
D
D1
H
L4
R e e1 b
A1
A2
L1
L
0.25
V2
Gauge plane c
R
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed.
DS13169 - Rev 2 page 7/13
DS13169 - Rev 2
Ref.
E1 e e1
H
L
L2
L4
V2 c c2
D
D1
E
A
A1
A2 b b4
6.7
STTH25M06
DPAK package information
Min.
0.46
0.46
5.97
4.95
6.35
4.32
2.18
0.90
0.03
0.64
4.95
4.40
9.35
1.0
0.60
-8°
Table 5. DPAK package mechanical data
Dimensions
Millimeters
2.286 typ.
Max.
0.61
0.60
6.22
5.60
6.73
5.50
2.40
1.10
0.23
0.90
5.46
4.70
10.40
1.78
1.27
1.02
+8°
Inches (for reference only)
Min.
Max.
0.018
0.018
0.235
0.194
0.250
0.170
0.085
0.035
0.001
0.025
0.194
0.024
0.023
0.244
0.220
0.265
0.216
0.094
0.043
0.009
0.035
0.215
0.090 typ.
0.173
0.368
0.039
0.023
-8°
0.185
0.409
0.070
0.050
0.040
+8°
Figure 16. DPAK recommended footprint (dimensions in mm)
12.7
6.7
3.0
3.0
4.572
A
B
The device must be positioned within 0.05 AB
1.6
page 8/13
2.2
•
•
•
•
TO-220FPAC package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 17. TO-220FPAC package outline
STTH25M06
TO-220FPAC package information
H
B
A
L6
Di a
L3
L2 L7
F1
D
L4
G1
G
F
E
DS13169 - Rev 2 page 9/13
DS13169 - Rev 2
Ref.
F1
G
G1
H
L2
A
B
D
E
F
L3
L4
L6
L7
Diam
STTH25M06
TO-220FPAC package information
28.6
9.8
15.9
9.00
3.00
Min.
Millimeters
Max.
4.40
2.5
2.5
0.45
0.75
1.15
4.95
2.4
10
4.60
2.7
2.75
0.70
1
1.70
5.20
2.7
10.4
16 typ.
30.6
10.6
16.4
9.30
3.20
Table 6. TO-220FPAC package mechanical data
Dimensions
Inches (for reference only)
Min.
Max.
0.173
0.098
0.098
0.018
0.030
0.045
0.195
0.094
0.393
0.181
0.106
0.108
0.027
0.039
0.067
0.205
0.106
0.409
0.63 typ.
1.126
0.386
0.626
0.354
0.118
1.205
0.417
0.646
0.366
0.126
page 10/13
3
STTH25M06
Ordering information
Ordering information
Order code
STTH25M06B-TR
STTH25M06FP
Table 7. Ordering information
Marking
TH25 M06B
STTH25M06FP
Package
DPAK
TO-220FPAC
Weight
0.32 g
1.90 g
Base qty.
2500
50
Delivery mode
Tape and reel
Tube
DS13169 - Rev 2 page 11/13
Revision history
Date
09-Dec-2019
10-Feb-2020
Revision
1
2
Table 8. Document revision history
Changes
Initial release.
Added TO-220FPAC package information.
STTH25M06
DS13169 - Rev 2 page 12/13
STTH25M06
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
DS13169 - Rev 2 page 13/13
