ESDA37WY
Datasheet
Automotive dual Transil™ array for ESD protection
1
2
3
1
SOT323-3L
2
Product status
ESDA37WY
3
Features
• AEC-Q101 qualified
• Dual unidirectional Transil functions
• Low leakage current (I
R
max. < 1 µA at V
RM
)
• 300 W peak pulse power (8/20 µs)
• High ESD protection level: up to 25 kV
• High integration
• Suitable for high density boards
• Complies with the following standards/
– ISO 10605: C = 330 pF, R = 330 Ω: 30 kV (air discharge), 30 kV (contact discharge)
– ISO 7637-3 fast transient: Pulse a: V
S
= -150 V, Pulse b: V
S
= +100 V
– ISO 7637-3 slow transient: Positive pulse: V
S
= +85 V, Negative pulse: V
S
=
-85 V
Applications
Where transient overvoltage protection in ESD sensitive equipment is required, such as:
• Entertainment
• Signal communications
• Connectivity
• Comfort and convenience
Description
This device is a diode array designed to protect 1 line or 2 lines against ESD transients.
The device is ideal for applications where both reduced line capacitance and board space saving are required
It can also be used as bidirectional suppressor by connecting only pin 1 and 2.
DS12297 - Rev 2 - April 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1
ESDA37WY
ESDA37WY_Characteristics
ESDA37WY_Characteristics
Table 1. Absolute maximum ratings (T amb
= 25 °C)
Symbol Parameter
V pp
Peak pulse voltage (1)
ISO 10605 (C = 330 pF, R = 330 Ω):
Contact discharge
Air discharge
ISO 10605 (C = 150 pF, R = 330 Ω):
Contact discharge
Air discharge
P pp
I pp
T j
T stg
T
L
Peak pulse power (8/20 μs)
Peak pulse current (8/20 μs)
Maximum operating junction temperature range
Storage junction temperature range
Maximum temperature for soldering during 10 s
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Figure 1. Electrical characteristics (definitions)
I I F
II
Symbol
V
BR
V
CL
=
=
V
F
C
R d
I
RM
I
F
I
I
PP
R
α T
=
=
=
=
=
=
=
=
Parameter
Breakdown voltage
Clamping voltage
Stand-off voltage
Leakage current
Forward current
Peak pulse current
Breakdown current
Forward voltage drop
Capacitance
Dynamic impedance
Voltage temperature
V cl
V BR
V RM
I I RM
V
F
I I PP
Value
30
30
30
30
Unit kV
300
6.3
-55 to 175
-65 to 175
260
W
A
°C
°C
°C
Table 2. Electrical characteristics (T amb
= 25 °C)
Order code Min.
V
V
BR
at I
R
Max.
V
ESDA37WY 37 43.3
mA
1
1. Square pulse I pp
= 15 A, t p
= 2.5 µs
2. Δ V
BR
= αT x (T amb
-25 °C) x V
BR
(25 °C)
I
RM
at V
RM
Max.
µA V
1 36
R d
(1)
Typ.
mΩ
2400
αT (2)
Max.
10 -4 /°C
11
C line
Typ. at 0 V bias pF
48
V
F
at I
F
Max.
V mA
0.9
10
DS12297 - Rev 2 page 2/12
ESDA37WY
Characteristics (curves)
1.1
Characteristics (curves)
Figure 2. Peak pulse power dissipation versus initial junction temperature
Figure 3. Peak pulse power versus exponential pulse duration (maximum values)
P
PP
(W)
150
100
50
0
25
350
P
PP
(W)
300
250
200
50 75 100 125 150
T j
(°C)
1000
100
175
10
10 100
Tj initial = 25 °C maximum value t p
(µs)
1000
Figure 4. Variation of clamping voltage versus peak pulse current (maximum values)
100
I
PP
(A)
Figure 5.
