STMicroelectronics CBTVS2A12-1F3 Datasheet
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विज्ञापन
CBTVS2A12-1F3
Flip Chip
(4 bumps)
Circuit breaker with transient voltage suppressor
Figure 1. Pin configuration (bump side)
A B
1
2
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Figure 2. Configuration
(a)
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Datasheet
-
production data
Features
• Transient voltage suppressor (TVS)
• Non-resettable over current protection (OCP)
• Electrostatic discharge protection
• Electrical overstress protection (OVP)
• Unidirectional device
• Fast response time
• Very thin package: 0.4 mm
• High ESD protection level
• High integration
• Suitable for high density boards
Complies with the following standards:
•
IEC 61000-4-2 level 4:
– ± 15 kV (air discharge)
– ± 15 kV (contact discharge)
Description
The CBTVS2A12-1F3 is a single line diode TVS integrating a fuse designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD, OVP and OCP.
%
*1'
%
*1' a.
B1 and B2 bumps must be grounded on the PCB together.
May 2014
This is information on a product in full production.
DocID026350 Rev 1 1/7 www.st.com
Characteristics
1 Characteristics
CBTVS2A12-1F3
Symbol
V
PP
P
PP
T j
T stg
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Parameter Test condition Value
Peak pulse voltage
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
Peak pulse power dissipation
10/1000 µs pulse, on A2-B2,
T j
= T amb
8/20 µs pulse, on A2-B2,
T j
= T amb
Maximum operating junction temperature
Storage temperature range
15
15
44
350
125
-55 to +150
Unit kV
W
°C
°C
Symbol
V
BR
V
CL
I
RM
V
RM
I
F
R d
I
PP
I
R
V
F
=
=
=
=
=
=
=
=
=
Figure 3. Electrical characteristics (definitions)
I
Parameter
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Stand-off voltage
Forward current
Dynamic impedance
Peak pulse current
Breakdown current
Forward voltage drop
V
CL
V
BR
V
RM
I
F
I
RM
Slope = 1/Rd
I
PP
V
F
V
2/7
Table 2. Electrical characteristics (at operating temperature:
T op
= -30 °C to +85 °C, unless otherwise specified)
Test conditions Min.
Typ.
Max.
Unit Symbol
V
BR
I
RM
I
R
= 1 mA, T amb
= 25 °C
V
RM
= 10 V, at T amb
= 25 °C
V
CL
V
F
C line
R
A1-A2
R
A1-A2
T
Fuse
T
Fuse2
T fuse Lifetime
I
I
PP
= 1 A, 8/20 µs pulse waveform, between A1-B1 at T amb
= 25 °C
F
= 850 mA, between A1-B1
V
R
= 0 V, V
OSC
At T amb
= 30 mV, F = 1 MHz
= 25 °C at 100 mA
After fused
At 5 A (maximum opening time) A
1
-A
2,
A
2
-A
1
At 3.2 A, A
1
-A
2,
A
2
-A
1
I
DC
= 2 A (continuous current) at T amb
= 25 °C
12
1
500
180
100
15
1.4
50
100
24
V nA
V
V pF m Ω
M Ω ms hours hours
DocID026350 Rev 1
CBTVS2A12-1F3 Characteristics
Figure 4. Clamping voltage versus peak pulse current (typical values)
100
I
PP
(A)
8/20µs
Tj initial = 25 °C
A1/B1 A2/B2
10
1
0.1
13.5
14.5
15.5
16.5
17.5
Figure 5. Forward voltage drop versus peak
10
I
FM
(A) forward current (typical values)
1
0.1
0.01
18.5
V
CL
(V)
19.5
0.001
Tj initial = 25 °C
A1/B1 A2/B2
0.0001
0.6 0.7 0.8 0.9
1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9
2 V
FM
(V)
Figure 6. Frequency response
0
S21 (dB )
-10
-20
-30
-40
-50
300k 1M 3M 10M
F (Hz)
30M 100M 300M 1G 3G
Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
5.0 V/di v
Figure 7. Junction capacitance versus reverse applied voltage (typical values)
200.0
180.0
160.0
140.0
C (pF)
120.0
100.0
80.0
60.0
40.0
20.0
0.0
0 2 4 6 8 10
V
R
(V)
12
Figure 9. ESD response to IEC 61000-4-2
5.0 V/di v
(-8 kV contact discharge)
200 ns/div
200 ns/div
DocID026350 Rev 1 3/7
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Ordering information scheme
2 Ordering information scheme
CBTVS2A12-1F3
Figure 10. Ordering information scheme
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4/7 DocID026350 Rev 1
CBTVS2A12-1F3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 11. Package dimensions
400 µm ± 40 400 µm ± 50
205 µm ± 40
185 µm ± 10
0.77 mm ± 30 µm
255 µm ± 40
Figure 12. Foot print recommendations
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 13. Marking
Dot xx = marking z = manufacturing location yww = datecode
(y = year ww = week) x y x z w w
0.20 ± 0.05
Figure 14. Tape and reel specifications
Ø 1.55 ± 0.05
2.0 ± 0.05
4.0 ± 0.1
0.87± 0.05
0.69 ± 0.05
All dimensions in mm
2.0 ± 0.1
User direction of unreeling
DocID026350 Rev 1 5/7
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Ordering information
Note:
CBTVS2A12-1F3
More information is available in the application notes:
AN2348: “400 µm Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
Order code
CBTVS2A12-1F3
Marking
Table 3. Ordering information
Package Weight Base qty
EB Flip Chip 0.659 mg 10 000
Delivery mode
Tape and reel (7”)
Date
19-May-2014
Revision
Table 4. Document revision history
Changes
1 Initial release.
6/7 DocID026350 Rev 1
CBTVS2A12-1F3
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