EMIF02-SPK03F2
2-channel EMI filter and ESD protection for speaker phone
Datasheet
−
production data
Features
■
■
■
■
■
■
■
■
2-channel EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering:
– S21 attenuation, -40 dB at 900 MHz
– Xtalk, in audio band, -60 dB
Very low PCB space consumption:
0.89 x 1.26 mm
Very thin package: 0.6 mm after reflow
High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
High reduction of parasitic elements through integration and wafer level packaging
Packaged in lead-free Flip Chip
Complies with the following standards
■ IEC 61000-4-2 level 4:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Application
■
■
■
Mobile phones
Portable devices
Connectivity devices
Description
The EMIF02-SPK03F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF02-SPK03F2 is 2-channel, ultra compact, high attenuation filter available in
0.5 mm pitch WLCSP package. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
Flip Chip
(5 bumps)
Figure 1.
Pin configuration (bump side)
3 2 1
O1 I1
A
GND
B
O2 I2
C
Figure 2.
Functional schematic
L
I1 O1
C C
L
I2 O2
C C
June 2012
This is information on a product in full production.
Doc ID 023219 Rev 1 1/10 www.st.com
10
Characteristics
1 Characteristics
EMIF02-SPK03F2
Table 1.
Symbol
Absolute maximum ratings (T amb
= 25 °C)
Parameter Value
V
PP
ESD discharge IEC 61000-4-2
(1)
Air discharge
Contact discharge
30
I
SPK
T j
T op
T stg
Maximum rms currrent per channel
Maximum junction temperature
Operating temperature range
Storage temperature range
800
125
-30 to 85
-55 to + 150
1.
Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353,
“IEC 61000-4-2 standard testing”.
Unit kV mA
°C
°C
°C
Figure 3.
Electrical characteristics - definitions
Symbol
V
BR
V
CL
I
RM
V
RM
I
PP
=
=
=
=
=
I
R
R d
=
=
Parameter
Breakdown voltage
Clamping voltage
Leakage current @ V
RM
Stand-off voltage
Peak pulse current
Breakdown current
Dynamic resistance
V
CL
I
PP
Slope: 1/R d
Slope: 1/R d
I
PP
V
CL
Table 2.
Symbol
Electrical characteristics - values (Tamb = 25 °C)
Test conditions Min.
Typ.
V
BR
R d
I
RM
R
DC_L
C line
I
R
= 1 mA tp = 100 ns
V
RM
= 3 V per line
DC resistance of the inductor
Vline = 0 V, V
OSC
= 30 mV, F = 1 MHz
6
0.2
0.07
250
Max.
0.3
0.1
Unit
V
Ω
µA
Ω pF
2/10 Doc ID 023219 Rev 1
EMIF02-SPK03F2 Characteristics
Figure 4.
Insertion losses versus frequency
APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111
0
EMIF02-SPK03F2
S21
-10 dB
-20
-30
-40
-50
-60
300k 1M 3M
I1-O1
10M
Figure 5.
Analog crosstalk versus frequency
30M
F/Hz
100M 300M
I2-O2
1G 3G
APLAC 8.21 User: F:Cust# 8463:STMicroelectronics - Tours:AWR Corporation:RP=111
0
EMIF02-SPK03F2
XTalk
-10 dB
-20
-30
-40
-50
-60
-70
300k 1M 3M
I1-O2
10M 30M
F/Hz
100M 300M 1G 3G
Doc ID 023219 Rev 1 3/10
Characteristics
Figure 6.
Audio band analog crosstalk
EMIF02-SPK03F2
Note:
Figure 7.
Clamping voltage V
CL
versus peak pulse current I
PP
for short pulse duration such as ESD surges
Ipp (A)
18
16
14
12
10
8
2
0
6
4
32
30
28
26
24
22
20
Triangular pulse tP = 100 ns
Direct and reverse polarity
TJ initial = 25 °C
V
CL
(V)
0 2 4 6 8 10 12 14 16
For further information on the dynamic characteristic see the STMicroelectronics’ application note AN4022, “TVS short pulse R d
measurement and correlation with TVS clamping voltage during ESD”.
4/10 Doc ID 023219 Rev 1
EMIF02-SPK03F2
Figure 8.
ESD test conditions
Characteristics
2 x -20 dB
50 Ω input
Figure 9.
Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) Ix to Ox
Doc ID 023219 Rev 1 5/10
Characteristics EMIF02-SPK03F2
Figure 10.
Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) Ix to Ox
Figure 11.
Total harmonic distortion plus noise
6/10 Doc ID 023219 Rev 1
EMIF02-SPK03F2
2 Ordering information scheme
Ordering information scheme
Figure 12.
Ordering information scheme
EMI Filter
Number of lines
Information x = resistance value (Ohms) z = capacitance value / 10(pF) or
3 letters = application
2 digits = version
Package
F = Flip Chip x = 2: lead-free, pitch = 500 µm, bump = 255 µm
EMIF yy - xxx zz Fx
Doc ID 023219 Rev 1 7/10
Package information EMIF02-SPK03F2
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 13.
Package dimensions
500 µm ±10
250 µm ±10
315 µm ±50 650 µm ±65
500
µm
±15
0.89 mm ±50 µm
Figure 14.
Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max.
Solder stencil opening:
330 µm recommended
Solder mask opening recommendation:
340 µm min. for 315 µm copper pad diameter
Figure 15.
Marking
Dot, ST logo
ECOPACK status xx = marking z = manufacturing location yww = datecode
(y = year ww = week) x y x z w w
8/10 Doc ID 023219 Rev 1
EMIF02-SPK03F2
Figure 16.
Tape and reel specification
Dot identifying Pin A1 location
2.0
0.22
4.0
Ordering information
Ø 1.55
ST xxz yww
ST xxz yww
ST xxz yww
Note:
1.02
4.0
0.73
± 0.05
All dimensions are typical values in mm User direction of unreeling
More information is available in the application notes:
AN1235,”IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751, “EMI filters: recommendations and measurements”
Table 3.
Ordering information
Order code Marking Package
EMIF02-SPK03F2 JX Flip Chip
Weight
1.8 mg
Base qty
5000
Delivery mode
Tape and reel 7”
Table 4.
Date
19-Jun-2012
Document revision history
Revision
1 Initial release.
Changes
Doc ID 023219 Rev 1 9/10
EMIF02-SPK03F2
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