1000
I r
(nA)
Variation of leakage current at V versus junction temperature
R
= V
RM
100
10
10
1
1
0.1
20 25 30 35 40 45 50
V
CL
(V)
55 60
0.1
25 50
ESDA37LY (V
R
= V
RM
= 36 V)
75
T j
(°C)
100 125 150 175
DS12297 - Rev 2 page 3/12
DS12297 - Rev 2
ESDA37WY
Characteristics (curves)
Figure 6. ISO 7637-3 fast transient pulse a response
(VS = -150 V)
0.5 V/div
Figure 7. ISO 7637-3 fast transient pulse b response (VS = +100 V)
10 V/div
1A/div
50 ns/div
500 mA/div
50 ns/div
Figure 8. ISO 7637-3 slow transient positive pulse
(VS = +85 V)
Figure 9. ISO 7637-3 slow transient negative pulse
(VS = -85 V)
10 V/div 5 V/div
2 A/div
5 µs/div
5 A/div
2 µs/div page 4/12
2
ESDA37WY
Application and design guidelines
Application and design guidelines
Refer to STMicroelectronics application note:
• AN2689: Protection of automotive electronics from electrical hazards, guidelines for design and component selection.
DS12297 - Rev 2 page 5/12
3
3.1
ESDA37WY
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com
. ECOPACK ® is an ST trademark.
•
•
[Package name] package information
Epoxy meets UL 94,V0
Lead-free package
Figure 10. SOT-323 3L package outline
D
A c
θ
H
E
L e b
A1
DS12297 - Rev 2 page 6/12
DS12297 - Rev 2
Ref.
E e
H
L
ϴ
A
A1 b c
D
ESDA37WY
SOT-323 3L package information
Min.
0.8
0.0
0.25
0.1
1.8
1.15
0.60
1.8
0.1
Table 3. SOT323-3L package mechanical data
Dimensions
Millimeters
Typ.
2.0
1.25
0.65
2.1
0.2
0
Max.
1.35
0.70
2.4
0.30
30°
1.1
0.1
0.4
0.26
2.2
Min.
0.031
0.000
0.0098
0.003
0.070
0.0452
0.024
0.070
0.004
0
Inches
Typ.
0.078
0.0492
0.026
0.082
0.008
Figure 11. SOT323-3L recommended footprint
0.95
(0.037)
1.0
(0.039)
2.9
(0.114)
Max.
0.043
0.003
0.0157
0.0102
0.086
0.0531
0.028
0.094
0.012
30°
0.8
(0.031)
0.50
(0.019) page 7/12
ESDA37WY
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
4.2
4.3
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed.
4.
Use solder paste with fine particles: powder particle size 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3.
Standard tolerance of ±0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open vias.
2.
The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
DS12297 - Rev 2 page 8/12
4.4
ESDA37WY
Reflow profile
Reflow profile
Figure 12. ST ECOPACK ® recommended soldering reflow profile for PCB mounting
250
Temperature (°C)
200
150
100
50
0 30
0.9 °C/s
60
2 - 3 °C/s
240-245 °C
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
90 120 150
Time (s)
180 210 240 270 300
Note: Minimize air convection currents in the reflow oven to avoid component movement.
DS12297 - Rev 2 page 9/12
5
ESDA37WY
ESDA37WY_Ordering information
ESDA37WY_Ordering information
Figure 13. Ordering information scheme
ESDA XX WY
ESD Array
Minimum breakdown voltage
Package
W = SOT323-3L
Y = Automotive grade
Table 4. Ordering information
Order code
ESDA37WY
Marking (1)
E3Y
Package
SOT323-3L
Weight
6.6 mg
1. The marking can be rotated by multiples of 90° to differentiate assembly location.
Base qty.
3000
Delivery mode
Tape and reel
DS12297 - Rev 2 page 10/12
ESDA37WY
Revision history
Date
18-Dec-2017
09-Apr-2018
Table 5. Document revision history
Revision
1
2
Changes
First issue.
Updated Figure 2. Peak pulse power dissipation versus initial junction temperature
.
DS12297 - Rev 2 page 11/12
ESDA37WY
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DS12297 - Rev 2 page 12/12
